Enhanced electrical conductivity in polystyrene nanocomposites at ultra-low graphene content

We compared the electrical conductivity of multiwalled-carbon-nanotube/polystyrene and graphene/polystyrene composites. The conductivity of polystyrene increases from ～6.7 × 10(-14) to ～3.49 S/m, with an increase in graphene content from ～0.11 to ～1.1 vol %. This is ～2-4 orders of magnitude higher than for multiwalled-carbon-nanotube/polystyrene composites. Furthermore, we show that the conductivity of the graphene/polystyrene system can be significantly enhanced by incorporation of polylactic acid. The volume-exclusion principle forces graphene into the polystyrene-rich regions (selective localization) and generates ～4.5-fold decrease in its percolation threshold from ～0.33 to ～0.075 vol %.     

颗粒填充导电复合材料的传导特性

介绍了导电聚吡咯颗粒作为填充相,聚乙烯和聚苯乙烯作为基体相的导电复合材料的结构、导电特性、导电率的温度依赖性以及导热特性等.讨论了颗粒填充复合材料的制备工艺、结构、传导特性之间的关系.      

Mechanical properties of epoxy composites with high contents of nanodiamond

Mechanical properties and thermal conductivity of composites made of nanodiamond with epoxy polymer binder have been studied in a wide range of nanodiamond concentrations (0-25 vol.%). In contrast to composites with a low content of nanodiamond, where only small to moderate improvements in mechanical properties were reported before, the composites with 25 vol.% nanodiamond showed an unprecedented increase in Young’s modulus (up to 470%) and hardness (up to 300%) as compared to neat epoxy. A significant increase in scratch resistance and thermal conductivity of the composites were observed as well. The improved thermal conductivity of the composites with high contents of nanodiamond is explained by direct contacts between single diamond nanoparticles forming an interconnected network held together by a polymer binder.     

Thermal conductivity of polystyrene–aluminum nitride composite

The thermal conductivity of polymer composites having a matrix of polystyrene (PS) containing aluminum nitride (AlN) reinforcement has been investigated under a special dispersion state of filler in the composites: aluminum nitride filler particles surrounding polystyrene matrix particles. Data for the thermal conductivity of the composites are discussed as a function of composition parameters (aluminum nitride concentration, polystyrene particle size) and temperature. It is found that the thermal conductivity of composites is higher for a polystyrene particle size of 2 mm than that for a particle size of 0.15 mm. The thermal conductivity of the composite is five times that of pure polystyrene at about 20% volume fraction of AlN for the composite containing 2 mm polystyrene particle size. The relationship between thermal conductivity of composites and AlN filler concentrations has been compared with the predictions of two theoretical models from the literature.     

Design and preparation of graphene/poly(ether ether ketone) composites with excellent electrical conductivity

Graphene/poly(ether ether ketone) (m-TRG/PEEK) composites with excellent electrical conductivity were fabricated by hot pressing technique with thermally reduced graphene nanosheets (m-TRG) which were modified by poly(ether sulfone). Moreover, the conductive, thermal, and mechanical properties of PEEK/m-TRG composites were investigated by the precision impedance analyzer, thermal gravimetric analyzer, differential scanning calorimetry, and universal tester, respectively. The electrical conductivity of m-TRG/PEEK composites was greatly improved by incorporating graphene, resulting in a sharp transition from electrical insulator to semiconductor with a low percolation threshold of 0.76 vol.%. A high electrical conductivity of 0.18 S m^?1 was achieved with 3.84 vol.% of m-TRG. The data were compared with those of composites reduced chemically, and the results showed that thermal reduction was an effective method to acquire higher electrical conductive composites. The excellent electrical property should be attributed to the large specific surface area of m-TRG, well dispersion of m-TRG in PEEK matrix, and good compatibility of m-TRG with PEEK matrix, as proven by scanning electron microscope. Besides, m-TRG/PEEK composites also exhibited relatively good thermal and mechanical properties.     

Particle shape effect on the viscosity and thermal conductivity of ZnO nanofluids

The viscosity and thermal conductivity of ZnO nanofluids with nanoparticle shapes of nearly rectangular and of sphere, were experimentally investigated under various volume concentrations of the nanoparticles, ranging from 0.05 to 5.0 vol.%. The viscosity of the nanofluids increased with increases in the volume concentration by up to 69%. In addition, the enhancement of the viscosity of the nearly rectangular shape nanoparticles was found to be greater by 7.7%, than that of the spherical nanoparticles. The thermal conductivity of the ZnO nanofluids increased by up to 12% and 18% at 5.0 vol.% for the spherical and the nearly rectangular shape nanoparticles, respectively, compared to that of the base fluid (water). The shape of the particles is found to have a significant effect on the viscosity and thermal conductivity enhancements.     

In situ thermal reduction of graphene oxide for high electrical conductivity and low percolation threshold in polyamide 6 nanocomposites

Electrically conductive and thermally stable polyamide 6 (PA 6) nanocomposites were prepared through one-step in situ polymerization of ε-caprolactam monomer in the presence of electrically insulating and thermally unstable graphene oxide (GO) nanosheets. These nanocomposites show a low percolation threshold of ∼0.41 vol.% and high electrical conductivity of ∼0.028 S/m with only ∼1.64 vol.% of GO. Thermogravimetric analysis and X-ray photoelectron spectroscopy results of GO before and after thermal treatment at the polymerization temperature indicate that GO was reduced in situ during the polymerization process. X-ray diffraction patterns and scanning electron microscopy observation confirm the exfoliation of the reduced graphene oxide (RGO) in the PA 6 matrix. The low percolation threshold and high electrical conductivity are attributed to the large aspect ratio, high specific surface area and uniform dispersion of the RGO nanosheets in the matrix. In addition, although GO has a poor thermal stability, its PA 6 nanocomposite is thermally stable with a satisfactory thermal stability similar to those of neat PA 6 and PA 6/graphene nanocomposite. Such a one-step in situ polymerization and thermal reduction method shows significant potential for the mass production of electrically conductive polymer/RGO nanocomposites.     

Fabrication and effective thermal conductivity of multi-walled carbon nanotubes reinforced Cu matrix composites for heat sink applications

A novel particles-compositing method was used for the first time to disperse different contents of multi-walled carbon nanotubes (CNTs) in micron sized copper powders, which were subsequently consolidated into CNT/Cu composites by spark plasma sintering (SPS). Microstructural observations showed that the homogeneous distribution of CNTs and dense composites could be obtained for 0–10 vol.% CNT contents. The CNT clusters were appeared in the powder mixture with 15 vol.% CNTs, which resulted in an insufficient densification of the composites. The effective thermal conductivity of the composites was analyzed both theoretically and experimentally. The addition of CNTs showed no enhancement in overall thermal conductivity of the composites due to the interface thermal resistance associated with the low phase contrast of CNT to copper and the random tube orientation. Besides, the composite containing 15 vol.% CNTs led to a rather low thermal conductivity due possiblely to the combined effect of unfavorable factors induced by the presence of CNT clusters, i.e. large porosity, lower effective conductivity of CNT clusters themselves and reduction of SPS cleaning effect. The CNT/Cu composites may be a promising thermal management material for heat sink applications.     

Anisotropic thermal diffusivity characterization of aligned carbon nanotube-polymer composites

The anisotropic thermal diffusivity of aligned carbon nanotube-polymer composites was determined using a photothermoelectric technique. The composites were obtained by infiltrating poly-dimethyl siloxane (PDMS) in aligned multiwall CNT arrays grown by chemical vapor deposition on silicon substrates. The thermal diffusivities are insensitive to temperature in the range of 180 K-300 K. The thermal diffusivity values across the alignment direction are approximately 2-4 times smaller than along the alignment direction and larger than effective media theory predictions using reported values for the thermal diffusivity of millimeter thick aligned multiwall carbon nanotube arrays. The effective room temperature thermal conductivity of the composite along the carbon nanotube alignment direction is at least 6X larger than the thermal conductivity of the polymer matrix and is in good agreement with the effective media predictions. This work indicates that infiltration of long and aligned carbon nanotube arrays is currently the most efficient method to obtain high thermal conductivity polymer composites.     

Effect of homogeneous Al(OH)3 covered MWCNT addition on the thermal conductivity of Al2O3/epoxy-terminated poly(dimethylsiloxane) composites

Aluminum hydroxide covered multiwalled carbon nanotubes (A-MWCNTs) were synthesized as a conducting additive to alumina-epoxy-terminated poly(dimethylsiloxane). The measured diffusivity and calculated conductivity exhibited dissimilar behavior between several Al₂O₃ concentrations as a function of A-MWCNT loading, which correlated with the interface density and interconnectivity of the structures. The fabricated heterostructured A-MWCNT did not have a significant effect on the thermal conductivity of the composite because of phonon scattering at the interface. A small amount of A-MWCNT was feasible for establishment of a heat conductive percolating network with the greatest enhancement of thermal conductivity and diffusivity at an A-MWCNT loading of 1.0 and 2.0 wt%. Continuously increasing thermal transport properties were observed with the 49.1 vol.% Al₂O₃ loading which derived from a lower interface density nanowire and polymer matrix with enhanced interconnectivity.     

Thermal conductivities of alumina-based multiwall carbon nanotube ceramic composites

Composites incorporating various vol.% (0.0, 1.1, 6.4, and 10.4) of multiwall carbon nanotubes (MWCNTs) in alumina were consolidated by the spark plasma sintering. Their thermal transport properties were investigated over the temperature range 300–800 K as a function of nanotube contents. It was observed that the temperature-dependent effective thermal conductivity decreases with the addition of MWCNTs in alumina. This behavior was analyzed in terms of phonon mean free path, elastic modulus, average sound speed, and interface thermal resistance. Compared with 1/T behavior for pristine alumina, a subtle decrease in temperature dependence of the thermal conductivity of the composites with the addition of MWCNTs is observed, indicating the presence of extra phonon scattering mechanism beyond the intrinsic phonon–phonon scattering. Simulation of experimental results with theoretical model shows that the large interfacial thermal barrier between MWCNTs and alumina plays a dominant role in controlling thermal transport properties of the composites. In addition to dominant interface thermal resistance other secondary factors such as nanotube agglomeration, processing defects, porosity also contribute for low thermal conductivity at the higher volume fraction of MWCNTs in the composite.     

Thermally conducting aluminum nitride polymer-matrix composites

Thermally conducting, but electrically insulating, polymer-matrix composites that exhibit low values of the dielectric constant and the coefficient of thermal expansion (CTE) are needed for electronic packaging. For developing such composites, this work used aluminum nitride whiskers (and/or particles) and/or silicon carbide whiskers as fillers(s) and polyvinylidene fluoride (PVDF) or epoxy as matrix. The highest thermal conductivity of 11.5 W/(m K) was attained by using PVDF, AlN whiskers and AlN particles (7 μm), such that the total filler volume fraction was 60% and the AlN whisker–particle ratio was 1:25.7. When AlN particles were used as the sole filler, the thermal conductivity was highest for the largest AlN particle size (115 μm), but the porosity increased with increasing AlN particle size. The thermal conductivity of AlN particle epoxy-matrix composite was increased by up to 97% by silane surface treatment of the particles prior to composite fabrication. The increase in thermal conductivity is due to decrease in the filler–matrix thermal contact resistance through the improvement of the interface between matrix and particles. At 60 vol.% silane-treated AlN particles only, the thermal conductivity of epoxy-matrix composite reached 11.0 W/(m K). The dielectric constant was quite high (up to 10 at 2 MHz) for the PVDF composites. The change of the filler from AlN to SiC greatly increased the dielectric constant. Combined use of whiskers and particles in an appropriate ratio gave composites with higher thermal conductivity and low CTE than the use of whiskers alone or particles alone. However, AlN addition caused the tensile strength, modulus and ductility to decrease from the values of the neat polymer, and caused degradation after water immersion.     

Dielectric properties and thermal conductivity of PVDF reinforced with three types of Zn particles

In this study, three types of Zinc (Zn) particles, i.e., the spherical Zn (s-Zn), flaky Zn (f-Zn), and metal–semiconductor Zn@ZnO core–shell structure, are incorporated in poly(vinylidene fluoride) (PVDF) to obtain high dielectric permittivity polymer. The morphological, dielectric properties and thermal conductivity of the composites are characterized. The results indicate that compared with the s-Zn/PVDF the Zn@ZnO/PVDF at lower filler loading exhibited obviously higher dielectric permittivity due to the duplex interfacial polarizations, and that the f-Zn/PVDF showed larger dielectric permittivity and thermal conductivity owing to f-Zn’s high aspect ratio facilitating the formation of bridges between themselves. Furthermore, the dissipation factors of the s-Zn/PVDF and Zn@ZnO/PVDF were still at low level owing to the presence of self-passivation layer or ZnO shell between Zn core and PVDF, leading to a high critical filler concentration, whereas, a noticeable variation in the dissipation factor for the f-Zn/PVDF is observed up to 12 vol.% f-Zn.     

Improving the through-thickness thermal and electrical conductivity of carbon fibre/epoxy laminates by exploiting synergy between graphene and silver nano-inclusions

Fibre-reinforced polymer composites typically feature low functional (e.g., electric and thermal conductivity) and structural (e.g. mechanical strength and fracture toughness) properties in the laminate’s thickness direction. In the event of lightning strikes, overheating, and impact by foreign objects, composite laminates may suffer wide spread structural damage. This research explores the synergistic physical interaction between two-dimensional nanostructured (graphene nano-platelets) and, zero- or one-dimensional conductive fillers (silver nanoparticles or silver nanowires, respectively) when both are dispersed in fibre–polymer laminates. The results reveal a synergistic improvement in the through-thickness thermal conductivity that is more than the additive improvements by each constituent. Specifically, the simultaneous inclusion of graphene nano-platelets and silver nanoparticles/nanowires at a combined loading of 1 vol% resulted in approximately 40% enhancement in the through-thickness thermal conductivity while the inclusion of graphene nano-platelets alone at the same loading resulted only in 9% improvement. Similarly, the through-thickness electrical conductivity of carbon fibre/epoxy laminates incorporating graphene nano-platelets together with silver nanoparticles/nanowires was notably higher (⩾70%) than can be achieved by graphene nano-platelets alone (∼55%). These results demonstrate that the presence of nano-reinforcements exhibiting varied phonon transport and electron transfer pathways, and geometric aspect ratios promote synergistic physical interactions. Small improvements were found in the mechanical properties, including tensile, flexural or compressive properties of the carbon fibre-reinforced laminates, due to the relatively low concentrations of the nano-fillers.     

Thermal Conductivity Behavior of Carbon Nanotubes Reinforced Copper Matrix Composites

Carbon nanotubes (CNT) exhibit excellent thermal conductivity.Therefore they are potential reinforcements in composites materials for thermal management applications,where high thermal conductivity and low coefficient of thermal expansion (CTE) are required.In the present study,CNT/Cu composites containing CNTs varying from 0 vol.％ to 15 vol.％ were prepared,and their thermal conductivity behavior was studied in detail.The results indicated that the thermal conductivity of the composites shows no enhancement by the incorporation of CNTs.The presence of interfacial thermal resistance and high level of porosity are the main reasons for this low thermal conductivity.The well dispersed 0-10 vol.％ CNTs composites show a very close to the thermal conductivity of Cu.However,the addition of 15 vol.％ CNTs results in a rather low thermal conductivity of CNT/Cu composites due to the presence a high level of porosity induced by the formation of CNT clusters.The present paper also claims that a further substantial enhancement in thermal conductivity is only possible if the nanotubes are randomly oriented in the plane or if they are all aligned in one direction,for which the processing of CNTs-aligning in metal matrix should be developed.     

The properties of AlN-filled epoxy molding compounds by the effects of filler size distribution

AlN filler was compared with crystalline silica as a filler for advanced epoxy molding compounds. Properties such as the thermal conductivity, dielectric constant, CTE, flexural strength, elastic modullus and water absorption ratio of water-resistant grade AlN-filled molding compounds according to the contents or size of AlN and the filler size distribution were evaluated. A spiral flow test was also carried out to measure the change in viscosity according to the AlN size distribution for improved fluidity. The properties of EMC that is filled with a 70 vol.% of 12 micron AlN was compared with a crystalline silica-filled EMC. Thermal conductivity was improved by 2.2 times, the dielectric constant was reduced to less than one-half, the flexural strength was improved, and the CTE was also reduced. A binary mixture of an AlN-filled (65 vol.%) EMC showed improved fluidity, thermal conductivity, dielectric constant, flexural strength and water resistance compared to a single-size AlN-filled EMC. The maximum improvement was obtained when the fraction of small particles in the binary mixture of the AlN is 0.2–0.3. The CTE of EMC was decreased by increasing the volume fraction of small particles in the binary mixture of the AlN.     

Comparison of the thermal properties between composites reinforced by raw and amino-functionalized carbon materials

Carbon materials, such as graphite oxides, carbon nanotubes and graphenes, have exceptional thermal conductivity, which render them excellent candidates as fillers in advanced thermal interface materials for high density electronics. In this paper, these carbon materials were functionalized with 4,4′-diaminodiphenyl sulphone (DDS), to enhance the bonding between the carbon materials and the resin matrix. Their visibly different properties were investigated. It seems that DDS-functionalization can obviously improve the interfacial heat transfer between the carbon materials and the epoxy matrix. The thermal conductivity enhancement of D-Graphene composites (0.493 W/m K) was about 30% higher than that of D-MWNTs composites (0.387 W/m K) at 0.5 vol.% loading. The different effects among EGO, D-EGO, MWNTs, D-MWNTs and D-Graphene in polymer composites were also discussed. It was demonstrated that DDS-functionalized carbon materials had an obvious effect on the thermal performances of composite materials and were more effective in thermal conductivity enhancement.     

Electric conductivity-tunable transparent flexible nanowire-filled polymer composites: orientation control of nanowires in a magnetic field

Cobalt compound nanowires were dispersed in a transparent nonconductive polymer film by merely stirring, and the film's transparency and electrical conductivity were examined. This composite film is a unique system in which the average length of the nanowires exceeds the film's thickness. Even in such a system, a percolation threshold existed for the electric conductivity in the direction of the film thickness, and the value was 0.18 vol%. The electric conductivity value changed from ～1 × 10(-12) S/cm to ～1 × 10(-3) S/cm when the volume fraction exceeded the threshold. The electric conductivity apparently followed the percolation model until the volume fraction of the nanowires was about 0.45 vol %. The visible light transmission and electric conductivity of the composite film of about 1 vol % nanowires were 92% and 5 × 10(-3) S/cm, respectively. Moreover, the electric conductivity in the direction parallel to the film surface did not depend on the amount of the dispersed nanowires, and its value was about 1 × 10(-14) S/cm. Even in a weak magnetic field of about 100 mT, the nanowires were aligned in a vertical and parallel direction to the film surface, and the electric conductivity of each aligned composite film was 2.0 × 10(-2) S/cm and 2.1 × 10(-12) S/cm. The relation between the average wire length and the electric conductivity was examined, and the effect of the magnetic alignment on that relation was also examined.     

Thermal conductivity modeling of core-shell and tubular nanowires

The heteroepitaxial growth of crystalline core-shell nanostructures of a variety of materials has become possible in recent years, allowing the realization of various novel nanoscale electronic and optoelectronic devices. The increased surface or interface area will decrease the thermal conductivity of such nanostructures and impose challenges for the thermal management of such devices. In the meantime, the decreased thermal conductivity might benefit the thermoelectric conversion efficiency. In this paper, we present modeling results on the lattice thermal conductivity of core-shell and tubular nanowires along the wire axis direction using the phonon Boltzmann equation. We report the dependence of the thermal conductivity on the surface conditions and the core-shell geometry for silicon core-germanium shell and tubular silicon nanowires at room temperature. The results show that the effective thermal conductivity changes not only with the composition of the constituents but also with the radius of the nanowires and nanopores due to the nature of the ballistic phonon transport. The results in this work have implications for the design and operation of a variety of nanoelectronic devices, optoelectronic devices, and thermoelectric materials and devices.     

Determination of Thermal Conductivity of Silicate Matrix for Applications in Effective Media Theory

Silicate materials have an irreplaceable role in the construction industry. They are mainly represented by cement-based- or lime-based materials, such as concrete, cement mortar, or lime plaster, and consist of three phases: the solid matrix and air and water present in the pores. Therefore, their effective thermal conductivity depends on thermal conductivities of the involved phases. Due to the time-consuming experimental determination of the effective thermal conductivity, its calculation by means of homogenization techniques presents a reasonable alternative. In the homogenization theory, both volumetric content and particular property of each phase need to be identified. For porous materials the most problematic part is to accurately identify thermal conductivity of the solid matrix. Due to the complex composition of silicate materials, the thermal conductivity of the matrix can be determined only approximately, based on the knowledge of thermal conductivities of its major compounds. In this paper, the thermal conductivity of silicate matrix is determined using the measurement of a sufficiently large set of experimental data. Cement pastes with different open porosities are prepared, dried, and their effective thermal conductivity is determined using a transient heat-pulse method. The thermal conductivity of the matrix is calculated by means of extrapolation of the effective thermal conductivity versus porosity functions to zero porosity. Its practical applicability is demonstrated by calculating the effective thermal conductivity of a three-phase silicate material and comparing it with experimental data.