高亮度GaN基蓝色LED的研究进展

超高亮度GaN基蓝色LED的发展将会引起照明技术的一场革命，它是目前全球半导体领域研究和投资的特点。本文综合分析了GaN材料的特性及相应的材料生长和欧姆接触、刻蚀工艺等关键技术，并对GaN基蓝色LED器件的进一步改进及应用前景作了展望。     

氧化对 GaN 基LED透明电极接触特性的影响

研究了热退火对InGaN/GaN 多量子阱LED的Ni/Au-p-GaN欧姆接触的影响.发现在空气和 N2气氛中交替地进行热退火的过程中Ni/Au接触特性显示出可逆现象. Ni/Au-p-GaN接触的串联电阻在空气中随合金化时间逐渐减小,在随后的 N2 中的热退火后会使该串联电阻增加,但在空气中再次热退火能使接触特性得到恢复.同时对Ni/Au-p-GaN 接触在空气中合金化过程中的层反转的成因进行了讨论.     

使用ZnO电流扩展层提高GaN基LED提取效率

Gallium nitride （GaN） based light emitting diodes （LEDs） with a thick and high quality ZnO film as a current spreading layer grown by metal-source vapor phase epitaxy （MVPE） are fabricated successfully. Compared with GaN-based LEDs employing a Ni/Au or an indium tin oxide transparent current spreading layer, these LEDs show an enhancement of the external quantum efficiency of 93% and 35% at a forward current of 20 mA, respectively. The full width at half maximum of the ZnO （002） ω-scan rocking curve is 93 arcsec, which corresponds to a high crystal quality of the ZnO film. Optical microscopy and atomic force microscopy are used to observe the surface morphology of the ZnO film, and many regular hexagonal features are found. A spectrophotometer is used to study the different absorption properties between the ZnO film and the indium tin oxide film of the GaN LED. The mechanisms of the extraction quantum efficiency increase and the series resistance change of the GaN-based LEDs with ZnO transparent current spreading layers are analyzed.     

GaN基LED电流扩展对其器件特性的影响

GaN基LED的表面电流扩展对于器件的特性起着很重要的作用.制作环状N电极的器件在正向电压、总辐射功率、器件老化等特性方面较普通的电极都有很大的提高.通过一系列的实验对环状N电极和普通电极进行了比较,在外加正向电流为20 mA时,正向电压减小了6%,总辐射功率也略有提高,工作50小时后,总辐射功率相差8%,验证了环状N电极结构有利于器件电流扩展,减少器件串联电阻,减少了焦耳热的产生,提高了LED电光特性和可靠性.     

图形化衬底对GaN基LED电流与发光特性的影响

在传统蓝宝石衬底(CSS)和图形化蓝宝石衬底(PSS)上分别制备了结构相同的GaN基蓝光发射二极管(LEDs),测试并比较了这两种不同衬底器件的电流与发光特性。结果表明,与CSS-LED相比,PSS-LED在-4V处的反向漏电流降低了两个数量级,峰值波长基本不随电流增大而发生显著蓝移,半高宽、输出功率与外量子效率等发光性能也获得明显改善。PSS-LED反向漏电流的减小主要归功于外延层中位错密度的降低,发光性能的改善主要是因为PSS减少了光在LED内部的全反射,提高了光的析出率;PSS-LED的外量子效率随电流下降的行为(droop)并未明显改善,表明位错可能不是引起效率droop的主要原因。     

入射介质对GaN基分布布拉格反射器的反射谱影响

利用传输矩阵法对不同入射介质的GaN基分布布拉格反射器(DBR)进行了反射谱的理论分析。计算表明,入射介质的折射率与低周期DBR反射率呈二次函数关系,与高周期DBR反射率近似线性关系。根据这些特点,推导出估算DBR在LED器件中的实际反射率公式。分析了从空气和Al_(0.4)Ga_(0.5)In_(0.1)N入射介质下不同GaN基DBR结构的反射光谱差异。为减弱入射介质对DBR反射谱的影响以及改善材料结构的质量,设计了半混合GaN基DBR结构。分析指出,半混合DBR在材料结构生长和光谱方面比传统DBR更有优势。     

注入电流对GaN基LED发光特性的影响

通过调节量子阱中的In组分,制备了GaN基蓝光和绿光发光二极管（LED）。对两种LED进行变电流测试发现,注入电流由3 mA增加到900 mA过程中,波长有蓝移现象,且绿光LED的波长蓝移较明显。这是量子阱限制斯塔克效应（QCSE）造成的。由于绿光LED中In组分含量较大,QCSE较明显。并且发现,光效迅速下降,绿光L...     

GaN基蓝光LED关键技术进展

以高亮度GaN基蓝光LED为核心的半导体照明技术对照明领域带来了很大的冲击,并成为目前全球半导体领域研究和投资的热点。本文首先综述了GaN基材料的基本特性,分析了GaN基蓝光LED制程的关键技术如金属有机物气相外延,P型掺杂,欧姆接触,刻蚀工艺,芯片切割技术,介绍了目前各项技术的工艺现状,最后指出了需要改进的问题,展望了末来的研究方向。     

电极耦合层对GaN基蓝光LED出光特性的影响

光提取效率的提高对GaN基蓝光LED的广泛应用有重要的影响.计算了以Ni/Au基金属化方法形成的p型GaN电极的折射率,通过分析电极层中的能流传输情况在电极上设计高折射率的耦合层来减少电极层对光的吸收以及提高光的透射,耦合层通过采用圆台结构来减少光在空气/耦合层界面上的全反射以提高GaN基蓝光LED的光提取效率.应用传输矩阵法计算的结果表明,光学厚度为π/2,折射率为2.02的ITO耦合层能使450 nm的蓝光在膜系上的透射率提高到75%.     

界面过渡层对黄光OLED发光性能的影响研究

研究了黄光OLED发光层间加入界面过渡层对OLED发 光性能的影响。实验制备新型黄光OLED的发光层结构为 CBP:R-4B/CBP:Girl:R-4B/CBP:GIrl,对比OLED的发光层结构为CBP:10%R-4B/CBP:10%GIrl、CBP: 10%GIrl/CBP:10%GIrl10%R-4B/CBP:10%R-4B和CBP:10%GIrl/CBP:10%R-4B。结果表明,在对比器 件的发光层界面间加入过渡层可显著提高器件的发光亮度和发光效率,新型器件在13V电压 下、电流密度为40.29mA/cm²时,发光亮度和发光效率分别达到 了11120cd/m²与27.59cd/A,较未加入过渡层的器件分别提 高了265%56.18%。分析认为,过渡层的 加入消除了由不同发光层间严格的界面效应而造成的界面缺 陷,增加了载流子传输速率与激子的复合效率,从而提升了器件的发光性能。     

Fabrication and characteristics of excellent current spreading GaN-based LED by using transparent electrode-insulator-semiconductor structure

GaN-based vertical light-emitting-diodes (V-LEDs) with an improved current injection pattern were fabricated and a novel current injection pattern of LEDs which consists of electrode-insulator-semiconductor (EIS) structure was proposed. The EIS structure was achieved by an insulator layer (20-nm Ta₂O₅) deposited between the p-GaN and the ITO layer. This kind of EIS structure works through a defect-assisted tunneling mechanism to realize current injection and obtains a uniform current distribution on the chip surface, thus greatly improving the current spreading ability of LEDs. The appearance of this novel current injection pattern of V-LEDs will subvert the impression of the conventional LEDs structure, including simplifying the chip manufacture technology and reducing the chip cost. Under a current density of 2, 5, 10, and 25 A/cm², the luminous uniformity was better than conventional structure LEDs. The standard deviation of power density distribution in light distribution was 0.028, which was much smaller than that of conventional structure LEDs and illustrated a huge advantage on the current spreading ability of EIS-LEDs.     

Pulse-driven LED circuit with transformer-based current balance technique

Light emitting diodes (LEDs) have been gradually used for backlight modules for liquid crystal display as a substitute for cold cathode fluorescent lamps. In most of LED applications, it is required to connect several LED strings in parallel to limit the dc voltage level to be applied to the single LED string. Due to considerable current variations through each LED string with inevitable parameter deviations as well as temperature and ageing effects, techniques to balance currents flowing through LED strings are required for LED drivers. This article proposes a pulse-driven LED circuit with transformer-based current balancing scheme, which can simply regulate currents through the LED strings. The transformers are placed in series with the LED strings in such a way that the LED currents are automatically balanced. Since the developed current sharing technique employs no dissipative resistors and no linear-mode transistors, the proposed driver has high efficiency, low power dissipation and reduced thermal problems. In addition, the presented driver with no additional semiconductor devices and no additional controllers can provide a simple and a cost-effective current balancing solution, compared to conventional approaches. Thus, the proposed LED driver can feature a simple, highly efficient, reliable and cost-effective method. The presented LED driver is verified with experimental results.     

无机、有机LED和EL白色发光及绿色照明

用无机白色ＬＥＤ照明由于不含Ｈｇ，因而无公害，被称为绿色照明。描述了无机ＬＥＤ的特性及进展，特别描述了与发光粉结合成新的白光ＬＥＤ的发展动态；同时还评述了无机白光ＥＬ和有机ＥＬ白光发射在绿色照明应用的可能性。     

LED电极结构优化设计与仿真计算

LED电极结构极大地影响着LED芯片的电流扩展能力,优化电极结构,能够缓解电流拥挤现象.讨论了正装LED结构和倒装LED结构的电流分布模型,并通过SimuLED软件研究了电极结构对LED电流扩展能力的影响.仿真结果表明:采用插指型电板结构极大提高了正装LED的电流扩展能力,电极下方插入电流阻挡层(CBL)后改变了芯片的电流分布状况,有利于光效的提升;而倒装LED的通孔式双层金属电极结构利用两层金属的互联作用,使n电极能够在整个芯片范围内均匀分布,进一步提高了电流扩展性能.     

电流阻挡层结构对垂直发光二极管芯片老化特性之研究

发现ICP damage制作电流阻挡层的制程会导致垂直结构LED在老化过程中发生漏电。通过更换反射层的金属及EMMI&SEM分析,发现老化漏电的原因来源于反射金属——Ag的电迁移,迁移通道可能来源于ICP打开穿透位错的封口。在缺陷位错内填入低电迁移率金属并检测。结果表明,填入低电迁移率金属后既解决了老化漏电问题,同时不影响芯片的初始光电特性。     

基于功率型LED的在体整体荧光光学成像

用发光二极管（LED）替代常用的荧光激发光源汞灯,以实现基于LED的整体荧光光学成像（简称整体成像）。首先通过光谱计算分析,探讨了在不同波段与汞灯激发的荧光量相当时LED需要输出的光通量。以此为依据选择LED,构建了基于功率型LED的整体成像系统,用其动态监测绿色荧光蛋白（GFP）标记的肿瘤在裸鼠体内生长和药物治疗过程。实验表明,功率型LED可在类似于整体成像需要较大光功率的场合中应用。光源替代时,若两光源的光谱在选择的波段内分布不一样,则有必要考虑不同波长的光激发荧光效率差异的影响。     

TFT-LCD高温光照漏电流改善研究

造成TFT不稳定的问题点一般认为有两种:一是沟道内半导体材料内部的缺陷,另一个是栅极绝缘层内的或是绝缘层与沟道层界面的电荷陷阱。TFT-LCD在长期运行时由于高温及光照的影响会导致漏电流增加,进而对TFT造成破坏。分析研究表明,TFT沟道在刻蚀完成后,沟道内部存在一定的缺陷以及绝缘层与沟道层界面存在电荷陷阱,平面电场宽视角核心技术-高级超维场转换技术型产品由于设计的原因面临着如果进行氢处理会导致与其与氧化铟锡中的铟发生置换反应,导致铟的析出,所以无法采用氢处理。理论分析表明Si-O键稳定,本文主要介绍通过氯气/氧气和六氟化硫/氧气对TFT沟道进行处理改善高温光照漏电流。结果表明,通过氯气/氧气和六氟化硫/氧气处理TFT沟道后,高温光照漏电流从18.19pA下降到5.1pA,可见氯气/氧气和六氟化硫/氧气对沟道处理可有效改善高温光照漏电流。     

Investigating Morphology and Stability of Fac‐tris (2‐phenylpyridyl)iridium(III) Films for OLEDs

Stable film morphology is critical for long‐term high performance organic light‐emitting diodes (OLEDs). Neutron reflectometry (NR) is used to study the out‐of‐plane structure of blended thin films and multilayer structures comprising evaporated small molecules. It is found that as‐prepared blended films of fac‐tris(2‐phenylpyridyl)iridium(III) [Ir(ppy)₃] in 4,4′‐bis(N‐carbazolyl)biphenyl (CBP) are uniformly mixed, but the occurrence of phase separation upon thermal annealing is dependent on the blend ratio. Films comprised of the ratio of 6 wt% of Ir(ppy)₃ in CBP typically used in OLEDs are found to phase separate with moderate heating while a higher weight percent mixture (12 wt%) is found to be stable. Furthermore, it is found that thermal annealing of a multilayer film comprised of typical layers found in efficient devices ([tris(4‐carbazoyl‐9‐ylphenyl)amine (TCTA)/Ir(ppy)₃:CBP/bathocuproine (BCP)]) causes the BCP layer to become mixed with the emissive blend layer, whereas the TCTA interface remains unchanged. This significant structural change causes no appreciable difference in the photo­luminescence of the stack although such a change would have a dramatic effect on the charge transport through the device, leading to changes in performance. These results demonstrate the effect of thermal stress on the delicate interplay between the chemical composition and morphology of OLED films.