Electrical and photoelectric properties of Si-based metal–insulator–semiconductor structures with Au nanoparticles at the insulator–semiconductor interface

It is shown that the formation of Au nanoparticles at the insulator–silicon interface in structures with a high density of surface states results in a shift of the Fermi-level pinning energy at this interface towards the valence-band ceiling in silicon and in increasing the surface-state density at energies close to the Fermi level. In this case, a band with a peak at 0.85 eV arises on the photosensivity curves of the capacitor photovoltage, which is explained by the photoemission of electrons from the formed Au-nanoparticle electron states near the valence-band ceiling in silicon.     

Time dependent breakdown characteristics of parylene dielectric in metal–insulator–metal capacitors

In this work, we present reliability results of MIM (Metal–Insulator–Metal) capacitors fabricated with parylene as the dielectric, deposited at room temperature. We have evaluated the time dependent dielectric breakdown (TDDB) of parylene-based MIM capacitors as a function of constant DC voltage stress, area and dielectric thickness of the capacitor. Mean-time-to-failure (MTTF) of parylene evaluated at different stress voltages shows a power law distribution over the applied voltage range and device area, with MTTF driven by the number of defects. Defect density in the parylene capacitors is also reported and is calculated to be ～1.2 × 10³ defects/cm².     

Electrically-driven metal–insulator transition of vanadium dioxide thin films in a metal–oxide-insulator–metal device structure

We report the successful growth of vanadium dioxide (VO₂) films on SiO₂ buffered metal electrode and the fabrication of metal–oxide-insulator–metal (MOIM) junction. The VO₂ film has an abrupt thermal-induced metal–insulator transition (MIT) with a change of resistance of 2 orders of magnitude. The electrically-driven MIT (E-MIT) switching characteristics have been investigated by applying perpendicular voltage to VO₂ based MOIM device at particular temperatures, sharp jumps in electric current were observed in the I–V characteristics under a low threshold voltage of 1.6 V. The Ohmic behavior, non-Ohmic super-linear one, and metallic regime are sequentially observed in the MOIM device with the increase of voltage. It is expected to be of significance in exploring ultrafast electronic devices incorporating correlated oxides based MOIM structure.     

Atomic layer deposited HfO/sub 2/in metal?insulator?metal capacitor for RF IC applications

DC and RF characteristics of Si/SiO₂(~4 mum)/Ti/Pt-HfO₂-Al metal-insulator-metal (MIM) devices were investigated with atomic layer-deposited (ALD) high-k HfO₂ films. Excellent DC and RF properties were obtained compared to those using either SiO₂ or Si₃N₄. Both high capacitance density and small frequency-dependent capacitance reduction were observed in the MIM capacitors, in which ALD HfO₂ was used as an insulator.     

Engineering the current–voltage characteristics of metal–insulator–metal diodes using double-insulator tunnel barriers

The femtosecond-fast transport in metal–insulator–metal (MIM) tunnel diodes makes them attractive for applications such as ultra-high frequency rectenna detectors and solar cells, and mixers. These applications impose severe requirements on the diode current–voltage I(V) characteristics. For example, rectennas operating at terahertz or higher frequencies require diodes to have low resistance and adequate nonlinearity. To analyze and design MIM diodes with the desired characteristics, we developed a simulator based on the transfer-matrix method, and verified its accuracy by comparing simulated I(V) characteristics with those measured in MIM diodes that we fabricated by sputtering, and also with simulations based on the quantum transmitting boundary method. Single-insulator low-resistance diodes are not sufficiently nonlinear for efficient rectennas. Multi-insulator diodes can be engineered to provide both low resistance and substantial nonlinearity. The improved performance of multi-insulator diodes can result from either resonant tunneling or a step change in tunneling distance with voltage, either of which can be made to dominate by the appropriate choice of insulators and barrier thicknesses. The stability of the interfaces in the MIIM diodes is confirmed through a thermodynamic analysis.     

Photon-assisted capacitance–voltage study of organic metal–insulator–semiconductor capacitors

The results are reported of a detailed investigation into the photoinduced changes that occur in the capacitance–voltage (C–V) response of an organic metal–insulator–semiconductor (MIS) capacitor based on the organic semiconductor poly(3-hexylthiophene), P3HT. During the forward voltage sweep, the device is driven into deep depletion but stabilizes at a voltage-independent minimum capacitance, C_min, whose value depends on photon energy, light intensity and voltage ramp rate. On reversing the voltage sweep, strong hysteresis is observed owing to a positive shift in the flatband voltage, V_FB, of the device. A theoretical quasi-static model is developed in which it is assumed that electrons photogenerated in the semiconductor depletion region escape geminate recombination following the Onsager model. These electrons then drift to the P3HT/insulator interface where they become deeply trapped thus effecting a positive shift in V_FB. By choosing appropriate values for the only disposable parameter in the model, an excellent fit is obtained to the experimental C_min, from which we extract values for the zero-field quantum yield of photoelectrons in P3HT that are of similar magnitude, 10^?5 to 10^?3, to those previously deduced for π-conjugated polymers from photoconduction measurements. From the observed hysteresis we deduce that the interfacial electron trap density probably exceeds 10¹⁶ m^?2. Evidence is presented suggesting that the ratio of free to trapped electrons at the interface depends on the insulator used for fabricating the device.     

Quantum-well charge and voltage distribution in a metal–insulator–semiconductor structure upon resonant electron Tunneling

The prerequisites for electron storage in the quantum well of a metal–oxide–p ⁺-Si resonant-tunneling structure and the effect of the stored charge on the voltage distribution are theoretically investigated. Systems with SiO₂, HfO₂, and TiO₂ insulators are studied. It is demonstrated that the occurrence of a charge in the well in the case of resonant transport can be expected in structures on substrates with an acceptor concentration from (5–6) × 10¹⁸ to (2–3) × 10¹⁹ cm^–3 in the range of oxide thicknesses dependent on this concentration. In particular, the oxide layer thickness in the structures with SiO₂/p ⁺-Si(10¹⁹ cm^–3) should exceed ~3 nm. The electron density in the well can reach ~10¹² cm^–2 and higher. However, the effect of this charge on the electrostatics of the structure becomes noticeable only at relatively high voltages far above the activation of resonant transport through the first subband.     

Facile synthetic route to implement a fully bendable organic metal–insulator–semiconductor device on polyimide sheet

Triblock copolymer surfactant, HO(CH₂CH₂O)₂₀(CH₂CH(CH₃)O)₇₀(CH₂CH₂O)₂₀H (i.e. P123)-based nanocrystalline (nc)-TiO₂ thin film had been synthesized on organic flexible polyimide (PI) sheet for their application in organic metal–insulator–semiconductor (MIS) device. The nc-TiO₂ film over PI was successfully deposited for the first time by a systematic solution proceeds dip-coating method and by the assistance of triblock copolymer surfactant. The effect of annealing temperature (270 °C, 5 h) on the texture, morphology and time-induced hydrophilicity was studied by X-ray diffraction (XRD), atomic force microscopy (AFM), X-ray photoelectron spectroscopy (XPS) and contact angle system, respectively, to examine the chemical composition of the film and the contact angle. The surface morphology of the semiconducting layer of organic pentacene was also investigated by using AFM and XRD, and confirmed that continuous crystalline film growth had occurred on the nc-TiO₂ surface over flexible PI sheet. The semiconductor–dielectric interface of pentacene and nc-TiO₂ films was characterized by current–voltage and capacitance–voltage measurements. This interface measurement in cross-link MIS structured device yielded a low leakage current density of 8.7 × 10^?12 A cm^?2 at 0 to ?5 V, maximum capacitance of 102.3 pF at 1 MHz and estimated dielectric constant value of 28.8. Furthermore, assessment of quality study of nc-TiO₂ film in real-life flexibility tests for different types of bending settings with high durability (c.a. 30 days) demonstrated a better comprehension of dielectric properties over flexible PI sheet. We expected them to have a keen interest in the scientific study, which could be an alternate opportunity to the excellent dielectric–semiconductor interface at economic and low temperature processing for large-area flexible field-effect transistors and sensors.     

Interfaces analysis by impedance spectroscopy and transient current spectroscopy on semiconducting polymers based metal–insulator–semiconductor capacitors

Impedance and transient current measurements on metal–insulator–semiconductor (MIS) capacitors are used as tools to thoroughly investigate the bulk and interface electronic transport properties of semiconducting polymers, i.e. poly(3-hexylthiophene) (P3HT). Distinct features were observed at both interfaces, i.e. metal–semiconductor and semiconductor–insulator. The results revealed a dispersive transport in the bulk due to the band tail of the localized states, presence of interface states at the interface between the insulator and the semiconductor and formation of a less conductive small layer at the interface semiconductor–metal contact due to intrusions of sputtered Au particles. Effects of self-assembled monolayers (SAMs) treatments of the gate insulating dielectric were investigated showing that treating the gate dielectric with either ozone or hexamethyldisilazane (HMDS) or octyltrichlorosilane (OTS) alter not only the interface semiconductor–insulator but the bulk properties as well. An exponential density of states with a width parameter of 38–58 meV depending on the surface treatment was found to be representative of the band tail of P3HT. Though both OTS and HMDS treatments slightly increase the density of interface states, only OTS treated samples showed a decrease in disorder parameter of the bulk. The latter fact can be attributed to an increase of the grain size due to a favored π-π stacking film growth. An outcome explaining the already reported increase of the lateral mobility and decrease of the vertical mobility observed upon OTS treatment of the gate insulating dielectric in poly(3-hexylthiophene) based devices.     

Influence of growth conditions of oxide on electrical properties of AlGaN/GaN metal–insulator–semiconductor transistors

AlGaN/GaN metal–insulator–semiconductor high-electron-mobility transistors(MIS-HEMTs) on a silicon substrate were fabricated with silicon oxide as a gate dielectric by sputtering deposition and electron-beam(EB) evaporation. It was found that the oxide deposition method and conditions have great influences on the electrical properties of HEMTs. The low sputtering temperature or oxygen introduction at higher temperature results in a positive equivalent charge density at the oxide/AlGaN interface(Nequ), which induces a negative shift of threshold voltage and an increase in both sheet electron density(ns) and drain current density(ID). Contrarily, EB deposition makes a negative Nequ, resulting in reduced ns and ID. Besides, the maximum transconductance(gm-max) decreases and the off-state gate current density(I_G-off) increases for oxides at lower sputtering temperature compared with that at higher temperature, possibly due to a more serious sputter-induced damage and much larger Nequ at lower sputtering temperature. At high sputtering temperature, I_G-off decreases by two orders of magnitude compared to that without oxygen, which indicates that oxygen introduction and partial pressure depression of argon decreases the sputter-induced damage significantly. I_G-off for EB-evaporated samples is lower by orders of magnitude than that of sputtered ones, possibly attributed to the lower damage of EB evaporation to the barrier layer surface.     

Photoreduction of carbon dioxide by graphene–titania and zeolite–titania composites under low-intensity irradiation

As it is the most important of the greenhouse gases, the utilization and reduction of carbon dioxide have attracted a great attention. As compared to the technological demands for carbon capture and storage (CCS), carbon dioxide reduction is a safe and effective way to convert carbon dioxide to fuel. In this research, two different catalysts, graphene–titania and zeolite–titania, are used to achieve the carbon dioxide reduction. The characteristics of these materials are analyzed by Brunnauer–Emmett–Teller, X-ray diffraction, Fourier transform infrared spectroscopy, ultraviolet–visible, scanning electron microscope and transmission electron microscopy. Because of the different features of the catalysts, various products can be generated through different pathways. Formic acid and methanol are the final products when graphene is used as the catalyst, but only methanol can be generated when zeolite–titania is used as the catalyst. The reaction mechanisms and pathways are discussed.     

Optical-beam profiling by field-controlled metal–semiconductor–metal structures

Optical-beam profiling properties of Schottky-barrier metal–semiconductor–metal (MSM) structures have been investigated experimentally. Making use of a planar molybdenum/n-type silicon/molybdenum (Mo/n-Si/Mo) MSM structure with a wide electrode separation, one-dimensional (1-D) profiling of optical-beam intensity distribution from a helium–neon (He–Ne) laser was carried out. It was confirmed that, in addition to the existing photosensing function, the sensitivity (output photocurrent) of such a structure could be controlled by applying a bias via lateral spreading of the surface space-charge-region (SCR) at the side of the reverse-biased Schottky-junction.     

Organic thin film transistors with PMMA modified insulator

A double insulation layer structure organic thin films transistor (OTFT) was investigated for improving the performance of the SiO2 gate insulator. A 50 nm PMMA layer was coated on top of the SiO2 gate insulator as the organic insulator layer. The results demonstrated that using inorganic/organic compound insulator as the gate dielectric layer is an effective method to fabricate OTFTs with improved electric characteristics and decreased leakage current. Electrical parameters of carrier mobility and on/off ratio were calculated. OTFT based on Si substrate with a field-effect mobility of 4.0 × 10-3cm2/Vs and on/off ratio of 104 was obtained.     

Charging–discharging characteristics of a wound aluminum polymer capacitor

This study characterized aluminum polymer capacitors, especially when they are charging and discharging. Tests were conducted under various conditions. The following environments were considered: three high-temperature conditions, two high temperature/high humidity conditions, and room temperature. Various operating conditions were also considered, such as charging–discharging, operating, and storage. The test results showed that the capacitance of the wound polymer aluminum capacitor degraded with charging–discharging at low temperature. At lower temperatures, this characteristic accelerated but was mitigated with a dry electrolyte. The degraded capacitances partially recovered when the capacitors were stored at a high temperature. These characteristics were not observed for a conventional liquid aluminum capacitor. This unreported special characteristic of polymer aluminum capacitors should be considered when designing systems such as power electronics. Polymer capacitors are known for their high reliability, especially at high temperatures. At low temperatures, however, the charging–discharging characteristic should be carefully considered. This paper reports on this characteristic of polymer capacitors for consideration by industries.     

Spray Pyrolysis Synthesized and ZnO–NiO Nanostructured Thin Films Analysis with Their Nanocomposites for Waveguiding Applications

Semiconductors - In this work, we have prepared ZnO, NiO, and nanocomposites ZnO–NiO thin films elaborated by the chemical method of spray pyrolysis on glass substrates at a temperature of...     

Nonvolatile memory performance improvements for solution-processed thin-film transistors with composition-modified In–Zn–Ti–O active channel and ferroelectric copolymer gate insulator

The nonvolatile memory thin-film transistors (M-TFTs) using a solution-processed indium-zinc-titanium oxide (IZTiO) active channel and a poly(vinylidene fluoride-trifluoroethylene) ferroelectric gate insulator were fabricated and characterized to elucidate the relationships between the IZTiO channel composition and the memory performances such as program speed and data retention. The compositions of the spin-coated IZTiO layers were modified with different Ti amounts of 0, 2, 5, and 10 mol%. The carrier concentration of IZTiO channel layer was effectively modulated by the incorporated Ti amounts and the defect densities within the channel were effectively reduced by Ti incorporation. The M-TFT fabricated with IZTiO channel with 2-mol% Ti composition exhibited the best overall device performances, in which the μ_FE, SS, MW, and programmed I_on/off were obtained to be 23.6 cm² V^?1 s^?1, 701 mV/decade, 11.8 V, and 1.2 × 10⁵, respectively. Furthermore, thanks to the suitable amounts of Ti incorporation into the IZO, the improved program speed and data retention properties were successfully confirmed.     

On the current transport mechanism in a metal—insulator—semiconductor (MIS) diode

The current transport mechanism in an MIS-tunnel diode has been studied by considering both the process of tunneling and the effect of pinholes in the insulating layer. It has been shown that in order to explain the experimental J-V characteristics of MIS-diodes, presence of a thin interfacial layer of thickness δ_p within the pinholes should be considered. From an analysis of the tJ-V and C-V characteristics, a method has been suggested for the estimation of the value of δ_p. The values of interface trap density and barrier height for the MOS-part of the diodes are also calculated. The dependence of barrier height on oxide thickness for the diodes is found to obey the barrier height model of Cowley and Sze.     

Generation of surface electron states with a silicon–ultrathin-oxide interface under the field-induced damage of metal–oxide–semiconductor structures

The high-frequency capacitance–voltage characteristics of metal–oxide–semiconductor structures on n-Si substrates with an oxide thickness of 39 Å are studied upon being subjected to damage by field stress. It is shown that the action of a high, but pre-breakdown electric field on an ultrathin insulating layer brings about the formation of a large number of additional localized interface electron states with an energy level arranged at 0.14 eV below the conduction band of silicon. It is found that, as the field stress is increased, the recharging of newly formed centers provides the accumulation of excess charge up to 8 × 10¹² cm^–2 at the silicon–oxide interface. The lifetime of localized centers created under field stress is two days, after which the dependences of the charge localized at the semiconductor–insulator interface on the voltage at the gate after and before field stress are practically the same.