Synthesis and some surface studies of laminated ZnO/TiO2 transparent bilayer by two-step growth

A laminated bilayer was prepared by first depositing titanium dioxide (TiO₂) nanocrystals on indium tin oxide (ITO) coated glass by a two-electrode cell. Zinc oxide (ZnO) thin film was thereafter deposited on the TiO₂ by two different techniques: electrochemical deposition and vacuum evaporation. The films were characterized by some surface probing techniques. Morphological study revealed that particle size of the TiO₂ underlayer increases between 110 and 138 nm with increase in deposition voltage. It also showed that ZnO thin film (overlayer) completely covered the underlying TiO₂ without chemical interaction between constituents of both layers. Cross-sectional FESEM study gave values of layered film thickness below 55 µm. Exhibition of strong diffraction peak at plane (121) indicated preference of TiO₂ film's growth orientation. It also suggested a feature of phase-pure brookite. Optical studies showed that each film exhibited strong absorption edge at λ=~330 nm and transmitted fairly across visible light region. Energy band gap lied between 3.24 and 3.43 eV. This study demonstrated successive layer deposition of transparent metal oxide structures from inorganic reagents. It also reaffirmed TiO₂ as a recipe for barrier layer that can hinder transition of holes from absorber to transparent front contact of nanostructured photonic devices.     

Characterization of cadmium sulfide/titania heterostructure films by utilizing microstructure and optical characteristics

Engineering and controlling the bandgap of semiconducting metal oxide (TiO₂) to enhance photoactivity under visible light is challenging. Impact of the changing CdS thickness (50–150 nm) on the structure and optical properties of the CdS/TiO₂ heterostructure films (HSFs) which fabricated by pulsed laser deposition (PLD) was observed. XRD, FE-SEM, AFM, UV–vis and PL spectroscopy measurements were utilized to characterize structural and optical behaviors of the films. XRD measurement shows gradual increments of the lattice constants of the films with the increase of CdS thickness. The mean values of the calculated lattice constants and cell volume (V) were a=b=0.3785 nm, c=0.9475 nm and V=13.58 nm³ respectively. The average of crystallite sizes estimated for TiO₂ and CdS/TiO₂ at various CdS thickness is 12.20, 13.49, 24.24 and 43.10 nm. FESEM images prove the high quality nanocrystalline nature of the films without cracks and dislocation. The root means square roughness of the films was increased with the increase of CdS thickness as showed by AFM images. UV–vis measurement reveals an improvement in the optical absorbance of HSFs in the range of 380–550 nm due to presence of CdS. Interestingly, the PL intensity was enhanced by a factor of nineteen compare to pure TiO₂ attributed to the charge carrier recombination in the band gap. The current results suggest that possibility to improve the optical and structural properties of the TiO₂ films and also it possible to fabricate high quality CdS/TiO₂ HSFs by variation of the CdS thickness.     

Influence of Ti film thickness and oxidation temperature on TiO2 thin film formation via thermal oxidation of sputtered Ti film

Single-phase rutile TiO₂ films with good crystallinity were obtained by thermal oxidation of sputtered Ti films on Si and quartz substrates. The influence of the Ti film thickness on oxidation was systematically investigated. A temperature of 823 K was sufficient to fully oxidize Ti films of <0.2 μm in thickness, but 923 K was required for complete oxidation of thicker films. The crystal structure, phase, composition, and optical properties of the TiO₂ films were investigated using X-ray diffraction (XRD), Raman spectroscopy, energy-dispersive X-ray analysis (EDAX), and UV-vis-NIR spectroscopy. XRD and Raman analyses showed that the TiO₂ films are rutile phase. The bandgap of the TiO₂ films decreased with increasing thickness. A growth mechanism for TiO₂ thin films due to thermal oxidation of sputtered Ti films is proposed. Oxidation commences from the surface and proceeds inside the bulk and Ti→TiO₂ phase transformation occurs via different intermediate phases. We found that the oxidation temperature rather than the duration is the dominant factor in the growth of TiO₂ thin films.     

The significant effect of film thickness on the properties of chalcopyrite thin absorbing films deposited by RF magnetron sputtering

In this paper, thickness dependent structural, surface morphological, optical and electrical properties of RF magnetron sputtered CuIn_0.8Ga_0.2Se₂ (CIGS) thin films were studied using X-ray diffraction (XRD), Transmission electron microscopy (TEM), Field emission scanning electron microscopy (FE-SEM), Atomic force microscopy (AFM), UV–vis–NIR spectrophotometer and Keithley electrical measurement unit. The peak intensity along (112) plane as well as crystallite size was found to increase with thickness. However, for higher film thickness >1.16 μm, crystallinity reduced due to higher % of Cu content. TEM analysis confirmed pollycrysallinity as well as chalcopyrite phase of deposited films. The band gap was found to decrease with increase in thickness yielding a minimum value of 1.12 eV for film thickness 1.70 μm. The I–V characteristics showed the ohmic behavior of metal semiconductor contact with higher conductivity for film thickness 1.16 μm.     

Sputtered oxides used for passivation layers of amorphous InGaZnO thin film transistors

Four sputtered oxide films (SiO₂, Al₂O₃, Y₂O₃ and TiO₂) along with their passivating amorphous InGaZnO thin film transistors (a-IGZO TFTs) were comparatively studied in this paper. The device passivated by an Al₂O₃ thin film showed both satisfactory performance (μ_FE=5.3 cm²/V s, I_on/I_off>10⁷) and stability, as was probably related to smooth surface of Al₂O₃ thin films. Although the performance of the a-IGZO TFTs with a TiO₂ passivation layer was also good enough (μ_FE=3.5 cm²/V s, I_on/I_off>10⁷), apparent V_th shift occurred in positive bias-stress tests due to the abnormal interface state between IGZO and TiO₂ thin films. Sputtered Y₂O₃ was proved no potential for passivation layers of a-IGZO TFTs in this study. Despite unsatisfactory performance of the corresponding a-IGZO TFT devices, sputtered SiO₂ passivation layer might still be preferred for its high deposition rate and excellent transparency which benefit the mass production of flat panel displays, especially active-matrix liquid crystal displays.     

Nanotribological properties of ALD-processed bilayer TiO2/ZnO films

TiO₂/ZnO films grown by atomic layer deposition (ALD) demonstrated nanotribological behaviors using scratch testing. TEM profiles obtained an amorphous structure TiO₂ and nanocrystalline structure ZnO, whereas the sample has significant interface between the TiO₂/ZnO films. The experimental results show the relative XRD peak intensities are mainly contributed by a wurtzite oxide ZnO structure and no signal from the amorphous TiO₂.With respect to tribology, increased friction causes plastic deformation between the TiO₂ and ZnO films, in addition to delamination and particle loosening. The plastic deformation caused by adhesion and/or cohesion failure is reflected in the nanoscratch traces. The pile-up events at a loading penetration of 30 nm were measured at 21.8 μN for RT, 22.4 μN for 300 °C, and 36 μN for 400 °C. In comparison to the other conditions, the TiO₂/ZnO films annealed at 400 °C exhibited higher scratch resistance and friction with large debris, indicating the wear volume is reduced with increased annealing temperature and loading.     

Biaxially aligned YBCO film tapes fabricated by all pulsed laser deposition

Biaxially aligned yttria-stabilized zirconia (YSZ) films on Ni-based alloy substrates were realized with high deposition rate of 0.5 μm min⁻¹ by the inclined substrate deposition (ISD) technique without ion beam assistance. The microstructure of YSZ was examined to study the growth mechanism of biaxial alignment by ISD. Columnar structures toward the plasma plume suggested a self-shadowing effect in the ISD process. To raise I_c values, YBCO thickness was increased up to 5 μm. Thick YBCO films with high J_c values were realized on the ISD-grown YSZ. Long YBCO tapes with biaxial alignment were successfully fabricated using continuous pulsed laser deposition and a high I_c value of 37.0 A (77.3 K, 0 T) at a 75 cm voltage tap spacing was achieved.     

Low-cost TiO2/Sb2(S,Se)3 heterojunction thin film solar cell fabricated by sol-gel and chemical bath deposition

Low cost TiO₂/ Sb₂(S, Se)₃ heterojunction thin film solar cell are prepared successfully by using sol-gel and chemical bath deposition. At first, TiO₂ thin film is prepared on the ITO-coated glass substrate by a simple sol-gel and dip-coating method. Subsequently, Sb₂(S, Se)₃ film is fabricated on TiO₂ by selenizing the Sb₂S₃ film prepared by chemical bath deposition (CBD). The heat-treated process of TiO₂ and Sb₂(S, Se)₃ films has been discussed, respectively. After being heat-treated at 550 °C for TiO₂ and 290 °C for Sb₂(S, Se)₃ films, the photovoltaic devices are completed with the conductive graphite as electrode. The J-V characteristics of TiO₂/ Sb₂(S, Se)₃ solar cell are measured and the open circuit voltage (V_oc) of this cell is about 350 mV.     

Application of sputter-deposited amorphous and anatase TiO2 as electron-collecting layers in inverted organic photovoltaics

We demonstrate the deposition of amorphous and anatase TiO₂ on indium tin oxide (ITO) substrates via the process of sputtering, and the use of these materials as electron-collecting layers (ECLs) in inverted-type organic photovoltaics (OPVs). Anatase TiO₂ was obtained via vacuum-annealing of as-deposited amorphous TiO₂ at 300 °C. No deterioration of optical and electrical properties of ITO was observed after both sputter-deposition of TiO₂ and annealing process. The anatase TiO₂ proved to be an effective ECL when employed in inverted OPVs using bulk heterojunction photoactive layer of poly(3-hexylthiophene) and [6,6]-phenyl-C61-butyric acid methyl ester, achieving a power conversion efficiency of 3.3% (J_SC = 9.0 mA cm^?2, V_OC = 0.62 V and FF = 0.60).     

Influence of processing and annealing steps on electrical properties of InAlN/GaN high electron mobility transistor with Al2O3 gate insulation and passivation

We report on preparation and electrical characterization of InAlN/AlN/GaN metal–oxide–semiconductor high electron mobility transistors (MOS HEMTs) with Al₂O₃ gate insulation and surface passivation. About 12 nm thin high-κ dielectric film was deposited by MOCVD. Before and after the dielectric deposition, the samples were treated by different processing steps. We monitored and analyzed the steps by sequential device testing. It was found that both intentional (ex situ) and unintentional (in situ before Al₂O₃ growth) InAlN surface oxidation increases the channel sheet resistance and causes a current collapse. Post deposition annealing decreases the sheet resistance of the MOS HEMT devices and effectively suppresses the current collapse. Transistors dimensions were source-to-drain distance 8 μm and gate width 2 μm. A maximum transconductance of 110 mS/mm, a drain current of ～0.6 A/mm (V_GS = 1 V) and a gate leakage current reduction from 4 to 6 orders of magnitude compared to Schottky barrier (SB) HEMTs was achieved for MOS HEMT with 1 h annealing at 700 °C in forming gas ambient. Moreover, InAlN/GaN MOS HEMTs with deposited Al₂O₃ dielectric film were found highly thermally stable by resisting 5 h 700 °C annealing.     

High photosensitivity with enhanced photoelectrical contribution in hybrid nanocomposite flexible UV photodetector

To devise a reliable strategy to develop an ultraviolet (UV) sensitive hybrid photodetector, plasma process is utilized as a single step method for production of large area nanocomposite films based on plasma polymerized aniline–titanium dioxide (PPani–TiO₂). The synthesis of PPani–TiO₂ nanocomposite films are made using reactive magnetron sputtering in combination with plasma polymerization. The deposited PPani–TiO₂ nanocomposite films are characterized and discussed in terms of structural, optical and electrochemical properties. A hybrid flexible nanostructured UV photodetector is constructed from PPani–TiO₂ nanocomposite and its optoelectronic properties are evaluated which exhibits a greatly enhanced photosensitivity resulting in high photoconductive gain (G = 4.56 × 10⁴) and high responsivity (R = 9.36 × 10³ AW⁻¹) under UV illumination of 254 nm. The flexible devices are successfully operated under bending up to 170° (bending radius, R = 8 mm) and showed a good folding strength and stability. The proposed plasma based method provides a green technology where the self-assembly of molecules, that is, the spontaneous association of atomic or molecular building blocks under plasma environment, emerge as a successful strategy to form well-defined structural and morphological units of nanometer dimensions.     

Development of highly conducting n-type micro-crystalline silicon oxide thin film and its application in high efficiency amorphous silicon solar cell

Wide band gap and highly conducting n-type nano-crystalline silicon film can have multiple roles in thin film solar cell. We prepared phosphorus doped micro-crystalline silicon oxide films (n-μc-SiO:H) of varying crystalline volume fraction (X_c) and applied some of the selected films in device fabrication, so that it plays the roles of n-layer and back reflector in p-i-n type solar cells. It is generally understood that a higher hydrogen dilution is needed to prepare micro-crystalline silicon, but in case of the n-μc-SiO:H an optimized hydrogen dilution was found suitable for higher X_c. Observed X_c of these films mostly decreased with increased plasma power (for pressure<2.0 Torr), increased gas pressure, flow rate of oxygen source gas and flow rates of PH₃>0.08 sccm. In order to determine deposition conditions for optimized opto-electronic and structural characteristics of the n-μc-SiO:H film, the gas flow rates, plasma power, deposition pressure and substrate temperature were varied. In these films, the X_c, dark conductivity (σ_d) and activation energy (E_a) remained within the range of 0–50%, 3.5×10⁻¹⁰ S/cm to 9.1 S/cm and 0.71 eV to 0.02 eV, respectively. Low power (30 W) and optimized flow rates of H₂ (500 sccm), CO₂ (5 sccm), PH₃ (0.08 sccm) showed the best properties of the n-μc-SiO:H layers and an improved performance of a solar cell. The photovoltaic parameters of one of the cells were as follows, open circuit voltage (V_oc), short circuit current density (J_sc), fill-factor (FF), and photovoltaic conversion efficiency (η) were 950 mV, 15 mA/cm², 64.5% and 9.2% respectively.     

Solution processable poly(2,5-dialkyl-2,5-dihydro-3,6-di-2-thienyl-pyrrolo[3,4-c]pyrrole-1,4-dione) for ambipolar organic thin film transistors

Solution processable diketopyrrolopyrrole (DPP)-bithiophene polymers (PDBT) with long branched alkyl side chains on the DPP unit are synthesized. These polymers have favourable highest occupied molecular orbital (HOMO) and lowest unoccupied molecular orbital (LUMO) energy levels for the injection and transport of both holes and electrons. Organic thin film transistors (OTFTs) using these polymers as semiconductors and gold as source/drain electrodes show typical ambipolar characteristics with very well balanced high hole and electron mobilities (μ_h = 0.024 cm² V^?1 s^?1 and μ_e = 0.056 cm² V^?1 s^?1). These simple and high-performing polymers are promising materials for ambipolar organic thin film transistors for low-cost CMOS-like logic circuits.     

Nb-doped TiO2 sol–gel films for CO sensing applications

Nb doped titania (TiO₂:Nb) multilayered films (1–10 layers) with anatase structure were obtained by the low-cost sol–gel and dipping method on microscope glass substrates, followed by thermal treatment at 450 °C for 1 h. After each layer deposition, an intermediate annealing step was performed at 300 °C for 30 min. Doping TiO₂ sol–gel films with a low amount of Nb (0.8 at%) allows obtaining an improved CO sensor able to operate under environmental atmosphere (air). It was found that the sensor sensitivity is less dependent on the film thickness but is significantly influenced by Nb doping at the optimal working temperature of 400 °C. Good recovery characteristics were obtained for a wide CO detection range, between 0 and 2000 ppm. The gas-sensing behavior of the films was correlated with the structural, chemical and morphological properties of the multi-layered structures.     

Control of the Ti diffusion in Pt/Ti bottom electrodes for the fabrication of PZT thin film transducers

For the achievement of microactuators based on piezoelectric thin films, a Pt/Ti/Si bottom electrode is widely used. This study presents the experimental results for Ti out-diffusion in Pt and Si for both sputtered Pt/Ti and Pt/TiO_x electrodes. These results have been compared before and after a rapid thermal annealing (RTA). The diffusion has been characterized by secondary ion mass spectroscopy (SIMS) analysis using Cs⁺ as a primary ion source. The Pt orientation has been observed by XRD measurements. Ti thin films (20 nm) have been sputtered in pure Ar whereas TiO_x films have been obtained by reactive sputtering in a mixture of Ar/O₂ (90/10). Finally, the Pt (100 nm) has been sputtered without vacuum breaking. After RTA (400°C, 30 s, in N₂), the Pt film exhibited a (1 1 1) orientation for both Ti and TiO_x adhesion films. The roughness of the Pt film measured by AFM with TiO_x underlayer was 80% less than that of the Pt/Ti bi-layer. The TiO_x film, as shown by SIMS analysis, has drastically reduced the diffusion of Ti in both Pt and Si. This phenomenon is accompanied by a very low Pt roughness. These results are analyzed in terms of diffusion and regrowth mechanisms inside the Pt film.     

Effects of annealing technique and TiO2 seed layer on the phase composition of 0.7Pb(Mg1/3Nb2/3)O3–0.3PbTiO3 film

The lead magnesium niobate–lead titanate (PMN–PT) thin films with and without the TiO₂ seed layer were prepared by a pulsed laser deposition (PLD) deposited on Pt/Ti/SiO₂/Si substrates. The films were treated by two-step annealing and normal annealing with rapid thermal annealing (RTA). The effects of two-step annealing and the TiO₂ seed layer on the phase composition of PMN–PT films were studied. The results show that the PMN–PT film with TiO₂ seed layer can gain a pure perovskite phase with a high (1 0 0) preferential orientation after the two-step annealing technique.     

Sol–gel derived nanocrystalline ZnO photoanode film for dye sensitized solar cells

Nanocrystalline ZnO was synthesized from zinc (II) acetate/oxalate mixture using a facile sol–gel synthesis and is characterized by techniques such as powder XRD, FTIR and Raman spectroscopy, TEM and SEM. The TEM and SEM study showed that the nanocrystalline ZnO powder and film have an average particle size of 25 nm. This material has been successfully applied as photoanodes in dye sensitized solar cells (DSCs) constructed with standard N719 dye and conventional iodide/triiodide (I⁻/I₃⁻) electrolytes. A systematic investigation of the performance of DSCs with film thickness and dyeing time had also been carried out. Among the five different film thicknesses 4, 8, 12, 16 and 20 μm prepared, the best result was obtained for the film thickness of 16 μm for 2 h dying showing an efficiency of 2.2% with a J_SC of 4.7 mA cm⁻² and a very high fill factor of >73%.     

Study of the correlation between structural and photoluminescence properties of CdSe thin films deposited by close-spaced vacuum sublimation

CdSe polycrystalline films were deposited by a close-spaced vacuum sublimation method at different substrate temperatures (T_s) using glass slides as substrates. At T_s≤673 K the films have a structure with strong dispersion of grain size (d) (from 0.1 to 0.3 μm). In this case the layer-by-layer mechanism determines the growth process of the layers. For T_s=873 K they have a columnar-like structure with a clear growth texture and the average grain size d=3–4 μm. The films obtained at T_s>473 K are n-type and only correspond to a single wurtzite phase. The crystallites are preferentially oriented with the (102) planes parallel to the substrate. At lower temperatures the films are bi-phase. The microstress level in CdSe films obtained at Т_s=873 K (0.5×10⁻³) is considerably smaller than for the films deposited at Т_s=773 K (4.0×10⁻³). Increase of the value of T_s improves the stoichiometry of CdSe films. Analysis of the low-temperature photoluminescence (PL) spectra let us determine the nature and energy of point and extended defects in the investigated films. It was shown that the films contain Na(Li) and P residual impurities. The results of the structural and PL measurements showed that the CdSe polycrystalline films are of fairly good crystal and optical quality for T_s=873 K and can be suitable for various applications.     

Ambipolar field-effect transistors with bilayered thiophene/phenylene co-oligomers

Bilayered organic field-effect transistors were fabricated by successive vapor-depositions of 1,4-bis{5-[4-(trifluoromethyl)phenyl]thiophene-2-yl}benzene (AC5-CF₃) and 5,5″-bis(4-biphenylyl)-2,2′:5′,2″-terthiophene (BP3T). With decreasing thickness of the n-type AC5-CF₃ film in contact with the dielectric layer, ambipolar characteristics were improved under both positive and negative gate biases. Two types of asymmetric source/drain electrodes were prepared by either obliquely shadowed lamination or mask-shifted depositions of AlLi and Au. The latter method in which the device was characterized without exposure to air after the electrode deposition of AlLi resulted in remarkable improvement of ambipolarity and reduction of leak currents. Finally, optimized ambipolar mobilities of μ_e = 5.00 × 10^?2 and μ_h = 1.56 × 10^?2 cm² V^?1 s^?1) were obtained with 5-nm-thick AC5-CF₃ and 30-nm-thick BP3T.     

Effect of AlN buffer layer thickness on the properties of GaN films grown by pulsed laser deposition

The GaN films are grown by pulsed laser deposition (PLD) on sapphire, AlN(30 nm)/Al₂O₃ and AlN(150 nm)/Al₂O₃, respectively. The effect of AlN buffer layer thickness on the properties of GaN films grown by PLD is investigated systematically. The characterizations reveal that as AlN buffer layer thickness increases, the surface root-mean-square (RMS) roughness of GaN film decreases from 11.5 nm to 2.3 nm, while the FWHM value of GaN film rises up from 20.28 arcmin to 84.6 arcmin and then drops to 31.8 arcmin. These results are different from the GaN films deposited by metal organic chemical vapor deposition (MOCVD) with AlN buffer layers, which shows the improvement of crystalline qualities and surface morphologies with the thickening of AlN buffer layer. The mechanism of the effect of AlN buffer layer on the growth of GaN films by PLD is hence proposed.