A test of independence based on a generalized correlation function

In this paper, we propose a novel test of independence based on the concept of correntropy. We explore correntropy from a statistical perspective and discuss its properties in the context of testing independence. We introduce the novel concept of parametric correntropy and design a test of independence based on it. We further discuss how the proposed test relaxes the assumption of Gaussianity. Finally, we discuss some computational issues related to the proposed method and compare it with state-of-the-art techniques.     

A spare bandwidth sharing scheme based on network reliability

Spare bandwidth is required for recovering the network service from network faults. However, it degrades the efficiency of network utilization. Spare bandwidth demand can be reduced significantly by letting spare bandwidth be shared among several network services. Spare bandwidth reserved on a network element can be shared by a set of network services for a network fault if they are not simultaneously affected by the network fault. A new, and more practical spare bandwidth sharing scheme, which is based on the network reliability, is proposed in this paper. In the proposed scheme, multiple link failures are allowed with a given link failure rate, and a reasonable restoration level of near 100%; while in the conventional scheme, only a single link failure, and 100% restoration level are considered. To develop the spare bandwidth sharing scheme, we first investigate the framework for evaluating the reliability of path-based network services, and then we explain the proposed spare bandwidth sharing scheme with decision parameters such as lifetime of the path, restoration level, and the maximum number of working paths which can be protected by a backup link. Simulation results show that the proposed spare bandwidth sharing scheme requires a smaller amount of spare bandwidth than the conventional scheme.     

基于贝叶斯网络的装备供应链可靠性评估模型

为对装备供应链可靠性进行评估,构建了一种基于贝叶斯网络的评估模型.首先,阐述了装备供应链可靠性的基本概念,然后,介绍了装备供应链的主要环节,最后,根据贝叶斯网络的基本原理,将装备供应链的故障树模型转化为贝叶斯网络模型.     

基于可靠度最大化的多源计算机网络传输线优化设计

为了解决计算机网络铺设过程中的网络传输线的优化问题,提高网络传输数据的可靠度,文中利用RETLA算法对计算网络传输线配置的费用构建模型,并提高网络的可靠度,利用NSGA-II算法找到计算机网络传输线配置的Pareto解,求解出可靠度最大情况下的最优传输线配置问题.利用计算机仿真对文中的算法进行验证,并将计算结果与遍历算...     

一种基于Petri网的飞机配电系统可靠性分析方法

将一种基于Petri网的故障树分析法运用于飞机配电系统的可靠性分析,以库所和变迁为节点,有向弧的指示方向表达系统故障的传播关系.同时提出一种应用Petri网的关联矩阵求最小割集的新算法,此算法按照指定关联矩阵中所表达的输入、输出关系直接从关联矩阵得出割集,易于计算机程序的实现,而且对于求有重复事件Petri网模型的割集更为简单、直观,避免了传统飞机配电系统可靠性分析方法中分析复杂,减少了计算量,弥补了传统故障树分析法中的不足.     

提高计算机网络可靠性研究

随着社会的不断发展,人们的生活水平不断提高,对于自身生活质量的要求也越来越高。在此背景下,实现网络环境的净化是社会及科技发展的需求。现代计算机网络的发展和网络的可靠性创建有着重要的联系,创建可靠性网络不仅是计算机网络今后的发展需求,还是我国社会经济及科技的发展需求,创建良好的计算机网络环境对我国青少年的成长具有重要的意义。基于此,文章就计算机网络可靠性的提高进行了研究,针对此问题提出一系列针对性的措施,从而促进计算机网络安全的提升,具有重要的现实意义。     

基于多因子分析的无线传感器网络可靠性评估模型设计

采用判决反馈方法评估无线传感器网络时,仅从网络链路稳定性因素方面考虑,未考虑影响网络可靠性的多种因素,自适应能力和可靠性评估效果差。设计基于多因子分析的无线传感器网络可靠性评估模型,利用多因子分析过程将无线传感器网络复杂的变量关系简单化。由5个主指标与20个有相互关联的子指标建立无线传感器网络可靠性评估指标体系,通过主成分分析方法分析指标体系获取11个无线传感器网络可靠性指标主因子。将这些因子输入神经网络模型中,构建无线传感器神经网络可靠性评估模型,完成无线传感器网络可靠性评估。实验结果表明,该模型的可靠性评估精度均值为98%,该模型下的无线传感网络可靠性最高达到98%,极大提高了无线传感器的安全性能。     

A statistical approach to characterizing the reliability of systems utilizing HBT devices

This paper describes a statistical approach to simulating the reliability of systems with HBT devices. Compared to the conventional worst-case method, the described approach utilizes statistical reliability information of the HBT individual devices, along with analysis on the critical paths of the system, to provide more accurate and more comprehensive reliability evaluation of the systems utilizing HBT devices.     

A statistical study to identify the effects of packaging structures on lumen reliability of LEDs

The development of high-power light-emitting diode (LED) devices has been bedeviled by the reliability problems. And most reliability issues are caused by the packaging materials rather than the chips. However, which packaging material is the most influential remains unrevealed. To answer this question, a statistical method was introduced in this paper. Optical simulations were conducted to calculate the optical output power of LED package according to the orthogonal experimental design. Range and variance analyses were carried out to determine the significance of the relevant factors on the LED's light output. The results showed that the dome lens among the non-luminescent packaging materials had the most significance in affecting the light output. It is concluded that this method is useful in detecting the most significant part of LED packaging materials during the development of new packaging structures and is beneficial for enhancing the whole reliability of LED package effectively.     

基于联合法的配电网供电能力可靠性评估研究

分布式电源功率输出的随机性和间歇性及其并入电网的位置,会影响配网供电能力的可靠性.文中对此展开研究,首先建立了分布式电源、风电以及光伏发电三种数学模型,同时研究了负荷和系统可靠性指标概率分布特征,然后提出了一种将网络等值与拟蒙特卡罗联合法用于配电系统可靠性的定量评估,最后结合改进的IEEE-RBTS Bus6的F4馈线...     

基于关联规则引导遗传算法的高可靠性无线网络拓扑设计

无线网络中的节点与路径故障会产生惩罚性网络成本,该成本是无线网络的一个重要性能指标,对此提出了一种基于关联规则引导遗传算法的高可靠性无线网络拓扑设计算法。首先,采用Monte Carlo模拟器将网络模拟为图结构;然后,采用Apriori算法提取模拟器数据的关联规则;最后,利用提取的关联规则引导遗传算法的变异与交叉操作,搜索最优的网络拓扑结构。仿真实验结果表明,对于多个网络规模,该算法均可获得较好的网络性能与收敛速度,具有较好的实用性。     

基于高生存性RPR网络的可靠性研究

由标准单环的弹性分组环衍生出的高生存性RPR网络弥补了单环结构可靠性较低的缺点.由于基于此种高生存性RPR网络还没有足够准确的可靠性分析,在设计网络中无法把握合适的网络参数,因此此提出一种可靠性数学模型,利用概率与排列组合理论得到比较精确的高生存性RPR网络的可靠性函数.通过计算表明,该高生存性RPR网络可以显著提高网络的可靠性.     

A new technique in the global reliability of cyclic communications network

The global reliability of a communications network is the probability that given any pair of nodes, there exists a viable path between them. A characterization of connectivity, for a given class of networks, can enable one to find this reliability. Such a characterization is described for a useful class of undirected networks called “daisy-chained” or “braided” networks. This leads to a new method of quickly computing the global reliability of these networks. Asymptotic behavior in terms of component reliability is related to geometric properties of the given graph. Generalization of the technique is discussed.     

A new reliability growth model: its mathematical comparison to the Duane model

The Duane reliability growth model has been traditionally used to model electronic systems undergoing development testing. This paper proposes a new reliability growth model derived from variance stabilisation transformation theory which surpasses the Duane model in typical reliability growth situations. This new model is simpler to plot and fits the data more closely than the Duane model whenever the Duane slope is less than 0.5. This paper explores the mathematical relationships between these two models; and shows that at a Duane slope of 0.5, both models are mathematically equivalent in their capacity to fit the observed data. The instantaneous MTBF of the new model is also developed and compared to that of Duane. As the new model is influenced by the later failures, compared to early failures for the Duane model, it has the further advantage of leading to reduced test times for achieving a specified instantaneous MTBF. As the reliability of electronic systems increases, this has positive implications for testing.     

一种计算随机流网络可靠性的新算法

提出了一种计算随机流网络可靠性的新方法。通过一定的规则生成网络的状态树，使得每一个分支都是全序集合。在生成状态树的同时搜索每一个分支，对状态采用基于割集的方法进行判断。每个分支上的最小的有效状态就是网络的d-下界点。求得所有的d-下界点，进而求出网络的可靠性。     

The influence of the number of users on the reliability of a branched computer network

A hierarchical computer network with branched structure containing three data processing levels and realizing, in fixed time intervals, a determined set of tasks is considered as a class of such networks. The influence of the number of users on the number of realized tasks and on the assumed reliability measure is discussed.     

A comparison between near-field shielding-effectivenessmeasurements based on coaxial dipoles and electrically small apertures

The near-field shielding effectiveness (SE) of a material can be measured by placing it between two closely spaced dipoles (electric or magnetic) and noting the resulting insertion loss. An alternative approach is to cover an electrically small aperture with the test material and measure the resulting loaded aperture polarizability (electric or magnetic), as is done in a dual TEM (transverse electromagnetic) cell. The author develops approximations leading to simple closed-form SE expressions by developing expressions that relate these two configurations. Small-aperture theory is discussed first, followed by a development of approximate dipole coupling expressions. The results are then compared with an experimental example     

A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth properties

The effects of under bump metallurgy (UBM) microstructures on the intermetallic compound (IMC) growth of electroplated and stencil printed eutectic Sn-Pb solder bumps were investigated. The process parameters and their effects on UBM surface morphology and UBM shear strength were studied. For the electroplating process, the plating current density was the dominant factor to control the Cu UBM microstructure. For the stencil printing process, the zincation process has the most significant effect on the Ni UBM surface roughness and Ni grain sizes. In both processes, the good adhesion of UBM to aluminum can be obtained under suitable UBM processing conditions. Samples with different UBM microstructures were prepared using the two processes. The resulting samples were thermal aged at 85/spl deg/C, 120/spl deg/C, and 150/spl deg/C. It was observed that the Cu UBM surface roughness had larger effect on the IMC growth and solder ball shear strength than the Ni UBM surface roughness. The thickness of Cu/sub 3/Sn and Cu/sub 6/Sn/sub 5/ IMC depended strongly on the UBM microstructure. However, for Ni/Au UBM, no significant dependence was observed. More likely, the thickness of Au-Ni-Sn IMC near the IMC/solder interface was controlled by the amount of gold and the gold diffusion rate in the solder. Shear tests were performed after thermal aging tests and thermal/humidity tests. Different failure modes of different sample groups were analyzed. Electroless Ni UBM has been developed because it is a mask-less, low-cost process compared to electroplated Cu UBM. This study demonstrated that the process control was much easier for Ni UBM due to its lower reactivity with Sn material. These properties made Ni UBM a promising candidate for the lead-free solder applications.     

A programmable optical network testbed in support of C-RAN: a reliability study

With both mobile network services and related data traffic volume on the rise, reliability of the radio access network is of the essence. A number of radio functional splits are defined by 3GPP to offer increased flexibility of implementation and feasibility of new mobile network services. For example, it is possible to implement certain radio functions in the Cloud, an architectural solution referred to as C-RAN. C-RAN solutions require highly reliable backhaul and fronthaul network designs. This paper describes PROnet, a programmable optical software-defined network testbed, which has been upgraded to offer backhaul and fronthaul transport capabilities in support of C-RAN functionalities with increased reliability. The testbed is upgraded with a specially designed 1 + 1 protection mechanism at the Ethernet layer in order to meet the stringent network round-trip requirements imposed by one of the C-RAN functional split options on the fronthaul.