微量元素Sb对BGA焊锡球内部组织及可焊性的影响

本文以Sn-3.0Ag-0.5Cu(wt.%)焊料为母合金,探讨了微量元素Sb对BGA焊锡球内部组织及熔点、润湿性的影响。实验研究表明,添加适量的微量元素Sb,可强化Ag在基体中的弥散强化效应,抑制焊接界面处Cu_6Sn_5的生长,提高焊点机械强度;同时可降低焊料合金的液相线温度,减小糊状区间,改善BGA焊锡球的润湿性。     

In的添加对Sn-9Zn无铅焊料合金组织与性能的影响

锡锌（Sn-Zn）无铅焊料在电子封装中具有广阔的应用前景,但其润湿性和抗氧化性能较差。采用16通道摇摆炉制备Sn-9Zn-x In(x=0,1,2,3,4;%,质量分数)焊料合金,研究In元素对Sn-9Zn无铅焊料合金微观组织、熔化特性、润湿性、抗氧化性以及力学性能的影响。结果表明：添加的In元素与Sn,Zn形成低熔点合金,明显降低焊料合金的熔点及固相线温度;加入In元素使得焊料合金表面张力降低,润湿性能提高;焊料合金的润湿力在In含量为3%达到最大值（0.857 mN）;焊料添加In元素形成In2O3氧化膜有保护熔体的作用,有助于增强焊料合金抗氧化性能,不含In元素时焊料合金的氧化增重为0.47%,而In含量为3%时其氧化增重质量分数为0.14%,抗氧化性能提高;添加In后在Sn基体中产生固溶强化和析出强化使得合金抗拉强度先提高后降低,当In含量为3%时,焊料合金极限抗拉强度达到55 MPa左右。加入In后破碎为长条状、针棒状的富Zn相使得延伸率逐渐下降,当In添加量大于3%时,延伸率急剧下降。综合焊料的力学性能、润湿性、抗氧化性能,确定In的在Sn-9Zn中最优添加量为3%。     

添加微量稀土元素对Sn-Ag-Cu系无铅焊料性能的影响

以Sn-3．0Ag-0．5Cu（质量分数，％）焊料为母合金，探讨了微量稀土元素Ce、Er、Y和Sc对Sn—Ag—Cu合金物理性能、润湿性能以及力学性能的影响。试验结果表明：稀土元素对焊料的性能有不同的影响，添加微量Ce元素可以更好地改善焊料综合性能。     

微量Ce含量对Sn-50Zn-2Cu合金微观组织和腐蚀行为的影响

Sn-Zn-Cu系合金作为镀锌层的低熔点修补焊料已经有一定范围的使用,但对于稀土元素对该类合金微观组织和性能的影响并不清楚。采用混溶法制备不同Ce含量的Sn-50Zn-2Cu-x Ce(x=0,0.025%,0.05%,0.1%,0.25%,质量分数,下同)合金,采用扫描电子显微镜(SEM)、能谱仪(EDS)、X射线衍射(XRD)、电化学阻抗谱(EIS)和极化曲线(Tafel)等测试技术,研究Ce含量对Sn-50Zn-2Cu合金微观组织和腐蚀行为的影响。结果表明,Sn-50Zn-2Cu基合金均由富Zn相和富Sn相两相组成且并无金属间化合物的出现,同时,随着Ce含量增加,Sn-50Zn-2Cu基合金组织中富Zn相从枝晶状向团簇状转变,组织得到细化;随着Ce含量从0到0.1%范围中增加,Sn-50Zn-2Cu基合金的腐蚀电流密度从9.028×10-6μA·cm~(-2)降低至2.964×10~(-6)μA·cm~(-2),腐蚀产物与合金界面的阻抗也从1127Ω·cm~2升至4570Ω·cm~2,结合等效电路参数中容抗数值可知,合金的腐蚀产物层也越来越致密,但当Ce含量增至0.25%时,合金耐蚀性能略微下降,但仍然与含Ce量为0.05%的合金相近。整体看,Ce元素的添加明显提高了Sn-50Zn-2Cu合金在5%Na Cl溶液中的耐蚀性能,随着Ce含量的增加合金的耐蚀性能先逐步提高,然后略有下降,当Ce含量为0.1%时,合金表现出最好的耐蚀性。     

Mg-5Y-3Sm-0.8Ca-0.5Sb合金的组织和力学性能

采用组织分析和拉伸试验,研究了Mg-5Y-3Sm-0.8Ca-0.5Sb(%,质量分数)合金的显微组织和力学性能。结果表明,铸态Mg-5Y-3Sm-0.8Ca-0.5Sb合金的显微组织由α-Mg基体和Mg24Y5、Mg41Sm5、Mg2Ca、Mg3Sb2相组成。时效态Mg-5Y-3Sm-0.8Ca-0.5Sb合金具有良好的室温及高温力学性能,在室温下的抗拉强度为266 MPa,200℃时为244 MPa,300℃时仍高达208 MPa,其抗拉强度稳定性优于发展最为成功的商用耐热镁合金WE43。     

OSP和Im-Sn镀层对Sn10Sb焊点微观结构和高速剪切性能的影响

Sn10Sb合金具有优良的热疲劳性能和相对较高的断裂强度,在对耐热疲劳有要求的细分市场中已得到广泛应用,但其焊点在不同焊盘镀层下的高速剪切性能仍缺少研究。为此,研究了有机可焊防护剂(OSP)和化学沉锡(Im-Sn)两种镀层对Sn10Sb(Sb的质量分数为10%)焊点在1 000 mm/s剪切速率下力学性能的影响。研究结果表明,相比于Sn10Sb块体合金,20～40μm的Sn-Sb化合物均匀分散在β-Sn基体中,而焊点由于熔化和凝固过程中热场不均匀导致Sn-Sb化合物大部分偏聚在表面上、少数聚集在其内部和界面,通过Ansys有限元模拟焊点升降温过程中的热场不均匀分布对该现象进行了解释。此外,利用扫描电子显微镜(SEM)和能量色散X射线光谱仪(EDS)对焊点进行观察,发现两种镀层的焊点都由β-Sn基体、SnSb化合物和Cu₆Sn₅化合物组成。相比于Sn10Sb/OSP焊点,由于Sn10Sb/Im-Sn焊点基体内部有更多的SnSb化合物形成且界面处的Cu₆Sn₅层更薄,使得Sn10Sb/Im-Sn焊点的剪...     

SnBi36Ag0.5Sbx焊料合金组织与性能

向SnBi36Ag0.5合金中加入不同含量的Sb元素,按设计的质量比将Sn、Bi、Ag、Sb纯金属在450℃熔化,保温6 h、320℃浇铸,制备成SnBi36Ag0.5Sbx(x=0.3、0.7、1.0、1.5、2.0)焊料合金。并对合金的显微组织、相成分、熔点、润湿性、力学性能进行表征,研究Sb含量对合金性能的影响。结果表明该合金由网状Bi相、基体Sn相、颗粒状和短杆状的富Bi相、Ag3Sn构成。在一定范围内,Sb元素绝大部分固溶于Sn基体相中,难以析出SnSb化合物。Sb的添加使合金的液相线温度和熔程明显提高。随着Sb含量增高,润湿时间越长,润湿力越低,润湿性能下降。当Sb含量为2%时,抗拉强度最高值为97.09 MPa。添加少量的Sb对Sn-Bi系中Bi合金焊料性能产生明显影响。     

坡莫合金在pH=2.14的氯化钠溶液中的电化学腐蚀行为研究

针对金属薄膜复合板的金属膜选材问题,对坡莫合金进行成分、物相及显微硬度分析,同时研究了坡莫合金在pH=2.14氯化钠溶液中的电化学腐蚀行为,结果表明:镍成分(50%wt)的坡莫合金中的主物相为正方晶系的FeNi(97.7%wt)物相,多边形奥氏体组织;动电位极化曲线表明:镍成分(50%wt)的坡莫合金在pH=2.14的酸性氯化钠溶液中腐蚀以阳极的电化学反应为主,腐蚀速率控制在10~(-3)A/cm~2;交流阻抗表明:电化学腐蚀反应分两步,第一步为阳极的活化反应形成中间腐蚀产物并覆盖在电极表面,第二步为覆盖在电极上的中间腐蚀产物的活化溶解,腐蚀行为及腐蚀机理随着时间的延长未发生变化。     

NH3对CuZnAl合金在3.5%NaCl溶液中腐蚀行为的影响

通过对CuZnAl舍金在3．5％NaCl和3．5％NaCl＋NH，溶液中的腐蚀速率和电化学参数的测试及CuZnAl合金腐蚀形貌的观察，分析了NH3对CuZnAl合金在3．5％NaCl溶液中腐蚀行为的影响。结果表明：NH3能改变CuZnAl舍金的腐蚀形貌，使合金的腐蚀电位负移。腐蚀电流增加，合金的腐蚀速率增大。     

5083铝镁合金在不同浓度NaCl溶液中的腐蚀研究

采用扫描电化学显微镜（SECM）中的极化曲线法和交流阻抗图谱法研究5083铝镁合金在不同浓度NaCl溶液中的腐蚀行为,结果表明:合金在中性NaCl溶液中的腐蚀为钝化材料体系,随着盐度的增加,Cl-对合金基体的破坏加剧,腐蚀电位正移,点蚀电位减小,其电化学阻抗谱中仅有1个容抗弧且呈现收缩趋势.同时,阻抗减小,相位角增加,弥散指数降低,合金的耐腐蚀性能下降.溶液中存在强活化作用的Cl-,会损坏合金表面的氧化膜,逐渐取代腐蚀产物Al（OH）₃中的OH-,生成新的腐蚀产物AlCl₃.      

Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys

The presence of an intermetallic is often an indication of good wetting in a solder joint. However, excessive intermetallic growth and the brittleness of the intermetallic layer may be detrimental to joint reliability. This study examined the growth and mechanical behavior of interfacial intermetallics between copper and six solder alloys commonly used in electronics assembly. The solder alloys tested were 60Sn-40Pb, 63Sn-37Pb, 95Sn-5Sb, 96.5Sn-3.5Ag, 50Pb-50In, 50Sn-50In, and 40In-40Sn-20Pb. The 50Sn-50In and 40In-40Sn-20Pb exhibited faster solid state growth of the intermetallic layer at 100 °C as compared to the near-eutectic Sn-Pb control solder. The 50In-50Pb had a slower growth rate, relative to 63Sn-37Pb, at the aging temperature of 170 °C due to slower reaction rate kinetics of indium with copper. The 96.5Sn-3.5Ag and 95Sn-5Sb had similar intermetallic growth rates at 170 °C and 205 °C, and the aging was comparable to that of the 63Sn-37Pb alloy. The 95Sn-5Sb solder/copper intermetallic had a faster growth rate of the Cu₃Sn layer than was observed in the Sn-Ag or Sn-Pb alloys. Modified fracture toughness and low load indentation tests were used to characterize the mechanical behavior of the intermetallics. The intermetallics were harder than both the base metal and the solder alloy. The fracture behavior of the joints in tension was dependent upon the strength of the solder alloy. Solders with low strengths failed in the solder by plastic deformation. The failure of solders with higher strengths was dependent upon intermetallic thickness. When the intermetallic was thin, fracture occurred in the solder or at the solder/ intermetallic interface. As the interfacial intermetallic thickened, the fracture path moved into the intermetallic layer.     

Creep deformation characteristics of tin and tin-based electronic solder alloys

Creep deformation characteristics of pure tin, and Sn-3.5Ag and Sn-5Sb electronic solder alloys, have been studied at various temperatures between ambient and 473 K (homologous temperature 0.58 to 0.85). Power-law relationships between strain rate and stress were observed at most of the temperatures. The stress exponent (n=7.6, 5.0, and 5.0) and activation energy (Q _c =60.3, 60.7, and 44.7 kJ/mol) values were obtained in the case of tin, Sn-3.5Ag, and Sn-5Sb respectively. Based on n and Q _c values, it is suggested that the rate controlling creep-deformation mechanism is dislocation climb controlled by lattice diffusion in pure tin and Sn-3.5Ag alloy, and viscous glide controlled by pipe diffusion in Sn-5Sb alloy. The results on Sn-3.5Ag bulk material are compared with the initial results on solder bump arrays.     

新型铝合金阳极在NaOH碱性溶液中的腐蚀行为

制备了两种不同含量的Al-Ga-In-Zb-Mg-Mn合金和Al-Ga-In-Sn-Zn-Mg-Mn合金，共三种新型铝合金阳极材料。研究了该系列合金在4mol／LNaOH碱性溶液中的自腐蚀速率和电化学性能。结果表明：在不同的电解液中铝阳极表现出不同的自腐蚀速率和不同的电极电位；合金元素的均匀分布可极大地降低铝阳极的自腐蚀速率。研制出的新型铝合金阳极材料具有优良的电化学性能和良好的耐腐蚀性能，No．1、No．1-1和N0．3阳极在80℃、电流密度为800mA／cm^2条件下、在添加偏铝酸盐时的电解液中，其稳态平均电位分别达到了-1．576V、-1．574V和-1．53V（vs．Hg／HgO）；同时铝合金阳极具有良好的铸造性能和机加工性能。     

Ti90及其优化合金的组织与力学性能研究

Ti90合金是我国自主研发的一种新型近α型钛合金,具有高比强度、高韧性、耐蚀和加工性能好等优点。本课题组前期对Ti90合金进行了成分优化,得到一种名义成分为Ti-5. 5Al-4. 0Zr-1. 0Sn-0. 3Mo-1. 0Nb的优化合金。利用X射线衍射仪、金相显微镜、电子探针显微分析仪、电子万能试验机和电化学工作站等检测仪器,对Ti90及其优化合金的组织与力学性能进行对比分析。结果表明,优化合金组织为带有网篮特征的魏氏组织,原始β晶界和α集束清晰可见,有少量残留β相分布于α片层之间。与Ti90合金相比,优化合金的压缩屈服强度与断裂韧性得到了显著的提高,极限应变量有所增加,电化学腐蚀性能较好。     

Influence of Nd and Y additions on the corrosion behaviour of extruded Mg-Zn-Zr alloys

To improve the corrosion resistance of wrought magnesium alloys through rare earth (RE) additions, the corrosion behaviour of Mg-5Zn-0.3Zr-xNd (x=0, 1, and 2; wt%) and Mg-5Zn-0.3Zr-2Nd-yY (y=0.5 and 1; wt%) alloys in a 5wt% NaCl solution was investigated using immersion test and electrochemical measurements. The results of immersion test show that Mg-5Zn-0.3Zr-2Nd alloy exhibits the best corrosion resistance among the tested alloys. Electrochemical measurements show that secondary phases in RE-containing Mg-5Zn-0.3Zr alloys behave as less noble cathodes in micro-galvanic corrosion and suppress the cathodic process. The additions of Nd and Y into Mg-5Zn-0.3Zr alloy also improve the compactness of the corrosion product film and are beneficial to the corrosion resistance.     

Corrosion of Ga-doped Sn-0.7Cu Solder in Simulated Marine Atmosphere

The surface corrosion behaviors of Sn and Sn-0.7Cu solder in simulated marine atmosphere have been studied. The results showed that pitting and uniform corrosion are the two main initial damage types in the corrosion process. During uniform corrosion, the initial corrosion products, which gradually develop a laminated corrosion film with microcracks, are fragile and easily spall off the surface, thus giving little resistance to further corrosion. XRD of the long-term corrosion products showed that they are mainly amorphous SnO and crystalline Sn(OH)₂ and SnO·xH₂O. Doping the Sn-0.7Cu with gallium significantly improved the corrosion resistance of the alloy in the salt spray test. X-ray photoelectron spectroscopy results showed that the trace amount of Ga significantly segregates to the surface of Sn-0.7Cu alloy and forms a composite oxide layer after solidification in air, thus improving the corrosion resistance. On the other hand, doping the Sn-0.7Cu alloy with phosphorus had little effect.     

时效处理对超高强Cu-Ti合金腐蚀行为的影响

将固溶水淬处理后的Cu-2.7Ti-0.15Mg-0.1Ce-0.1Zr合金分别进行单级时效和组合时效处理,然后在30℃的3.5%NaCl溶液中进行腐蚀实验,利用透射电镜、扫描电镜、能谱分析、腐蚀速率测试、极化曲线和交流阻抗谱的测试与分析,研究合金的腐蚀行为。结果表明:组合时效有利于提高合金的耐腐蚀性能。腐蚀3 d后,合金表面生成致密的腐蚀产物膜,对合金表面具有良好的保护作用。浸泡腐蚀30 d后,腐蚀程度加深,腐蚀产物增多,腐蚀产物主要为Cu_2O,CuO和Al_2O_3等组成的络合物,单级时效合金和组合时效合金的腐蚀深度分别为20和10μm,年平均腐蚀速率分别为0.076 9和0.062 3 mm/a。     

Titanium Containing High Strength Sulfuric Acid Corrosion Resistant Steel

Ti containing low alloy steel free of Sb is found to have higher strength than and equivalent sulfuric acid corrosion (SAC) resistance to traditional SAC resistant steels in Cu? Cr? Sb system. SAC resistance of the Ti containing steel was investigated with potentiodynamic polarization, linear polarization resistance, electrochemical impedance spectroscopy, and weight loss measurements in a solution of 20 wt% H₂SO₄ at 20°C. All measurements confirm that Ti addition is suitable for designing high strength SAC resistant steels.     

钛合金与NiAl封严涂层的电偶腐蚀行为研究

钛合金材料与不同材料相互连接,并处于富含氯离子的电解质溶液中,有可能使得材料发生电偶腐蚀而遭到破坏。采用极化曲线的方法分别研究了NiAl涂层、TA15的电化学行为。结果表明NiAl涂层的腐蚀电位较TA15的低,二者相差约30 mV,NiAl涂层腐蚀电流为1.718×10-4A,TA15腐蚀电流为1.170×10-5A。研究了NiAl封严涂层和TA15钛合金之间在5%NaCl水溶液中的电偶腐蚀行为。测试了NiAl-TA15电偶对的电偶电流-时间曲线,并通过计算出的平均电偶电流密度,评价了钛合金和NiAl封严涂层的电偶腐蚀敏感性。结果表明,TA15钛合金和NiAl封严涂层之间的电位差很小,电偶腐蚀倾向很小,电偶电流密度为0.0253μA.cm-2。电偶腐蚀过程中,腐蚀电位较低的NiAl涂层作为电偶对的阳极发生腐蚀,钛合金作为阴极得到保护。电偶腐蚀后电偶对的阳极、阴极的自腐蚀电位均升高,阳极电位从-347 mV正移到-242 mV,阴极电位从-323 mV正移到-210 mV;电偶电位为-300 mV。NiAl涂层含有较多孔洞,可以作为腐蚀介质的渗透通道,在含有Cl-并且有溶解氧存在的腐蚀性介质中,容易导致腐蚀的发生与发展。