Influence of channel shape on the thermal and hydraulic performance of microchannel heat sink

Microchannel heat sinks (MCHS) can be made with channels of various shapes. Their size and shape may have remarkable influence on the thermal and hydrodynamic performance of MCHS. In this paper, numerical simulations are carried out to solve the three-dimensional steady and conjugate heat transfer governing equations using the Finite-Volume Method (FVM) of a water flow MCHS to evaluate the effect of shape of channels on the performance of MCHS with the same cross-section. The effect of shape of the channels on MCHS performance is studied for different channel shapes such as zigzag, curvy, and step microchannels, and it is compared with straight and wavy channels. The MCHS performance is evaluated in terms of temperature profile, heat transfer coefficient, pressure drop, friction factor, and wall shear stress. Results show that for the same cross-section of a MCHS, the temperature and the heat transfer coefficient of the zigzag MCHS is the least and greatest, respectively, among various channel shapes. The pressure drop penalty for all channel shapes is higher than the conventional straight MCHS. The zigzag MCHS has the highest value of pressure drop, friction factor, and wall shear stress followed by the curvy and step MCHS, respectively.     

Cooling performance of a microchannel heat sink with nanofluids

In this paper, the cooling performance of a microchannel heat sink with nanoparticle–fluid suspensions (“nanofluids”) is numerically investigated. By using a theoretical model of thermal conductivity of nanofluids that accounts for the fundamental role of Brownian motion, we investigate the temperature contours and thermal resistance of a microchannel heat sink with nanofluids such as 6 nm copper-in-water and 2 nm diamond-in-water. The results show that the cooling performance of a microchannel heat sink with water-based nanofluids containing diamond (1 vol.%, 2 nm) at the fixed pumping power of 2.25 W is enhanced by about 10% compared with that of a microchannel heat sink with water. Nanofluids reduce both the thermal resistance and the temperature difference between the heated microchannel wall and the coolant. Finally, the potential of deploying a combined microchannel heat sink with nanofluids as the next generation cooling devices for removing ultra-high heat flux is shown.     

Optimum thermal performance of microchannel heat sink by adjusting channel width and height

A three-dimensional numerical model of the microchannel heat sink is presented to study the effects of heat transfer characteristics due to various channel heights and widths. Based on the theory of a fully developed flow, the pressure drop in the microchannel is derived under the requirement of the flow power for a single channel. The effects of two design variables representing the channel width and height on the thermal resistance are investigated. In addition, the constraint of the same flow cross section is carried out to find the optimum dimension. Finally, the minimum thermal resistance and optimal channel width with various flow powers and channel heights are obtained by using the simulated annealing method.     

Thermal performance of U-shaped serpentine microchannel heat sink using various metal oxide nanofluids

This study aims to evaluate the thermal performance and friction factor characteristics of the U-shaped serpentine microchannel heat sink using three different nanofluids. Two distinct nanoparticles, namely Al₂O₃ (alumina) and CuO (copper oxide), were used for the preparation of nanofluids using water and ethylene glycol (EG) as base fluids. Three nanofluids, namely nanofluid I (Al₂O₃ + water), nanofluid II (CuO + water), and nanofluid III (CuO + EG), have been prepared. The results showed that the thermal conductivity of nanofluids was increased for all concentrations (from 0.01 to 0.3%), compared with base fluids. The theoretical values derived from the relationship between the Darcy friction factor showed a clear understanding of the fully developed laminar flow. Thermal resistance for nanofluid III was lower than other nanofluids, resulting in a higher cooling efficiency. The nanofluid mechanism and the geometry of the U-shaped serpentine heat sink have led to the improvement in the thermal performance of electronic cooling systems.     

Thermal performance of optimized interrupted microchannel heat sink (IMCHS) using nanofluids

An interrupted microchannel heat sink (IMCHS) using nanofluids as working fluids is analyzed numerically to increase the heat transfer rate. The rectangular IMCHS is designed with length and width of 10 mm and 0.057 mm respectively while optimum cut section number, n_c = 3. The three dimensional governing equations (continuity, momentum and energy) were solved using finite volume method (FVM). Parametric study of thermal performance between pure water-cooled and nanofluid-cooled IMCHS are evaluated for particle diameter in the range of, 30 nm to 60 nm, volume fraction in the range of, 1% to 4%,nanofluid type of Al₂O₃, CuO, and SiO₂ at Reynolds number range of 140 to 1034 are examined. The effects of the transport properties, nanofluid type, nanoparticle volume fraction and particle diameter are investigated on the IMCHS performance. It is inferred that the Nu number for IMCHS is higher than the conventional MCHS with a slight increase of the pressure drop. It is found that highest thermal augmentation is predicted for Al₂O₃, followed by CuO, and finally for SiO₂ in terms of Nu_nf/Nu_pw in the IMCHS. The Nu number increased with the increase of nanoparticle volume fraction and with the decrease of nanoparticle diameter.     

Analysis of microchannel heat sink performance using nanofluids

In this study, silicon microchannel heat sink performance using nanofluids as coolants was analyzed. The nanofluid was a mixture of pure water and nanoscale Cu particles with various volume fractions. The heat transfer and friction coefficients required in the analysis were based on theoretical models and experimental correlations. In the theoretical model, nanofluid was treated as a single-phase fluid. In the experimental correlation, thermal dispersion due to particle random motion was included. The microchannel heat sink performances for two specific geometries, one with W_ch = W_fin = 100 μm and L_ch = 300 μm, the other with W_ch = W_fin = 57 μm and L_ch = 365 μm, were examined. Because of the increased thermal conductivity and thermal dispersion effects, it was found that the performances were greatly improved for these two specific geometries when nanofluids were used as the coolants. In addition to heat transfer enhancement, the existence of nanoparticles in the fluid did not produce extra pressure drop because of small particle size and low particle volume fraction.     

Thermal effect of a thermoelectric generator on parallel microchannel heat sink

Thermoelectric generators (TEG) convert heat energy to electrical power by means of semiconductor charge carriers serving as working fluid. In this work, a TEG is applied to a parallel microchannel heat sink. The effect of the inlet plenum arrangement on the laminar flow distribution in the channels is considered at a wide range of the pressure drop along the heat sink. The particular focus of this study is geometrical effect of the TEG on the heat transfer characteristics in the micro-heat sink. The hydraulic diameter of the microchannels is 270 μm, and three heat fluxes are applied on the hot surface of the TEG. By considering the maximum temperature limitation for Bi₂Te₃ material and using the microchannel heat sink for cooling down the TEG system, an optimum pumping power is achieved. The results are in a good agreement with the previous experimental and theoretical studies.     

Experimental microchannel heat sink performance studies using nanofluids

In this study, microchannel heat sink (MCHS) performance using nanofluids as coolants is addressed. We first carried out a simple theoretical analysis that indicated more energy and lower MCHS wall temperature could be obtained under the assumption that heat transfer could be enhanced by the presence of nanoparticles. Experiments were then performed to verify the theoretical predictions. A silicon MCHS was made and CuO–H₂O mixtures without a dispersion agent were used as the coolants. The CuO particle volume fraction was in the range of 0.2 to 0.4%. It was found that nanofluid-cooled MCHS could absorb more energy than water-cooled MCHS when the flow rate was low. For high flow rates, the heat transfer was dominated by the volume flow rate and nanoparticles did not contribute to the extra heat absorption. The measured MCHS wall temperature variations agreed with the theoretical prediction for low flow rate. For high flow rate, the measured MCHS wall temperatures did not completely agree with the theoretical prediction due to the particle agglomeration and deposition. It was also found that raising the nanofluid bulk temperature could prevent the particles from being agglomerated into larger scale particle clusters. The experimental result also indicated that only slightly increase in pressure drop due to the presence of nanoparticles in MCHS operation.     

Numerical study of microchannel heat sink performance using nanofluids

This study presents the numerical simulation of three-dimensional incompressible steady and laminar and turbulent fluid flow of a trapezoidal micro-channel heat sink (MCHS) using CuO/water nanofluid as a cooling fluid. Navier–Stokes equations with conjugate energy equation are discretized by the finite-volume method. CFD predictions of laminar and turbulent forced convection of CuO/water nanofluids by single-phase and two-phase models (mixture model) are compared. The parameters studied include the particle volume fraction (ϕ = 0.204 %, 0.256%, 0.294% and 0.4%), and the volumetric flow rate ($\dot{\mathit{V}}=10\mathrm{mL}/min$, 15 mL/min and 20 mL/min). Comparisons of the thermal resistance predicted by the single-phase and two-phase models with corresponding experimental results show that the two-phase model is more accurate than the single-phase model. In the laminar flow, the thermal resistance of nanofluids is smaller than that of the water, which decreases as the particle volume fraction and the volumetric flow rate increase. In addition, the pressure drop of both nanofluid-cooled MCHS and pure water-cooled MCHS is discussed. For the laminar flow case, the pressure drop increases slightly for nanofluid-cooled MCHS.     

Enhancement of thermal performance in double-layered microchannel heat sink with nanofluids

A three-dimensional analysis aimed at enhancing the thermal performance of a double-layered microchannel heat sink by using a nanofluid and varying the geometric parameters has been conducted. A system of fully elliptic equations that govern the flow and thermal fields are solved using the finite volume method. The analysis indicates that the dominant factors determining the thermal resistance of the channel include the type of nanofluid; particle volume fraction; geometric parameters of the channel, such as the channel number, channel width ratio, channel aspect ratio; and pumping power. The results indicate that the greatest enhancement in channel cooling can be expected when an Al₂O₃–water nanofluid is used. The thermal resistance of the channel can be minimized by properly adjusting the particle volume fraction under various pumping powers; the minimum thermal resistance depends on the geometric parameters. The study also reveals that the relationship between the thermal resistance and channel number, channel width ratio, or channel aspect ratio exhibits a decrease followed by an increase. The thermal performance of the channel can usually be improved by decreasing the channel number or channel aspect ratio, or increasing the channel width ratio. Finally, increasing the pumping power reduces the overall thermal resistance. An Al₂O₃ (1%)–water nanofluid shows an average improvement in thermal performance of 26% over that of pure water for a given pumping power. However, the design’s effectiveness declines significantly under high pumping power. In particular, the thermal resistance obtained by employing nanofluids was not necessarily lower than that of water under all pumping powers, but it can be reduced by properly adjusting the geometric parameters under optimal conditions.     

Effect of tip clearance on the cooling performance of a microchannel heat sink

In this paper, the effect of tip clearance on the cooling performance of the microchannel heat sink is presented under the fixed pumping power condition. The thermal resistance of a microchannel heat sink is defined for evaluating its cooling performance. The effect of tip clearance is numerically investigated by increasing tip clearance from zero under the fixed pumping power condition. From the numerical results, the optimized tip clearance is determined, for which the thermal resistance has a minimum value. Finally, we show that the presence of tip clearance can improve the cooling performance of a microchannel heat sink when tip clearance is smaller than a channel width.     

Effects of tapered-channel design on thermal performance of microchannel heat sink

A channel with a height- or width-tapered variation is designed to improve the thermal performance of a microchannel heat sink (MCHS). To this end, a three-dimensional MCHS model is constructed to analyze the effects of the height- and width-tapered ratios on the thermal performance of the MCHS. The thermal resistance and temperature distribution are taken as the thermal performance indicators. Numerical predictions show that the relationship between the thermal resistance and the width-tapered ratio is not monotonic at the fixed pumping power. The thermal resistance first decreases and then increases. A similar behavior is also exhibited by the height-tapered ratio. However, the height-tapered ratio effects can be negligible. It is also found that the width-tapered-channel design has a lower and a relatively uniform temperature distribution compared to parallel or height-tapered channel design. Moreover, the MCHS with width-tapered channel design showed a maximum enhancement in thermal performance of around 16.7% over that of the parallel-channel design when the pumping power is larger than 0.4 W.     

Effect of nanofluid on thermo hydraulic performance of double layer tapered microchannel heat sink used for electronic chip cooling

Thermo-hydraulic performance analysis of a tapered double layer microchannel heat sink (DL-MCHS) is done numerically. Water and Al₂O₃–H₂O nanofluid coolants are used with uniform heat flux at the base of DL-MCHS. Comparatively higher heat transfer and lower pressure drop can be achieved considering temperature dependent thermo-physical properties. An overall performance factor is determined which indicates that though the tapered channel gives better thermal performance than straight channel, it is not always advantageous, if hydraulic performance is also considered, due to the increase in pressure drop penalty. Finally, from optimization study, maximum heat transfer is obtained at tapering factor of 0.32.     

Channel cross section effect on heat transfer performance of oblique finned microchannel heat sink

In the present work, the effect of channel cross section on the heat transfer performance of an oblique finned micro-channel heat sink was investigated. Water and Al₂O₃/water nanofluid of volume fraction 0.25% were used as a coolant. The oblique finned microchannels are designed with three channel cross-sections namely square, semicircle and trapezoidal. The primary work of this paper is to study the heat transfer and hydrodynamic characteristics in the oblique finned microchannel. The experimental setup and procedure are validated using water as coolant in a micro-channel heat sink. Heat transfer and flow characteristics are examined for three cross-sections of varying mass flux. The trapezoidal channel cross-section increases the considerable heat transfer rate improvement for both water and nanofluid by 3.133% and 5.878% compared to square and semicircle cross section. Also, the pressure drop is higher in the trapezoidal cross-section over the square and semicircle cross section. This is due to increase in friction loss of trapezoidal cross section. The results indicate that trapezoidal cross-section oblique finned micro-channel is more suitable for heat transfer in the electronic cooling application.     

Three-dimensional numerical optimization of a manifold microchannel heat sink

A three-dimensional analysis procedure for the thermal performance of a manifold microchannel heat sink has been developed and applied to optimize the heat-sink design. The system of fully elliptic equations, that govern the flow and thermal fields, are solved by a SIMPLE-type finite volume method, while the optimal geometric shape is traced by a steepest descent technique. For a given pumping power, the optimal design variables that minimize the thermal resistance are obtained iteratively. The procedure is robust and the optimal state is reached within six global iterations. Comparing with the comparable traditional microchannel heat sink, the thermal resistance is reduced by more than a half while the temperature uniformity on the heated wall is improved by tenfold. The sensitivity of the thermal performance on each design variable is also examined and presented in the paper. Among various design variables, the channel width and depth are more crucial than others to the heat-sink performance. The optimal dimensions and corresponding thermal resistance have a power-law dependence on the pumping power.     

Analysis of flexible microchannel heat sink systems

In this work, single layered (SL) and double layered (DL) flexible microchannel heat sinks are analyzed. The deformation of the supporting seals is related to the average internal pressure by theory of elasticity. It is found that sufficient cooling can be achieved using SL flexible microchannel heat sinks at lower pressure drop values for softer seals. Double layered flexible microchannel heat sinks provide higher rate of cooling over SL flexible microchannel heat sinks at the lower range of pressure drops. Single layered flexible microchannel heat sinks are preferred for large pressure drop applications while DL flexible microchannel heat sinks are preferred for applications involving low pressure drops.     

Investigation of thermal performance of microchannel heat sink with triangular ribs in the transverse microchambers

A numerical investigation is conducted to predict the thermal and hydraulic performances of the microchannel heat sink (MCHS) with different geometric parameters of triangular rib in the transverse microchamber. The parametric variables of width, length and height of the triangular rib are studied to find optimum design. The flow structure and characteristics of the interrupted MCHS are interpreted in details. The dimensionless ratios of average Nusselt number, friction factor and thermal enhancement factor are evaluated. It is found that the heat transfer rate is increasing with the increase of rib width and height, but decreasing with the increase of rib length. The boundary layer interruption and redevelopment effects introduced by the triangular rib are discussed. The results of thermal enhancement factor reveals an optimum geometrical parameters for the triangular rib with width = 100 μm, length = 400 μm and height = 120 μm for about Reynolds number of 500, yielding 43% enhancement relative to non-interrupted rectangular MCHS at equal pumping power. The results of mean Nusselt number ratio reveal an optimum enhancement of 56% relative to non-interrupted MCHS.     

聚光条件下螺旋式微通道散热器传热性能研究

基于高倍聚光砷化镓电池冷却问题,研究螺旋式微通道散热器结构尺寸、冷却水流速等参数对光伏光热系统性能的影响,得到了系统热、电效率随高导热陶瓷基板(PCB板)尺寸、流道圈数的变化规律。研究表明:PCB板尺寸对电池表面温度影响较小,当其长度为30~127 mm时,随着长度的增加系统热效率降低,电效率升高,总效率降低幅度小于1%;随着流道圈数的增加,电池表面温度、系统热效率及总效率先迅速降低后再缓慢升高,电效率则相反;在直射辐照度(DNI)为1000 W/m2、聚光倍数为811X条件下,微通道螺旋圈数为6圈时,可得到较高的电效率和冷却效果,当流速为0.55 m/s时,电池表面平均温度为79.34℃,出口流体温度为68.32℃,可作为膜蒸馏系统驱动热源。该研究对砷化镓电池微通道散热器优化、提高光伏光热系统综合效率,实现能源梯级利用提供理论依据。     

3-Dimensional numerical optimization of silicon-based high performance parallel microchannel heat sink with liquid flow

A full 3-dimensional (3D) conjugate heat transfer model has been developed to simulate the heat transfer performance of silicon-based, parallel microchannel heat sinks. A semi-normalized 3-dimensional heat transfer model has been developed, validated and used to optimize the geometric structure of these types of microheat sinks. Under a constant pumping power of 0.05 W for a water-cooled microheat sink, the optimized geometric parameters of the structure as determined by the model were a pitch of 100 μm, a channel width of 60 μm and a channel depth of about 700 μm. The thermal resistance of this optimized microheat sink was calculated for different pumping powers based on the full 3D conjugate heat transfer model and compared with the initial experimental results obtained by Tuckerman and Pease in 1981. This comparison indicated that for a given pumping poser, the overall cooling capacity could be enhanced by more than 20% using the optimized spacing and channel dimensions. The overall thermal resistance was 0.068 °C/W for a pumping power of 2 W.