退火温度对ZnS/PS薄膜的晶体结构和光电性质的影响

用脉冲激光沉积法(PLD)在多孔硅(PS)衬底上生长ZnS薄膜,分别在300℃、400℃和500℃下真空退火。用X射线衍射(XRD)和扫描电子显微镜(SEM)研究了退火对ZnS薄膜的晶体结构和表面形貌的影响,并测量了ZnS/PS复合体系的光致发光(PL)谱和异质结的I-V特性曲线。研究表明,ZnS薄膜仅在28.5°附近存在着(111)方向的高度取向生长,由此判断薄膜是单晶立方结构的-βZnS。随着退火温度的升高,-βZnS的(111)衍射峰强度逐渐增大,且ZnS薄膜表面变得更加均匀致密,说明高温退火可以有效地促进晶粒的结合并改善结晶质量。ZnS/PS复合体系的PL谱中,随着退火温度升高,ZnS薄膜的自激活发光强度增大,而PS的发光强度减小,说明退火处理更有利于ZnS薄膜的发光。根据三基色叠加的原理,ZnS的蓝、绿光与PS的红光相叠加,ZnS/PS体系可以发射出较强的白光。但过高的退火温度会影响整个ZnS/PS体系的白光发射。ZnS/PS异质结的I-V特性曲线呈现出整流特性,且随着退火温度的升高其正向电流增加。     

Effect of preheating and annealing temperature on the microstructure and optoelectronic properties of CZTS films prepared by sol-gel method

The effects of different preheating and annealing temperatures on the surface morphology, microstructure, and optical properties of Cu2ZnSnS4 (CZTS) thin films are investigated by controlling the preheating and annealing temperatures. The prepared thin films were characterized using X-ray diffraction (XRD), Raman spectroscopy, scanning electron microscopy (SEM), and ultra-violet-visible (UV-Vis) spectroscopy techniques. XRD and Raman spectroscopy showed that a Kesterite structure with a selective orientation along the (112) peak was generated, and the thin films produced at a preheating temperature of 300 °C and annealing temperature of 570 °C had fewer secondary phases, which was beneficial for improving the performance of the solar cells. SEM confirms that the crystallite size increases and then decreases as the temperature increases, and the largest and most uniform crystallite size with the smoothest surface is generated at the above preheating and annealing temperatures. UV-Vis measurements show that the thin films generated at the above temperature have the lowest transmittance and the lowest optical band gap value of 1.46 eV, which is close to the optimal band gap value for solar cells and is suitable as an absorber layer material.     

衬底和退火温度对多晶硅薄膜结构及光学性质影响

通过射频等离子体增强化学气相沉积(RF-PECVD)技术与退火处理制备多晶硅薄膜,研究了衬底和退火温度对所制薄膜的结构及光学性质的影响。本次试验最大的晶粒尺寸是在衬底温度为250℃获得,考虑薄膜表面的质量,最佳的退火温度为635℃,衬底温度为225℃,在玻璃衬底形成的晶粒大于50 nm,光学带隙为1.5 e V。结果表明:衬底温度影响着薄膜中氢含量以及相关的缺陷。随着退火温度的升高,晶化率的提高,光学带隙先减小后增大。     

Low temperature thermal annealing of arsenic implanted silicon

The annealing of heavily arsenic implanted (100) silicon using low temperature furnace techniques to obtain metastable concentrations of the dopant is described and the activations obtained are compared with those found after laser and electron beam annealing.     

The effects of high temperature annealing on metal-inducedlaterally crystallized polycrystalline silicon

Metal-induced laterally crystallized (MILC) polycrystalline silicon (poly-Si) with and without a post-crystallization high temperature anneal have been studied and compared. It was revealed using transmission electron microscopy (TEM) that the anneal resulted in significant improvement in the material quality. Consequently, the electrical properties of the annealed MILC poly-Si resistors were greatly enhanced, showing conduction behavior approaching that of single-crystal Si. Thin-film transistors realized on high-temperature annealed MILC poly-Si exhibited excellent device characteristics, thus making them potentially applicable to three-dimensional (3-D) device integration. Based on the TEM observations and a detailed consideration of the mechanism of grain growth during MILC, the effects of the anneal can be explained in terms of the evolution of the unique MILC grain structure during the high temperature treatment     

（英）退火温度对电子束蒸发沉积硅薄膜结构和光学性能的影响

系统研究了退火温度对硅薄膜结构和光学性能的影响。通过电子束蒸发工艺制备硅薄膜,然后在氮气保护下对薄膜样品在200~500°C范围内进行退火处理。使用XRD、拉曼光谱、电子自旋共振和透射光谱测量等方法对薄膜样品进行了表征。结果显示,随着退火温度的升高,非晶硅薄膜结构有序度在短程和中程范围内得到改善,同时缺陷密度显著降低-。当样品在400°C退火后,消光系数k由6.14×10^-3下降到最小值1.02×10~3(1000 nm),这是由于此时硅薄膜缺陷密度也降到最低,约为沉积态薄膜的五分之一。试验结果表明,硅薄膜在适当的温度下退火可以有效地降低近红外区膜层的光学吸收,这对硅薄膜在光学薄膜器件研制中具有重要应用。     

Structural and optoelectronic properties of nanostructured TiO2 thin films with annealing

About 480 nm thick titanium oxide (TiO₂) thin films have been deposited by electron beam evaporation followed by annealing in air at 300–600 °C with a step of 100 °C for a period of 2 h. Optical, electrical and structural properties are studied as a function of annealing temperature. All the films are crystalline (having tetragonal anatase structure) with small amount of amorphous phase. Crystallinity of the films improves with annealing at elevated temperatures. XRD and FESEM results suggest that the films are composed of nanoparticles of 25–35 nm. Raman analysis and optical measurements suggest quantum confinement effects since Raman peaks of the as-deposited films are blue-shifted as compared to those for bulk TiO₂ Optical band gap energy of the as-deposited TiO₂ film is 3.24 eV, which decreases to about 3.09 eV after annealing at 600 °C. Refractive index of the as-deposited TiO₂ film is 2.26, which increases to about 2.32 after annealing at 600 °C. However the films annealed at 500 °C present peculiar behavior as their band gap increases to the highest value of 3.27 eV whereas refractive index, RMS roughness and dc-resistance illustrate a drop as compared to all other films. Illumination to sunlight decreases the dc-resistance of the as-deposited and annealed films as compared to dark measurements possibly due to charge carrier enhancement by photon absorption.     

Effect of annealing temperature on the copper nanoparticles deposited on the silicon nanoporous pillar array

Copper/silicon nanocomposite system (Cu/Si-NPA) is prepared by immersion plating Cu nanoparticles on silicon nanoporous pillar array (Si-NPA). The Cu/Si-NPA samples are heated under nitrogen for 2 h at elevated temperatures of 400 °C, 600 °C, and 800 °C. The morphological changes of Cu nanoparticles before and after heat treatments are characterized by SEM. The crystallinity and the average size of Cu nanoparticles before and after heat treatments are studied by XRD. The results show that two possible mechanisms, Ostwald ripening, and particle migration and coalescence, are believed to be responsible for the ripening of annealed Cu nanoparticles at different annealing temperatures.     

Effect of deposition and annealing conditions on the optical properties of amorphous silicon

The spectral characteristics of the refractive index and the extinction coefficient in the range 0.6–2.0 eV for amorphous silicon films prepared by electron-beam evaporation with variation of the substrate temperature, deposition rate, and annealing temperature in air are presented. The results obtained are discussed on the basis of the changes in the Penn gap energy as a function of the indicated preparation and treatment conditions. Fiz. Tekh. Poluprovodn. 32, 879–881 (July 1998)     

Some annealing properties of low-energy-antimony—implanted silicon resistors

Shallow-implanted antimony in silicon can be used in fabricating n-type silicon resistors with very low temperature coefficient of resistance (TCR), controllably and reproducibly. This paper reports a study of the sheet resistance of silicon resistors implanted with ¹²¹Sb at 10 keV, for various doses and annealing conditions. The methods used in fabricating samples and taking measurements were described in an earlier paper[1]. For high doses, ～ 10¹⁵ Sb/cm², we found that two-stage annealing[2]—preannealing at 550°C followed by annealing at 1000°C—improves the electrical conductivity. For low doses, ～10¹² Sb/cm², the final annealing determines the conductivity. For medium doses, ～10¹³–10¹⁴ Sb/cm², the interplay of damage-annealing and activation of Sb in Si introduces complications, giving a crossover of shet resistance vs implant dose for various annealing temperatures. For doses around 3 × 10¹³ cm^?2, the resistances are very insensitive to the details of annealing sequence and temperature; also the TCR is very low, about 50 ppm/°C. The effect of annealing conditions for various doses, resistivities and TCR values are discussed.     

Effects of annealing conditions on the properties of tantalum oxide films on silicon substrates

The formation of a SiO₂ layer at the Ta₂O₅/Si interface is observed by annealing in dry O₂ or N₂ and the thickness of this layer increases with an increase in annealing temperature. Leakage current of thin (less than 40 nm thick) Ta₂O₅ films decreases as the annealing temperature increases when annealed in dry O₂ or N₂. The dielectric constant vs annealing temperature curve shows a maximum peak at 750 or 800° C resulting from the crystallization of Ta₂O₅. The effect is larger in thicker Ta₂O₅ films. But the dielectric constant decreases when annealed at higher temperature due to the formation and growth of a SiO₂ layer at the interface. The flat band voltage and gate voltage instability as a function of annealing temperature can be explained in terms of the growth of interfacial SiO₂. The electrical properties of Ta₂O₅ as a function of annealing conditions do not depend on the fabrication method of Ta₂O₅ but strongly depend on the thickness of Ta₂O₅ layer.     

Influence of the deposition and annealing conditions on the optical properties of amorphous silicon

The refractive index and extinction coefficient in the range 0.6–2.0 eV of amorphous silicon films deposited by electron-beam evaporation with variation of the substrate temperature, deposition rate, and anneal temperature in an air atmosphere are presented. The results are discussed in terms of variation of the Penn energy gap as a function of the deposition and treatment conditions. Fiz. Tekh. Poluprovodn. 32, 1390–1392 (November 1998)     

退火温度对ZnO掺杂ITO薄膜性能的影响

利用电子束蒸镀方法,在K8玻璃衬底上沉积ZnO掺杂ITO(ZnO-ITO)与ITO薄膜。研究不同退火温度对ZnO-ITO薄膜的微观结构的影响;对比分析了在不同退火温度条件下,ZnO-ITO和无掺杂ITO薄膜的光电性能。结果发现,ZnO-ITO薄膜具有较大的晶粒尺寸,随着退火温度的上升,晶体结构得到改善,表面粗糙度减小,薄膜的光电性能显著提高。ZnO-ITO薄膜经过500℃退火后得到最佳的综合性能,其表面均方根粗糙度(RMS)为32.52nm,电阻率为1.43×10-4Ω.cm;对442nm波长的光,透射率可达98.37%;与ITO薄膜相比,ZnO-ITO薄膜具有显著的抗PEDOT:PSS溶液腐蚀的能力。     

Modification of optoelectronic properties of porous silicon produced in an electrolyte based on heavy water

The methods of infrared spectroscopy, electron spin resonance, and photoluminescence were used to study the porous-silicon layers formed by electrochemical treatment of Si in an HF: D₂O solution. In contrast with the samples prepared in a conventional electrolyte (HF: H₂O), a steady increase in the photoluminescence intensity in the course of routine oxidation of the sample was observed, with the hydrogen coverage of the silicon-skeleton surface retained. A mechanism for anomalous oxidation of the layers of porous silicon obtained in a mixture of HF and heavy water is suggested.     

Dependence of energy conversion efficiency of dye-sensitized solar cells on the annealing temperature of TiO2 nanoparticles

Dye-sensitized solar cells (DSSCs) were fabricated from porous electrodes derived from sol–gel-synthesized (SGS) nanoparticles (NPs) of TiO₂. Current–voltage measurements were performed to investigate performance characteristics of electrodes derived from SGS-NPs of TiO₂ annealed at different temperatures. Experimental results indicate that the effects of bulk traps and surface states within TiO₂ films on recombination of photo-injected electrons in DSSCs depend upon annealing temperature of SGS-TiO₂ NPs. Moreover, electrodes fabricated from SGS-TiO₂ showed higher photoelectric conversion efficiency than nonporous commercial (P25) TiO₂ NPs. Porous structures within SGS-TiO₂ NPs are of great benefit to sensitizer dye adsorption, and consequently to improvement of photo-electrochemical properties of DSSCs.     

SiO_2基质中包埋纳米晶Si光电性质的模拟计算

采用第一性原理方法,研究了SiO2基质中包埋纳米晶Si的电子结构及光学性质。结果表明:位于约1.7eV的吸收峰是–0.59eV能级上的电子向由价键畸变产生的1.2eV能级跃迁的结果。纳米Si粒中含不饱和键的Si原子的p轨道对可见光区光的吸收有主要的贡献。同时由于这些缺陷引入的能级使价带、导带在Fermi面发生交叠而表现出导电性。     

Dependence of wet etch rate on deposition, annealing conditions and etchants for PECVD silicon nitride film

tchants for SiO2 and SiNx:H. A high etching selectivity of SiO2 over SiNx:H was obtained using highly concentrated buffered HE     

沉积、退火条件以及刻蚀液对PECVD氮化硅薄膜湿法刻蚀速率的影响

The influence of deposition, annealing conditions, and etchants on the wet etch rate of plasma enhanced chemical vapor deposition （PECVD） silicon nitride thin film is studied. The deposition source gas flow rate and annealing temperature were varied to decrease the etch rate of SiNx：H by HF solution. A low etch rate was achieved by increasing the SiH4 gas flow rate or annealing temperature, or decreasing the NH3 and N2 gas flow rate. Concentrated, buffered, and dilute hydrofluoric acid were utilized as etchants for Sit2 and SiNx：H. A high etching selectivity of Sit2 over SiNx：H was obtained using highly concentrated buffered HE     

退火温度对NdFeO_3微结构及酒敏性能的影响

采用sol-gel法制备了具有单一斜方钙钛矿结构的NdFeO3样品,研究了退火温度对NdFeO3样品的晶格常数、微结构、电性能及酒敏特性的影响。结果表明:随着退火温度的提高,样品的晶胞体积减小,晶粒度变大,利用该样品制成的气敏元件的电导也随之增大。800℃退火的样品显示出最佳酒敏特性,元件对体积分数为5×10–4的乙醇的最大灵敏度高达151.69,不同退火温度的样品均显示出较好的低温(90℃左右)工作特性。     

退火温度对Cr-Si压阻薄膜电性能的影响

采用射频磁控溅射法在氧化铝陶瓷基底上制备了Cr-Si-Ni-Ti压阻薄膜,研究了不同退火温度对薄膜电性能的影响.结果表明:在溅射态及退火温度低于600℃时,薄膜为非晶态.随着退火温度的升高,薄膜的电阻温度系数(TCR)逐渐增大,应变因子(GF)先增大后减小,室温电阻率(ρ)则逐渐降低.在退火温度为300℃时,Cr-Si...