Effect of film thickness on the surface,structural and electrical properties of InAlN films prepared by reactive co-sputtering

InAlN films of different thicknesses (150 nm, 250 nm, 380 nm, 750 nm and 1050 nm) were grown on Si (111) by means of reactive co-sputtering at 300 °C. Surface morphology results indicated an increase in the grains size and their spacing with increase of the film thickness. The surface of InAlN remained smooth with a slight variation in its RMS roughness from 1.29 nm to 6.62 nm by varying the film thickness. X-ray diffraction patterns exhibited InAlN diffraction peaks with preferred orientation along (002) plane in the thickness range 250 nm to 750 nm, however, the preferred orientation of the film was changed towards (101) plane at 1050 nm. An improvement in the crystallinity of InAlN was observed with increase of the film thickness. Electrical characterization revealed a decrease in the film's resistivity by increasing its thickness to 750 nm, however, the resistivity was found to increase at 1050 nm. The electron concentration indicated an increasing trend whereas changes in the electron mobility were found to be inconsistent with increase of the film thickness.     

Effect of the film thickness on the crystal structure and ferroelectric properties of (Hf0.5Zr0.5)O2 thin films deposited on various substrates

In this work, the effect of the film thickness on the crystal structure and ferroelectric properties of (Hf_0.5Zr_0.5)O₂ thin films was investigated. The thin films were deposited on (111) Pt-coated SiO₂, Si, and CaF₂ substrates with thermal expansion coefficients of 0.47, 4.5, and 22×10⁻⁶/°C, respectively. From the X-ray diffraction measurements, it was found that the (Hf_0.5Zr_0.5)O₂ thin films deposited on the SiO₂ and CaF₂ substrates experienced in-plane tensile and compressive strains, respectively, in comparison with the films deposited on the Si substrates. For films deposited on all three substrates, the volume fraction of the monoclinic phase increased with increasing film thickness, with the SiO₂ substrate having the lowest monoclinic phase volume fraction at all film thicknesses tested. The grain size of the films, which is an important factor for the formation of the ferroelectric phase, remained almost constant at about 10 nm in diameter regardless of the film thickness and type of substrate utilized. Ferroelectricity was observed for the 17 nm-thick films deposited on SiO₂ and Si substrates, and the maximum remanent polarization (P_r) value of 9.3 µC/cm² was obtained for films deposited on the SiO₂ substrate. In contrast, ferroelectricity with P_r=4.4 µC/cm² was observed only for film on SiO₂ substrate in case of 55 nm-thick films. These results suggest that the films under in-plane tensile strain results in the larger ferroelectricity for 17 nm-thick films and have a ferroelectricity up to 55 nm-thick films.     

Influence of cathode roughness on the performance of F8BT based organic–inorganic light emitting diodes

Hybrid light emitting diodes (HyLED) with a structure of FTO/ZnO/F8BT/MoO₃/Au/Ag is fabricated and the influence of surface roughness of cathode (FTO/ZnO) is investigated. The roughness of FTO could be decreased from 9.2 nm to 2.2 nm using a mild polishing process. The ZnO film, deposited by spray pyrolysis, functions as an electron injection layer. The roughness of the FTO/ZnO surface is found also highly dependent on the ZnO thickness. For thin ZnO films (20 nm), polishing results in better efficacy and power efficiency of LED devices, with nearly a two times improvement. For thick ZnO films (210 nm), the overall FTO/ZnO roughness is almost independent of the FTO roughness, hence both polished and unpolished substrates exhibit identical performance. Increasing ZnO thickness generally improves the electron injection condition, leading to lower turn on voltage and higher current and power efficiencies. However, for too large ZnO thickness (210 nm) the ohmic loss across the film dominates and deteriorates the performance. While the polished substrates show less device sensitivity to ZnO thickness and better performance at thin ZnO layer, best performance is obtained for unpolished substrates with 110 nm ZnO thickness. Larger interface area of ZnO/F8BT and enhanced electric filed at sharp peaks/valleys could be the reason for better performance of devices with unpolished substrates.     

Nucleation mechanism for epitaxial growth of aluminum films on sapphire substrates by molecular beam epitaxy

Aluminum (Al) epitaxial films with various thicknesses are grown on sapphire substrates by molecular beam epitaxy (MBE). The nucleation evolution of surface morphology and structural property during the growth of Al epitaxial films on sapphire substrates are investigated in detail. It is found that the 10 nm-thick Al epitaxial films grown on the sapphire substrates show the full-width at half-maximum (FWHM) for Al(111) of 0.35° and the root-mean square (RMS) surface roughness of 2.4 nm. When the thickness increases, the surface initially starts to roughen and then becomes smoother. At the same time, the crystal quality of the Al epitaxial films becomes better thanks to the annihilation of dislocations. As the thickness of Al epitaxial films reaches 800 nm, the FWHM for Al(111) is 0.04° and the RMS surface roughness is 0.14 nm, indicating the high crystal quality and flat surface morphology of Al epitaxial films. The corresponding nucleation mechanism of Al epitaxial films grown on sapphire substrates is hence proposed. This work is of great significance for the fabrication of Al-based devices.     

Transparent conductors with an ultrathin nickel layer for high-performance photoelectric device applications

A thin nickel (Ni) layer of thickness 5 nm was inserted in between the indium tin oxide (ITO) layers of thickness 50 nm each so as to increase the conductivity of ITO without affecting much of its transmittance nature. ITO layers with and without Ni film were prepared by reactive DC sputtering on both Si and glass substrates. The influence of Ni layer on the optical and electrical properties of prepared devices was investigated. Due to the insertion of thin Ni layer, the resistivity of ITO/Ni/ITO sample (3.2×10⁻⁴ Ω cm) was reduced 10 times lesser than that of ordinary ITO layer (38.6×10⁻⁴ Ω cm); consequently it increased the mobility of ITO/Ni/ITO device. The external and internal quantum efficiencies (EQE and IQE) of ITO/Ni/ITO device exhibited better performance when compared to ITO layer that has no Ni film. At wavelengths of 350 and 600 nm, the photoresponses of ITO/Ni/ITO device were predominant than that of reference ITO device. This highly conductive and photoresponsive Ni inserting ITO layers would be a promising device for various photoelectric applications.     

Optical characteristics of wurtzite ZnTe thin films

The growth of wurtzite ZnTe thin films with thickness between 250 and 1000 nm on borosilicate glass substrates by electron beam evaporation is reported. The formation of the wurtzite structure was confirmed using X-ray diffraction. The films showed diffraction peaks originating from the (110), (016) and (116) planes, indicating absence of any preferred orientation. The transmission of all the films was of the order of 80% in the near IR region. The refractive index of the wurtzite ZnTe phase increased with increase in thickness from 3.0 at 250 nm to 4.2 for the 1000 nm thickness film at a wavelength of 1800 nm. The optical band gap of these films increased with thickness showing values of 0.85, 0.9 and 0.98 eV at 250, 400 and 1000 nm thickness, respectively. Chemical composition studies revealed that the films were mildly non-stoichiometric with excess Te. Comparison with the zinc blende structure of ZnTe shows that the wurtzite structure has a higher refractive index, lower band gap and lower charge carrier concentration.     

Spin-coated PMMA films

Polymethylmethacrylate (PMMA) spin-coated thin films are commonly used as resist films in micro/nanofabrication processes. By using atomic force microscopy (AFM) imaging, scratching lithography and force–distance curves spectroscopy, the spin coating and post-processing conditions were determined, for obtaining films whose surface morphology appears featureless or is dominated by pinholes and other surface defects. Featureless appear the surfaces of films spin coated at 8 krpm from a 1.25% solution on silicon substrates and postbaked at 200 °C for 2 min on a hot plate, while surface defects in the form of large circular pits with diameters between 10 and 20 μm and depth of ∼2 nm dominate the surface morphologies of films spin coated at 7 krpm on glass substrates from a 2% solution and postbaked either at 200 °C for 2 min on a hot plate or at 170 °C for 30 min in an oven. Surface defects in the form of pinholes appear on the surfaces of films spin coated at 8 krpm on silicon substrates from a 1.25% solution (thickness of ∼8 nm) and postbaked at 170 °C for 60 min in an oven or left in a low vacuum chamber for a few days. The implication of the different film properties—depending on the preparation parameters—in lithographic techniques is explained and discussed in the paper.     

Role of thermal annealing on SiGe thin films fabricated by PECVD

Amorphous Silicon Germanium (a-SiGe) thin films of 500 nm thickness are deposited on silicon substrates using Plasma Enhanced Chemical Vapour Deposition (PECVD). To obtain polycrystalline nature of films, thermal annealing is done at various temperature (450–600 °C) and time (1–10 h). The surface morphology of the pre- and post-annealed films is investigated using scanning electron microscopy (SEM) and atomic force microscopy (AFM). The crystallographic structure of the film is obtained by X-ray diffraction method. Raman spectroscopy is carried out to quantify the Ge concentration and the degree of strain relaxation in the film. Nano-indentation is performed to obtain the mechanical properties of the film. It is found that annealing reduces the surface roughness of the film and increases the Ge concentration in the film. The grain size of the film increases with increase in annealing temperature. The grain size is found to decrease with increase in annealing time up to 5 h and then increased. The results show that 550 °C for 5 h is the critical annealing condition for variation of structural and mechanical properties of the film. Recrystallization starts at this condition and results in finer grains. An increase in hardness value of 7–8 GPa has been observed. Grain growth occurs above this critical annealing condition and degrades the mechanical properties of the film. The strain in the film is only relaxed to about 55% even for 10 h of annealing at 600 °C. Transmission Electron Microscopy (TEM) observations show that the strain relaxation occurs by forming misfit dislocations and these dislocations are confined to the SiGe/Si interface.     

Deposition of aluminum oxide-doped zinc oxide transparent nano-films on glass substrates for electrostatic discharge applications

Aluminum oxide-doped zinc oxide (ZnO:Al₂O₃) transparent thin films were deposited by DC magnetron sputtering on glass substrates; film thickness can be correlated with deposition time. The effect of ZnO:Al₂O₃ film thickness on electrical properties, ultraviolet (UV) transmission, surface morphology and structure, solvent resistance, and scratch hardness was investigated. The surface roughness and crystallite size of deposited films increased from 0.75 to 2.22 nm and from 14 to 57 nm, respectively, as the film thickness was increased from 18 to 112 nm. In contrast, the percent UV transmission (% T) of ZnO:Al₂O₃ deposited glass plates at a wavelength of 365 nm increased when the film thickness was decreased. The electrical properties of nano-film deposited glass plates such as electrical resistance, tribo-charge voltage, and decay time were in the range of electrostatic discharge (ESD) specifications. The ZnO:Al₂O₃ nano-film deposited glass substrate possessed good acetone and iso-propanol resistance as well as high scratch hardness. This work opens up the possibility of using the ZnO:Al₂O₃ transparent ultra-thin film on glass substrate in ESD applications based on their excellent properties in terms of the relatively thin and adjustable ZnO:Al₂O₃ film thickness needed.     

Structural and the optical dispersion parameters of nano-CdTe thin film/flexible substrate

CdTe thin films of different thicknesses were deposited on polymer substrates for flexible optical devices applications. X-ray diffractogram of different thicknesses for CdTe films are measured and their patterns exhibit polycrystalline nature with a preferential orientation along the (111) plane. The optical constants of CdTe films were calculated based on the measured transmittance spectral data using Swanepoel's method in the wavelength range 400–2500 nm. The refractive index n and absorption index k were calculated and the refractive index exhibits a normal dispersion. The refractive index dispersion data followed the Wemple–DiDomenico model based on single oscillator. The oscillator dispersion parameters and the refractive index no. at zero photon energy were determined. The possible optical transition in these films is found to be allowed direct transition with energy gap increase from 1.46 to 1.60 eV with the increase in the film thickness. CdTe/flexible substrates are good candidates in optoelectronic devices     

Effect of seed layers (Al,Ti) on optical and morphology of Fe-doped ZnO thin film nanowires grown on Si substrate via electron beam evaporation

The effects of Al and Ti seed layers were studied for undoped and Fe-doped ZnO thin films deposited on n-type Si substrates by electron beam (e-beam) evaporation. The films were characterized by X-ray diffraction (XRD), field emission scanning electron microscopy (FE-SEM) and transmission electron microscopy (TEM). The films grown on seed layers showed wurtzite hexagonal crystal nanorod and nanowire structures. A higher angle phase shift was observed in the doped thin films compared to the pristine ZnO films. Microstructural studies confirmed the growth of nanorods and nanowires with average widths of ~32 nm and ~8–29 nm, respectively. The nanostructures were denser and more crystalline on the Al seed layer than on the Ti seed layer for the doped thin films. However, in the undoped thin films, a more crystalline nature was observed on the Ti seeded layer than the Al seeded layer.     

Phonon–plasmon coupling in Si doped GaN nanowires

The vibrational properties of silicon doped GaN nanowires with diameters comprised between 40 and 100 nm are studied by Raman spectroscopy through excitation with two different wavelengths: 532 and 405 nm. Excitation at 532 nm does not allow the observation of the coupled phonon–plasmon upper mode for the intentionally doped samples. Yet, excitation at 405 nm results in the appearance of a narrow peak at frequencies close to that of the uncoupled A₁(LO) mode for all samples. This behavior points to phonon–plasmon scattering mediated by large phonon wave-vector in these thin and highly doped nanowires.     

Thickness dependent barrier performance of permeation barriers made from atomic layer deposited alumina for organic devices

Organic devices like organic light emitting diodes (OLEDs) or organic solar cells degrade fast when exposed to ambient air. Hence, thin-films acting as permeation barriers are needed for their protection. Atomic layer deposition (ALD) is known to be one of the best technologies to reach barriers with a low defect density at gentle process conditions. As well, ALD is reported to be one of the thinnest barrier layers, with a critical thickness – defining a continuous barrier film – as low as 5–10 nm for ALD processed Al₂O₃. In this work, we investigate the barrier performance of Al₂O₃ films processed by ALD at 80 °C with trimethylaluminum and ozone as precursors. The coverage of defects in such films is investigated on a 5 nm thick Al₂O₃ film, i.e. below the critical thickness, on calcium using atomic force microscopy (AFM). We find for this sub-critical thickness regime that all spots giving raise to water ingress on the 20 × 20 μm² scan range are positioned on nearly flat surface sites without the presence of particles or large substrate features. Hence below the critical thickness, ALD leaves open or at least weakly covered spots even on feature-free surface sites. The thickness dependent performance of these barrier films is investigated for thicknesses ranging from 15 to 100 nm, i.e. above the assumed critical film thickness of this system. To measure the barrier performance, electrical calcium corrosion tests are used in order to measure the water vapor transmission rate (WVTR), electrodeposition is used in order to decorate and count defects, and dark spot growth on OLEDs is used in order to confirm the results for real devices. For 15–25 nm barrier thickness, we observe an exponential decrease in defect density with barrier thickness which explains the likewise observed exponential decrease in WVTR and OLED degradation rate. Above 25 nm, a further increase in barrier thickness leads to a further exponential decrease in defect density, but an only sub-exponential decrease in WVTR and OLED degradation rate. In conclusion, the performance of the thin Al₂O₃ permeation barrier is dominated by its defect density. This defect density is reduced exponentially with increasing barrier thickness for alumina thicknesses of up to at least 25 nm.     

Protective nanometer films for reliable Cu-Cu connections

In this work, we report on the protective effect of platinum and carbon based films deposited onto Cu surfaces subject to pre-bonding temperature stress. The protection of Cu surfaces is an important and advantageous procedure to improve the reliability of Cu-Cu connections. The results were obtained from combined non-destructive Scanning Electron Microscopy (SEM) techniques and PeakForce Kelvin Probe Force Microscopy (PF-KPFM).As an indicator of degradation, the oxidation of the Cu surface was used. It could be shown that a C layer provides a much better protective effect than a Pt layer. Besides very local sporadically distributed Cu oxide grains, a gradual degradation of the protective carbon film was not even observable at the nanoscale for a stress temperature of 200 °C and layer thicknesses down to 3 nm. In contrast, with a 10 nm thick Pt film the Cu surface exhibits already at a stress temperature of 150 °C locally grown Cu oxide grains. The introduced carbon coating passivation of Cu surfaces has the potential of being a key technique for a reliable Cu-Cu wire bonding.     

Threshold-voltage variability analysis and modeling for junctionless double-gate transistors

This paper presents a detailed analysis on the variation sources in junctionless double-gate transistors using numerical device simulation. Comparison with conventional ultra-scaled devices is also included in the study. When channel thickness is reduced to 10 nm or below, thickness variation becomes a significant source of threshold voltage variation even though random dopant fluctuation has been considered the most significant one, especially in the highly doped junctionless channel. When accounting for volume inversion in the thin silicon film, we propose a modeling approach to estimate the film thickness variation impact on threshold voltage using effective film thickness. Our study suggests that when T_Si is less than 4 nm, the threshold voltage becomes less sensitive to film thickness variation, partly due to quantum confinement.     

22 nm silicon nanowire gas sensor fabricated by trilayer nanoimprint and wet etching

In this work, we demonstrate the fabrication of silicon nanowires down to 22 nm wide using trilayer nanoimprint lithography and wet etching. Using the same template prepared by E-beam lithography (EBL), nanowires with top width of 22 nm and 75 nm are fabricated on boron-doped top silicon layer of SOI substrate. The two samples are tested in 250 ppm NO₂ ambient for gas detection. The 22 nm wide one shows a much higher relative sensitivity than the 75 nm wide one. The simulation which calculates the carrier density by solving Poisson equation was carried out and the results well explain the sensitivity disparity between the two samples.     

Sol–gel synthesized Titania nanoparticles deposited on porous polycrystalline silicon: Improved carbon dioxide sensor properties

Titania nanoparticles (TNPs) were synthesized by a sol–gel method in our laboratory using titanium tetrachloride as the precursor and isopropanol as the solvent. The particles׳ size distribution histogram was determined using ImageJ software and the size of TNPs was obtained in the range of 7.5–10.5 nm. The nanoparticle with the average size of 8.5 nm was calculated using Scherrer׳s formula. Homogeneous and spherical nanoparticles were characterized by X-ray diffraction (XRD), atomic force microscopy (AFM), field emission scanning electron microscopy (FESEM) and UV–visible spectroscopy (UV–vis). The X-ray powder diffraction analysis showed that the prepared sample (TNPs) has pure anatase phase. TNPs were deposited on porous polycrystalline silicon (PPS) substrate by electron beam evaporation. The TNPs thickness was 23±2 nm at 10⁻⁵ mbar pressure at room temperature. Porosity was performed by an anodization method. Since polycrystalline silicon wafers consist of different grains with different orientations, the pore size distribution in porous layer is non-uniform [1]. Therefore, the average diameter of pores can be reported in PPS layer analysis. Average diameter of pores was estimated in the range of 5 μm which was characterized by FESEM. The nanostructured thin films devices (Al/Si/PPS/TNPs/Al and Al/Si/PPS/Al) were fabricated in the sandwich form by aluminum (Al) electrodes which were also deposited by electron beam evaporation. Electrical measurements (I–V curves) demonstrated the semiconducting behavior of thin film devices. The gas sensitivity was studied on exposure to 10% CO₂ gas. As a result, conductivity of devices increased on exposure to CO₂ gas. The device with TNPs thin film (Al/Si/PPS/TNPs/Al) was more sensitive and, had better response and reversibility in comparison with the device without TNPs thin film (Al/Si/PPS/Al).     

Effect of 100 MeV O7+ ion beam irradiation on radio frequency reactive magnetron sputtered ZnO thin films

Zinc oxide (ZnO) thin films were deposited on sapphire substrates at room temperature by radio frequency (RF) magnetron sputtering. These films were irradiated with 100 MeV O⁷⁺ ions of the fluencies 5×10¹³ ions/cm² at room temperature (RT) and at liquid nitrogen temperature (LNT). Profilometer studies showed that the roughness of pristine and LNT irradiated ZnO thin films were higher than that of the RT irradiated ZnO thin film. The glancing angle X-ray diffraction analysis reveals a reduced intensity and increased full width at half maximum (FWHM) of the (002) diffraction peak in the case of LNT irradiated film indicating disorder. However, the intensity and FWHM of the (002) diffraction peak in the case of RT irradiated ZnO thin films are comparable to those of the pristine film. UV–visible transmission spectra show that the percentage of transmission and band gap energy are different for RT and LNT irradiated films. While the pristine ZnO thin film exhibits two emissions—a broad emission at 403 nm and a sharp emission at 472 nm in its photoluminescence spectrum; the emission at 472 nm was absent for the irradiated films. The atomic concentrations of zinc and oxygen during the irradiation process were obtained using auger electron spectroscopy.     

Effects of ammonia concentration on property of Cd1−xZnxS films by chemical bath deposition

Cd_1−xZn_xS thin films were grown on soda–lime glass substrates by chemical-bath deposition (CBD) at 80 °C with stirring. All the samples were annealed at 200 °C for 60 min in the air. The crystal structure, surface morphology, thickness and optical properties of the films were studied with transmission electron microscopy (TEM), X-ray diffraction (XRD), scanning electron microscopy (SEM), step height measurement instrument and spectrophotometer respectively. The results revealed that Cd_1−xZn_xS thin films had cubic crystal structure and the intensity of the diffraction peak increased gradually as ammonia concentration rose and the grain size varied from 5.1 to 8.3 nm. All of Cd_1−xZn_xS thin films had a granular surface with some smaller pores and the average granule sizes increased from 92 to 163 nm with an increase in ammonia concentration. The Cd_1−xZn_xS thin films had the highest transmittance with ammonia concentration of 0.5 M L⁻¹, whose thickness was 50 nm and band gap was 2.62 eV.     

The electronic structure of Ni-phthalocyanine/metal interfaces studied by X-ray and ultraviolet photoelectron spectroscopy

Nickel phthalocyanine (NiPc) thin films were grown stepwise on polycrystalline gold and silver substrates and the formed interfaces were characterized by X-ray and ultraviolet photoelectron spectroscopies (XPS, UPS). The variation of the XPS core level binding energy with NiPc film thickness yields information about band bending and interface dipoles. The valence band structure of the NiPc thin films was determined by UPS and exhibits four main features at binding energies 1.50 eV, 3.80 eV, 6.60 eV and 8.85 eV, respectively. The NiPc highest occupied molecular orbital (HOMO) cut-off was measured at ∼1.00 eV from the analyzer Fermi level and from the measured work function change of the growing NiPc film a final work function value for NiPc was estimated at 3.90 ± 0.10 eV. The main C1s peak of the NiPc film (∼5.0 nm) consists of two components at 284.8 eV (C–C bonds), 286.2 eV (C–N bonds) reflecting photoemission from multiple carbon sites within the molecule and a satellite at 287.9 eV, whereas the Ni2p and N1s peaks appear at ∼855.9 eV and ∼399.3 eV, respectively and are due to Ni–N bonds. The energy level diagrams of the NiPc/Au and NiPc/Ag interfaces were determined from a combination of the XPS and UPS results, yielding a hole injection barrier of 0.90 ± 0.10 eV for both substrates.