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1.
A double-doped metamorphic In0.35Al0.65As/In 0.35Ga0.65As power heterojunction FET (HJFET) on GaAs substrate is demonstrated. The HJFET exhibits good dc characteristics, with gate forward turn on voltage of 1.0 V, breakdown voltage of 20 V, and maximum drain current of 490 mA/mm. Under RF operation at a frequency of 950 MHz, a power added efficiency of 63% with associated output power of 31.7 dBm is obtained at a gate width of 12.8 mm. This large gate width and state-of-the-art power performance in metamorphic HJFETS were enabled by a selective etching, sputtered WSi gate process and low surface roughness due to an Al0.60Ga0.40As0.69Sb0.31 strain relief buffer 相似文献
2.
Hsien-Chin Chin Ming-Jyh Hwu Shih-Cheng Yang Yi-Jen Chan 《Electron Device Letters, IEEE》2002,23(5):243-245
Surface passivation technology plays an important role, especially in E-mode pHEMTs applications, and a new passivation technology has been proposed in this study. This novel benzocyclobutene (BCB) passivation layer takes advantage of the low dielectric permittivity (2.7) and a low loss tangent (0.0008). In this letter, we not only suppress the gate-to-drain leakage current but also improve the device power performance under a high input power swing by using a BCB passivation layer. The passivated 1.0 μm-long gate pHEMTs exhibit a better off-state performance than the unpassivated ones. The maximum output power under a 2.4-GHz operation is 118 mW/mm, with a linear power gain of 11.1 dB and a power-added efficiency is 60% 相似文献
3.
Nien-Tze Yeh Jia-Ming Lee Tzer-En Nee Jen-Inn Chyi 《Photonics Technology Letters, IEEE》2000,12(9):1123-1125
Self-assembled In0.5Ga0.5As quantum-dot lasers with different doping schemes in the active region are investigated. Their lasing wavelength, characteristic temperature, quantum efficiency, and internal loss are characterized and correlated with the size, uniformity, and density of the quantum dots as revealed by atomic force microscopy. Continuous-wave operation of Be-doped quantum-dot lasers has been achieved. Undoped In0.5Ga0.5 As quantum-dot lasers with a characteristic temperature as high as 125 K above room temperature have also been demonstrated 相似文献
4.
A new GaAs:Er buffer layer grown by MBE has been developed which significantly reduces backgating currents (by 3 to 4 orders of magnitude) in pseudomorphic InGaAs/AlGaAs modulation-doped field effect transistors (MODFET's). The buffer layer is highly resistive, in the 10 2-105 Ω·cm range over the Er-doping range investigated. Presence of internal Schottky barriers resulting from high-density ErAs precipitates has been proposed to he the cause of the high resistivity 相似文献
5.
InP-based high electron mobility transistors (HEMTs) were fabricated by depositing Pt-based multilayer metallization on top of a 6-nm-thick InP etch stop layer and then applying a post-annealing process. The performances of the fabricated 55-nm-gate HEMTs before and after the post-annealing were characterized and were compared to investigate the effect of the penetration of Pt through the very thin InP etch stop layer. After annealing at 250 °C for 5 min, the extrinsic transconductance (Gm) was increased from 1.05 to 1.17 S/mm and Schottky barrier height was increased from 0.63 to 0.66 eV. The unity current gain cutoff frequency (fT) was increased from 351 to 408 GHz, and the maximum oscillation frequency (fmax) was increased from 225 to 260 GHz. These performance improvements can be attributed to penetration of the Pt through the 6-nm thick InP layer, and making contact on the InAlAs layer. The STEM image of the annealed device clearly shows that the Pt atoms contacted the InAlAs layer after penetrating through the InP layer. 相似文献
6.
Jin-Ping Ao Qing-Ming Zeng Yong-Lin Zhao Xian-Jie Li Wei-Ji Liu Shi-Yong liu Chun-Guang Liang 《Electron Device Letters, IEEE》2000,21(5):200-202
Using strained aluminum-rich In0.45Al0.55As as Schottky contact materials to enhance the barrier height and indium-rich In0.75Ga0.25As as channel material to enhance the channel performance, we have developed InP-based enhancement-mode pseudomorphic InAlAs/InGaAs high electron mobility transistors (E-PHEMT's) with threshold voltage of about 170 mv. A maximum extrinsic transconductance of 675 mS/mm and output conductance of 15 mS/mm are measured respectively at room temperature for 1 μm-gate-length devices, with an associated maximum drain current density of 420 mA/mm at gate voltage of 0.9 V. The devices also show excellent rf performance with cutoff frequency of 55 GHz and maximum oscillation frequency of 62 GHz. To the best of the authors' knowledge, this is the first time that InP-based E-PHEMT's with strained InAlAs barrier layer have been demonstrated 相似文献
7.
InP/In0.53Ga0.47As heterojunction bipolar transistors (HBTs) utilizing a carbon-doped base have been demonstrated. The devices were grown by low-pressure metalorganic chemical vapor deposition (LP-MOCVD) using carbon tetrachloride (CCl4) as the p-type dopant source. These devices exhibit a DC common-emitter current gain of 50 and an emitter-base junction ideality factor of 1.29 in a structure for which no undoped spacer layer was employed at the emitter-base junction. These preliminary results suggest that C-doping of In0.53Ga0.47As may be a suitable alternative to Zn in MOCVD-grown InP/In0.53Ga0.47As HBTs 相似文献
8.
Negative differential resistance has been observed in the current/voltage characteristics of a double barrier resonant tunnelling structure with Al0.2Ga0.8As emitters, Al0.4 Ga0.6As barriers and GaAs quantum well for the first time. The NDR becomes clear at low temperatures below 77 K, and the current/voltage characteristic is asymmetric. Results demonstrate that high-quality abrupt GaAs-AlxGa1-xAs-AlyGa1-yAs heterojunctions can be of use in resonant tunnelling structures 相似文献
9.
Temperature-dependent current-voltage measurement was employed to study the band offsets of the In0.30Ga0.70As/In 0.29Al0.71As heterojunction. The conduction band discontinuity was determined to be 0.71±0.05 eV which corresponds to a conduction band offset to bandgap difference ratio ~0.66. The comparison between experimental and theoretical results is presented 相似文献
10.
Thermal stability of MISFET with low-temp molecular-beamepitaxy-grown GaAs and Al0.3Ga0.7As gate ins
GaAs and Al0.3Ga0.7As epilayers grown at LT by MBE were used as insulators in the fabrication of MISFET devices. Parametric changes were used to evaluate the thermal stability of MISFET, to identify failure mechanisms and validate the reliability of these devices. The LT-Al0.3Ga0.7As MISFET showed superior thermal stability. The degradation in the performance of MISFET with 1000 Å thick LT-GaAs gate insulator was worse than those of the MESFET. On the other hand, MISFET with 250 Å thick LT-GaAs gate insulators exhibited stable characteristics with thermal stressing, LF (low frequency) noise studies on the TLM structures of MISFET layers exhibited 1/f noise in the LT-Al0.3Ga0.7As samples and 250 Å LT-GaAs samples; whereas the 1000 Å thick LT-GaAs samples exhibited 1/f3/2 noise, which was attributed to: (i) the thermal noise generated at the interface of the insulator, and (ii) the active layer due to the outdiffused metallic arsenic. Reverse gate-drain current degradation experiments were carried out at 120°C, 160°C, 200°C, and 240°C. Transconductance frequency dispersion studies were carried out before and after thermal stress on these MISFET. The transconductance of MISFET with 1000 Å LT-GaAs gate insulators was degraded by 40% at 100 kHz after thermal stress. The rest of the samples exhibited stable characteristics. These results indicate that composition changes had occurred at the interface in thicker LT-GaAs MISFET structures. Thinner LT-layers are ideal for achieving higher transconductance and better thermal stability without sacrificing the power capability of MISFET 相似文献
11.
Metal-semiconductor-metal photodiodes (MSM PDs) with Ga0.47 In0.53As active layers were fabricated. The low Schottky barrier height of GaInAs was overcome by the insertion of a lattice mismatched AlGaAs intermediary layer between metal and GaInAs active layer. Fabricated MSM PDs utilising interdigitated metal electrodes formed by a self-alignment technique showed a fast rise and fall time of 650 ps, which was limited by the capacitance of the device. The gain of the device was less than 1 相似文献
12.
Magneto-transport and cyclotron resonance measurements were made to determine directly the density, mobility, and the effective mass of the charge carriers in a high-performance 0.15-μm gate In0.52 Al0.48As/In0.53Ga0.47As high-electron-mobility transistor (HEMT) at low temperatures. At the gate voltage V G=0 V, the carrier density n g under the gate is 9×1011 cm-2, while outside of the gate region n g=2.1×1012 cm-2. The mobility under the gate at 4.2 K is as low as 400 cm2/V-s when V G<0.1 V and rapidly approaches 11000 cm2/V-s when V G>0.1 V. The existence of this high mobility threshold is crucial to the operation of the device and sets its high-performance region in V G>0.1 V 相似文献
13.
Monolithic, two-stage amplifiers using 0.5*80 mu m/sup 2/ gate GaAs/AlGaAs heterojunction FETs have been developed for Ka-band operation. These monolithic two-stage amplifiers were fabricated using ion implantation for the active layer and optical lithography for the 0.5 mu m gate length. MMIC two-stage amplifiers achieved average gains of 12.6+or-1.4 dB at 30 GHz and 8.8+or-2.0 dB at 40 GHz, respectively, for all 39 sites across a three inch diameter wafer. These are the first reported results for MMIC two-stage amplifiers using 0.5 mu m gate length ion-implanted GaAs/AlGaAs heterojunction FETs achieving over 10 dB gain at Ka band.<> 相似文献
14.
Jeong D.-H. Jang K.-S. Lee J.-S. Jeong Y.-H. Kim B. 《Electron Device Letters, IEEE》1992,13(5):270-272
Al0.25Ga0.75As/GaAs quantum well delta-doped channel FETs (QWDFETs) have been successfully fabricated by low-pressure metalorganic chemical vapor deposition (LP-MOCVD). The FETs with a gate dimension of 1.8 μm×100 μm had a maximum extrinsic transconductance of 190 mS/mm and a maximum current density of 425 mA/mm. The device showed extremely broad transconductances around its peak. The S-parameter measurements indicated that the current gain and power gain cutoff frequencies of the device were 7 and 15 GHz, respectively. The transconductance versus gate voltage profiles showed a plateau region through a range of 1.7 V supporting spatial confinement of the electrons. These values are among the best reported for delta-doped GaAs-based FETs with a similar device geometry 相似文献
15.
A self aligned In0.52Al0.48As/In0.53 Ga0.47As double heterojunction bipolar transistor (HBT) with a graded heterointerface has been grown by molecular-beam epitaxy (MBE) and tested. The DC characteristics of HBT structures with a compositionally graded junction using a linear graded In0.53Ga0.47-xAlxAs between two ternary layers were investigated. Typical quaternary graded devices with an emitter dimension of 50×50 μm2 exhibited a current gain as high as 1260, as compared to 800 for abrupt devices, at a collector current density of 2.8×103 A/cm2 相似文献
16.
This letter describes a successfully developed enhancement-mode double-doped AlGaAs/InGaAs/AlGaAs heterojunction FET with a buried p/sup +/-n junction gate structure for low-voltage-operated mobile applications. The buried p/sup +/-GaAs gate structure effectively reduced on-resistance (R/sub on/) and suppressed drain-current frequency dispersion for the device with high positive threshold voltage, resulting in high-efficiency characteristics under low-voltage operation. The fabricated p/sup +/-gate HJFET exhibited a low R/sub on/ of 1.4 /spl Omega//spl middot/mm with a threshold voltage of +0.4 V. Negligible frequency dispersion characteristics were obtained through pulsed current-voltage measurements for the device. Under a single 2.7-V operation, a 19.8-mm gate width device exhibited a power added efficiency of 51.9% with 26.8-dBm output power and a -40.1-dBc adjacent channel power ratio using a 1.95-GHz wideband code-division multiple-access signal. 相似文献
17.
Yo-Sheng Lin Tai-Ping Sun Shey-Shi Lu 《Electron Device Letters, IEEE》1997,18(4):150-153
Ga0.51In0.49P/In0.15Ga0.85 As/GaAs pseudomorphic doped-channel FETs exhibiting excellent DC and microwave characteristics were successfully fabricated. A high peak transconductance of 350 mS/mm, a high gate-drain breakdown voltage of 31 V and a high maximum current density (575 mA/mm) were achieved. These results demonstrate that high transconductance and high breakdown voltage could be attained by using In0.15Ga0.85As and Ga0.51In0.49P as the channel and insulator materials, respectively. We also measured a high-current gain cut-off frequency ft of 23.3 GHz and a high maximum oscillation frequency fmax of 50.8 GHz for a 1-μm gate length device at 300 K. RF values where higher than those of other works of InGaAs channel pseudomorphic doped-channel FETs (DCFETs), high electron mobility transistors (HEMTs), and heterostructure FETs (HFETs) with the same gate length and were mainly attributed to higher transconductance due to higher mobility, while the DC values were comparable with the other works. The above results suggested that Ga0.51In0.49P/In0.15Ga0.85 As/GaAs doped channel FET's were were very suitable for microwave high power device application 相似文献
18.
Cruz Serra A. Abreu Santos H. Marty A. Bailbe J.P. Rey G. 《Electron Devices, IEEE Transactions on》1993,40(2):353-357
The differential capacitance C of an abrupt isotype n Al0.5 Ga0.5As/GaAs heterojunction has been modeled by directly calculating the dependence of the space charge on the voltage V at its terminals. The electron charge distribution was calculated considering the 2-D electron gas by simultaneously solving the Schrodinger and the Poisson equations, DX centers included. Results from this model predict an asymmetric bell-shape dependence of C on V , with a maximum near the contact potential, and are in good agreement with experiment. This further provides experimental evidence of Γ-Γ and X -X valley coupling for electrons traveling across the heterojunction. For voltage values not too close to the contact potential, it was possible to find a simple method, based on a total depletion, that gives a good fit to experiment 相似文献
19.
Pao Y.-C. Nishimoto C. Riaziat M. Majidi-Ahy R. Bechtel N.G. Harris J.S. Jr. 《Electron Device Letters, IEEE》1990,11(7):312-314
The surface potential of FETs has shown a strong effect on the channel potential and charge control in the channel. A study of the role of undoped versus doped cap layers in In0.52Al0.48As-In0.53Ga0.47 As-InP high-electron-mobility transistors (HEMT) is discussed. As the result of surface potential effect, direct comparison of 0.3×150-μm2 gate devices yielded improved gate breakdown characteristics and a DC output conductance of less than 15 mS/mm for the surface undoped structure compared to 50 mS/mm for the doped structure. The surface undoped MEMT achieved a very high maximum stable gain of 19.2 dB compared to 16.0 dB for the surface doped HEMT at 18 GHz, largely due to the improved g m/g 0 ratio. This study demonstrates that control of the surface potential in In0.52Al0.48As-In0.53Ga 0.47As-InP HEMTs is consistent with the effect of a gate recess in MESFETs. This study also shows that, in achieving high-gain applications of HEMTs, the surface potential near the gate edge should be optimized through unconventional surface layer design 相似文献
20.
Harrang J.P. Daniels R.R. Fuji H.S. Griem H.T. Ray S. 《Electron Device Letters, IEEE》1991,12(5):206-209
The authors report the successful demonstration of a 1.0-μm gate InAlAs/InGaAs heterojunction FET (HFET) on top of thick InGaAs layers using lattice-matched molecular beam epitaxy (MBE). This scheme is compatible with metal-semiconductor-metal (MSM) photodetector fabrication. The authors measured the performance of InAlAs/InGaAs HFETs from 0 to 40 GHz. Device performance is characterized by peak extrinsic transconductances of 390 mS/mm and as-measured cutoff frequencies up to 30 GHz for a nominal 1.0-μm-gate-length HFET. HFET device measurements are compared for samples growth with and without the thick underlying InGaAs optical-detector absorbing layer 相似文献