Formation of low-resistance and transparent indium tin oxide ohmic contact for high-brightness GaN-based light-emitting diodes using a Sn–Ag interlayer

We report on the formation of low-resistance and highly transparent indium tin oxide (ITO) ohmic contacts to p-GaN using a Sn–Ag alloy interlayer. Although the as-deposited Sn–Ag(6 nm)/ITO(200 nm) contacts show non-ohmic behaviors, the scheme becomes ohmic with specific contact resistance of 4.72×10⁻⁴ Ω cm² and produce transmittance of ∼91% at wavelength of 460 nm when annealed at 530 °C. Blue light-emitting diodes (LEDs) fabricated with the Sn–Ag/ITO contacts give forward-bias voltage of 3.31 V at injection current of 20 mA. LEDs with the Sn–Ag/ITO contacts show the improvement of the output power by 62% (at 20 mA) compared with LEDs with Ni/Au contacts.     

Growth and characterization of indium oxide diodes prepared by reactive magnetron sputtering

The electrical properties of Cr/Pt/Au and Ni/Au ohmic contacts with unintentionally doped In₂O₃ (U-In₂O₃) film and zinc-doped In₂O₃ (In₂O₃:Zn) prepared by reactive magnetron sputtering deposition are described. The lowest specific contact resistance of Cr/Pt/Au and Ni/Au is 2.94 × 10⁻⁶ and 1.49 × 10⁻² Ω-cm², respectively, as determined by the transmission line model (TLM) after heat treatment at 300 °C by thermal annealing for 10 min in nitrogen ambient. The indium oxide diodes have an ideality factor of 1.1 and a soft breakdown voltage of 5 V. The reverse leakage current prior to breakdown is around 10⁻⁵ A.     

Green and blue-green phosphorescent heteroleptic iridium complexes containing carbazole-functionalized β-diketonate for non-doped organic light-emitting diodes

Two novel iridium complexes both containing carbazole-functionalized β-diketonate, Ir(ppy)₂(CBDK) [bis(2-phenylpyridinato-N,C²)iridium(1-(carbazol-9-yl)-5,5-dimethylhexane-2,4-diketonate)], Ir(dfppy)₂(CBDK) [bis(2-(2,4-difluorophenyl)pyridinato-N,C²)iridium(1-(carbazol-9-yl)-5,5-dimethylhexane-2,4-diketonate)] and two reported complexes, Ir(ppy)₂(acac) (acac = acetylacetonate), Ir(dfppy)₂(acac) were synthesized and characterized. The electrophosphorescent properties of non-doped device using the four complexes as emitter, respectively, with a configuration of ITO/N,N′-diphenyl-N,N′-bis(1-naphthyl)-1,1′-diphenyl-4,4′-diamine (NPB) (20 nm)/iridium complex (20 nm)/2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline (BCP) (5 nm)/tris(8-hydroxyquinoline)aluminum (AlQ) (45 nm)/Mg_0.9Ag_0.1 (200 nm)/Ag (80 nm) were examined. In addition, a most simplest device, ITO/Ir(ppy)₂(CBDK) (80 nm)/Mg_0.9Ag_0.1 (200 nm)/Ag (80 nm), and two double-layer devices with configurations of ITO/NPB (30 nm)/Ir(ppy)₂(CBDK) (30 nm)/Mg_0.9Ag_0.1 (200 nm)/Ag (80 nm) and ITO/Ir(ppy)₂(CBDK) (30 nm)/AlQ (30 nm)/Mg_0.9Ag_0.1 (200 nm)/Ag (80 nm) were also fabricated and examined. The results show that the non-doped four-layer device for Ir(ppy)₂(CBDK) achieves maximum lumen efficiency of 4.54 lm/W and which is far higher than that of Ir(ppy)₂(acac), 0.53 lm/W, the device for Ir(dfppy)₂(CBDK) achieves maximum lumen efficiency of 0.51 lm/W and which is also far higher than that of Ir(dfppy)₂(acac), 0.06 lm/W. The results of simple devices involved Ir(ppy)₂(CBDK) show that the designed complex not only has a good hole transporting ability, but also has a good electron transporting ability. The improved performance of Ir(ppy)₂(CBDK) and Ir(dfppy)₂(CBDK) can be attributed to that the bulky carbazole-functionalized β-diketonate was introduced, therefore the carrier transporting property was improved and the triplet–triplet annihilation was reduced.     

Optimizing the fabrication process for high performance graphene field effect transistors

As an emerging material, graphene has attracted vast interest in solid-state physics, materials science, nanoelectronics and bioscience. Graphene has zero bandgap with its valence and conduction bands are cone-shaped and meet at the K points of the Brillouin zone. Due to its high intrinsic carrier mobility, large saturation velocity, and high on state current density, graphene is also considered as a promising candidate for high-frequency devices. To improve the reliability of graphene FETs, which include shifting the Dirac point voltage toward zero, increasing the channel mobility and decreasing the source/drain contact resistance, we optimized the device fabrication process. For CVD grown graphene, the film transfer and the device fabrication processes may produce interfacial states between graphene and the substrate and make graphene p or n-type, which shift the fermi level far away from the Dirac point. We have found that after graphene film transfer, an annealing process at 400 °C under N₂ ambient will shift Dirac point toward zero gate voltage. Ti/Au, Ni, and Ti/Pd/Au source/drain structures have been studied to minimize the contact resistance. According to the measured data, Ti/Pd/Au structure gives the lowest contact resistance (～500 ohm μm). By controlling the process of graphene growth, transfer and device fabrication, we have achieved graphene FETs with a field effective mobility of 16,000 cm²/V s after subtraction of contact resistance. The contact resistivity was estimated in the range of 1.1 × 10^?6 Ω cm² to 8.8 × 10^?6 Ω cm², which is close to state of the art III–V technology. The maximum transconductance was found to be 280 mS/mm at V_D = 0.5 V, which is the highest value among CVD graphene FETs published to date.     

Electron injection barrier and energy-level alignment at the Au/PDI8-CN2 interface via current–voltage measurements and ballistic emission microscopy

We probe electron transport across the Au/organic interface based on oriented thin films of the high-performance n-type perylene diimide semiconductor PDI8-CN₂. To this purpose, we prepared organic-on-inorganic Schottky diodes, with Au directly evaporated onto PDI8-CN₂ grown on n-Si. Temperature-dependent current–voltage characteristics and complementary ballistic electron emission microscopy studies reveal that rectification at the Au/PDI8-CN₂ interface is controlled by a spatially inhomogeneous injection barrier, that varies on a length scale of tens of nanometers according to a Gaussian distribution with mean value ∼0.94 eV and standard deviation ∼100 meV. The former gradually shifts to ∼1.04 eV on increasing PDI8-CN₂ thickness from 5 nm to 50 nm. Experimental evidences and general arguments further allow to establish the energetics at the Au/PDI8-CN₂ interface. Our work indicates injection-limited current flow in PDI8-CN₂-based devices with evaporated Au electrodes. Furthermore, it suggests chemical reactivity of PDI8-CN₂ with both Au and Si, driven by the lateral isocyano groups.     

Source/drain metallization effects on the specific contact resistance of indium tin zinc oxide thin film transistors

We report on the specific contact resistance of interfaces between thin amorphous semiconductor Indium Tin Zinc Oxide (ITZO) channel layers and different source/drain (S/D) electrodes (Al, ITO, and Ni) in amorphous oxide thin film transistors (TFTs) at different channel lengths using a transmission line model. All the contacts showed linear current–voltage characteristics. The effects of different channel lengths (200–800 μm, step 200 μm) and the contact resistance on the performance of TFT devices are discussed in this work. The Al/ITZO TFT samples with the channel length of 200 μm showed metallic behavior with a linear drain current-gate voltage (I_D–V_G) curve due to the formation of a conducting channel layer. The specific contact resistance (ρ_C) at the source or drain contact decreases as the gate voltage is increased from 0 to 10 V. The devices fabricated with Ni S/D electrodes show the best TFT characteristics such as highest field effect mobility (16.09 cm²/V·s), ON/OFF current ratio (3.27×10⁶), lowest sub-threshold slope (0.10 V/dec) and specific contact resistance (8.62 Ω·cm² at V_G=0 V). This is found that the interfacial reaction between Al and a-ITZO semiconducting layer lead to the negative shift of threshold voltage. There is a trend that the specific contact resistance decreases with increasing the work function of S/D electrode. This result can be partially ascribed to better band alignment in the Ni/ITZO interface due to the work function of Ni (5.04–5.35 eV) and ITZO (5.00–6.10 eV) being somewhat similar.     

Charge conduction study of phosphorescent iridium compounds for organic light-emitting diodes application

The charge conduction properties of a series of iridium-based compounds for phosphorescent organic light-emitting diodes (OLEDs) have been investigated by thin-film transistor (TFT) technique. These compounds include four homoleptic compounds: Ir(ppy)₃, Ir(piq)₃, Ir(Tpa-py)₃, Ir(Cz-py)₃, and two heteroleptic compounds Ir(Cz-py)₂(acac) and FIrpic. Ir(ppy)₃, Ir(piq)₃ and FIrpic are commercially available compounds, while Ir(Tpa-py)₃, Ir(Cz-py)₃ and Ir(Cz-py)₂(acac) are specially designed to test their conductivities with respect to the commercial compounds. In neat films, with the exception of FIrpic, all Ir-compounds possess significant hole transporting capabilities, with hole mobilities in the range of about 5 × 10⁻⁶–2 × 10⁻⁵ cm² V⁻¹ s⁻¹. FIrpic, however, is non-conducting as revealed by TFT measurements. We further investigate how Ir-compounds modify carrier transport as dopants when they are doped into a phosphorescent host material CBP. The commercial compounds are chosen for the investigation. Small amounts of Ir(ppy)₃ and Ir(piq)₃ (<10%) behave as hole traps when they are doped into CBP. The hole conduction of the doped CBP films can be reduced by as much as 4 orders of magnitude. Percolating conduction of Ir-compounds occurs when the doping concentrations of the Ir-compounds exceed 10%, and the hole mobilities gradually increase as their values reach those of the neat Ir films. In contrast to Ir(ppy)₃ and Ir(piq)₃, FIrpic does not participate in hole conduction when it is doped into CBP. The hole mobility decreases monotonically as the concentration of FIrpic increases due to the increase of the average charge hopping distance in CBP.     

Fabrication of Ag nanoparticle/ZnO thin films using dual-plasma-enhanced metal-organic chemical vapor deposition (DPEMOCVD) system incorporated with photoreduction method and its application

We report a novel method to grow silver nanoparticle/zinc oxide (Ag NP/ZnO) thin films using a dual-plasma-enhanced metal-organic chemical vapor deposition (DPEMOCVD) system incorporated with a photoreduction method. The crystalline quality, optical properties, and electrical characteristics of Ag NP/ZnO thin films depend on the AgNO₃ concentration or Ag content and annealing temperature. Optimal Ag NP/ZnO thin films have been grown with a AgNO₃ concentration of 0.12 M or 2.54 at%- Ag content and 500 °C- rapid thermal annealing (RTA); these films show orientation peaks of hexagonal-wurtzite-structured ZnO (002) and face-center-cubic-crystalline Ag (111), respectively. The transmittance and resistivity for optimal Ag NP/ZnO thin films are 85% and 6.9×10⁻⁴ Ω cm. Some Ag NP/ZnO transparent conducting oxide (TCO) films were applied to InGaN/GaN LEDs as transparent conductive layers. The InGaN/GaN LEDs with optimal Ag NP/ZnO TCO films showed electric and optical performance levels similar to those of devices fabricated with indium tin oxide.     

Electrical characteristics of electroless gold contacts on p-type Hg1−xCdxTe

High contact resistance of the order of 10⁻³ Ω cm² observed in p-type HgCdTe is one of the practical problems in the production of fine pitch high operating temperature and avalanche photodiode detector array. Electrical and compositional measurements on Au/p-HgCdTe are reported to understand the difficulties in reducing the contact resistance in HgCdTe detectors. Characterization of Au contacts on p-type Hg_1−xCd_xTe (x=0.3) formed by electrode-less (electroless) process and current transport mechanism are discussed. SIMS depth profiling of interfacial layer formed by the reaction of gold chloride with HgCdTe have been analyzed. Extent of the interfacial layer containing Au, Te, O and Cl is found to increase with increasing deposition time. Effect of annealing on the migration of Au across the contact region and electrical characteristics are presented. Heavily doped HgCdTe region with N_A=10¹⁷ cm⁻³ is produced beneath the contact regions after annealing at 80 °C leading to an order of magnitude improvement in the specific contact resistance. These results are useful for the creation of Au/p-HgCdTe contacts in a controlled and reproducible manner.     

Electrical and thermal stability of Ag ohmic contacts for GaN-based flip-chip light-emitting diodes by using an AgAl alloy capping layer

We have investigated Ag(200 nm)/AgAl(100 nm) ohmic contacts to p-type GaN for near-UV (405 nm) flip-chip light-emitting diodes (LEDs). It is shown that the use of an AgAl alloy capping layer (with 8 at% Al) results in better electrical and optical properties as compared to single Ag contacts when annealed at 430 °C. For example, Ag/AgAl (8 at% Al) contacts give specific contact resistance of 4.6×10^–4 Ω cm² and reflectance of 90% at a wavelength of 405 nm. However, use of an AgAl (with 50 at% Al) layer is not effective. LEDs fabricated with the Ag/AgAl (8 at% Al) reflectors produce higher light output as compared with the ones with single Ag reflectors. Ohmic mechanisms of the Ag/AgAl (8 at% Al) contacts are described and discussed.     

Highly efficient two component phosphorescent organic light-emitting diodes based on direct hole injection into dopant and gradient doping

A series of two component phosphorescent organic light-emitting diodes (PHOLEDs) combing the direct hole injection into dopant strategy with a gradient doping profile were demonstrated. The dopant, host, as well as molybdenum oxide (MoO₃)-modified indium tin oxide (ITO) anode were investigated. It is found that the devices ITO/MoO₃ (0 or 1 nm)/fac-tris(2-phenylpyridine)iridium [Ir(ppy)₃]:1,3,5-tris(N-phenylbenzimidazole-2-yl)benzene (TPBi) (30 → 0 wt%, 105 nm)/LiF (1 nm)/Al (100 nm) show maximum external quantum efficiency (EQE) over 20%, which are comparable to multi-layered PHOLEDs. Moreover, the systematic variation of the host from TPBi to 4,7-diphenyl-1,10-phenanthroline (Bphen), dopant from Ir(ppy)₃ to bis(2-phenylpyridine)(acetylacetonate)iridium [Ir(ppy)₂(acac)], and anodes between ITO and ITO/MoO₃ indicates that balancing the charge as well as controlling the charge recombination zone play critical roles in the design of highly efficient two component PHOLEDs.     

Alcohol-soluble polyfluorenes containing dibenzothiophene-S,S-dioxide segments for cathode interfacial layer in PLEDs and PSCs

A series of alcohol-soluble amino-functionalized polyfluorene derivatives (PF-N-S, PF-N-SC8 and PF-N-SOC8) comprising various ratios of dibenzothiophene-S,S-dioxide segments (S/SC8/SOC8) in the main chains, respectively, were synthesized and utilized as cathode interfacial layer (CIL) in polymer light-emitting diodes (PLEDs) and polymer solar cells (PSCs) with high-work-function Al (or Au) electrode. The polymers possess LUMO/HOMO levels at −2.78 to −3.53 eV/−5.69 to −6.32 eV. Multilayer PLEDs and PSCs with device configurations of ITO/PEDOT:PSS (40 nm)/P-PPV or PFO-DBT35:PCBM = 1:2 (80 nm)/CIL (3–15 nm)/Al (or Au) (100 nm) were fabricated. The PF-N-S-10/Al (or Au) cathode PLEDs displayed maximum luminous efficiency of 24.4 cd A⁻¹ (or 11.9 cd A⁻¹), significantly higher than bare Al (or Au) cathode device, exceeding well-known Ba/Al and poly[(9,9-bis(3′-(N,N-dimethylamino)propyl)-2,7-fluorene)-alt-2,7-(9,9-dioctylfluorene)] (PFN)/Al (or PFN/Au) cathode devices. The enhanced open-circuit voltages (V_ocs), electron reflux and reduced work functions clarify that the electron injection barrier from the Al (or Au) electrode can be lowered by inserting the polymers as CIL. The resulted PSCs also show device performances exceeding Al and PFN/Al cathode devices. The results indicate that PF-N-S, PF-N-SC8 and PF-N-SOC8 are excellent CIL materials for PLEDs and PSCs with high-work-function Al or Au electrode.     

Green and blue–green light-emitting electrochemical cells based on cationic iridium complexes with 2-(4-ethyl-2-pyridyl)-1H-imidazole ancillary ligand

The ionic iridium complexes, [Ir(ppy)₂(EP-Imid)]PF₆ (Complex 1) and [Ir(dfppy)₂(EP-Imid)]PF₆ (Complex 2) are used as the light-emitting material for the fabrication of light-emitting electrochemical cells (LECs). These complexes have been synthesized, employing 2-(4-ethyl-2-pyridyl)-1H-imidazole (EP-Imid) as the ancillary ligand, 2-phenylpyridine (ppy) and 2-(2,4-difluorophenyl)pyridine (dfppy) as the cyclometalated ligands, which were characterized by various spectroscopic, photophysical and electrochemical methods. The photoluminescence (PL) emission spectra in acetonitrile solution show blue–green and blue light emission for Complexes 1 and 2 respectively. However, LECs incorporating these complexes resulted in green (522 nm) light emission for Complex 1 with the Commission Internationale de L’Eclairage (CIE) coordinates of (0.33, 0.56) and blue–green (500 nm) light emission for Complex 2 with the CIE coordinates of (0.24, 0.44). Using Complex 1, a maximum luminance of 1191 cd m⁻² and current efficiency of 1.0 cd A⁻¹ are obtained while that of Complex 2 are 741 cd m⁻² and 0.88 cd A⁻¹ respectively.     

Improving the light output power of GaN-based light-emitting diodes through the use of SiO2 cones

We introduced a simple wet-etching process to form SiO₂ cones and investigated the effect of the size and coverage of the SiO₂ cones on the output power of GaN-based light-emitting diodes (LEDs). The diameter of the cones varies from 2.8 to 17.1 μm and the height from 0.6 to 2.0 μm. It is shown that regardless of the sizes of the cones, all of the LEDs exhibit a same forward-bias voltage of 3.31 V at an injection current of 20 mA. As the size of the cones increases, the light output increases, reaches maximum at cone #3 (12.4 μm in diameter and 2.0 μm in height), and then decrease slightly. For example, the LEDs fabricated with different SiO₂ cones exhibit 11.4–35.9% higher light output power (at 20 mA) than do the LEDs without the cones. The electroluminescence (EL) intensity (at 20 mA) also exhibits cone size dependence similar to that of light output power. For example, the LEDs fabricated with different cones exhibit 7.7–36.3% higher EL intensity than the LEDs without the cones.     

Influence of cathode roughness on the performance of F8BT based organic–inorganic light emitting diodes

Hybrid light emitting diodes (HyLED) with a structure of FTO/ZnO/F8BT/MoO₃/Au/Ag is fabricated and the influence of surface roughness of cathode (FTO/ZnO) is investigated. The roughness of FTO could be decreased from 9.2 nm to 2.2 nm using a mild polishing process. The ZnO film, deposited by spray pyrolysis, functions as an electron injection layer. The roughness of the FTO/ZnO surface is found also highly dependent on the ZnO thickness. For thin ZnO films (20 nm), polishing results in better efficacy and power efficiency of LED devices, with nearly a two times improvement. For thick ZnO films (210 nm), the overall FTO/ZnO roughness is almost independent of the FTO roughness, hence both polished and unpolished substrates exhibit identical performance. Increasing ZnO thickness generally improves the electron injection condition, leading to lower turn on voltage and higher current and power efficiencies. However, for too large ZnO thickness (210 nm) the ohmic loss across the film dominates and deteriorates the performance. While the polished substrates show less device sensitivity to ZnO thickness and better performance at thin ZnO layer, best performance is obtained for unpolished substrates with 110 nm ZnO thickness. Larger interface area of ZnO/F8BT and enhanced electric filed at sharp peaks/valleys could be the reason for better performance of devices with unpolished substrates.     

Polycarbonate films metalized with a single component molecular conductor suited to strain and stress sensing applications

The paper reports all-organic strain and stress sensitive films that use electrical monitoring approach. The films were prepared by self-metallizing polycarbonate films with the single component molecular conductor [Au(α-tpdt)₂]⁰ (tpdt = 2,3-thiophenedithiolate). It was shown that [Au(α-tpdt)₂]⁰ by its nature is able to form metallic solid material with low crystallinity. Electromechanical tests demonstrated that the developed films are strain-resistive materials with advanced elastic properties: their electrical resistance varies linearly with uniaxial elongation up to relative strain being of 1.0% that is about five times larger than that for conventional metals. The gauge factor of the films is 4.4 and stress sensitivity is 30 Ω/bar. The processing characteristics of polycarbonate films, self-metalized with a metallic [Au(α-tpdt)₂]⁰-based layer, make them potentially useful for engineering flexible, lightweight, strain and pressure sensors. Due to electromechanical characteristics these films are suited to strain sensing applications requiring miniature strain control in a wide deformation range.     

Electrical and optical characteristics of phosphorescent organic light-emitting device with thin-codoped layer insertion

In this paper, we demonstrated the changes of electrical and optical characteristics of a phosphorescent organic light-emitting device (OLED) with tris(phenylpyridine)iridium Ir(ppy)₃ thin layer (4 nm) slightly codoped (1%) inside the emitting layer (EML) close to the cathode side. Such a thin layer helped for electron injection and transport from the electron transporting layer into the EML, which reduced the driving voltage (0.40 V at 100 mA/cm²). Electroluminescence (EL) spectral shift at different driving voltage was observed in our blue OLED with [(4,6-di-fluoropheny)-pyridinato-N,C^2′]picolinate (FIrpic) emitter, which came from the recombination zone shift. With the incorporation of thin-codoped Ir(ppy)₃, such EL spectral shift was almost undetectable (color coordinate shift (0.000, 0.001) from 100 to 10,000 cd/m²), due to the compensation of Ir(ppy)₃ emission at low driving voltage. Such a methodology can be applied to a white OLED which stabilized the EL spectrum and the color coordinates ((0.012, 0.002) from 100 to 10,000 cd/m²).     

Residual strain and electrical resistivity dependence of molybdenum films on DC plasma magnetron sputtering conditions

Sputter deposited molybdenum (Mo) thin films are used as back contact layer for Cu(In_1−xGa_x)(Se_1−yS_y)₂ based thin film solar cells. Desirable properties of Mo films include chemical and mechanical inertness during the deposition process, high conductivity, appropriate thermal expansion coefficient with contact layers and a low contact resistance with the absorber layer. Mo films were deposited over soda-lime glass substrates using DC-plasma magnetron sputtering technique. A 2³ full factorial design was made to investigate the effect of applied power, chamber pressure, and substrate temperature on structural, morphological, and electrical properties of the films. All the films were of submicron thickness with growth rates in the range of 34–82 nm/min and either voided columnar or dense growth morphology. Atomic force microscope studies revealed very smooth surface topography with average surface roughness values of upto 17 nm. X-ray diffraction studies indicated, all the films to be monocrystalline with (001) orientation and crystallite size in the range of 4.6–21 nm. The films exhibited varying degrees of compressive or tensile residual stresses when produced at low or high chamber pressure. Low pressure synthesis resulted in film buckling and cracking due to poor interfacial strength as characterized by failure during the tape test. Measurement of electrical resistivity for all the films yielded a minimum _value of 42 μΩ cm for Mo films deposited at 200 W DC power.     

Transparent Al/WO3/Au film as anode for high efficiency organic light-emitting diodes

A transparent Al/WO₃/Au anode is introduced to fabricate high efficiency organic light-emitting devices (OLEDs). By optimizing the thicknesses of each layers of the Al/WO₃/Au structure, the transmittance of Al(7 nm)/WO₃(3 nm)/Au(13 nm) has reached over 55%. Concerning the performance of OLEDs using the optimized anode, the electroluminescence (EL) current efficiency and brightness are enhanced and the EL spectrum is greatly narrowed as compared to the OLEDs using indium-tin-oxide (ITO) as the anode. The results indicate that the metal/metal oxide/metal transparent electrode is a good structure for the anode of high performance OLEDs. In addition, Al/WO₃/Au can function as a composite transparent electrode for top-emitting OLEDs.     

The effect of temperature on the growth and properties of green light-emitting In0.5Ga0.5N films prepared by reactive sputtering with single cermet target

We have grown In_0.5Ga_0.5N films on SiO₂/Si (100) substrate at 100–400 °C for 90 min by rf reactive sputtering with single cermet target. The target was made by hot pressing the mixture of metallic indium, gallium and ceramic gallium nitride powder. X-ray diffraction (XRD) measurements indicated that In_0.5Ga_0.5N films had wurtzite structure and showed the preferential (1 0 -1 0) diffraction. Both SEM and AFM showed that In_0.5Ga_0.5N films were smooth and had small roughness of 0.6 nm. Optical properties were measured by photoluminescence (PL) spectra from room temperature to low temperature of 20 K. The 2.28 eV green emission was achieved at room temperature for all our InGaN films. The electrical properties of In_0.5Ga_0.5N films on a SiO₂/Si (100) substrate were measured by the Hall measurement at room temperature. InGaN films showed the electron concentration of 1.51×10²⁰–1.90×10²⁰ cm⁻³ and mobility of 5.94–10.5 cm² V⁻¹ s⁻¹. Alloying of InN and GaN was confirmed for the sputtered InGaN.