直流磁控溅射制备非晶硅薄膜的研究

非晶硅薄膜(a-Si)是目前重要的光敏材料,在很多领域得到广泛应用.直流磁控溅射具有工艺简单,沉积温度低等优点,是制备薄膜的一种重要技术.采用直流磁控溅射工艺在玻璃基板上沉积薄膜,并对样品进行了退火处理.研究了沉积速率与溅射功率的关系.结果表明薄膜的沉积速率与溅射功率近似有线性关系.利用X射线衍射(XRD)对薄膜进行了分析鉴定,结果表明溅射的薄膜是非晶硅薄膜.利用扫描电子显微镜(SEM)对非晶硅薄膜的表面形貌进行了观察和分析,与X射线衍射测试的结果一致.所以,利用直流磁控溅射工艺能在常温下能快速制备出良好的非晶硅薄膜.     

直流磁控溅射制备非晶硅薄膜的研究

非晶硅薄膜（a-Si）是目前重要的光敏材料,在很多领域得到广泛应用。直流磁控溅射具有工艺简单．沉积温度低等优点,是制备薄膜的一种重要技术。采用直流磁控溅射工艺在玻璃基板上沉积薄膜,并对样品进行了退火处理。研究了沉积速率与溅射功率的关系。结果表明薄膜的沉积速率与溅射功率近似有线性关系。利用X射线衍射（XRD）对薄膜进行了分析鉴定,结果表明溅射的薄膜是非晶硅薄膜。利用扫描电子显微镜（SEM）对非晶硅薄膜的表面形貌进行了观察和分析,与X射线衍射测试的结果一致。所以．利用直流磁控溅射工艺能在常温下能快速制备出良好的非晶硅薄膜。     

Thermal conductivity of AlN thin films deposited by RF magnetron sputtering

Aluminum nitride (AlN) film, which is being investigated as a possible passivation layer in inkjet printheads, was deposited on a Si (1 0 0) substrate at 400 °C by radio frequency (RF) magnetron sputtering using an AlN ceramic target. Dependence on various reactive gas compositions (Ar, Ar:H₂, Ar:N₂) during sputtering was investigated to determine thermal conductivity. The crystallinity, grain size, and Al–N bonding changes by the gas compositions were examined and are discussed in relation to thermal conductivity. Using an Ar and 4% H₂, the deposited AlN films were crystalline with larger grains. Using a higher nitrogen concentration of 10%, a near amorphous phase, finer morphology, and an enhanced Al–N bonding ratio were achieved. A high thermal conductivity of 134 W/mk, which is nine times higher than that of the conventional Si₃N₄ passivation film, was obtained with a 10% N₂ reactive gas mixture. A high Al–N bonding ratio in AlN film is considered the most important factor for higher thermal conductivity.     

Effects of annealing on the structural and optical properties of zinc sulfide thin films deposited by ion beam sputtering

We report the structural and optical properties of ZnS thin films fabricated by ion-beam sputtering. X-ray diffraction (XRD) and transmission electron microscopy (TEM) results revealed a polycrystalline ZnS film with zinc blende phase as manifested by diffraction from the (111), (220) and (311) planes. Annealing resulted in the appearance of a metastable wurtzite phase with a concentration up to 26.6%. An energy bandgap, estimated from absorption spectra, was found to vary between 3.32 and 3.40 eV. The lower energy of this bandgap, as compared to bulk ZnS, is associated with the structural point defects along with mixed zinc blende and wurtzite phases of the polycrystalline ZnS films. Ion beam sputtering deposition can be used to tune the optical bandgap for potential applications in optoelectronic materials.     

退火处理对磁控溅射制备Ga掺杂ZnO薄膜性能的影响

采用磁控溅射法在普通玻璃上制备了Ga掺杂ZnO(GZO)薄膜,研究了退火处理对GZO薄膜组织结构、表面形貌及光电性能的影响,并利用扫描电子显微镜、X射线衍射仪、紫外分光光度计、四探针测试仪等对GZO薄膜的表面形貌、晶体结构、透光率及电阻率等进行测量与表征。结果表明:400~800℃退火对GZO薄膜的生长方式影响较小,所制薄膜均在(002)晶向沿c轴择优取向,退火温度对薄膜表面形貌影响较大,退火温度为600℃时,薄膜表面致密、平整,结晶质量最好,薄膜的透光率超过95%,电阻率最低为4.9×10~(-4)?·cm。     

不同退火条件对磁控溅射CdS薄膜性能的影响

采用磁控溅射法,在衬底温度300 ℃制备CdS薄膜,并选取370 ℃、380 ℃、390℃三个温度退火,获得在干燥空气和CdCl2源+干燥空气两种气氛下退火的CdS薄膜.通过研究热处理前后CdS薄膜的形貌、结构和光学性能表明,CdS薄膜在干燥空气中退火,晶粒度、表面粗糙度和可见光透过率变化不明显,光学带隙随退火温度的升高而增大; 在CdCl2源+干燥空气中退火,随退火温度的升高发生明显的再结晶和晶粒长大,表面粗糙度增大,可见光透过率和光学带隙随退火温度的升高而减小.分析得出: 上述性能的改变是由于不同的退火条件对CdS薄膜的再结晶温度和带尾态掺杂浓度改变的结果.     

射频磁控溅射法制备掺锆氧化锌透明导电薄膜

利用射频磁控溅射法在室温下制备出了掺锆氧化锌(ZnO∶Zr)透明导电薄膜。研究了溅射压强对ZnO∶Zr薄膜表面形貌、结构、光学和电学性能的影响。结果表明:ZnO∶Zr薄膜为六角纤锌矿结构的多晶薄膜,且具有c轴择优取向,溅射压强对薄膜电阻率有显著影响,压强为1.5Pa时,电阻率具有最小值1.77×10–3Ω·cm。所制备的ZnO∶Zr薄膜具有良好的附着性能,在可见光区平均透过率超过93%。     

Au schottky barrier diodes on β-SiC thin films deposited on silicon substrates by reactive magnetron sputtering technique

β-SiC thin films have been grown on (100) silicon substrates using reactive magnetron sputtering of a silicon target in an Ar/CH₄ mixed plasma. For the first time it has been possible to make gold Schottky diodes on β-SiC grown by reactive magnetron sputtering. Current-voltage measurements showed an ideality factor of 1.27 and a leakage current density of 4 μA/cm². Capacitance-voltage measurements gave a barrier height of 1.04 eV. The static dielectric constant for β-SiC was determined to be 9.     

磁控溅射工艺参数对Cu薄膜电阻率的影响

在确定Cu薄膜临界尺寸的基础上,选定基底温度、靶基距、溅射功率和工作气压为影响因素设计正交试验,研究了磁控溅射制备工艺对Cu薄膜电阻率的影响。研究结果表明:基底温度是影响薄膜电阻率的最主要因素,电阻率随着基底温度的升高而减小;在工艺条件为基底温度200℃、靶基距45 mm、溅射功率100 W、工作气压0.5 Pa时,所制薄膜的电阻率将会达到最小。最后,结合薄膜微观形貌对试验结论进行了分析,并对最佳工艺条件进行了实验验证。     

Effect of sputter deposited Zn precursor film thickness and annealing time on the properties of Cu2ZnSnS4 thin films deposited by sequential reactive sputtering of metal targets

Cu₂ZnSnS₄ (CZTS) is made of earth abundant elements and also have suitable optical properties for solar cell applications. But, in phase diagram, CZTS exists in a narrow range of temperature and composition. Therefore, optimizing the elemental composition and annealing time is very important for obtaining phase pure CZTS. In this study, the effects of elemental composition and short annealing time on the structural and optical properties of reactively sputtered CZTS thin films are reported. Thin films were deposited by reactive sputtering of Cu: Sn (60:40 wt%), Sn and Zn targets sequentially in the presence of H₂S at room temperature. Amount of Zn precursor was varied by changing the sputter time for Zn. The films were rapidly annealed in inert atmosphere for varying time. The band gap of sample changed with change in the composition as well as annealing time. Sample with higher Zn content showed better crystallinity. With increase in the annealing time the crystallinity of samples improved. Sample annealed for 12 min at 550 °C was phase pure. Obtaining good quality film even for very short anneal time is the novelty of reactive sputtering method as all the elements are already mixed and short annealing is required only for crystal growth. Through detailed experiments, the optimum composition and annealing time required for the growth of phase pure CZTS has been established.     

Thickness-dependent optoelectronic properties of CuCr0.93Mg0.07O2 thin films deposited by reactive magnetron sputtering

CuCr_0.93Mg_0.07O₂ thin films were successfully deposited by DC reactive magnetron sputtering at 1123 K from metallic targets. The influence of film thickness on the structural and optoelectronic properties of the films was investigated. X-ray diffraction (XRD) results revealed that all the films had a delafossite structure with no other phases. The optical and electrical properties were investigated by UV–VIS spectrophotometer and Hall measurement, respectively. It was found that the optoelectronic properties exhibited a thickness-dependent behavior. The optical band gap and the average transmittance of the films showed a monotonous decrease with respect to the increase in thickness. The average transmittance in the visible region decreased from 67% to 47% as the thickness increased from ~70 nm to ~280 nm. Simultaneously, the conductivity of the films fell from 1.40 S∙cm⁻¹ to 0.27 S∙cm⁻¹. According to Haacke's figure of merit (FOM), a film with a maximum FOM value of about 1.72×10⁻⁷ Ω⁻¹ can be achieved when the thickness is about 70 nm (σ≈ 1.40 S·cm⁻¹ and T_av. ≈67%).     

Photoelectric properties of ITO thin films deposited by DC magnetron sputtering

As anti-reflecting thin films and transparent electrodes of solar cells,indium tin oxide（ITO） thin films were prepared on glass substrates by DC magnetron sputtering process.The main sputtering conditions were sputtering power,substrate temperature and work pressure.The influence of the above sputtering conditions on the transmittance and conductivity of the deposited ITO films was investigated.The experimental results show that, the transmittance and the resistivity decrease as the sputtering power increases from 30 to 90 W.When the substrate temperature increases from 25 to 150℃,the transmittance increases slightly whereas the resistivity decreases.As the work pressure increases from 0.4 to 2.0 Pa,the transmittance decreases and the resistivity increases.When the sputtering power,substrate temperature and work pressure are 30 W,150℃,0.4 Pa respectively,the ITO thin films exhibit good electrical and optical properties,with resistivity below 10^-4Ω·cm and the transmittance in the visible wave band beyond 80%.Therefore,the ITO thin films are suitable as transparent electrodes of solar cells.     

用直流磁控溅射法制备的ＩＴＯ薄膜的光电性能研究

用直流磁控溅射法将ＩＴＯ薄膜制备在玻璃基片上以作为太阳电池的透明电极。通过改变溅射功率、基片温度和工作气压来研究它们对所沉积的ITO薄膜的透过率和电导率的影响。实验结果表明：当溅射功率从30W增加到90W时,薄膜的透过率和电阻率都将减小;当基片温度从25℃ 增加到 150℃时,透过率稍微有点增大但电阻率减小;当工作气压从0.4Pa 增大到2.0Pa时,透过率减小,但电阻率增大。因此,在溅射功率为30W、基片温度为150℃、工作气压为0.4Pa 时,ITO薄膜有比较好的光电性能,其电阻率小于10-4 Ω•cm ,在可见光波段的透过率大于80%,适合于作为太阳电池的透明电极。     

氮分压对磁控溅射制备TaN薄膜性能的影响

采用直流反应磁控溅射法制备了TaN薄膜,研究了φ(N2)对薄膜的结构和性能影响。研究发现,在N2分压(体积分数)为9%时,多相共存的TaN薄膜表现出TaN(200)面择优取向,方阻和αt达到最佳,其值为52Ω/□和–306×10–6/℃。薄膜的方阻、电阻温度系数αt和晶粒尺寸都随着N2分压的增大而增大:当N2分压高于11%时,薄膜的方阻和αt增长较快。     

Optical and structural properties of CuCrO2 thin films on c-face sapphire substrate deposited by reactive RF magnetron sputtering

Reactive sputtering with Ar/N₂ mixture gas was introduced to improve stoichiometry of p-type transparent CuCrO₂ films, and effects of N₂ partial pressure ratio (α_N) on optical and structural properties were investigated. Film composition was changed from Cu rich (i.e. Cr poor) to Cr rich (i.e. Cu poor) by N₂ addition, and the stoichiometric film was grown at α_N of about 20%. Although N atoms were not incorporated into the films from analyses of crystal structure and chemical bonding state, both transmittance from visible to near-infrared wavelength and crystallinity were improved at α_N up to 10%. These improvements were attributed to suppression of the CuO formation and promotion of the O-Cu-O dumbbell bonds formation. This was confirmed by the decrease of diffraction intensity from CuO and the increase of vibrational intensity corresponding A_1g mode. From these results, it can be considered that N atoms decreased not only Cu but also excess O in the film. At α_N of 20% or above, transmittance at wavelength of 450 nm and crystallinity deteriorated. This is supposed that excessive N₂ addition probably generated both O and Cu deficiencies. As a result, it was found that slightly Cu-rich composition is suitable to obtain high-transparency CuCrO₂ thin films for practical use.     

激光溅射淀积Y-Ba-Cu-O超导薄膜

利用准分子激光束辐照Y-Ba-Cu-O超导靶体,使之元素溅射出来,喷到平行于靶面的基片之上而淀积成膜,然后通过适当的退火过程,所制薄膜在液氮温区具有超导性。制取了零电阻温度85K的高温超导薄膜;讨论了淀积条件与退火过程对薄膜超导性能的影响。     

射频磁控溅射制备钛酸锶钡薄膜的研究进展

综述了射频磁控溅射制备钛酸锶钡(BST)薄膜的国内外研究动态,详细阐述了溅射工艺参数(电极、溅射气压、氧分压、温度)对BST薄膜微结构和电性能的影响,提出了射频磁控溅射制备BST薄膜中亟待解决的问题。     

Post-deposition annealing effect on In2S3 thin films deposited using SILAR technique

Indium Sulfide thin films have been deposited on glass substrate using a simple and inexpensive technique viz., successive ionic layer adsorption and reaction (SILAR). The films are characterized using X-ray diffraction, X-ray photoelectron spectroscopy (XPS) and optical absorption techniques. Samples are prepared by varying dipping and rinsing time, and those prepared at room temperature are found to be amorphous in nature. However, peaks corresponding to β-In₂S₃ are observed, on annealing at 400 °C. Grain size is found to increase with increase in the dipping times, either in the precursor solutions or in water. Band gap decreases considerably for samples annealed at 400 °C in vacuum.     

衬底温度对磁控溅射生长HMGZO薄膜特性的影响

为适应高效Si基薄膜太阳电池对宽光谱透明导电 薄膜的需求,采用磁控溅射技术 生长了不同衬 底温度氢化作用下Ga和Mg共掺杂ZnO(HMGZO)透明导电氧化物(TCO)薄膜。研究了不同衬底温 度(200～280 ℃)对HMGZO薄膜 结晶特性及光电特性的影响。实验结果表明,制备的HMGZO薄膜均为具有六角纤锌矿结构的 多晶薄膜,呈 现(002)晶面择优生长。随着衬底温度的升高,薄膜中Mg含量逐渐增加,并且薄膜表面新型 锥状结构趋于 致密和均匀化。在各元素含量和结晶质量的共同影响下,其电阻率随着温度的升高从6．70×10－4 Ω·cm增加至7．63×10－4 Ω·cm。所有薄膜在可 见光区域(380～800 nm)的透过率均在80%以上,由于载流子共振吸收的作用,近红外区域的 透过率有所下降。MgO扩展带隙的作用和 Burstein-Moss(BM)效应的影响共同促进了薄膜光学带隙E_g展 宽,使得E_g达到了3.75 eV。当衬底温度为280 ℃ 时,薄膜方块电阻为4.91 Ω/sq,电阻率为7.63×10－4 Ω·cm,光电性能指数ΦTC值达0.022 Ω－1。     

Effect of microwave power and reactive gas ratio on the properties of silicon nitride thin films deposited by ECR PECVD

Silicon nitride films were deposited at room temperature on a single crystal silicon substrate by ECR PECVD (electron cyclotron resonance plasma enhanced chemical vapor deposition). Effects of the microwave power and the reactive gas ratio (SiH₄/N₂) on the film properties, such as, refractive index and breakdown field were investigated. It turned out that the microwave power was closely related to the change in refractive index of the silicon nitride films, while breakdown field did not change much from 6 MV/cm. It was also found that the deposition rate, refractive index, and breakdown field were changed in a certain way with respect to the change in SiH₄/N₂ ratio, which could be explained in terms of the activated chemical species concentrations in the plasma during deposition.