Fracture of flash oxidized,yttria-doped sintered reaction-bonded silicon nitride

The oxidation behaviour of a slip cast, yttria-doped, sintered reaction-bonded silicon nitride after flash oxidation was investigated. It was found that both the static oxidation resistance and flexural stress rupture life (creep deformation) were improved at 1000° C in air compared to those of the same material without flash oxidation. Stress rupture data at high temperatures (1000 to 1200° C) are presented to indicate applied stress levels for oxidation-dependent and independent failures.     

The compression creep behaviour of silicon nitride ceramics

A comparison has been made of the compression creep characteristics of samples of reaction-bonded and hot-pressed silicon nitride, a sialon and silicon carbide. In addition, the effects of factors such as oxide additions and fabrication variables on the creep resistance of reaction-bonded material and the influence of dispersions of SiC particles on the creep properties of hot-pressed silicon nitride have been considered. For the entire range of materials examined, the creep behaviour appears to be determined primarily by the rate at which the development of grain boundary microcracks allows relative movement of the crystals to take place. Now with the BNF Metals Technology Centre, Wantage.     

Creep of silicon nitride-titanium nitride composites

The effect of particulate TiN additions (0–50 wt%) on creep behaviour of hot-pressed (5 wt%Y₂O₃ + 2 wt%Al₂O₃)-doped silicon nitride (HPSN)-based ceramics was studied. Creep was measured using a four-point bending fixture in air at 1100–1340 °C. At 1100 °C, very low creep rates of HPSN with 0–30 wt% TiN are observed at nominal stresses up to 160 MPa. At 1200 °C the creep rate is slightly higher, and at 1300 °C the creep rate is increased by three orders of magnitude compared to 1100 °C and rupture occurs after a few hours under creep conditions. It was established that the formation of a TiN skeleton could detrimentally affect the creep behaviour of HPSN. An increase in TiN content leads to higher creep rates and to shorter rupture times of the samples. Activation energies of 500–1000 kJ mol^?1 in the temperature range of 1100–1340 °C at 100 MPa, and stress exponentsn?4 in the stress range 100–160 MPa at 1130–1200 °C were calculated. Possible creep mechanisms and the effect of oxidation on creep are discussed.     

Effects of heat treatments on the creep properties of a hot pressed silicon nitride ceramic

Effects of heat treatment in an argon atmosphere at high temperatures for varying times on the creep properties of a Y₂O₃-Al₂O₃ (8-2 wt%) doped hot pressed silicon nitride (HPSN) ceramic were investigated. It was observed from the creep measurements that higher temperature, i.e. 1360C, and longer time, i.e. 8 h, heat treatment in an argon atmosphere improved the creep properties, (e.g. secondary creep rate) of this material. Heat treatment at a lower temperature of 1300C and for a shorter time of 4 h did not change the creep behaviour. Improvement of the creep properties was related to the crystallization of an amorphous grain boundary phase by heat treatment. Secondary creep rate parameters of the as-received material: stress exponent, n (2.95–3.08) and activation energy, Q (634–818 kJ mol^S–1), were in the range of values found by other investigators for various hot pressed silicon nitride ceramics.     

The structure of slow crack interfaces in silicon nitride

Fracture interfaces formed in silicon nitride at high temperatures were studied using light and electron microscopy. The structure of the fracture interface depended on the type of silicon nitride fractured. High-purity, reaction-bonded silicon nitride always formed flat, relatively featureless, fracture surfaces. Fracture occurred by a brittle mode even at the highest temperature (1500° C) studied. The critical stress intensity factor for reaction-bonded silicon nitride ( 2.2 MN m^–3/2) is relatively low and is insensitive to temperature. By contrast, hot-pressed silicon nitride gave evidence of plastic flow during fracture at elevated temperatures. Crack growth in magnesia-doped, hot-pressed silicon nitride occurs by creep, caused by grain boundary sliding and grain separation in the vicinity of the crack tip. As a consequence of this behaviour, extensive crack branching was observed along the fracture path. The primary and secondary cracks followed intergranular paths; sometimes dislocation networks, generated by momentary crack arrest, were found in grains bordering the crack interface. As a result of the high temperature, cracks were usually filled with both amorphous and crystalline oxides that formed during the fracture studies. Electron microscopy studies of the compressive surfaces of fourpoint bend specimens gave evidence of grain deformation at high temperatures by diffusion and dislocation motion.     

High-temperature deformation and fracture processes in sintered reaction-bonded silicon nitride

Studies of the high-temperature deformation behaviour of sintered reaction-bonded silicon nitride (SRBSN) materials were conducted at 1200 °C in air under selected stress levels, which were applied at a single stress or as a sequence of stepwise increasing stresses. The objective was to evaluate the effects of the fabrication methods (conventional versus microwave heating process), microstructure, and precursor silicon powder purity on the deformation and fracture processes during creep loading of SRBSN materials containing a mixture of 3 wt% Al₂O₃ and 9 wt% Y₂O₃ sintering additives. Results indicated that all of the SRBSN materials exhibited a threshold stress above which the dominant process underwent transition from creep to extensive creep-assisted crack growth (CACG) from existing pores. In addition, the microwave SRBSN materials exhibited a better resistance (higher threshold stress) to CACG process, compared with those fabricated by conventional heating with the same metallurgical grade of silicon powder. The higher threshold stress observed in microwave SRBSN is mainly associated with the increased number density of elongated grains and the related higher fracture toughness. However, the minimum creep rates and stress exponents obtained in the creep regime were independent of the heating method. The microwave SRBSN material fabricated with lower purity silicon also exhibited a higher threshold stress for multiple crack formation and growth as compared with that processed with higher purity silicon. Conversely, the creep rate of microwave SRBSN materials was decreased by decreasing the impurity level (i.e. iron) in silicon powder.     

Creep of hot-pressed silicon nitride

Creep tests were undertaken on hot-pressed silicon nitride in the temperature range 1200 to 1400° C. The activation energy for creep was determined to be 140 kcal mol^?1 and the stress exponent of creep rate was 1.7. The creep behaviour is ascribed to grain-boundary sliding accommodated by void deformation at triple points and by limited local plastic deformation. Electron microscopic evidence supporting this mechanism is presented.     

Transient creep behaviour of hot isostatically pressed silicon nitride

Transient creep is shown to dominate the high-temperature behaviour of a grade of hot isostatically pressed silicon nitride containing only 4 wt% Y₂O₃ as a sintering aid. Contributing factors to transient creep are discussed and it is concluded that the most likely cause of longterm transient creep in the present study is intergranular sliding and interlocking of silicon nitride grains. In early stages of creep, devitrification of the intergranular phase, and intergranular flow of that phase may also contribute to the transient creep process. The occurrence of transient creep precluded the determination of an activation energy on the as-received material. However, after creep in the temperature range 1330–1430°C for times exceeding approximately 1100 h, an apparent activation energy of 1260 kJ mol^–1 was measured. It is suggested that the apparent activation energy for creep is determined by the mobility and concentration of diffusing species in the intergranular glassy phase. The time-to-rupture was found to be a power function of the minimum strain rate, independent of applied stress or temperature. Hence, creep-rupture behaviour followed a Monkman-Grant relation. A strain rate exponent of – 1.12 was determined.     

Time-dependent uniaxial behavior of rolled magnesium alloy AZ31B at 393 K and room temperature

To address the time-dependent properties of rolled AZ31B alloy, we conducted typical tests of the rate jump, creep, and stress relaxation at room temperature and 393 K. In the rate jump tests, the tensile curve exhibited a strong dependence on the strain rate, whereas compression was totally insensitive to the stress rate at both temperatures. For the creep and stress relaxation test, we observed creep strain and decay stress in the compression, which was weaker than the tensile curve. The plastic viscosity increased at 393 K because the dislocation motion was thermally activated. We then applied thermal activation theory for the repeated stress relaxation tests. The activation volume implies that cross-slip and dislocation nucleation are the operating mechanisms for creep and stress relaxation.

     

An analysis of the creep of hot pressed silicon nitride in bending

The creep behaviour of hot pressed silicon nitride is investigated in four-point-bend tests at temperatures of about 1200° C. By use of appropriate creep laws for the primary creep range as well as for the secondary range the experimental results can be well described analytically.     

Creep and recovery of polycarbonate

The creep behaviour of polycarbonate was investigated at high stresses in tension and compression. The creep curve was separated into a recoverable strain and persistent strain. The equation describing the recoverable strain was directly related to the kinetics of the recovery curve. The concept of an internal stress was useful in describing the recoverable part of the creep and recovery. The persistent strain-rate was related to the failure of the material by accelerated creep. Measurements of the temperature during creep showed that heating was not responsible for the occurrence of the material softening which lead to accelerated creep. It was found that the strain behaviour during loading and unloading was asymmetrical in that the instantaneous loading strain was less than the instantaneous unloading strain.     

Influence of the Dispersoid Material and Forming Process on the Creep Behaviour of Dispersion Strengthened Aluminium

The effect of small percentages of Al4C3 and Al2O3 in dispersion hardened aluminium on the creep behaviour has been investigated. A comparative study was conducted on the group of AlC3Ol and AlC2O2. These two groups were produced by cold isostatic pressing (CIP), but the second group was produced by four several methods of powder forming processes. Creep rupture properties in these alloys were characterized in terms of the stress and temperature dependence of minimum creep strain rate ε_min, rupture lives t_R and creep rate parameter α. Within the stress ranges used in this work, the stress dependence of both ε_min and t_R at various temperatures of these groups can be represented by power laws: .     

High temperature stability of 2.25Cr-1Mo steel during creep

The creep rapture behaviour of 2.25Cr—1Mo steel in air and in a salt mixture was studied. The salt coating, which can form a liquid phase at the test temperatures, increased the creep rate and reduced the rupture life of the material. The coating reduced the available cross-section of the material by removing the surface layers, thereby resulting in a reduction of the rupture life. Cross-sections of coated samples showed an outer oxide layer comprising oxide of the metal and precipitates of sulphide at the metal/oxide interface. This subsurface penetration of the corrodants was responsible for the early failure of the coated samples. This is typical of hot corrosion mechanisms. The formation of various carbides like M₂₃C₆ and M₆C, as observed by transmission electron microscopy, during creep reduced the creep strength of the material both in air and in the coated state. Increasing temperature enhanced the formation of these carbides with a consequent decrease in creep strength. Applied stress did not seem to play much of a role in the degree of carbide precipitation.     

Creep rupture of a phenolic-alumina particulate composite

The creep and creep rupture behaviour of a phenolic-alumina particulate composite was determined in an aqueous environment. Flexural creep tests were carried out in which the loading-point displacement was measured as a function of applied stress and time. The material exhibits power-law creep behaviour in which the steady-state creep rate is a power function of the initial applied elastic stress. The creep exponent was found to be 5.3. The creep rupture behaviour can be explained using a modified Monkman-Grant relationship which provides a failure criterion that is independent of applied stress and stress state.     

Viscoplastic–plastic modelling of IN792

At high temperatures metallic materials behave in a viscous manner exemplified by strain rate dependence, stress relaxation and creep deformation. At low temperatures however, these effects are extremely small, and the behaviour is strain rate independent and shows no or very small relaxation effects. Finally there exists an intermediate region, in which the material behaviour is close to strain rate independent for high strain rates but at the same time shows time dependent inelastic effects, such as stress relaxation and creep. For IN792 this occurs at temperatures around 650 °C. The article describes the extension of a power-law viscoplastic model describing the behaviour of IN792 at 850 °C, also to describe the behaviour at 650 °C, by bounding the elastic–viscoplastic stress-space by a plastic yield surface. The model parameters have been estimated using data from creep test and tailored step relaxation tests, and the model fits well to both the step relaxation data aimed at resembling relevant component conditions and long term creep data.     

Cyclic creep behaviour under tension–tension loading cycles with hold time of modified 9Cr–1Mo steel

Abstract

Cyclic creep behaviour of modified 9Cr–1Mo steel was investigated by a series of cyclic creep (CC) tests at 600°C, which were performed under controlled tension–tension loading cycles with the magnitude of stress ranges in a constant stress ratio (R?=?0·1). Hold time was applied for a 10 min hold at the maximum stress (σ_max) and minimum stress (σ_min). The CC properties were compared with the static creep (SC) using Norton’s power law, Larson–Miller plot, and Monkman–Grant relation, and the microstructure was examined. For the test conditions employed in the present investigation, retardation in the CC behaviour in terms of a lower creep rate and longer rupture time compared to those in the SC was obtained. The retardation was ascribed to the effects associated with anelastic recovery during the 10 min hold time at the minimum load of the cyclic loading. The creep rupture ductility decreased with a general decrease in stress, and there was no difference in the creep ductility between the CC and SC. The steel displayed a transgranular fracture characterised by the presence of dimples resulting from micro-void coalescence. Carbide precipitation was more coarsened with increasing in exposure time in the CC tests.     

THE CREEP/FATIGUE BEHAVIOUR OF TYPE 316 STEEL UNDER REVERSE BENDING CONDITIONS

Abstract— Reverse bending creep/fatigue tests have been performed on Type 316 steel at temperatures of 550 and 600°C for test durations of up to 12,000 h. It is shown that endurances obtained are comparable to those observed under push-pull conditions and that the introduction of a hold period can significantly reduce the endurance. Detailed fractography indicates that creep/fatigue in tension is more damaging than creep/fatigue in compression. The crack initiation behaviour is shown to be temperature dependent and may result from the combination of tensile and shear stresses, the relative importance of which will depend on the precise conditions of temperature, stress level and possibly microstructure.     

The influence of stress distribution on the deformation and fracture behaviour of ceramic materials under compression creep conditions

The stress distribution developed in test pieces during compression creep has been determine using the finite element method. The analyses are shown to account precisely for the inhomogeneous distribution of grain-boundary cracks developed during creep of polycrystalline magnesia and indicate that the accommodation of grain-boundary sliding by cavity formation is the rate-controlling process during high temperature creep of reaction-bonded silicon nitride.     

Development of high temperature high strength silicon nitride by glass encapsulated hot isostatic pressing

This paper presents the state-of-the art of low doped silicon nitride materials processed to complex shapes by glass encapsulated hot isostatic pressing (HIP). The evaluation of the high temperature behaviour is based on stepped temperature stress rupture (STSR), stress rupture and flexural strength testing. The influence of minor impurities and additives (oxygen, halogens, alumina and iron oxide) is discussed.     

Effect of severe plastic deformation on creep behaviour of a Ti–6Al–4V alloy

This paper examines the effect of severe plastic deformation on creep behaviour of a Ti–6Al–4V alloy. The processed material with an ultrafine-grained (UFG) structure (d ≈ 150 nm) was prepared by multiaxial forging. Uniaxial constant stress compression and constant load tensile creep tests were performed at 648–698 K and at stresses ranging between 300 and 600 MPa on the UFG processed alloy and, for comparison purposes, on its coarse-grained (CG) state. The values of the stress exponents of the minimum creep rate n and creep activation energy Q _c were determined. Creep behaviour was also investigated by nanoindentation method at room temperature under constant load. The microstructure was examined by transmission electron microscopy and scanning electron microscope equipped with an electron back scatter diffraction unit. The results of the uniaxial creep tests showed that the minimum creep rates of the UFG specimens are significantly higher in comparison with those of the CG state. However, the differences in the minimum creep rates of both states of alloy strongly decrease with increasing values of applied stress. The CG alloy exhibits better creep resistance than the UFG one over the stress range used; the minimum creep rate for the UFG alloy is about one to two orders of magnitude higher than that of the CG alloy. The indentation creep tests showed that annealing had little effect on the creep behaviour in UFG Ti alloy at room temperature.