PdSe2半导体薄膜的真空硒化法制备研究

PdSe₂薄膜主要通过机械剥离法和气相沉积法制得, 本研究采用一种简单有效的可在SiO₂/Si衬底上制备PdSe₂薄膜的方法。通过高真空磁控溅射技术在SiO₂/Si衬底上沉积一层Pd金属薄膜, 将Pd金属薄膜与Se粉封在高真空的石英管中并在一定的温度下进行硒化, 获得PdSe₂薄膜。根据截面高分辨透射电镜(HRTEM)照片可知PdSe₂薄膜的平均厚度约为30 nm。进一步研究硒化温度对PdSe₂薄膜电输运性能的影响, 当硒化温度为300 ℃时, 所制得的PdSe₂薄膜的体空穴浓度约为1×10¹⁸ cm^-3, 具有最大的室温迁移率和室温磁阻, 分别为48.5 cm²·V^-1·s^-1和12%(B=9 T)。值得注意的是, 本实验中通过真空硒化法获得的薄膜空穴迁移率大于通过机械剥离法制得的p型PdSe₂薄膜。随着硒化温度从300 ℃逐渐升高, 由于Se元素容易挥发, Pd薄膜的硒化程度逐渐减小, 导致薄膜硒含量、迁移率和磁电阻降低。本研究表明：真空硒化法是一种简单有效地制备PdSe₂薄膜的方法, 在贵金属硫族化合物的大面积制备及多功能电子器件的设计中具有潜在的应用价值。     

Fabrication of robust Bi3.25La0.75Ti3O12 thin film resistant to hydrogen damage

Ferroelectric bismuth lanthanum titanate (Bi_3.25La_0.75Ti₃O₁₂; BLT) thin films were deposited on Pt/TiO₂/SiO₂/Si substrate by chemical solution deposition method. The films were crystallized in the temperature range of 600–700 °C. The spontaneous polarization (P_s) and the switching polarization (2P_r) of BLT film annealed at 700 °C for 30 min were 22.6 μC/cm² and 29.1 μC/cm², respectively. Moreover, the BLT capacitor did not show any significant reduction of hysteresis for 90 min at 300 °C in the forming gas atmosphere.     

Preparation of strontium titanate thin films by mirror-confinement-type electron cyclotron resonance plasma sputtering

Using mirror-confinement-type electron cyclotron resonance (ECR) plasma sputtering method, strontium titanate (SrTiO₃) thin films have been prepared on Si and Pt/Ti/SiO₂/Si substrates at a low substrate temperature (below 450 K) in a low pressure (2.7×10⁻² Pa) environment of pure Ar and Ar/O₂ mixture. Prepared film surfaces were very smooth regardless of high deposition rate (8.5 nm/min). The composition ratio Sr/Ti of Sr to Ti in the films varied with the distance between the target and the substrate. All as-deposited films on Si substrates were found to be amorphous and were crystallized by post-deposition annealing using an electric furnace at 650 K, i.e. approximately 250 K lower than annealing for films obtained by conventional RF magnetron sputtering. Post-deposition annealing of these films using millimeter-wave radiation decreased the crystallization temperature to a value of 550 K. Furthermore, all as-deposited films on Pt/Ti/SiO₂/Si substrates by a plasma of Ar and O₂ gas mixture were found to be crystallized regardless of no substrate heating.     

MBE growth and characterization of buried silicon oxide films on Si(100)

Silicon molecular beam epitaxy (Si-MBE) has been used to produce silicon oxide (SiO_x) films by evaporating Si on a heated Si(100) substrate in an ultra high vacuum system with an O₂ pressure of 10⁻⁶ to 10⁻⁴ mbar. Then the SiO_x films were overgrown with pure Si. The influence of the substrate temperature, the O₂ pressure and the Si deposition rate on the oxygen content in the SiO_x films and on the crystalline quality of the Si top-layer was investigated by Rutherford backscattering spectrometry and ion channeling. Epitaxial growth of the Si top-layer was observed up to a maximum concentration of ≈20 at.% oxygen content in the SiO_x film. Cross-sectional transmission electron microscopy shows that the structure of the SiO_x film changes duringa subsequent annealing procedure. Electron energy loss spectrometry proves that amorphous SiO₂ is formed and the development of holes indicates that the density of the as-grown SiO_x film is much lower than that of SiO₂. The specific for the as-grown SiO_x films was determined by I–V measurements.     

Controllable formation of Er–Yb codoped Al2O3 films by the non-aqueous sol–gel method

1 mol%Er³⁺–10 mol%Yb³⁺ codoped Al₂O₃ thin films have been prepared on thermally oxidized SiO₂/Si(110) substrates by a dip-coating process in the non-aqueous sol–gel method from the hydrolysis of aluminum isopropoxide [Al(OC₃H₇)₃] under isopropanol environment. Addition of N,N-dimethylformamide (DMF) as a drying control chemical additive (DCCA) into the sol suppresses formation of the cracks in the Er³⁺–Yb³⁺ codoped Al₂O₃ thin films when the rare-earth ion is doped with a high doping concentration. Homogeneous, smooth and crack-free Er³⁺–Yb³⁺ codoped Al₂O₃ thin films form at the conditions by a molar ratio of 1:1 for DMF:Al(OC₃H₇)₃. A strong photoluminescence spectrum with a broadband extending from 1.400 to 1.700 µm centered at 1.533 µm is obtained for the Er³⁺–Yb³⁺ codoped Al₂O₃ thin films, which is unrelated to the addition of DMF. Controllable formation of the Er³⁺–Yb³⁺ codoped Al₂O₃ thin films may be explained by the fact that the DMF assisted the deprotonation process of Al–OH at the surfaces of gel particles, resulting in enhancement of the degree of polymerization of sols and improvement of the mechanical properties of gel thin films.     

Growth and characterization of AP-MOCVD iron doped titanium dioxide thin films

Atmospheric pressure metal organic chemical vapor deposition (AP-MOCVD) was used to prepare iron doped titanium dioxide thin films. Thin films, between 40 and 150 nm thick, were deposited on Si, SiO₂ and Al₂O₃ substrates using titanium tetra isopropoxide and ferrocene as metal organic precursors. TiO₂ iron doping was achieved in the range of 1–4 at.%. The film morphology and thickness, polycrystalline texture and doping content were studied using respectively scanning electron microscopy (SEM), X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS). The influence of growth temperature, deposition time, substrate type and dopant partial pressure were studied. Electrical characterizations of the films were also performed.     

Yttrium sesquioxide, Y2O3, thin films deposited on Si by ion beam sputtering: microstructure and dielectric properties

Y₂O₃ thin films were in-situ deposited by ion beam sputtering on Si substrate. The influence of the deposition parameters are studied by X-ray diffraction, electrical measurements and high resolution transmission electron microscopy observations. The stress sate of the oxide layers is investigated by the sin²ψ method as a function of the deposition parameters and the post-annealing treatments. Oxygen ion beam assisted deposition process or post-annealing of as-deposited thin films lead to the same relaxation of the internal compressive stress within the oxide layer. An SiO₂ layer sandwiched between Si and Y₂O₃ is always observed and should play a role both in the growing process and electrical properties of the MOS structure based on Y₂O₃ oxide layer. The results are interpreted in terms of diffusional process in the oxide, which are directly related to the temperature and the oxygen partial pressure during the growth process.     

Low temperature plasma-assisted oxidation and thin-film deposition processes for forming device-quality SiO2/Si and composite dielectric-SiO2/Si heterostructures

In the high-temperature thermal oxidation of Si, the SiO₂/Si interface is continuously regenerated as the bulk oxide grows. This paper describes an alternative low temperature, 200–300 °C, plasma-assisted process that optimizes electrical properties of SiO₂/Si interfaces and bulk SiO₂ layers by separately controlling interface formation and bulk oxide deposition. Composite dielectrics, oxide/nitride (ON) and oxide (ONO), have been fabricated by extending the low temperature plasma-assisted processes to include deposition of Si₃N₄ films. The electrical properties of SiO₂/Si structures formed by the two-step, low temperature oxidation-deposition process are essentially the same as those of SiO₂/Si structures formed by high temperature, 850–1050 °C, thermal oxidation. The electrical properties of devices incorporating ON and ONO composite dielectrics are degraded with respect to the SiO₂/Si structures, but are similar to those of composite dielectrics formed by combinations of high temperature processing.     

Investigation of thermal stability, phase formation, electrical, and microstructural properties of sputter-deposited titanium aluminide thin films

Titanium aluminide thin films are being considered as coating materials for high temperature applications due to their high melting points and high oxidation resistance. In this study, Ti₃₇Al₆₃ and Ti₅₃Al₄₇ thin films are deposited onto SiO₂ substrates by RF magnetron sputtering using compound targets and then annealed in vacuum to investigate the properties of the films. Rutherford backscattering spectrometry, X-ray diffractometry, transmission electron microscopy, and four-point probe measurements are used to analyze the characteristics of Ti₃₇Al₆₃ and Ti₅₃Al₄₇ thin films for high temperature electronics applications. The films show good thermal stability up to 700 °C for 1 h in vacuum. Reasonable resistivity is obtained when appropriate compositions and anneal conditions are used.     

Thickness measurement of SiO2 films thinner than 1 nm by X-ray photoelectron spectroscopy

The thickness measurement of ultra-thin SiO₂ films thinner than 1 nm was studied by X-ray photoelectron spectroscopy (XPS). Amorphous SiO₂ thin films were grown on amorphous Si films to avoid the thickness difference due to the crystalline structure of a substrate. SiO₂ thin films were grown by ion beam sputter deposition under oxygen gas flow and the thickness was measured by in situ XPS. The attenuation length was determined experimentally by a SiO₂ film with a known thickness. The straight line fit between the measured thickness using XPS and the nominal thickness showed a good linear relation with a gradient of 0.969 and a small offset of 0.126 nm. The gradient measured at the range of 3.4–0.28 nm was very close to that measured at sub-nanometer range of 1.13–0.28 nm. This result means that the reliable measurement of SiO₂ film thickness below 1 nm is possible by XPS.     

Low-temperature growth and orientational control in RuO2 thin films by metal-organic chemical vapor deposition

For growth temperatures in the range of 275°C to 425°C, highly conductive RuO₂ thin films with either (110)- or (101)-textured orientations have been grown by metal-organic chemical vapor deposition (MOCVD) on both SiO₂/Si(001) and Pt/Ti/SiO₂/Si(001) substrates. Both the growth temperature and growth rate were used to control the type and degree of orientational texture of the RuO₂ films. In the upper part of this growth temperature range ( 350°C) and at a low growth rate (< 3.0 nm/min.), the RuO₂ films favored a (110)-textured orientation. In contrast, at the lower part of this growth temperature range ( 300°C) and at a high growth rate (> 3.0 nm/min.), the RuO₂ films favored a (101)-textured orientation. In contrast, higher growth temperatures (> 425°C) always produced randomly-oriented polycrystalline films. For either of these low-temperature growth processes, the films produced were crack-free, well-adhered to the substrates, and had smooth, specular surfaces. Atomic force microscopy showed that the films had a dense microstructure with an average grain size of 50–80 nm and a rms. surface roughness of 3–10 nm. Four-probe electrical transport measurements showed that the films were highly conductive with resistivities of 34–40 μΩ-cm (at 25°C).     

The Rectification Studies on the P -Ion Implanted C60/Si Films

N-type doping of the C₆₀ films deposited on Si substrates has been achieved by 80 keV P⁺-ion implantation with doses of 2×10¹⁴ cm^-2 at room temperature. The heterostructures composed of the n-type doped C₆₀ films and n- or p-type Si(111), Si(100) substrates are studied in view of semiconductor heterojunctions. The rectification and other electrical characteristics of the P⁺-ion implanted n-C₆₀/n-(p-)Si heterostructures are disclosed by the current-voltage (I-V) measurements at room temperature. The n-C₆₀/p-Si heterostructures show stronger rectification than n-C₆₀/n-Si heterostructures and Si(111) substrates are found to be more suitable for forming n-C₆₀/Si heterostructures than Si(100) substrates.     

Deposition of HfO2 thin films on ZnS substrates

HfO₂ thin films with columnar microstructure were deposited directly on ZnS substrates by electron beam evaporation process. SiO₂ thin films, deposited by reactive magnetron sputtering, were used as buffer layers, HfO₂ thin films of granular microstructure were obtained on SiO₂ interlayer by this process. X-ray diffraction patterns demonstrate that the as-deposited HfO₂ films are in an amorphous-like state with small amount of crystalline phase while the HfO₂ films annealed at 450 °C in O₂ for 30 min and in Ar for 150 min underwent a phase transformation from amorphous-like to monoclinic phase. Antireflection effect in certain infrared wave band, such as 3–6 μm, 4–12 μm, 4–8 μm and 3–10 μm, can be observed, which was dependent on the thickness of thin films. The cross-sectional images of HfO₂ films, obtained by field emission scanning electron microscopy, revealed that there was no distinct morphological change upon annealing.     

Effect of deposition temperature on the structural and thermoelectric properties of bismuth telluride thin films grown by co-sputtering

Thermoelectric bismuth telluride thin films were prepared on SiO₂/Si substrates by radio-frequency (RF) magnetron sputtering. Co-sputtering method with Bi and Te targets was adopted to control films' composition. Bi_xTe_y thin films were elaborated at various deposition temperatures with fixed RF powers, which yielded the stoichiometric Bi₂Te₃ film deposition without intentional substrate heating. The effects of deposition temperature on surface morphology, crystallinity and electrical transport properties were investigated. Hexagonal crystallites were clearly visible at the surface of films deposited above 290 °C. Change of dominant phase from rhombohedral Bi₂Te₃ to hexagonal BiTe was confirmed with X-ray diffraction analyses. Seebeck coefficients of all samples have negative value, indicating the prepared Bi_xTe_y films are n-type conduction. Optimum of Seebeck coefficient and power factor were obtained at the deposition temperature of 225 °C (about − 55 μV/K and 3 × 10^− 4 W/K²·m, respectively). Deterioration of thermoelectric properties at higher temperature could be explained with Te deficiency and resultant BiTe phase evolution due to the evaporation of Te elements from the film surface.     

Enhanced ferroelectric properties of multilayer SrBi2Ta2O9/SrBi2Nb2O9 thin films for NVRAM applications

Ferroelectric SrBi₂Ta₂O₉/SrBi₂Nb₂O₉ (SBT/SBN) multilayer thin films with various stacking periodicity were deposited on Pt/TiO₂/SiO₂/Si substrate by pulsed laser deposition technique. The X-ray diffraction patterns indicated that the perovskite phase was fully formed with polycrystalline structure in all the films. The Raman spectra showed the frequency of the O–Ta–O stretching mode for multilayer and single layer SrBi₂(Ta_0.5Nb_0.5)₂O₉ (SBNT) samples was 827–829 cm⁻¹, which was in between the stretching mode frequency in SBT (813 cm⁻¹) and SBN (834 cm⁻¹) thin films. The dielectric constant was increased from 300 (SBT) to 373 at 100 kHz in the double layer SBT/SBN sample with thickness of each layer being 200 nm. The remanent polarization (2P_r) for this film was obtained 41.7 μC/cm², which is much higher, compared to pure SBT film (19.2 μC/cm²). The coercive field of this double layer film (67 kV/cm) was found to be lower than SBN film (98 kV/cm).     

退火气氛对镶嵌在SiO2中Ag纳米颗粒热演变影响效应的研究

将70 keV的Ag离子以5×10¹⁶ cm^-2的剂量注入到SiO₂基底中, 随后分别在400~800℃的Ar、N₂、空气气氛中退火, 详细研究了样品的表面形貌、光吸收特性、结构及成分随退火气氛及退火温度的变化规律。原子力显微镜、紫外-可见分光光度计及掠入射X射线衍射仪的测试结果显示: Ar气氛退火样品中形成的Ag纳米粒子(NPs)细小均匀, 其颗粒密度在700℃时达到最大值, 光吸收性能最佳; N₂气氛退火引发Ag纳米颗粒的团聚生长, 在样品近表面形成较大的Ag NPs, 其颗粒密度也在700℃时达到最大值; 而空气中退火后, 由于AgO的形成、分解, 样品的光吸收强度随退火温度升高持续下降。最后, 卢瑟福背散射研究结果表明, 样品的这些变化主要归因于Ag原子在不同退火气氛下随退火温度的扩散行为不同。     

Optical and structural characterizations of Cu-doped KCl films

The production of highly Cu⁺-doped KCl films and the properties of their 266 nm absorption band, which has an off-center property in doped single crystals, open the possibility of application of these films as ultra-violet optical filters. The investigated films, of approximately 1 μm thickness, were prepared by resistive co-evaporation of KCl and CuCl powders on different substrates of CaF₂, Al₂O₃, SiO₂, KCl and Si. The Cu⁺ concentration, as determined by energy-dispersive X-ray, ranges from 10²⁰ to 10²¹ cm⁻³, for 1–15% CuCl nominal mole percent concentration. Structural and optical properties were investigated through scanning electron microscopy, X-ray diffraction, ellipsometry, optical absorption and transmission. The films are polycrystalline, and the gain size decreases with increasing Cu⁺ impurity concentration, yielding an increase of visible transmission to a limited CuCl concentration. These films show a 6.295 Å lattice parameter with a f.c.c. structure and an index of refraction of 1.53 at 266 nm. When the Cu⁺ concentration is increased, the UV band position remains the same and no clusters are evidenced even to the high 15% CuCl concentration investigated, which differs very much from single crystals samples grown by the Kyropoulos-Czochralski method. For a Cu⁺ concentration of 8×10²⁰ cm⁻³ the film shows a transmission better than 88% at 350 nm wavelength.     

基于MoS2/SiO2范德华异质结的VO2薄膜转移打印研究

近年来, 柔性电子器件由于在物联网、生物电子等领域的潜在应用引起了研究者的广泛关注。功能氧化物材料在柔性聚合物中的集成已被证明是实现高性能柔性电子器件的有效方式。由于功能氧化物薄膜通常需要高温制备, 直接在柔性聚合物基底上合成高质量的氧化物薄膜仍然是一个巨大的挑战。本研究提出了一种基于MoS₂/SiO₂范德华异质结转移打印大面积VO₂薄膜的方法, 即利用MoS₂和SiO₂薄膜亲疏水性能的不同, 可以仅使用去离子水解离MoS₂/SiO₂范德华异质结界面, 成功将Si/SiO₂/MoS₂/SiO₂/VO₂ 多层膜结构上的VO₂薄膜转印到Si、SiO₂/Si以及柔性基底上。X射线衍射(XRD)结果显示, 转印前后VO₂薄膜的晶体结构没有差异, 变温Raman光谱和变温红外反射光谱证明了转印前后VO₂薄膜良好的金属-绝缘体转变性能。本研究提供了一种有效的功能氧化物薄膜转印方法, 在不引入牺牲层和腐蚀性溶剂的条件下, 实现了VO₂薄膜在任意基底上的低温集成, 为柔性可穿戴电子器件的研制提供了一种新思路。     

Growth of Ti:sapphire single crystal thin films by pulsed laser deposition

This paper documents the growth of single crystal Ti:sapphire thin films, typically 10 μm thick, on undoped sapphire substrates using pulsed laser deposition from a Ti:sapphire single crystal target with a doping level of 0.1 wt.% Ti₂O₃. These thin films are shown to have very high crystal quality using ion beam channelling and X-ray diffraction techniques. The degree of titanium incorporation into the films is investigated using inductively coupled plasma mass spectrometry and particle induced X-ray emission. These techniques show that levels of up to 0.08 wt.% Ti₂O₃ are present in the deposited layers.     

共掺Na~＋（K~＋）/Er~（3＋）50SiO_2-30PbO-20PbF_2-0.8ErF_3玻璃陶瓷的上转换光谱性质

研究掺入少量的碱金属离子Na~＋、K~＋后,50SiO_2-30PbO-20PbF_2-0.8ErF_3玻璃及玻璃陶瓷的热稳定性质和光谱性质。应用Judd-OfeIt理论和吸收光谱计算了Er~（3＋）离子的J-0参数Ω_λ（λ=2、4、6）。上转换光谱分析表明：在520、545和650 nm处有较强的绿光和红光发射,在...