碳膜保护对高温激活SiC表面形貌的影响

采用碳膜覆盖于SiC晶片表面,作为SiC离子注入后高温激活退火的保护层,1650℃20 min高温退火后,有碳膜保护的SiC晶片表面粗糙度RMS只有0.6 nm,无明显形貌退化。AZ5214光刻胶在不同温度条件Ar气氛围下碳化40 min,光刻胶均转变为纳米晶体石墨化碳膜。进行Raman测试表明,碳膜D峰和G峰的比值随碳化温度升高而增大,800℃高温碳化形成的碳膜ID:IG达到3.57,对高温激活退火SiC表面保护效果最佳,经过Ar气氛围下1 650℃20 min激活退火后,有碳膜保护和无碳膜保护的SiC表面粗糙度RMS分别为0.6 nm和3.6 nm。     

SiC功率器件离子注入和退火设备及工艺验证

针对SiC功率器件工艺制程中离子注入和激活退火的技术难题,利用爱发科公司自行设计并开发的高温离子注入设备(ULVAC,IH-860DSIC)、碳膜溅射设备(ULVAC,SME-200)和高温激活退火设备(ULVAC,PFS-6000-25)。通过计算模拟、AFM对比结果、Hall电阻测定和RHEED图像分析等表征手段,研究了高温高能多步注入、碳膜覆盖技术和退火温度分别对SiC器件的物理特性、表面特性及电学特性的影响。结果表明,采用500℃Al离子注入浓度为5×1018cm-3、20 nm厚碳膜溅射技术和1 700~2 000℃激活退火技术,能够实现具有良好表面特性和电学特性的p型SiC掺杂工艺。设备的稳定性已在多条SiC生产线上用于制造SiCSBD器件和SiC-MOSFET器件完成工艺验证。     

Hf0.5Zr0.5O2基铁电电容器的特性研究

利用原子层淀积工艺制备了9 nm厚的铪锆氧(Hf0.5Zr0.5O₂)铁电薄膜。通过淀积TiN顶/底电极形成Hf0.5Zr0.5O₂铁电电容,研究退火工艺和机械夹持工艺对铁电电容性能的影响。实验结果表明,极化强度-电压曲线为电滞回线形,双倍剩余极化强度达31.7 μC/cm²,矫顽电压约为1.6 V,电学性能明显提高。在150 ℃高温下,Hf0.5Zr0.5O₂基铁电电容器的电学性能仍然良好,证明了退火工艺和机械夹持工艺对电学性能的优化作用。     

金属Al与半导体Ge欧姆接触的制备和表征

基于圆形传输线模型,通过测试样品的比接 触电阻率和电流-电压(I-V)特性曲线,分析 对比了Al与Si基上外延生长的p型Ge、n型Ge和n型Si的接触特性。实验结果发现,由于金 属与Ge材料接触存在强烈的费米钉效应,导致金属与n型Ge接触有高的接触电阻,难实 现低的比接触电阻率;而Al与p型Ge在掺杂浓度为4.2×10¹⁸ cm－3时,并且经过退火,比接 触电阻率能达到4.0×10－7 Ω·cm²;Al与n型Ge和n型Si接 触电极相比,后者可形成良好的 欧姆接触,其比接触电阻率较n型Ge接触降低了1个量级,经合金化处理后的Al/n⁺Si接触 电阻率能达到5.21×10－5 Ω·cm²,达到了制作高性能Ge 光电器件的要求。     

钒注入制备半绝缘SiC的退火效应

对钒离子注入P型和n型4H-SiC制备半绝缘层的方法和特性进行了研究.注入层电阻率随退火温度的升高而增加,经过1 650℃退火后,钒注入p型和n型SiC的电阻率分别为1.6×1010Ω·cm和7.6×106Ω·cm.借助原子力显微镜对样品表面形貌进行分析,发现碳保护膜可以有效减小高温退火产生的表面粗糙,抑制沟槽的形成.二次离子质谱分析结果表明退火没有导致明显的钒在SiC中的再扩散.即使经过1 650℃高温退火,也没有发现钒离子向SiC表面外扩散的现象.     

重掺杂p型SiC晶片Ni/Al欧姆接触特性

系统研究了Al和Ni/Al两种金属体系在重掺杂p型SiC晶片上的欧姆接触特性和电学性质。利用X射线衍射、扫描电子显微镜和综合物性测量系统对这两种电极表面的微观结构和样品的电学性质进行了表征。结果表明：在真空环境下经过800℃退火后Al电极可呈现出欧姆接触行为,其比接触电阻率为1.98×10^-3Ω·cm²,退火处理后Al电极与SiC在接触界面形成化合物Al₄C₃,有助于提高接触界面稳定性。在Ni/Al复合体系中,当Ni金属层厚度为50 nm时,其比接触电阻率显著降低至4.013×10^-4Ω·cm²。退火后Ni与SiC在接触界面生成的Ni₂Si有利于欧姆接触的形成和降低比接触电阻率。研究结果可为开发液相法生长的p型SiC晶片电子器件提供参考。     

Ni-Au/AlN/Si器件的深能级瞬态谱研究

对GaN器件制备过程中AlN缓冲层相关的电活性缺陷进行了C-V和深能级瞬态谱(DLTS)研究。C-V研究结果表明,制备态Ni-Au/AlN/Si MIS器件中,靠近AlN/Si界面处的掺杂浓度为4.4×10¹⁷cm-3,明显高于Si衬底的1.4×10¹⁶cm-3,意味着制备态样品中Al原子已经向衬底硅中扩散。采用退火工艺研究了GaN器件制备过程中的热影响以及热处理前后电活性缺陷在硅衬底中的演变情况,发现退火处理后,Al原子进一步向衬底硅中更深处扩散,扩散深度由制备态的500nm左右深入到1μm附近。DLTS研究结果发现,在Si衬底中与Al原子扩散相关的缺陷为Al-O配合物点缺陷。DLTS脉冲时间扫描表明,相比于制备态样品,退火态样品中出现了部分空穴俘获时间常数更大的缺陷,退火处理造成了点缺陷聚集,缺陷类型由点缺陷逐渐向扩展态缺陷发展。     

大面积均匀平坦纳米AlN薄膜的研制

采用射频磁控溅射法,通过优化沉积工艺,在n型 (100)Si片上制备出 (100)择优取向表面粗糙度均匀的氮化铝(AlN)薄膜。当溅射功率为 120W和N₂∶Ar＝12∶8时,制备的AlN薄膜的结晶性最好,101.6 mm AlN薄膜样 品的表面粗糙度为3.31~3.03nm,平均值为3.17nm。研究结果表明:射频磁控溅射能量 和N₂浓度是实现大面积、均匀平坦、纳米级AlN薄膜的重要制备工艺参数。     

锗单晶在酸性SiO2抛光液条件下的抛光机理及加工工艺

该文研究了化学机械抛光(CMP)条件下,锗单晶在含HNO₃的SiO₂抛光液中的腐蚀过程。通过改变抛光时间,分析锗单晶表面状态的变化规律。结果表明,在SiO₂抛光液pH值为1~2时,SiO₂抛光液中存在 Si—OH和 Si—O^-形式;锗单晶先与HNO₃反应生成Ge(NO₃)₄,而后Ge⁴⁺的含氧酸盐会剧烈水解生成Ge—OH,Ge—OH 继续反应并以Ge—OH₂⁺形式存在。由于表面电荷的吸引,Si—O^-和Ge—OH₂⁺在锗单晶表面生成Si—O—Ge软化层,从动力学角度加快了腐蚀速率,促进了表面抛光的程度。抛光时间为15~20 min时,机械抛光和侵蚀的法向速度处于平衡状态,CMP抛光后锗单晶表面粗糙度S_a≤0.8 nm,10倍显微镜下无划痕、麻点。     

α-IGZO薄膜场效应晶体管的光敏特性

通过掩膜板制备源漏电极 的方法,以非晶铟-镓-锌氧化物(α-IGZO)为有源层,制备了结构为ITO/SiO₂(400nm)/α-IGZO(50nm)/Al 的底栅顶接触型(BGTC)光敏薄膜场效应晶体管(TFT) 并研究了其光敏特性。实验发现,在蒸镀Al电极作为源极和漏极,再在 空气中及350℃的温度下退火1h后,器件的阈值电压Vt h为15.0V,在栅源偏压VGS=30V时其有效场效应迁移率 为0.57cm²/Vs,表现出良好的晶体管特性。当用强度为8.1mW/cm²的白光照射时,器件表现出明显 的光敏特 性,其Vth下降为－15.0V,在源漏电压VDS=20V且VGS=30V时其有 效场效应迁移率上升为1.34cm²/Vs, 在VGS=2.5V时其“明/暗”电流比达到一极大值,响应 率达到1.11A/W,并具有良好的时间响应特性。     

Effect of annealing process on the surface roughness in multiple Al implanted 4H-SiC

A P-layer can be formed on a SiC wafer surface by using multiple Al ion implantations and post-implantation annealing in a low pressure CVD reactor.The Al depth profile was almost box shaped with a height of 1×10¹⁹cm^-3 and a depth of 550 nm.Three different annealing processes were developed to protect the wafer surface.Variations in RMS roughness have been measured and compared with each other.The implanted SiC, annealed with a carbon cap,maintains a high-quality surface with an RMS roughness as low as 3.8 nm.Macrosteps and terraces were found in the SiC surface,which annealed by the other two processes（protect in Ar/protect with SiC capped wafer in Ar）.The RMS roughness is 12.2 nm and 6.6 nm,respectively.     

Surface roughening in ion implanted 4H-silicon carbide

Silicon carbide (SiC) devices have the potential to yield new components with functional capabilities that far exceed components based on silicon devices. Selective doping of SiC by ion implantation is an important fabrication technology that must be completely understood if SiC devices are to achieve their potential. One major problem with ion implantation into SiC is the surface roughening that results from annealing SiC at the high temperatures which are needed to activate implanted acceptor ions, boron or aluminum. This paper examines the causes and possible solutions to surface roughening of implanted and annealed 4H-SiC. Samples consisting of n-type epilayers (5 × 10¹⁵ cm⁻³, 4 μm thick) on 4H-SiC substrates were implanted with B or Al to a total dose of 4 × 10¹⁴ cm⁻² or 2 × 10¹⁵ cm⁻², respectively. Roughness measurements were made using atomic force microscopy. From the variation of root mean square (rms) roughness with annealing temperature, apparent activation energies for roughening following implantation with Al and B were 1.1 and 2.2 eV, respectively, when annealed in argon. Time-dependent activation and surface morphology analyses show a sublinear dependence of implant activation on time; activation percentages after a 5 min anneal following boron implantation are about a factor of two less than after a 40 min anneal. The rms surface roughness remained relatively constant with time for anneals in argon at 1750°C. Roughness values at this temperature were approximately 8.0 nm. Annealing experiments performed in different ambients demonstrated the benefits of using silane to maintain good surface morphology. Roughnesses were 1.0 nm (rms) when boron or aluminum implants were annealed in silane at 1700°C, but were about 8 and 11 nm for B and Al, respectively, when annealed in argon at the same temperature.     

Low threading dislocation density Ge deposited on Si (1 0 0) using RPCVD

Epitaxial Ge layer growth of low threading dislocation density (TDD) and low surface roughness on Si (1 0 0) surface is investigated using a single wafer reduced pressure chemical vapor deposition (RPCVD) system. Thin seed Ge layer is deposited at 300 °C at first to form two-dimensional Ge surface followed by thick Ge growth at 550 °C. Root mean square of roughness (RMS) of ∼0.45 nm is achieved. As-deposited Ge layers show high TDD of e.g. ∼4 × 10⁸ cm⁻² for a 4.7 μm thick Ge layer thickness. The TDD is decreasing with increasing Ge thickness. By applying a postannealing process at 800 °C, the TDD is decreased by one order of magnitude. By introducing several cycle of annealing during the Ge growth interrupting the Ge deposition, TDD as low as ∼7 × 10⁵ cm⁻² is achieved for 4.7 μm Ge thick layer. Surface roughness of the Ge sample with the cyclic annealing process is in the same level as without annealing process (RMS of ∼0.44 nm). The Ge layers are tensile strained as a result of a higher thermal expansion coefficient of Ge compared to Si in the cooling process down to room temperature. Enhanced Si diffusion was observed for annealed Ge samples. Direct band-to-band luminescence of the Ge layer grown on Si is demonstrated.     

Comparison of Solid-State Microwave Annealing with Conventional Furnace Annealing of Ion-Implanted SiC

Rapid solid-state microwave annealing was performed for the first time on N⁺-, Al⁺-, and B⁺-implanted SiC, and the results were compared with the conventional furnace annealing. For microwave annealing, temperatures up to 2,000 °C were attained with heating rates exceeding 600 °C/s. An 1,850 °C/35 s microwave anneal yielded a root-mean-square (RMS) surface roughness of 2 nm, which is lower than the 6 nm obtained for 1,500 °C/15 min conventional furnace annealing. For the Al implants, a minimum room-temperature sheet resistance (R _s ) of 7 kΩ/□ was measured upon microwave annealing. For the microwave annealing, Rutherford backscattering (RBS) measurements indicated a better structural quality, and secondary-ion-mass-spectrometry (SIMS) boron implant depth profiles showed reduced boron redistribution compared to the corresponding results of the furnace annealing.     

Vanadium-based ohmic contacts to n-type Al<Subscript>0.6</Subscript>Ga<Subscript>0.4</Subscript>N

Four vanadium-based contacts to n-type Al_0.6Ga_0.4N were compared in this work. Both V/Al/Pd/Au and V/Al/V/Au contacts with optimized layer thicknesses provided lower specific-contact resistances than did the previously reported V/Al/Pt/Au ohmic contact. Specific contact resistances of the V/Al/Pd/Au (15 nm/85 nm/20 nm/95 nm) and V/Al/V/Au (15 nm/85 nm/20 nm/95 nm) contacts were 3×10⁻⁶ Ω·cm² and 4×10⁻⁶ Ω·cm², respectively. On the other hand, an analogous V/Al/Mo/Au contact never became ohmic, even after it was annealed at 900°C for 30 sec. Compared to the V/Al/Pd/Au contact, the V/Al/V/Au contact required a less severe annealing condition (30 sec at 700°C instead of 850°C). The V/Al/V/Au contact also provided a smoother surface, with a root-mean-square (RMS) roughness of 39 nm.     

Dopant activation and surface morphology of ion implanted 4H- and 6H-silicon carbide

The activation of ion-implanted B into 4H-SiC, and B, and Al into 6H-SiC is investigated. Complete activation of B implants into 4H-SiC is achieved by annealing at 1750°C for 40 min in an Ar environment. Significant activation (>10%) is not achieved unless the annealing temperature is 1600°C or greater. Sheet resistances of Al-implanted 6H-SiC annealed at 1800°C are 32.2 kΩ/□, indicating high activation of Al at this temperature. Annealing conditions which result in good acceptor activation are shown to be damaging to the surface of either 4H- or 6H-SiC. Atomic force microscopy and Nomarski differential interference contrast optical microscopy are applied to characterize the surfaces of these polytypes. Roughening of the surfaces is observed following annealing in Ar, with measured roughnesses as large as 10.1 nm for B-implanted 4H-SiC annealed at 1700°C for 40 min. Based on data obtained from these techniques, a model is proposed to describe the roughening phenomenon. The premise of the model is that SiC sublimation and mobile molecules enable the surface to reconfigure itself into an equilibrium form.     

磨料特性对InP晶片集群磁流变抛光效果的影响

对InP晶片进行了集群磁流变抛光实验,研究了抛光过程中磨料参数(类型、质量分数和粒径)对InP材料去除速率和表面粗糙度的影响。实验结果表明,InP晶片的去除速率随磨料硬度的增加而变大,表面粗糙度受磨料硬度和密度的综合影响;在选取的金刚石、SiC、Al2O3和SiO2等4种磨料中,使用金刚石磨料的InP去除速率最高,使用SiC磨料的InP抛光后的表面质量最好。随着SiC质量分数的增加,InP去除速率逐渐增加,但表面粗糙度先减小后增大。当使用质量分数4%、粒径3μm的SiC磨料对InP晶片进行抛光时,InP去除速率达到2.38μm/h,表面粗糙度从原始的33 nm降低到0.84 nm。     

Low resistance bilayer Nd/Al ohmic contacts on n-type GaN

A bilayer Nd/Al metallization structure has been deposited onto low pressure organometallic vapor phase epitaxy grown n-type GaN ( 1 × 10¹⁸ cm⁻³) by electron-beam evaporation. Ohmic metal contacts were patterned photolithographically for standard transmission line measurement, and then thermally annealed at temperatures ranging from 200 to 350°C and from 500 to 650°C using conventional thermal annealing (CTA) and rapid thermal annealing (RTA), respectively. The lowest values for the specify contact resistivity of 9.8 × 10⁻⁶ Ω−cm² and 8 × 10⁻⁶ Ω−cm² were obtained using Nd/Al metallization with CTA of 250°C for 5 min and RTA of 600°C for 30 s. Examination of the surface morphology using atomic force microscopy as a function of annealing temperature revealed that the surface roughness was strongly influenced by conventional thermal annealing, it was smooth in the temperature range from 550 to 650°C for rapid thermal annealing. Auger electron spectroscopy depth profiling was employed to investigate the metallurgy and interdiffusion of contact formation.     

Investigation of structural and optoelectronic properties of annealed nickel phthalocyanine thin films

Thin films of nickel phthalocyanine (NiPc) were prepared by thermal evaporation and the effects of annealing temperature on the structural and optical properties of the samples were studied using different analytical methods. Structural analysis showed that the grain size and crystallinity of NiPc films improved as annealing temperature increased from 25 to 150 °C. Also, maximum grain size (71.3 nm) was obtained at 150 °C annealing temperature. In addition, NiPc films annealed at 150 °C had a very smooth surface with an RMS roughness of 0.41 nm. Optical analysis indicated that band gap energy of films at different annealing temperatures varied in the range of 3.22–3.28 eV. Schottky diode solar cells with a structure of ITO/PEDOT:PSS/NiPc/Al were fabricated. Measurement of the dark current density–voltage (J–V) characteristics of diodes showed that the current density of films annealed at 150 °C for a given bias was greater than that of other films. Furthermore, the films revealed the highest rectification ratio (23.1) and lowest barrier height (0.84 eV) demonstrating, respectively, 23% and 11% increase compared with those of the deposited NiPc films. Meanwhile, photoconversion behavior of films annealed at 150 °C under illumination showed the highest short circuit current density (0.070 mA/cm²) and open circuit voltage of (0.55 V).     

高体份SiC/Al反射镜在空间光学应用可行性的分析

简述了空间遥感器设计中反射镜材料选择的重要性及影响。对SiC和SiC/Al复合材料与常用光学材料的空间应用综合品质因子进行了比较,SiC材料的综合品质因子为8072.92,高体分SiC/Al复合材料的综合品质因子为1 687.50。并对高体分SiC/Al复合材料应用在反射镜上的光学性能进行了检测。检测结果得出材料的表面粗糙度能够达到1.49 nm,小于5 nm;反射率达到95%以上,能够满足反射镜的性能要求。对采用高体分SiC/Al复合材料作为反射镜和背板材料的相机结构进行分析。分析结果得出整体结构前三阶模态为115 Hz,120 Hz,203 Hz,满足空间遥感器大于100 Hz的技术要求,各反射镜的面形精度满足RMS≤1/50λ(λ=632.8 nm)的技术要求。各项测试数据和有限元分析结果表明,高体份SiC/Al复合材料作为反射镜在空间光学中应用是可行的。