Influence of Mn doping on structural,optical and electrical properties of CdO thin films prepared by cost effective spray pyrolysis method

Transparent and conducting cadmium oxide (CdO) and manganese doped CdO (Mn: CdO) thin films were deposited using a low cost spray pyrolysis method on the glass substrate at 300 °C. For Mn doping, various concentrations of manganese acetate (1–3 wt%) was used in the spraying precursor solution. The structural, electrical and optical properties of CdO and Mn: CdO films were investigated using X-ray diffraction (XRD), scanning electron microscope (SEM), atomic force microscope (AFM), UV–vis and Hall measurement. X-ray diffraction study reveals that the CdO and Mn: CdO films are possessing cubic crystal structures. SEM and AFM studies reveal that the grain size and roughness of the films are increased with increasing Mn doping concentration. Optical transmittance spectra of the CdO film decreases with increasing doping concentration of manganese. The optical band gap of the films decreases from 2.42 eV to 2.08 eV with increasing concentration of manganese. A minimum resistivity of 1.11×10⁻³ Ω cm and maximum mobility of 20.77 cm² V⁻¹ s⁻¹ is achieved for 1 wt% of manganese doping.     

Development of transparent conducting copper and iron co-doped cadmium oxide films: Effect of annealing in hydrogen atmosphere

Hydrogenated (annealed in hydrogen atmosphere) cadmium oxide (CdO) thin films co-doped with iron (Fe) of different levels and fixed (2.5%) copper (Cu) amount were deposited on glass and silicon wafer substrates by thermal evaporation. The films were characterised with X-ray fluorescence, X-ray diffraction, optical spectroscopy, and dc-electrical measurements. The obtained results show important improvements in the conductivity, mobility, and carrier concentration compared to un-doped and non-hydrogenated CdO. Hydrogenated CdO doped with 2.5% Cu and 1.3% Fe improved the conductivity (2293.6 S/cm) by ~46 times, mobility (78.31 cm²/V s) by ~11 times, and carrier concentration (1.82×10²⁰ cm⁻³) by ~4 times. This suggests the possibility of using CdO:Cu:Fe–H as transparent-conducting-oxide and dilute-magnetic-semiconductor field of applications.     

Characteristics of ZnOV2O5MnO2Nb2O5Er2O3 semiconducting varistors with sintering processing

The effects of sintering temperature on the microstructure, electrical properties, and dielectric characteristics of ZnOV₂O₅MnO₂Nb₂O₅Er₂O₃ semiconducting varistors have been studied. With increase in sintering temperature the average grain size increased (4.5–9.5 μm) and the density decreased (5.56–5.45 g/cm³). The breakdown field decreased with an increase in the sintering temperature (6214–982 V/cm). The samples sintered at 900 °C exhibited remarkably high nonlinear coefficient (50). The donor concentration increased with an increase in the sintering temperature (0.60×10¹⁸–1.04×10¹⁸ cm^?3) and the barrier height exhibited the maximum value (1.15 eV) at 900 °C. As the sintering temperature increased, the apparent dielectric constant increased by more than four-fold.     

Dependence of the optoelectronic properties of selenium-hyperdoped silicon on the annealing temperature

Selenium-hyperdoped silicon was prepared by ion implantation at 100 eV to a dose of 6×10¹⁵ Se/cm², followed by furnace annealing at 500–900 °C for 30 min. A phase transition from amorphous to crystalline was observed for the sample annealed at 600 °C. Carrier density in the Se doping layer gradually increases with the annealing temperature and a high carrier/donor ratio of 7.5% was obtained at 900 °C. The effects of annealing temperature on the rectifying behavior and external quantum efficiency of n⁺p junctions formed on Se-hyperdoped silicon were also investigated. We found that 700 °C was the optimal annealing temperature for improving the crystallinity, below-bandgap absorption, junction rectification and external quantum efficiency of Se-doped samples.     

Properties of In2O3 films obtained by thermal oxidation of sprayed In2S3

In₂S₃ thin films were grown by the chemical spray pyrolysis (CSP) method using indium chloride and thiourea as precursors at a molar ratio of S:In=2.5. The deposition was carried out at 350 °C on quartz substrates. The film thickness is about 1 µm. The films were then annealed for 2 h at 550, 600, 650 and 700 °C in oxygen flow. This process allows the transformation of nanocrystal In₂O₃ from In₂S₃ and the reaction is complete at 600 °C. X-ray diffraction spectra show that In₂O₃ films are polycrystalline with a cubic phase and preferentially oriented towards (222). The film grain size increases from 19 to 25 nm and RMS values increase from 9 to 30 nm. In₂O₃ films exhibit transparency over 70–85% in the visible and infrared regions due to the thickness and crystalline properties of the films. The optical band gap is found to vary in the range 3.87–3.95 eV for direct transitions. Hall effect measurements at room temperature show that resistivity is decreased from 117 to 27 Ω cm. A carrier concentration of 1×10¹⁶ cm^?3 and mobility of about 117 cm² V^?1 s^?1 are obtained at 700 °C.     

Contact resistance between pentacene and indium–tin oxide (ITO) electrode with surface treatment

Contact resistance between indium–tin oxide (ITO) electrode and pentacene was studied by transmission line method (TLM). Organic solvent cleaned, inorganic alkali cleaned, and self-assembled monolayer (with OTS: octadecyltrichlorosilane) modified ITO electrode structures were compared. Pentacene layer of 300 Å thickness was vacuum deposited on patterned ITO layer at 70 °C with a deposition rate of 0.3 Å/s. Alkali cleaned and SAM modified ITO gave a lower contact resistance of about 6.34 × 10⁴ Ω cm² and 1.88 × 10³ Ω cm², respectively than organic solvent cleaned ITO of about 6.58 × 10⁵ Ω cm². Especially with the SAM treatment, the work function of ITO increased closer to the highest occupied molecular orbital (HOMO) level of pentacene, which lowers the injection barrier between ITO and pentacene. It was also believed that pentacene morphology was improved on SAM modified ITO surface due to the lowering of the surface energy. We could obtain the low contact resistance with SAM treatment which is comparable to the measured value of gold–pentacene contact, 1.86 × 10³ Ω cm². This specific contact resistance is still much higher than that of amorphous silicon thin film transistor (0.1–30 Ω cm²).     

Effects of Cu incorporation on physical properties of ZnTe thin films deposited by thermal evaporation

The present paper reports on a systematic study of the Cu doping effect on the optical, electrical and structural properties of ZnTe:Cu (Cu=0, 6, 8, and 10 at%) thin films. Polycrystalline Cu-doped ZnTe thin films were deposited on glass substrates at room temperature by thermal evaporation. A detailed characterization of the Cu-doped ZnTe films were performed by X-ray diffraction (XRD), Spectrophotometry, Fourier transform infrared spectroscopy (FT-IR) and Raman spectroscopy. XRD of the as-deposited Cu-doped ZnTe films belong to single-phase cubic structure of ZnTe with preferential orientation along (111) planes revealed minor effect of Cu content. The interference pattern in optical transmission spectra was analyzed to determine energy band gap, refractive index, extinction coefficient and thickness of the films. Wemple–DiDomenico and Tauc's relation were used for the determination and comparison of optical band gap values. The formation of ZnTe and Cu-doped ZnTe phase was confirmed by FT-IR. AC conductivity in a frequency range of 0–7 MHz has been studied for investigation of the carriers hoping dynamics in the films. Raman spectra indicated merely typical longitudinal optical (LO) phonon mode of the cubic structure ZnTe thin film at 194 cm⁻¹ because the excitation energy is well above of the optical band-gap of the material and exhibited a blue-shift from 194 to 203 cm⁻¹ with Cu which could be associated to the substitution of Zn atom with Cu at the lattice sites.     

Properties of fluorine-doped SnO2 thin films by a green sol–gel method

Fluorine doped tin oxide (FTO) films were fabricated on a glass substrate by a green sol–gel dip-coating process. Non-toxic SnF₂ was used as fluorine source to replace toxic HF or NH₄F. Effect of SnF₂ content, 0–10 mol%, on structure, electrical resistivity, and optical transmittance of the films were investigated using X-ray diffraction, Hall effect measurements, and UV–vis spectra. Structural analysis revealed that the films are polycrystalline with a tetragonal crystal structure. Grain size varies from 43 to 21 nm with increasing fluorine concentration, which in fact critically impacts resultant electrical and optical properties. The 500 °C-annealed FTO film containing 6 mol% SnF₂ shows the lowest electrical resistivity 7.0×10⁻⁴ Ω cm, carrier concentration 1.1×10²¹ cm⁻³, Hall mobility 8.1 cm²V⁻¹ s⁻¹, optical transmittance 90.1% and optical band-gap 3.91 eV. The 6 mol% SnF₂ added film has the highest figure of merit 2.43×10⁻² Ω⁻¹ which is four times higher than that of un-doped FTO films. Because of the promising electrical and optical properties, F-doped thin films prepared by this green process are well-suited for use in all aspects of transparent conducting oxide.     

Low-temperature low-pressure die attach with hybrid silver particle paste

New types of die attach pastes comprising micron-sized Ag particles hybridized with submicron-sized Ag particles were considered as lead-free die attach materials for SiC power semiconductors. Micron-sized Ag particles in alcohol solvent were prepared by mixing the die attach paste with submicron-sized Ag particles. The alcohol vaporizes completely during sintering and no residue exists in the bonding layer. The Ag layer has a uniform porous structure. The electrical resistivity of the printed tracks decreases below 1 × 10^?5 Ω cm when sintered above 200 °C. When sintered at 200 °C for 30 min, the average resistivity reaches 5 × 10^?6 Ω cm, which is slightly higher than the value obtained by using Ag nanoparticle paste. A SiC die was successfully bonded to a direct bonded copper substrate and the die-shear strength gradually increases with the increase in bonding temperature up to 300 °C. The Ag die attach bond layer was stable against thermal cycles between ?40 °C and 300 °C.     

Study on the thermal stability of Ga-doped ZnO thin film: A transparent conductive layer for dye-sensitized TiO2 nanoparticles based solar cells

Generally, optoelectronic devices are fabricated at a high temperature. So the stability of properties for transparent conductive oxide (TCO) films at such a high temperature must be excellent. In the paper, we investigated the thermal stability of Ga-doped ZnO (GZO) transparent conductive films which were heated in air at a high temperature up to 500 °C for 30 min. After heating in air at 500 °C for 30 min, the lowest sheet resistance value for the GZO film grown at 300 °C increased from 5.5 Ω/sq to 8.3 Ω/sq, which is lower than 10 Ω/sq. The average transmittance in the visible light of all the GZO films is over 90%, and the highest transmittance is as high as 96%, which is not influenced by heating. However, the transmittance in the near-infrared (NIR) region for the GZO film grown at 350 °C increases significantly after heating. And the grain size of the GZO film grown at 350 °C after annealing at 500 °C for 30 min is the biggest. Then dye-sensitized TiO2 NPs based solar cells were fabricated on the GZO film grown at 350 °C (which exhibits the highest transmittance in NIR region after heating at 500 °C for 30 min) and 300 °C (which exhibits the lowest sheet resistance after heating at 500 °C for 30 min). The dye-sensitized solar cell (DSSC) fabricated on the GZO film grown at 350 °C exhibits superior conversion efficiency. Therefore, transparent conductive glass applying in DSSCs must have a low sheet resistance, a high transmittance in the ultraviolet–visible–infrared region and an excellent surface microstructure.     

Improving carriers mobility in copper and iron-codoped CdO

Thin films of Fe and Cu-codoped CdO (CdO:Cu:Fe) with different Fe content and fixed Cu content were deposited in a high vacuum on glass and Si wafer substrates. These films were studied by X-ray fluorescence (XRF), X-ray diffraction (XED), optical spectroscopy, and dc-electrical measurements. The structural results show enhancement of film [1 1 1] orientation with Fe doping especially with 1.3%Fe film. Also, light doping with Fe improves the dc-conduction parameters of the CdO:Cu:Fe films so that the utmost enhancement of mobility (90.5 cm²/Vs) and conductivity (1470.6 S/cm) was found with 1.3 wt% Fe doping level. It was found that the variation in the bandgap is related to the variation in electron concentration that caused by Fe doping. For low Fe ion concentration (<1.3 wt% ), the bandgap varies according to the Moss–Burstein model.     

Influence of Cu doping on physical properties of sol-gel processed SnS thin films

Copper-doped tin sulfide thin films (Cu-SnS) with different Cu doping concentrations were prepared by using the spin coating technique and their structural, electrical, and optical properties were studied. All the prepared films were polycrystalline and exhibited diffraction peaks corresponding to orthorhombic SnS with the preferred (111) orientation. The XRD spectra revealed improvement in the preferential orientation and crystalline quality with up to 4% Cu doping concentration, whereas Cu doping concentrations above 4% deteriorate the preferential orientation and crystalline quality. It has been observed that upon Cu doping the band gap decreased significantly from 1.46 eV (pure SnS) to 1.37 eV (4% of Cu-doped SnS). Hall measurements revealed the p-type semiconducting nature of the SnS thin films. The observations revealed that doping of SnS with Cu causes a noticeable drop in the room-temperature resistivity value from 10⁵ Ω-cm for pure SnS to 10³ Ω-cm for 4% Cu-doped SnS.     

Non-ohmic effect and pulse aging behavior of V/Mn/Co/Bi/Dy co-doped ZnO semiconducting varistors with sintering processing

We examined the effect of sintering on the microstructure, non-ohmic properties, clamping characteristics, and pulse aging behavior of V/Mn/Co/Bi/Dy codoped ZnO semiconducting varistors. The average grain size increased from 4.7 to 10.4 µm and the densities of the sintered pellets decreased from 5.47 to 5.37 g/cm³ with the increase in sintering temperature. The maximum non-ohmic coefficient (35.3) was obtained at a sintering temperature of 900 °C. Varistors sintered at 900 °C exhibited the best clamp characteristics, a clamp voltage ratio of 1.74–2.54 at a pulse current of 1–25 A. Varistors sintered at 925 °C exhibited the strongest electrical stability; variation rates for the breakdown field measured at 1.0 mA/cm², for the non-ohmic coefficient, and for the leakage current density were 3.4%, 6.6%, and −11.2%, respectively, after application of a pulse current of 100 A.     

Preparation optimization of ATO particles by robust parameter design

3-level-3-factor robust parameter design and variance analysis were employed to optimize the formulatimemon process of antimony doped tin oxide (ATO) particles with high conductivity. Results indicated that optimized formulation parameters were as follow: Sb doped content of 11 mol%, calcination temperature of 800 °C and calcination time of 0.75 h. For the ATO powder prepared under the above optimal condition, the conductivity of ATO in the validation experiment was 7.6511 S cm⁻¹, which was almost close to the predicted value, and the ATO powder had smaller diameter, higher transmittance in visible region as well as better thermal insulating properties than its counterparts.     

Properties of fluorine-doped tin oxide films prepared by an improved sol-gel process

Fluorine-doped tin oxide (FTO) films were prepared by an improved sol-gel process, in which FTO films were deposited on glass substrates using evaporation method, with the precursors prepared by the conventional sol-gel method. The coating and sintering processes were combined in the evaporation method, with the advantage of reduced probability of films cracking and simplified preparation process. The effects of F-doping contents and structure of films on properties of films were analyzed. The results showed the performance index (Φ_TC=3.535×10⁻³ Ω⁻¹ cm) of the film was maximum with surface resistance (R_sh) of 14.7 Ω cm⁻¹, average transmittance (T) of 74.4% when F/Sn=14 mol%, the reaction temperature of the sol was 50 °C, and the evaporation temperature was 600 °C in muffle furnace, and the film has densification pyramid morphology and SnO_2−xF_x polycrystalline structure with tetragonal rutile phase. Compared with the commercial FTO films (Φ_TC=3.9×10⁻³ Ω⁻¹ cm, R_sh=27.4 Ω cm⁻¹, T=80%) produced by chemical vapor deposition (CVD) method, the Φ_TC value of FTO films prepared by an improved sol-gel process is close to them, the electrical properties are higher, and the optical properties are lower.     

Investigation of TiO2 on AlGaAs prepared by liquid phase deposition and its application

The study explored titanium dioxide (TiO₂) on aluminum gallium arsenide (AlGaAs) prepared by liquid phase deposition (LPD) at 40 °C. The leakage current density was about 8.4 × 10^?6 A/cm² at 1 MV/cm. The interface trap density (D_it) and the flat-band voltage shift (ΔV_FB) were 2.3 × 10¹² cm^?2 eV^?1 and 1.2 V, respectively. After rapid thermal annealing (RTA) in the ambient N₂ at 350 °C for 1 min, the leakage current density, D_it, and ΔV_FB were improved to 2.4 × 10^?6 A/cm² at 1 MV/cm, 7.3 × 10¹¹ cm^?2 eV^?1, and 1.0 V, respectively. Finally, the study demonstrates the application to the AlGaAs/InGaAs metal–oxide–semiconductor pseudomorphic high-electron-mobility transistor (MOS-PHEMT). The results indicate the potential of the proposed device with a LPD-TiO₂ gate oxide for power application.     

Influence of thermal annealing on electrical and optical properties of indium tin oxide thin films

Transparent conducting indium tin oxide (ITO) thin films with the thickness of 300 nm were deposited on quartz substrates via electron beam evaporation, and five of them post-annealed in air atmosphere for 10 min at five selected temperature points from 200 °C to 600 °C, respectively. An UV–vis spectrophotometer and Hall measurement system were adopted to characterize the ITO thin films. Influence of thermal annealing in air atmosphere on electrical and optical properties was investigated in detail. The sheet resistance reached the minimum of 6.67 Ω/sq after annealed at 300 °C. It increased dramatically at even higher annealing temperature. The mean transmittance over the range from 400 nm to 800 nm reached the maximum of 89.03% after annealed at 400 °C, and the figure of merit reached the maximum of 17.79 (Unit: 10⁻³ Ω⁻¹) under the same annealing condition. With the annealing temperature increased from 400 °C to 600 °C, the variations of transmittance were negligible, but the figure of merit decreased significantly due to the deterioration of electrical conductivity. With increasing the annealing temperature, the absorption edge shifted towards longer wavelength. It could be explained on the basis of Burstein–Moss shift. The values of optical band gap varied in the range of 3.866–4.392 eV.     

Contact resistivity of amorphous and crystalline GeCu2Te3 to W electrode for phase change random access memory

We have investigated the contact resistivity of GeCu₂Te₃ (GCT) phase change material to a W electrode using the circular transfer length method (CTLM). The contact resistivity ρ_c of as-deposited amorphous GCT to W was 3.9×10⁻² Ω cm². The value of ρ_c drastically decreased upon crystallization and crystalline GCT that annealed at 300 °C showed a ρ_c of 4.8×10⁻⁶ Ω cm². The ρ_c contrast between amorphous (as-deposited) and crystalline (annealed at 300 °C) states was larger in GCT than in conventional Ge₂Sb₂Te₅ (GST). Consequently, it was suggested from a calculation based on a simple vertical structure memory cell model that a GCT memory cell shows a four times larger resistance contrast than a GST memory cell.     

Structural,optical, and photocatalytic properties of the spray deposited nanoporous CdS thin films; influence of copper doping,annealing, and deposition parameters

Nanoporous thin films of Cd_1−xCu_xS (0≤x≤0.06) were grown on a heated glass substrate employing a home-made spray pyrolysis technique. The influences of [Cu]/[Cd] and the annealing in the range 300–500 °C on the structural and morphological properties of the films were investigated by X-ray diffraction (XRD), Fourier transformation infrared spectroscopy (FTIR), field emission scanning electron microscope (FE-SEM) and atomic force microscopy (AFM). The influences of Cu doping ratio, solution flow rate, and the deposition time on the optical properties and photocatalytic activity of these films are also reported. The films are of polycrystalline nature and hexagonal structure. Increasing the Cu doping ratio and annealing temperature improve the (1 0 1) preferential orientation. The crystallite size is ranged from 23.82 to 32.11 nm. XRD and FTIR reveal the formation of CdO in the 6% Cu-doped CdS film annealed at 400 °C and in all films annealed at 500 °C. The pure CdS film is of a porous structure and the close-packing and porosity of the films increase with increasing Cu%. Also, the pore diameter can be controlled from 50 to 15 nm with the increase of Cu content. The films showed transmittance below 70%. The optical band gap of the films is decreased from 2.43 to 1.82 eV with increasing Cu% and flow rate/deposition time. Additionally, the refractive indices and dispersion parameters of the films are also affected by the deposition conditions. Cu doping enhanced the films' photostability as well as the photocatalytic removal of methylene blue (MB).     

Evaporated iron disulfide thin films with sulfurated annealing treatments

FeS₂ thin films were grown on a glass substrate using a physical vapor deposition technique at room temperature. Subsequently, the thin films were annealed in two different atmospheres: vacuum and vacuum-sulfur. In the vacuum-sulfur atmosphere a graphite box was used as sulfur container and the films were sulfurated successfully at 200–350 ºC. It was found that annealing in a vacuum-sulfur atmosphere was indispensable in order to obtain polycrystalline FeS₂ thin films. The polycrystalline nature and pure phase were determined by XRD and Raman techniques and the electrical properties by the Hall effect. Using the sulfurating technique, the n-type semiconductor was prepared at 200–350 °C and a p-type at 500 °C. The carrier concentrations were between 1.19×10²⁰ and 2.1×10²⁰ cm⁻³. The mobility was 9.96–5.25 cm² V⁻¹ s⁻¹ and the resistivity was 6.31×10⁻² to 1.089×10⁻² Ω cm. The results obtained from EDS showed that the films prepared in the vacuum-sulfur atmosphere were close to stoichiometric and that the indirect band gap varied between 1.03 and 0.945 eV.