中国集成电路设计产业的发展趋势

分析了集成电路技术发展趋势及面临的挑战,介绍了2013年全球半导体产业和集成电路设计产业的基本情况、全球设计产业销售占集成电路销售的比重及全球前十大半导体IP供应商情况。深入分析了2013年我国集成电路产业现状,重点分析了集成电路设计产业发展面临的问题,比较了近10年我国集成电路产业在全球比重及我国集成电路产业结构的变化。全面分析了国家一系列鼓励集成电路产业发展政策,讨论了今后集成电路设计产业的发展重点领域。     

集成电路工艺的计算机辅助设计

一、集成电路 TCAD 系统的提出以缩短集成电路工艺、集成电路器件和集成电路电路的设计周期以及为提高设计精度和节省设计成本为目标而发展起来的集成电路工艺模拟、集成电路器件模拟、集成电路电路模拟用器件模型参数提取等方面的集成电路计算机辅助设计软件的研制和应用,如从美国 Scanford 大学推出一维硅器件全工序工艺模拟器 SUPREM-2(1978年)算起,已有十余年的历史了。在这十余年中.随着集成电路的飞速发展,集成电路工艺的 CAD 这个领域也有了较大的进展。在集成电路工艺模拟方面,已有了较成熟的一维硅集成电路全工序工艺模拟软件,二维硅集成电路全工序工艺模     

异步集成电路设计的研究与进展

回顾了异步集成电路设计发展的历史,阐述了当前异步集成电路重新引起重视的原因,总结了异步集成电路的优势,并对异步集成电路设计方法进行了简要地概括,介绍了实用的异步集成电路芯片,最后分析了异步集成电路面临的挑战,并揭示了它今后的发展方向.     

浅谈CMOS集成电路的应用

CMOS集成电路因其高性能、低功耗的特点已经在集成电路设计中得到了极为广泛的应用。本文浅析了CMOS集成电路的性能特点,通过对其特点的分析,介绍了目前CMOS集成电路的应用方面,并指出了CMOS集成电路应用的注意事项,为集成电路的发展提供理论依据。     

集成电路分选机的维修及应用

随着经济发展和技术的进步,集成电路产业取得了突飞猛进的发展。集成电路测试在集成电路产业链中的作用越来越大,专业化的集成电路测试业是集成电路产业中一个重要组成部分,是保证集成电路性能、质量的关键环节之一。各大半导体生产厂家都在竭力提高生产效率和检测效率,生产厂家在芯片生产中采用了自动化的半导体测试仪器和高速、智能化的集成电路分选机。以CTS800分选机为例,详细介绍了集成电路分选机常见故障的维修及应用。     

中国集成电路设计业实现飞跃性成长 TOP10门槛进一步提高

2003年是中国集成电路设计业高速发展的一年，是中国集成电路设计企业茁壮成长的一年，也是中国集成电路设计业具有里程碑意义的一年。在国际集成电路产业全面复苏的大环境下，中国的集成电路产业重新恢复了迅猛增长的势头。作为集成电路产业的龙头，中国集成电路设计业的设     

中国集成电路的发展现状与发展建议

本文从集成电路产业链入手,介绍了中国集成电路的发展现状,并且针对中国集成电路行业发展存在的问题,对中国集成电路行业的发展提出了若干建议.     

国外军用超大规模集成电路的应用与发展趋势

论述了国外超大规模集成电路的发展趋势及在武器装备中的作用.介绍了美、欧、日、韩今后发展超大规模集成电路的对策.分析了国外超大规模集成电路民技军用的背景,随着集成电路技术的发展,民用市场上会有更多质优价廉的民用集成电路产品适合军事装备的需要,民技军用是国外军用集成电路今后的发展趋势.     

“数字集成电路设计”课程教学内容的探讨

本文探讨了将专用集成电路设计技术纳入微电子专业数字集成电路本科教学的重要性和可行性.分析了数字集成电路教学的现状,比较了不同数字集成电路课程的教学内容,提出一个以三门课为核心的数字集成电路教学体系.本文重点介绍了新的专用集成电路设计技术课,详细描述了理论部分和实验部分的教学内容及其参考资料,最后给出了课程的实施情况.     

新春致辞

飞雪迎春到。在庚寅年春节即将来临之际,《中国集成电路》向业界的朋友问好! 18年来,《中国集成电路》伴随着我国集成电路设计业的发展而成长。今天,《中国集成电路》为整个集成电路产业链服务的新理念、新目标既向《中国集成电路》提出了更高的要求,也为《中国集成电路》开辟了更广阔的发展空间。     

CMOS射频集成电路：成果与展望

CMOS射频集成电路的研究和制作将大大拓展集成电路的应用空间,文章介绍了采用CMOS工艺集成射频电路研究中所取得的成果,评述了其中存在的问题,最后指出了该领域中未来的几个研究方向。     

微波集成电路技术—回顾与展望

半个多世纪来 ,微波电路技术经历了从分立电路、两维微波集成电路、三维微波集成电路等阶段。在回顾这一发展历程后 ,介绍多层微波集成电路和三维微波集成电路。阐述其产生背景、关键技术及发展方向。文中将涉及微加工技术以及从直流至射频的多芯片全集成新概念。瞻望二十一世纪前景。     

Cut-and-paste customization of organic FET integrated circuit and its application to electronic artificial skin

The concept of cut-and-paste customization is introduced for the first time in designing integrated circuits based on mechanically flexible organic field-effect transistors, and is applied to electronic artificial skin. The electronic artificial skin comprise of three separate integrated circuits that are a pressure-sensor array, row decoders, and column selectors to read out pressure information over a large area. All of three integrated circuits are scalable in size because the pressure-sensor array is a simple repetition of sensor cells and the row and column decoders adopt wired-NAND circuits, which enables the cut-and-paste customization in size. The physical cut-and-paste procedure is employed by cutting a part of the integrated circuits and pasting it to another integrated circuit with a connecting plastic tape. The integrated circuits are designed with a standard SPICE simulator and layout design tool, and the operation is confirmed by measurement.     

微波混合集成电路的ESD设计

主要介绍了微波混合集成电路ESD设计的一些探索工作,对两种不同功能和形式的混合集成电路的抗静电能力和电路中的薄弱部位进行了研究和分析.依据实验摸底结果并结合电路的自身特点,有针对性地进行ESD保护电路设计,既有效提高了电路的抗静电能力,又保证电路的微波电性能不受较大的影响.试验结果表明,运用这种电路后,使得HE393B宽带放大器防静电能力从300 V提高到1 500 V,HE010电压产生器达到800 V.     

Optical Integrated Circuits: A Personal Perspective

The remarkable early success and current explosive growth of electronic integrated circuits have fascinated photonics researchers since 1969 with the prospect of similar success in optical integrated circuits. Alas, physical and economic factors have stymied their efforts. Two recent commercial optical integrated circuits may be the first points on a photonic Moore's law curve. The author presents his view of the progress of optical integrated circuits since S. E. Miller's proposal in the 1969 Bell Systems Technical Journal.      

GaAs integrated optoelectronics

Monolithic integrated optoelectronic circuits, which incorporate electronic and optical devices on the same substrate, have the advantages of smaller size, and potentially higher reliability compared with conventional hybrid circuits. In addition, significant improvements in the speed and noise performance of communication systems can be realized. This paper reviews the various elements which constitute the integrated optoelectronic circuits (IOEC's) with emphasis on the structure of GaAlAs injection lasers. Several integrated circuits on GaAs substrates are described in detail. A view of optoelectronic circuits in other III-V compounds is presented.     

Conception assistée par ordinateur des circuits intégrés monolithiques hyperfréquences

Computer aided design of microwave monolithic integrated circuits must combine two different fields. The first domain is the simulation of microwave circuits taking into account non linear aspects development of time domain and harmonic balance simulation algorithms specialized for microwave circuits. In the second place are found, the layout algorithms which were developed for logic circuits (on Si or GaAs). The association of these two types of algorithms leads to the constitution of aCad workstation for microwave monolithic integrated circuits. Two examples of design and realization of integrated circuits with these tools are presented.     

RF 集成电路工艺探讨¹

射频集成电路的研究和制作将大大拓展集成电路的应用空间，本文介绍了当今RF的主流工艺，并分别对基于硅的深亚微米CMOS工艺在RF设计中的可行性和困难进行了研究，评述了其中存在的问题，最后提出了该领域中未来的发展前景。     

Preface: Special Issue on Large Scale Integration

The interests of the solid-state circuits community have been focused on integrated circuits during the past several years. Through a potent combination of technological and economic factors, the development of digital integrated circuits has progressed at a particularly rapid rate during this petiod. At present, large scale integration represents the region of singular importance in the field of digital integrated circuits. Typically, large scale integration consists of the combination of a multiplicity of circuit elements within a basic cell and the further combination of a multiplicity of cells in a monolithic structure to form a highly complex integrated circuit or an integrated equipment component. A most significant feature of an integrated equipment component is the uniquely intimate interdependence of its material, device, circuit, and system-design considerations. Recognizing this interdependence, the central position of large scale integration in electronics and its salient importance in solid-state circuits, the purpose of this issue is to act as an expose of advanced work being done in this field.     

Substrate integrated nonradiative dielectric waveguide

A new substrate integrated circuits (SICs) fabrication technique is proposed for realizing nonradiative dielectric (NRD) waveguide circuits. This new technique called substrate integrated NRD (SINRD) guide allows the NRD guide be integrated within a dielectric substrate by drilling a pattern of air holes. Dispersion analysis and design considerations of the new structure are discussed. A hybrid integrated scheme of planar and SINRD circuits is demonstrated for the first time with simulation and measurement results.