High-field transport in InGaAs/InAlAs modulation-doped heterostructures

The velocity-field and mobility-field characteristics of normal and inverted InGaAs/InAlAs modulation-doped heterostructures grown by molecular-beam epitaxy have been measured at 300 and 77 K. Veloczities of 3.0 × 10⁷and 1.7 × 10⁷cm/s have been measured in the normal and inverted structures, respectively, at 77 K. Current instabilities are observed at the corresponding field values. Hall mobilities decrease With field beyond 500 V/cm, principally due to phonon scattering. The mobilities in normal and inverted heterostructures attain Similar values at fields higher than 1 kV/cm, irrespective of the low-field values.     

Low-frequency noise characteristics of p-n-p InAlAs/InGaAs HBTs

The low-frequency noise characteristics of p-n-p InAlAs/InGaAs heterojunction bipolar transistors (HBTs) were investigated. Devices with various geometries were measured under different bias conditions. The base noise current spectral density (3.11 /spl times/ 10/sup -16/ A/sup 2//Hz) was found to be higher than the collector noise current spectral density (1.48 /spl times/ 10/sup -16/ A/sup 2//Hz) at 10 Hz under low bias condition (I/sub C/=1 mA, V/sub EC/=1 V), while the base noise current spectral density (2.04 /spl times/ 10/sup -15/ A/sup 2//Hz) is lower than the collector noise current spectral density (7.87 /spl times/ 10/sup -15/ A/sup 2//Hz) under high bias condition (I/sub C/=10 mA, V/sub EC/=2 V). The low-frequency noise sources were identified using the emitter-feedback technique. The results suggest that the low-frequency noise is a surface-related process. In addition, the dominant noise sources varied with bias levels.     

Impact ionization in InAlAs/InGaAs/InAlAs HEMT's

The kink effect and excess gate current in InAlAs/InGaAs/InAlAs HEMT's have been linked to impact ionization in the high field region of the channel. In this letter, a relationship is established between experimentally measured excess gate current and the tunneling of holes from the quantum well formed in the channel. The channel hole current is then obtained as the quotient of the excess gate current to the gate-voltage-dependent transmission probability. This channel hole current follows the exponential dependence of the ionization constant on the inverse electric field     

DC and RF characteristics of InAlAs/InGaAs dual-gate TEGFETs

DC and microwave measurements on 0.7 mu m single-gate (SG) and dual-gate (DG) In/sub 0.52/Al/sub 0.48/As/In/sub 0.53/Ga/sub 0.47/As planar doped two-dimensional electron gas field-effect transistors (TEGFETs) are reported. The DG devices show a large increase of the g/sub m/ to g/sub D/ ratios, which are as high as 100 at g/sub m/=380 mS/mm, compared with 12 at 420 mS/mm for the single gate (SG) devices on the same chip, as well as 6 dB improvement in the RF power gain compared with their SG counterparts.<>     

Improved InAlAs/InGaAs HEMT characteristics by inserting an InAslayer into the InGaAs channel

An InAlAs/InGaAs HEMT with a thin InAs layer inserted into the InGaAs channel is proposed and its electron transport properties and device performances have been investigated. By optimizing the thickness and the exact point of insertion in the InAs layer, the mobility and electron velocity at 300 K have been increased by 30% and 15%, respectively, compared to the conventional heterostructure. In addition, a maximum intrinsic transconductance of 970 mS/mm and a maximum current gain cutoff frequency of 58.1 GHz have been attained by a 0.6 μm-gate-length device     

InGaAs/InAlAs RTD I-V特性的量子力学隧穿模拟

本文通过数值求解含时Schrodinger方程得到了InGaAs/InAlAs共振隧穿二极管 (RTD)的电流 偏压曲线 ,我们发现数值模拟的结果与实验符合得很好。     

Delta-doping-enhanced InGaAs/InAlAs heterobarrier diodes

Modification of the effective conduction-band offset in InGaAs/InAlAs isotype heterojunctions by incorporating, during epitaxial growth, a doping dipole formed by alternate n⁺, p⁺ delta (δ-) doping is demonstrated. Greatly improved current rectification is found when the dipole polarity enhances the potential barrier     

Ordering in InGaAs/InAlAs layers

The structure of InCaAs/InAlAs layers lattice matched to an InP substrate, grown on either (100) or on (110) with a 4° tilt toward [111] at 500 and 300°C has been investigated by transmission electron microscopy. High perfection resulted for the layers grown on [001] oriented substrates whereas growth on the near [110] substrates resulted in compositional nonuniformities, macrosteps formation, and ordering of the group III elements. This difference in structural perfection between the two sets of samples was also reflected in differences in electrical properties.     

InP/InAlAs/InGaAs quantum wires

Single InGaAs quantum wires and stacked InGaAs quantum wires with InAIAs barriers have been fabricated on V-grooved InP substrates by low pressure metal-organic chemical vapour deposition (MOCVD). We have found growth conditions where the InAIAs barrier exhibits a resharpening effect, similar to that of AlGaAs utilized for growth on GaAs substrates. The existence of structural and electronic quantum wires in the bottom of the grooves is proven.     

Processing techniques for InGaAs/InAlAs/InGaAs spin field effect transistors

Wet etch processing techniques for InGaAs/InAl/As/InGaAs transistors are used to fabricate an N-channel HEMT (High Electron Mobility Transistor) with Fe contacts. These processing techniques can easily be extended for dilute magnetic semiconductor regrowth and for testing of various spin injection geometries.     

Impact ionization in InAlAs/InGaAs HFET's

The presence of an energy barrier to the transfer of holes from the channel to the gate electrode of InAlAs/InGaAs HFET's prevents the gate current from being a reliable indicator of impact ionization. Consequently, we have used a specially designed sidegate structure to demonstrate that due to the narrow bandgap of InGaAs, impact ionization takes place in the channel of these devices under normal operating conditions. The ionization coefficient was found to follow a classic exponential dependence on the inverse electric field at the drain end of the gate, for over three orders of magnitude     

High-performance InAlAs/InGaAs HEMTs and MESFETs

The fabrication and microwave performance of heterostructure InAlAs/InGaAs HEMTs (high-electron-mobility transistors) and MESFETs are described. Maximum stable gains of 14.3 dB for a HEMT and 12 dB for a MESFET at 26.5 GHz have been achieved. These are believed to be record gains for FETs having gates as long as 0.7 μm     

应变补偿InGaAs/InAlAs量子级联激光器

利用应变补偿的方法研制出激射波长 λ≈ 3.5— 3.7μm的量子级联激光器 .条宽 2 0 μm,腔长 1 .6mm的 Inx Ga1- x As/Iny Al1- y As量子级联激光器已实现室温准连续激射 .在最大输出功率处的准连续激射可持续 30 min以上 .     

High-performance double-modulation-doped InAlAs/InGaAs/InAs HFETs

We demonstrate the improvement of double-sided-doped InAlAs/InGaAs MODFETs by inserting a thin InAs layer in the center of the conventional InGaAs channel. A maximum extrinsic transconductance of 1.4 S/mm is achieved for 0.13-μm devices. The current gain cutoff frequency of this device is as high as 265 GHz. Delay time analysis shows a significant improvement in the effective saturated velocity, from 2.4×10⁷ cm/s for LM devices to 3.1×10⁷ cm/s for InAs devices. We believe the superior performance of this device is primarily due to the reduction of scattering from donor layers, especially under the channel, and the interface roughness, which is achieved by inserting a 4-nm InAs layer in the channel     

应变补偿InGaAs/InAlAs量子级联激光器

利用应变补偿的方法研制出激射波长λ≈3.5—3.7μm的量子级联激光器.条宽20μm,腔长1.6mm的InxGa1-xAs/InyAl1-yAs量子级联激光器已实现室温准连续激射.在最大输出功率处的准连续激射可持续30min以上.     

InAlAs/InGaAs HBT X-band double-balanced upconverter

We report on an InAlAs/InGaAs HBT Gilbert cell double-balanced mixer which upconverts a 3 GHz IF signal to an RF frequency of 5-12 GHz. The mixer cell achieves a conversion loss of between 0.8 dB and 2.6 dB from 5 to 12 GHz. The LO-RF and IF-RF isolations are better than 30 dB at an LO drive of +5 dBm across the RF band. A pre-distortion circuit is used to increase the linear input power range of the LO port to above +5 dBm. Discrete amplifiers designed for the IF and RF frequency ports make up the complete upconverter architecture which achieves a conversion gain of 40 dB for an RF output bandwidth of 10 GHz. The upconverter chip set fabricated with InAlAs/InGaAs HBT's demonstrates the widest gain-bandwidth performance of a Gilbert cell based upconverter compared to previous GaAs and InP HBT or Si-bipolar IC's     

High-speed InAlAs/InGaAs heterojunction bipolar transistors

InAlAs/InGaAs heterojunction bipolar transistors fabricated from wafers grown by molecular beam epitaxy are discussed. A cutoff frequency of 32 GHz for a collector current of 20 mA is achieved in the emitter area of devices 6×10 μm². The use of heavily doped and nondoped InGaAs layers as the emitter cap and collector, respectively, results in a reduction of the emitter and collector charging times; this, in turn, leads to improved microwave performance     

Microwave performance of InAlAs/InGaAs/InP MODFET's

Modulation-doped InAlAs/InGaAs/InP structures were grown by molecular beam epitaxy (MBE) and fabricated into FET's with excellent RF gain performance. The intrinsic transconductance was about 400 mS/mm at 300 K. Current gain cutoff frequencies of up to 26.5 GHz were obtained in 1-µm gate devices. Extremely small S12and large S21led to a very largef_{max}of 62 GHz. These results represent the best reported figures for 1-µm devices in this material system and slightly better than those obtained in recently developed pseudomorphic modulation-doped field effect transistors (MODFET's).     

Microwave performance of InGaAs/InAlAs/InP SISFETs

Microwave S-parameter measurements and equivalent-circuit modeling of In_0.53Ga_0.47As/In_0.52Al_0.48 As/InP semiconductor-insulator-semiconductor FETs (SISFETs) of 1.1-μm gate length are discussed. The devices incorporated wide-bandgap buffers, self-aligned contact implants, and refractory air-bridge gates. Their DC I-V characteristics displayed sharp pinchoff, good output conductance of 10-20 mS/ss, and extrinsic transconductance up to 220 ms/mm at room temperature. The maximum unity-current-gain frequency was 27 GHz. Gate resistance was found to be the dominant factor limiting microwave power gain     

InGaAs(InAlAs)/InP和InP/InAlAs湿法选择腐蚀研究

介绍了两种选择腐蚀液对InGaAs(InAlAs)I/nP和InPI/nAlAs异质结构材料选择腐蚀的实验结果,重点介绍在InAlAs上面生长InP的湿法选择腐蚀,用HClH∶3PO4C∶H3COOH系列腐蚀液,InPI/nAlAs选择比大于300。InPI/nAlAs湿法选择腐蚀的结果可以很好应用到OEIC芯片制作中,并取得了较好的器件及电路结果。