Dynamics and thermal properties of epoxy resin cured by new diamino disiloxanes

Two disiloxane compounds, 3,3′‐(1,3‐dimethyl‐1,3‐diphenyl‐1,3‐disiloxanediyl)bis(benzenamine) ( C1 ) and 4,4′‐(1,3‐dimethyl‐1,3‐diphenyl‐1,3‐disiloxanediyl)bis(benzenamine) ( C2 ) were synthesized and used as new curing agents of DGEBA epoxy resin with an epoxy value of 0.51 ( E‐51 ). The curing kinetics of E‐51/C1 and E‐51/C2 systems was investigated by non‐isothermal differential scanning calorimetry (DSC) analyses. The activation energy (ΔE) and the characteristic cure temperatures of the two systems were determined. The two systems have the similar activation energy. The reactivity of E‐51/C1 is higher than that of E‐51/C2 . The reaction orders of E‐51/C1 and E‐51/C2 are 0.88 and 0.87, respectively, illustrating that curing reaction between the epoxy resin and curing agent ( C1 or C2 ) is complicated. The DSC result shows that E51 cured by C2 has higher Tg; whereas thermogravimetric analysis results indicate that E51 cured by C1 has higher thermal stability. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42385.     

Analysis of the cure reaction of carbon nanotubes/epoxy resin composites through thermal analysis and Raman spectroscopy

The effect of the incorporation of single‐walled carbon nanotubes (SWNTs) onto a diglycidyl ether of bisphenol A‐based (DGEBA) epoxy resin cure reaction was investigated by thermal analysis and Raman spectroscopy. The results of the investigation show that SWNTs act as a strong catalyst. A shift of the exothermic reaction peak to lower temperatures is, in fact, observed in the presence of SWNTs. Moreover, these effects are already noticeable at the lowest SWNT content investigated (5%) with slight further effects at higher concentrations, suggesting a saturation of the catalyzing action at the higher concentrations studied. The curves obtained under isothermal conditions confirm the results obtained in nonisothermal tests showing that the cure reaction takes less time with respect to the neat epoxy. The thermal degradation of cured DGEBA and DGEBA/SWNT composites was examined by thermogravimetry, showing a faster thermal degradation for DGEBA–SWNT composites. Raman spectroscopy was successfully applied to demonstrate that the observed changes in the cure reaction of the composites lead to a different residual strain on the SWNT bundles following a different intercalation of the epoxy matrix. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 452–458, 2003     

Aspects of reproducibility and stability for partial cure of epoxy matrix resin

Partial cure of thermosets is a promising approach to enhance manufacturing possibilities of reinforced and unreinforced polymers. If partial cure is taken into consideration as a genuine process parameter, novel manufacturing technologies can be developed by exploiting the specific properties of incomplete polymer networks. A main concern in this context is to control the kinetic reaction avoiding inhomogeneous or instable degrees of cure. Based on a combination of numerical simulations and experiments, a methodology is presented that enables a systematic assessment of the reproducibility and stability of partial cure. Special attention is paid to the interaction of thermal boundary conditions and the cure kinetic of thick samples as well as the storability of partially cured resin under different conditions. Guidelines for cure cycle selection, mold design, and storage are derived. The possibility to use complex multistep cure schedules and extended storage periods is demonstrated for an unmodified noninhibited epoxy resin. © 2019 The Authors. Journal of Applied Polymer Science published by Wiley Periodicals Inc. J. Appl. Polym. Sci. 2020 , 137, 48342.     

Synthesis of a novel lignin-based epoxy resin curing agent and study of cure kinetics,thermal, and mechanical properties

In this contribution, first of all, the methoxy groups of organic solvent lignin (OSL) was converted to phenolic hydroxyl groups through demethylation reaction for the purpose of fabricating demethylated organic solvent lignin (DOSL). In addition, the resulting DOSL was utilized as a renewable material to synthesize a novel esterified lignin (EDOSL) by reacting with isobutyryl chloride for curing of epoxy resin. Finally, commercial liquid diglycidyl ether of bisphenol A was cured by EDOSL in the presence of 4-dimethylaminopyridine (DMAP) used as a catalyst based on dual-curing mechanism. Dual curing is a processing methodology based upon the alliance of two diverse and compatible polymerization reactions occurring sequentially or simultaneously. According to the FTIR spectra and ¹H-NMR analyses, the demethylation of OSL, esterification of DOSL, and the curing reaction of epoxy resin with EDOSL were successfully conducted. The value of the phenolic hydrogen in the DOSL was approximately 4.89 mmol/g, which increased by 12.64% after demethylation. The thermal and mechanical performances of these cured epoxy samples were measured by DSC, DMA, TGA, and tensile testing. The epoxy system cured by 10%wt esterified lignin with 1%wt DMAP possessed the tensile strength of 71.54 ± 7.50 MPa and the initial degradation temperature (T_5%) of 370°C, which can compete fairly with commercial aromatic curing agents or other lignin-based agents studied currently for the curing of epoxy systems.     

Isothermal and nonisothermal cure kinetics of an epoxy/poly(oxypropylene)diamine/octadecylammonium modified montmorillonite system

The effect of an octadecylammonium‐exchanged montmorillonite on the curing kinetics of a thermoset system based on a bisphenol A epoxy resin and a poly(oxypropylene)diamine curing agent were studied with differential scanning calorimetry (DSC) in isothermal and dynamic (constant‐heating‐rate) conditions. Montmorillonite and the prepared composites were characterized by X‐ray diffraction analysis and simultaneous DSC and thermogravimetric analysis. The analysis of the DSC data indicated that the intercalated octadecylammonium cations catalyzed the epoxy–amine polymerization. A kinetic model, arising from an autocatalyzed reaction mechanism, was applied to the DSC data. Fairly good agreement between the experimental data and the modeling data was obtained. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 1765–1771, 2006     

汽车用环氧树脂结构胶固化动力学研究

运用非等温DSC(差示扫描量热)法对Sikapower-492G型汽车用EP(环氧树脂)结构胶在动态升温过程中的固化动力学进行了研究。根据不同升温速率时的DSC曲线,采用Kissinger法、Crane法、Ozawa法和温度-升温速率(T-β)外推法等得到该EP胶粘剂的动力学参数。结果表明:该EP胶粘剂体系的固化动力学可用1级固化动力学模型进行表征;该EP胶粘剂的凝胶化温度、固化温度和后处理温度约分别为123、164、224℃,其表观活化能、频率因子和反应级数等动力学参数分别为117 kJ/mol、1.80×1013 s-1和0.934。     

Reaction kinetics,thermal properties of tetramethyl biphenyl epoxy resin cured with aromatic diamine

Epoxy resins, 4, 4′‐diglycidyl (3, 3′, 5, 5′‐tetramethylbiphenyl) epoxy resin (TMBP) containing rigid rod structure as a class of high performance polymers has been researched. The investigation of cure kinetics of TMBP and diglycidyl ether of bisphenol‐A epoxy resin (DGEBA) cured with p‐phenylenediamine (PDA) was performed by differential scanning calorimeter using an isoconversional method with dynamic conditions. The effect of the molar ratios of TMBP to PDA on the cure reaction kinetics was studied. The results showed that the curing of epoxy resins contains different stages. The activation energy was dependent of the degree of conversion. At the early of curing stages, the activation energy showed the activation energy took as maximum value. The effects of rigid rod groups and molar ratios of TMBP to PDA for the thermal properties were investigated by the DSC, DMA and TGA. The cured 2/1 TMBP/PDA system with rigid rod groups and high crosslink density had shown highest T_g and thermal degradation temperature. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

Modeling the chemorheological behavior of epoxy/liquid aromatic diamine for resin transfer molding applications

The analysis of the chemorheological behavior of an epoxy prepolymer based on a diglycidylether of bisphenol‐A (DGEBA) with a liquid aromatic diamine (DETDA 80) as a hardener was performed by combining the data obtained from Differential Scanning Calorimetry (DSC) with rheological measurements. The kinetics of the crosslinking reaction was analyzed at conventional injection temperatures varying from 100 to 150°C as experienced during a Resin Transfer Molding (RTM) process. A phenomenological kinetic model able to describe the cure behavior of the DGEBA/DETDA 80 system during processing is proposed. Rheological properties of this low reactive epoxy system were also measured to follow the cure evolution at the same temperatures as the mold‐filling process. An empirical model correlating the resin viscosity with temperature and the extent of reaction was obtained to carry out later a simulation of the RTM process and to prepare advanced composites. Predictions of the viscosity changes were found to be in good agreement with the experimental data at low extents of cure, i.e., in the period of time required for the mold‐filling stage in RTM process. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 4228–4237, 2006     

Correlation between viscoelastic behavior and cooling stresses in a cured epoxy resin system

This work deals with the study of the rheological behavior of an epoxy system subjected to three cooling processes referred to as the normal, air‐, and water‐cooling processes. The system was set up by a difunctional epoxy resin (DGEBA) mixed with a tetrafunctional diamine (mPDA) in stoichiometric proportions. Different samples of (1) neat and cured polymers and (2) alumina—epoxy composites were prepared. The first part of this work was devoted to optimizing the cure cycle of the neat samples using differential scanning calorimetry and rheometry. The best cure cycle is based on a first heat step at 110°C during 10 min followed by a crosslinking stage of 75 min at 180°C. In the second part of the study the influence of the cooling cycle on the thermomechanical behavior of polymer and composite samples was investigated. Measurement of loss modulus, G″, and loss factor, tan δ, versus temperature showed that an intermediate relaxation α′ peak arose between the main and secondary relaxations (resp. α and β). The position and amplitude of the α′ peak increased with the cooling rate. This rheological phenomenon is related to the presence of nonequilibrium stresses frozen in the sample during cooling. The effect of thermal aging on the α′ peak also is reported. Our work also showed the presence of an α′ peak for the composites. However, the amplitude of this peak was more pronounced in the composites because of additional stresses induced by the difference between the resin and the ceramic in thermal expansion coefficients. We showed that a calculation based on a thermoelastic model was useful for qualitative comparison of rheological data on the influence of the cooling process. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 99: 679–690, 2006     

Model free kinetics coupled with finite element method for curing simulation of thermosetting epoxy resins

A finite element method algorithm for epoxy curing degree simulation was developed in Abaqus by integrating the discretized analytical solution of the model free kinetics into its user subroutines. This method was verified by nonisothermal and isothermal DSC experiments of an epoxy resin. By means of this method, the real manufacturing press cycle could be simulated regarding temperature distribution and curing degree with advanced curing degree‐dependent material properties. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46408.     

非等温DSC法研究环氧树脂固化反应动力学过程

采用非等温DSC(差示扫描量热)法研究了环氧树脂(EP)体系的固化过程,并采用Kissinger方程、Crane方程和T-β(温度-升温速率)外推法计算出该EP体系固化反应的动力学参数和固化温度。研究结果表明:当m(EP)∶m(填料)∶m(固化剂)∶m(促进剂)=100∶30∶90∶0.4时,EP体系固化反应的表观活化能为78.90 kJ/mol、指前因子为2.58×109min-1和反应级数为0.914,其最佳固化条件为"从室温升温至92℃(开始凝胶)→继续升温至140℃(恒温固化)→最后升温至169℃(进行后固化处理)"。     

Cure kinetics of an epoxy/liquid aromatic diamine modified with poly(ether imide)

The cure kinetics and mechanisms of an epoxy oligomer based on diglycidyl ether of bisphenol A (DGEBA), polymerized with a liquid aromatic diamine based on diethyl toluene diamine (DETDA 80), and its blends with poly(ether imide) (PEI) at concentrations of 0–15 wt % were studied with differential scanning calorimetry under dynamic and isothermal conditions. The kinetic analyses were performed with a phenomenological approach. The reaction mechanism of the blends remained the same as that of the neat epoxy. However, the addition of PEI had a marked effect on the cure kinetics in the DGEBA/DETDA 80 system. The rate of reaction decreased with an increase in the thermoplastic content. Diffusion control was incorporated to describe the cure behavior of the blends in the latter stages. Greater diffusion control was observed as the PEI concentration increased and the cure temperature decreased. Polymer blends based on this epoxy/liquid aromatic diamine had not been previously studied from a kinetic viewpoint. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 96: 660–672, 2005     

A kinetic study on the autocatalytic cure reaction of a cyanate ester resin

The cure of a novolac‐type cyanate ester monomer, which reacts to form a polycyanurate network, was investigated by using differential scanning calorimeter. The conversions and the rates of cure were determined from the exothermic curves at several isothermal temperatures (513–553 K). The experimental data, showing an autocatalytic behavior, conforms to the kinetic model proposed by Kamal, which includes two reaction orders, m and n, and two rate constants, k₁ and k₂. These kinetic parameters for each curing temperature were obtained by using Kenny's graphic‐analytical technique. The overall reaction order was about 1.99 (m = 0.99, n = 1.0) and the activation energies for the rate constants, k₁ and k₂, were 80.9 and 82.3 kJ/mol, respectively. The results show that the autocatalytic model predicted the curing kinetics very well at high curing temperatures. However, at low curing temperatures, deviation from experimental data was observed after gelation occurred. The kinetic model was, therefore, modified to predict the cure kinetics over the whole range of conversion. After modification, the overall reaction order slightly decreased to be 1.94 (m = 0.95, n = 0.99), and the activation energies for the rate constants, k₁ and k₂, were found to be 86.4 and 80.2 kJ/mol. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 3067–3079, 2004     

Kinetics analysis of the curing reaction of fast cure epoxy prepregs

In this article, the curing kinetics of two fast cure flip-chip epoxy encapsulants under both isothermal and nonisothermal conditions are investigated by differential scanning calorimetry. The method allows determination of the most suitable kinetic model and corresponding parameters. The kinetic analysis suggests that the two-parameter autocatalytic model is more appropriate to describe the kinetics of the curing reaction. There are certain differences between the kinetic data from isothermal and that from nonisothermal measurements. The apparent activation energy Ea and pre-exponential factor A of E-AB1 determined from nonisothermal experiments were higher than the isothermal values, whereas the Ea and A of E-RV2 determined from both methods are relatively close. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 1501–1508, 1999     

Intercalation of epoxy resin in organically modified montmorillonite

Various methods of preparation of epoxy resin/clay mixtures, before the addition of the crosslinking agent and curing to form epoxy‐based polymer layered silicate (PLS) nanocomposites, have been investigated to determine their effect on the nanostructure. Organically modified montmorillonite clay was used, and the mixtures were prepared by both simple mixing and solvent‐based methods. X‐ray diffraction shows that intercalation of the resin into the clay galleries occurs for all clay loadings up to 25 wt % and for both preparation methods, but the dispersion of the clay in the resin, observed by optical microscopy, is significantly better for the solvent preparation method. Differential scanning calorimetry (DSC) shows that the intercalated resin has the same molecular mobility as the extra‐gallery resin, but suggests that the intercalated resin does not penetrate completely into the galleries. Prolonged storage of the resin/clay mixtures at room temperature leads to changes in the DSC response, as well as in the response to thermogravimetry, which are interpreted as resulting from homopolymerization of the epoxy resin, catalyzed by the onium ion in the modified clay. This confirms and explains the earlier observation of Benson Tolle and Anderson (J Appl Polym Sci 2004, 91, 89) that “conditioning” of the resin/clay mixtures at ambient temperature has a significant effect when the crosslinking agent is subsequently added, and indicates that the preparation method has important consequences for the nanostructure development in the PLS nanocomposites. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102:3751–3763, 2006     

Thermal and mechanical properties of PES/PTFE composites and nanocomposites

Polyethersulphone/polytetrafluoroethylene (PES/PTFE) nanocomposites and composites were prepared by precipitation of PES into a PTFE latex‐containing nanoparticles. Different samples were obtained by varying the relative ratio between PES and PTFE. The complex crystallization process, discussed within the fractionated crystallization frame, allowed to identify and quantify different dispersion degree of the PTFE nanoparticles within the PES matrix. The different samples were thus divided into nanocomposite and composites. The effect of crystalline PTFE domains on the mobility of PES was investigated and discussed. The dynamic‐mechanical behavior was explained in terms of the particle aggregation state. The mechanical properties of the PES/PTFE composites were found to depend on both the dispersion and the concentration of the PTFE nanoparticles. In the glassy state the stiffness of the materials was found to increase with the dispersion degree, resulting higher for the nanocomposite with respect to composites. On the contrary, in the rubbery state the modulus was found proportional to the PTFE nanoparticles concentration, resulting higher in the composites with respect to the nanocomposite. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 130: 3624–3633, 2013     

Enhanced mechanical toughness of carbon nanofibrous-coated surface modified Kevlar reinforced polyurethane/epoxy matrix hybrid composites

High-performance Kevlar fiber had extensively been explored to upgraded mechanical properties of the advanced composites. Therefore, this study aimed a challenging work to grow carbon nanofibers onto the Kevlar fiber to improve its fiber-matrix interaction properties. It was successfully done through inexpensive flame deposition as well as modification of matrix with hybrid resin using polyurethane-epoxy mixture. A hand-layup method had been adopted to manufacture the composite laminates. The chemical and surface structures of the prepared laminae were examined by scanning electron microscopy, Raman spectroscopy, X-ray diffraction, and the composite's properties were evaluated tensile test, compact tension (CT) fracture test, fractography, and differential scanning calorimetry. The surface modified Kevlar laminae with CNF were used as reinforcing layer in the epoxy and PU/epoxy hybrid resin matrices. CNF-coated heated Kevlar reinforced laminated PU/epoxy hybrid composites (CNF-Kev/PU-Epoxy) showed highest elongation 47% and fracture toughness (11.7 MPa√m) along with good UTS 139 MPa. Therefore, these hybrid nanocomposites developed by simple inexpensive method would be the potential candidates for several advanced applications particularly in defense, automobile, aerospace, and spacecraft applications. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2020 , 137, 48802.     

Curing behavior of epoxy resins in two‐stage curing process by non‐isothermal differential scanning calorimetry kinetics method

In this research, a new thermal curing system, with two‐stage curing characteristics, has been designed. And the reaction behaviors of two different curing processes have been systematically studied. The non‐isothermal differential scanning calorimetry (DSC) test is used to discuss the curing reaction of two stages curing, and the data obtained from the curves are used to calculate the kinetic parameters. Kissinger‐Akahira‐Sunose (KAS) method is applied to determine activation energy (E_a) and investigate it as the change of conversion (α). Málek method is used to unravel the curing reaction mechanism. The results indicate that the curing behaviors of two different curing stages can be implemented successfully, and curing behavior is accorded with ?esták‐Berggren mode. The non‐isothermal DSC and Fourier transform infrared spectroscopy test results reveal that two different curing stages can be implemented successfully. Furthermore, the double x fitting method is used to determine the pre‐exponential factor (A), reaction order (m, n), and establish the kinetic equation. The fitting results between experiment curves and simulative curves prove that the kinetic equation can commendably describe the two different curing reaction processes. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40711.