Structural characterization of GaN epilayers on silicon: Effect of buffer layers

Cross-sections of GaN/AlN/3C-SiC/Si(111) system have been studied by electron microscopy techniques. A nanometer thick buffer layer of silicon carbide on Si(111) substrate was formed using an original solid-phase epitaxy method. The subsequent layers of gallium nitride and aluminum nitride were grown by the method hydride-chloride vapor phase epitaxy. The resulting GaN layers display neither threading dislocations nor cracks on any scale. The main fraction of defects in GaN layers have the form of dislocation pileups that are localized at and oriented parallel to the GaN/AlN interface. The dislocation density in the obtained GaN layers is (1–2) × 10⁹ cm⁻², which corresponds to a minimum level reported in the available literature. The buffer AlN layer contains nanopores, which reduce the level of stresses at the GaN/AlN interface and thus almost completely inhibit the formation of threading dislocations.     

Collective effects in the system of structural defects in homoepitaxial GaN grown on porous substrates

Results of experiments on the homoepitaxial growth of gallium nitride (GaN) on porous GaN substrates with nanostructured volume are reported. A mechanism that can be used to exclude the dislocations of substrate from the sources of threading dislocations in homoepitaxial layers is described for the first time.     

Dislocations at the interface between sapphire and GaN

GaN layers grown by metal organic vapour phase epitaxy on sapphire were imaged by synchrotron radiation X-ray topography. The threading dislocations could not be resolved in the topographs due to their high density, but a smaller density of about 10⁵ cm⁻² defects were seen in the interface between GaN and sapphire by utilizing large-area back-reflection topography for the sapphire substrates. The misfit dislocation images in the topographs form a well-resolved cellular network, in which the average cell size is roughly 30 μm. Different cell shapes in the misfit dislocation networks are observed on different samples. Also, images of small-angle grains of similar size were found in transmission section topographs of the GaN layers.     

Si Complies with GaN to Overcome Thermal Mismatches for the Heteroepitaxy of Thick GaN on Si

Heteroepitaxial growth of lattice mismatched materials has advanced through the epitaxy of thin coherently strained layers, the strain sharing in virtual and nanoscale substrates, and the growth of thick films with intermediate strain‐relaxed buffer layers. However, the thermal mismatch is not completely resolved in highly mismatched systems such as in GaN‐on‐Si. Here, geometrical effects and surface faceting to dilate thermal stresses at the surface of selectively grown epitaxial GaN layers on Si are exploited. The growth of thick (19 µm), crack‐free, and pure GaN layers on Si with the lowest threading dislocation density of 1.1 × 10⁷ cm^?2 achieved to date in GaN‐on‐Si is demonstrated. With these advances, the first vertical GaN metal–insulator–semiconductor field‐effect transistors on Si substrates with low leakage currents and high on/off ratios paving the way for a cost‐effective high power device paradigm on an Si CMOS platform are demonstrated     

Improvement of the quality of GaN epilayer by combining a SiNx interlayer and changed GaN growth mode

GaN epilayers with porous SiN_x interlayer and changed growth modes were grown by metal–organic chemical vapor deposition on c-plane sapphire substrates. Comparing with GaN epilayer grown by ordinary method, the crystalline qualities were significantly improved. The improvement was attributed to the reduction of the density of threading dislocations causing by over-growth process combining with delayed coalescence of individual GaN islands. The influence of the deposition and annealing of nucleation layer on the GaN regrowth was also discussed.     

Transmission electron microscopy characterisation of metalorganic chemical vapour deposition grown GaN layers

GaN layers grown onto sapphire substrates by metalorganic chemical vapour deposition were characterised by optical microscopy, transmission electron microscopy and atomic force microscopy measurements. Mirror like surfaces were obtained at certain growth conditions despite the hexagonal based pyramids found on the growth surface. The typical pyramids have a base diameter of 20–30 μm and height of about 1.5–3 μm. The GaN layers are of the wurtzite type and epitaxially oriented to the sapphire substrate. Beside the threading dislocations, hexagonal rods of GaN surrounded by inversion domain boundaries are observed. An AlN layer has been formed at the interface region during the nitridation process of sapphire.     

Structural properties of GaN grown on AlGaN/AlN stress mitigating layers on 100-mm Si (111) by ammonia molecular beam epitaxy

The structural properties of GaN grown on AlGaN/AlN stress mitigating layers on 100-mm diameter Si (111) substrate by ammonia molecular beam epitaxy have been reported. High resolution X-ray diffraction, micro-Raman spectroscopy, transmission electron microscopy and secondary ion mass spectroscopy have been used to study the influence of AlN thickness and AlGaN growth temperature on the quality of GaN. GaN grown on thicker AlN showed reduced dislocation density and lesser tensile strain. Three-dimensional growth regime was observed for GaN grown at lower AlGaN growth temperature while higher AlGaN growth temperature resulted in two-dimensional growth mode. The dislocation bending and looping at the AlGaN/AlN interface was found to have significant influence on the dislocation density and strain in the GaN layer. The evolution and interaction of threading dislocations play a major role in determining the quality and the strain states of GaN.     

Nanoheteroepitaxy of GaN on a nanopore array of Si(111) surface

Nanoheteroepitaxial (NHE) growth of GaN using AlN/AlGaN as a graded buffer layer by metalorganic chemical vapor deposition has been demonstrated on the nanoporous patterned Si(111) substrates. The nanopore array on Si(111) has been fabricated by using anodized aluminum oxide membrane as an induced couple plasma dry etching mask. The reduction of the threading dislocation density and relaxation of the tensile stress in NHE GaN are revealed by transmission electron microscopy (TEM), micro-Raman spectrum and photoluminescence spectrum, respectively. Cross-sectional TEM analysis shows that dislocations nucleated at the interface are forced to bend into (0001) basal plane. Red shift in the E₂ (TO) phonon peak of micro-Raman spectrum indicates the relaxation of tensile stress in the nanoheteroepitaxial lateral overgrowth of GaN. A single step ELO without mask on nanopatterned Si(111) substrates is a simple and promising way for the improvement of the quality of GaN on Si substrates.     

Structural characterization of high temperature AlN intermediate layer in GaN grown by molecular beam epitaxy

Transmission electron microscopy has been used to study the structural quality of GaN grown on sapphire by plasma assisted molecular beam epitaxy using high temperature AlN intermediate layers with different thicknesses. The introduction of an AlN intermediate layer with an optimum thickness is observed to minimize the density of dislocations reaching the overgrown GaN surface. In this sample, the measured threading dislocation density reaching the surface of 1×10¹⁰ cm⁻² resulted to be seven times lower than that of a reference sample, without any AlN interlayer. The bending at the GaN/AlN interface and following interactions between dislocations have been observed in cross-sectional transmission electron micrographs. This fact explains the decrease of dislocation density reaching the GaN surface.     

Luminescent properties of GaN-based epitaxial layers and heterostructures grown on porous SiC substrates

The photoluminescence of single epitaxial GaN layers and electroluminescence of double GaN/AlGaN heterostructures grown on porous silicon carbide (PSC) substrates was studied in comparison to the properties of analogous layers and structures grown on nonporous SiC substrates. The epilayers grown on PSC substrates are characterized by a lower concentration of dislocation-related nonradiative recombination centers. It is suggested that this factor favorably influences the radiative recombination processes in device structures based on group III nitride epilayers grown on PSC substrates.     

Cathodoluminescence study of GaN-based film structures

GaN films grown on sapphire substrate with an emphasis on epitaxial lateral overgrown (ELOG) layers with an array of rhombic shaped mask area as well as InGaN/GaN MQW laser diode layer structures were investigated by cathodoluminescence (CL) spectroscopy and CL imaging at room and low temperatures. The microscopic imaging with a high-spatial resolution clearly reveals the distribution of threading dislocations and point defects in ELOG GaN films. The secondary electron and CL data measured on cleaved faces of laser diodes are analyzed in consideration with luminescence mechanisms in semiconductor heterostructures and around the p–n junction, providing important information on the defects and carrier dynamics in laser diode devices.     

Asymmetry of the Defect Structure of Semipolar GaN Grown on Si(001)

The defect structure of a thick (~15 μm) semipolar gallium nitride (GaN) layer grown by hydride–chloride vapor phase epitaxy on a Si(001) substrate with buffer layers has been studied by transmission electron microscopy. The asymmetry of the defect structure of GaN epilayer has been revealed and analyzed. The influence of this asymmetry on the rate of decrease in the density of threading dislocations in the growing epitaxial layer is discussed.

     

Interaction between dislocations density and carrier concentration of gallium nitride layers

We investigated the problem of oxygen-dislocations interaction and its influence on carrier concentration in GaN layers. We achieved the samples with various dislocation density. Then we checked carrier concentration by means of Hall measurements. The samples with a higher EPD were characterized by a higher electron concentration. We assumed that oxygen diffuses along the threading dislocation lines, acts as a shallow donor and influences unintentional doping. Hence, the more dislocations present in GaN layers, the higher carrier concentration.     

Lateral epitaxial overgrowth of GaN films on patterned sapphire substrates fabricated by wet chemical etching

A promising technique of lateral epitaxial overgrowth, namely CantiBridge epitaxy, is developed and demonstrated in order to reduce the threading dislocation density in GaN films. Using metalorganic chemical vapor deposition, the GaN films are grown on patterned sapphire fabricated by wet chemical etching, instead of traditional dry etching. The image of atomic force microscopy shows that the threading dislocations in CantiBridge-epitaxy GaN are reduced sharply, which makes a promising to realize the high-performance GaN-based optoelectronic devices.     

Membrane-assisted revelation of the spatial nanoarchitecture of dislocation networks

We propose a method of direct visualization of the spatial nanoarchitecture of dislocation networks which is based on etching away the regions with low density of structural defects from the bulk of GaN epilayers, keeping intact only the threading dislocations and a thin surface film pre-treated with low-energy Ar⁺ ions. The formation of nanometer-thick suspended membrane to which the dislocations are genetically attached provides conditions for the revelation of the spatial nanoarchitecture of dislocation networks using conventional scanning electron microscopy. Complementary monochromatic and panchromatic micro-cathodoluminescence images are presented.     

The Effect of the Method by Which a High-Resistivity GaN Buffer Layer Is Formed on Properties of InAlN/GaN and AlGaN/GaN Heterostructures with 2D Electron Gas

AlGaN/AlN/GaN and InAlN/AlN/GaN structures with 2D electron gas have been grown on sapphire substrates by metal-organic vapor-phase epitaxy. The suppression of the parasitic conductivity of buffer GaN layers was provided either by intentionally raising the density of edge dislocations or by doping with iron (GaN:Fe). It was shown that using GaN buffer layers with a better crystal perfection and more planar surface results in the electron mobility in the 2D channel for carriers becoming 1.2–1.5 times higher.     

横向过生长 (LEO)外延 GaN材料及其生长机理

由于没有合适的衬底材料与之匹配，使外延生长的GaN材料缺陷密度很大，从而限制了它的应用。采用LEO（横向过生长外延）技术能使缺陷密度降低3－4个数量级,可生长出高质量的GaN材料。本文简要介绍了应用LEO技术生长GaN材料的现状及对生长机理研究的进展。     

A GaN bulk crystal with improved structural quality grown by the ammonothermal method

The realization of high-performance optoelectronic devices, based on GaN and other nitride semiconductors, requires the existence of a high-quality substrate. Non-polar or semipolar substrates have recently been proven to provide superior optical devices to those on conventional c-plane substrates. Bulk GaN growth enables GaN substrates sliced along various favourable crystal orientations. Ammonothermal growth is an attractive method for bulk GaN growth owing to its potential to grow GaN ingots at low cost. Here we report on improvement in the structural quality of GaN grown by the ammonothermal method. The threading dislocation densities estimated by plan-view transmission electron microscopy observations were less than 1 x 10(6) cm(-2) for the Ga face and 1 x 10(7) cm(-2) for the N face. No dislocation generation at the interface was observed on the Ga face, although a few defects were generated at the interface on the N face. The improvement in the structural quality, together with the previous report on growth rate and scalability, demonstrates the commercial feasibility of the ammonothermal GaN growth.     

Growth and characteristics of self-assembly defect-free GaN surface islands by molecular beam epitaxy

GaN surface nano-islands of high crystal quality, without any dislocations or other extended defects, are grown on a c-plane sapphire substrate by plasma-assisted molecular beam epitaxy. Nano-island growth requires special conditions in terms of V/III ratio and substrate temperature, distinct from either film or nanocolumn growth. The insertion of a nitrided Ga layer can effectively improve the uniformity of the nano-islands in both shape and size. The islands are well faced truncated pyramids with island size ranged from 30 to 110 nm, and height ranged from 30 to 55 nm. On, the other hand, the density and facet of the GaN surface islands would be affected by the growth conditions. An increase of the V/III ratio from 30 to 40 led to an increase in density from 1.4 x 10(9) to 4.3 x 10(9) cm(-2) and an evolution from {1-21-1} facets to {1-21-2} facets. The GaN layers containing the surface islands can moderate the compressive strain due to the lattice and thermal mismatch between GaN and c-sapphire. Conductive atomic force microscopy shows that the off-axis sidewall facets are more electrically active than those at the island center. The formation of the GaN surface islands is strongly induced by the Ehrlich-Schwoebel barrier effect of preexisting islands grown in the early growth stage. GaN surface islands are ideal templates for growing nano-devices.     

Mechanical stresses in the heterosystem germanium- gallium arsenide

Mechanical stresses in thin germanium epitaxial layers deposited by vacuum deposition on monocrystalline gallium arsenide substrates have been examined. The stresses arising are attributed to two factors: the pseudomorphic character of the growth mechanism and the gradient of structural defects in the transition layer. The experimental stress dependence has been shown to be in good agreement with the theory of the dynamic properties of dislocations.