PEEK抗静电复合材料的研究

制备了聚醚醚酮/炭黑(PEEK/CB)、聚醚醚酮/碳纤维(PEEK/CF)抗静电复合材料。结果表明,在PEEK/CB复合体系中,炭黑渗滤区含量为3%⁵%,较低的炭黑含量确保了复合材料优异的力学性能;在PEEK/CF复合体系中,碳纤维渗滤区含量为15%5%,较低的炭黑含量确保了复合材料优异的力学性能;在PEEK/CF复合体系中,碳纤维渗滤区含量为15%²0%;扫描电镜(SEM)结果证明:炭黑在PEEK基体中达到纳米级分散,形成空间导电网络结构,这种结构提高了复合材料的抗静电性能。     

PP-g-MAH对尼龙6/炭黑复合材料性能和形貌的影响

以炭黑(CB)为导电填料,马来酸酐接枝聚丙烯(PP-g-MAH)为增韧剂,通过双螺杆挤出机和注射成型机制备了尼龙(PA)6/PP-g-MAH/CB复合材料,研究了PP-g-MAH含量对7.5%CB填充PA6力学性能、抗静电性能、热稳定性能和形貌的影响。结果表明,添加质量分数20%的PP-g-MAH可提高PA6/CB复合材料的拉伸强度、韧性、抗静电性能和热稳定性。PA6/PP-g-MAH/CB复合材料力学强度和热稳定性的提高源于PP-g-MAH产生的能量耗散以及CB,PP-g-MAH与PA6之间较好的界面粘附和PP-g-MAH均匀细化分散在PA6/CB中。PP-g-MAH改变了CB在共混物中的选择性分布,使PA6/CB的表面电阻率和体积电阻率分别下降5个和3个数量级。     

PA6基耐磨材料的抗静电改性

以PA6基耐磨材料(WRPA6)为基体,以炭黑(CB)和高分子型抗静电剂MH2030为导电填料,制备抗静电耐磨材料。结果表明,CB能够显著降低材料表面电阻率,但使材料韧性下降;8%的MH2030就能明显降低材料的表面电阻率,材料表面电阻率随其含量的变化较小,同时,MH2030还能提高材料的冲击强度。CB和MH2030复配填充时,复合材料表面电阻率较二者单独填充时有明显降低,当CB和MH2030质量分数分别为16%和8%时,复合材料表面电阻率下降到1.58×10⁷Ω;此时摩擦系数和磨损率分别为0.249和1.03×10^-4 mm³/(N·m),具有较好的综合性能。     

PEEK/Cu/SCF导热复合材料的制备与性能研究

以微米级Cu粉和短碳纤维(SCF)作为复配导热填料,利用模压成型方法制备了聚醚醚酮(PEEK)/Cu/SCF二元导热复合材料,采用扫描电镜分析了复合材料的表面形貌,考察了导热填料用量对复合材料导热性能、表面电阻率、热性能的影响。结果表明:微米级Cu粉和SCF作为导热填料可以起到协同作用,显著改善了PEEK的导热性能;当Cu粉用量为10%时,随着SCF用量的增加,复合材料的导热系数明显提高,熔融温度降低,结晶度减小;SCF用量为20%时,复合材料的导热系数为0.832 W/(m·K),提高了162%;表面电阻率为108Ω,复合材料具有一定的抗静电性。     

激光原位铺放CF增强PEEK基复合材料工艺研究

通过激光原位铺放制备了CF增强PEEK基(CF/PEEK)复合材料,采用差示扫描量热法(DSC)与热重分析法(TGA)对CF/PEEK热性能进行了分析,利用扫描电子显微镜(SEM)表征CF/PEEK微观形貌,并研究了不同温度与铺放压力下CF/PEEK的力学性能。结果表明,激光原位铺放温度在400℃到420℃、铺放压力在220 N左右时,PEEK基体的流动性较好,CF/PEEK粘接牢固,成型的复合材料具有优异的力学性能。     

阻燃抗静电聚丙烯材料

用八溴二苯醚(OBDPO)和三氧化二锑(Sb2O3)的复配阻燃剂、导电炭黑(CB)、滑石粉(Talc)与聚丙烯(PP)熔融挤出制备阻燃抗静电聚丙烯.分别研究复配阻燃剂含量、CB含量和Talc含量对复合材料的垂直燃烧性能、表面电阻率及热稳定性能的影响.研究结果表明:当复合材料中复配阻燃剂、CB及Talc质量含量分别为30%、8%、6%时,体系的垂直燃烧性能达到FV-0级,同时表面电阻率达到3.14×104Ω.     

碳纤维协同碳纳米管改性聚乳酸的性能研究

选用可完全生物降解的聚乳酸材料作为导电抗静电聚合物复合材料的基体,以阵列碳纳米管(CNT)为主要电介质,碳纤维(CF)为增强材料和辅助导电剂,采用熔融共混法制备生物降解导电高分子材料。研究表明,含2%碳纳米管的聚乳酸(PLA)表面电阻率可达到1010Ω/sq,即可达到抗静电材料的要求;添加1%的碳纤维(CF),制备成PLA/CNT/CF导电复合材料,碳纤维不但可以提高材料的导电性能,还显著改善材料的拉伸强度和冲击性能,导电性和冲击强度均提高了4倍。     

PEEK/CF复合材料的非等温结晶动力学研究

利用差示扫描量热仪(DSC)研究了聚醚醚酮(PEEK)和PEEK/碳纤维(CF)复合材料的非等温结晶行为,采用Avrami,Ozawa和Mo方程对PEEK/CF复合材料的非等温动力学进行分析,获得相关非等温动力学参数,并利用Kissinger方程计算其结晶活化能。结果表明:Avrami方程和Mo方程能很好描述PEEK/CF复合材料的非等温结晶过程;PEEK/CF复合材料的非等温结晶活化能为79.99kJ/mol。     

PEEK/CF复合材料中PEEK结晶行为研究进展

对聚醚醚酮（PEEK）/碳纤维（CF）复合材料界面结晶研究现状进行综述,分析PEEK在复合过程中的结晶形态演变,总结影响PEEK在CF表面形成横晶结构的关键因素。PEEK横晶结构的生成与CF和PEEK的微观结构匹配性、导热性能匹配性,以及复合材料的热处理条件密切相关。诱导PEEK在CF表面形成横晶结构有助于提高二者的界面结合强度,进而提升复合材料的拉伸强度和杨氏模量。     

基于XFEM短纤维聚醚醚酮复合材料结构稳定性数值模拟分析

熔融沉积成型(FDM)制备短纤维增强聚合物复合材料成型技术日趋完善。采用FDM-3D挤压工艺制备了纤维含量为10%的短碳纤维(CF)和玻璃纤维(GF)增强的高性能聚醚醚酮复合材料,通过拉伸实验获取聚醚醚酮(PEEK)、碳纤维聚醚醚酮复合材料(CF/PEEK)以及玻璃纤维聚醚醚酮复合材料(GF/PEEK)试样应力-应变曲线。在此基础上,以单边缺口弯曲断裂试样为对象,基于扩展有限单元法(XFEM)建立三种材料的数值模拟模型,分别讨论了含初始裂纹缺陷和无预制裂纹状况下试样的结构稳定性。结果表明,在相同条件下CF/PEEK复合材料构件先于纯PEEK材料、GF/PEEK复合材料发生结构失效行为,且当构件中存在热裂纹的状况下,CF/PEEK复合材料构件更有可能发生断裂失效。     

抗静电半硬质PVC材料的制备及性能

通过SEM、拉伸断裂行为、表面电阻、DMA(动态热机械分析)和维卡软化温度测试,研究了半硬质PVC/炭黑(CB)材料力学性能、电性能、热性能和微观形态。结果表明:随着炭黑添加量增加,PVC/CB的导电性能和拉伸强度提高,而体系的断裂伸长率降低。当炭黑添加量仅为4份时,PVC/CB即有逾渗现象发生,表面电阻大幅度降低。当炭黑的添加量为7份时,材料的表面电阻降至1×105Ω,即可满足矿山材料抗静电的要求,而材料的综合力学性能良好。炭黑可使PVC材料的玻璃化转变温度向高温区域移动,材料的耐热性能提高。     

Processing‐dependent high impact polystyrene/styrene‐butadiene‐styrene tri‐block copolymer/carbon black antistatic composites

The electrical resistivity and morphology of high impact polystyrene (HIPS)/styrene‐butadiene‐styrene triblock copolymer (SBS)/carbon black (CB) blends were studied. Their antistatic sheets were prepared by both compression‐molding and extrusion calendaring process, with their surface morphology observed using scanning electron microscopy (SEM). The SEM images reveal better dispersion of CB achieved in extrusion‐calendering, resulting in low percolation threshold values in HIPS composites. Higher compression ratio and higher drawing speed (corresponding lower sheet thickness) are beneficial to get better CB dispersion, leading to decreased conductivity for the antistatic sheets. SEM images indicate that strong shear forces in extrusion tend to break the conductive network of CB, resulting in increased surface resistivity. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

The improved interface performance between carbon fiber and poly(ether-ether-ketone) by sulfonated polyether sulfone (s-PSF) sizing agent with different sulfonation degree

The effects of sulfonated polyether sulfone (s-PSF) with different sulfonation degrees on the interfacial properties of carbon fiber (CF)/poly(ether-ether-ketone) (PEEK) composites were investigated systematically. The performance of the modified CF and the corresponding CF/PEEK composites and was tested and characterized. Test results show that the CF surface polarity increases, the surface contact angle decreases, and the surface free energy increases with the increase in the s-PSF sulfonation degree. Scanning electron microscopy analysis shows that the increase in the sulfonation degree of s-PSF is beneficial to improve the interface between CF and PEEK. This condition can be ascribed to the hydrogen bonding force between the s-PSF sulfonic acid group and the polar functional group on the surface of the modified CF and the compatibility between s-PSF and PEEK. In terms of physical properties, the thermal and mechanical properties of CF/PEEK composite are improved with the increase in s-PSF sulfonation degree. The interlaminar shear strength, flexural strength, and modulus of CF/PEEK composites increase by 60.16%, 30.27%, and 19.30%, respectively.     

CB/PE阻燃抗静电复合材料的制备和性能研究

制备了聚乙烯基炭黑(CB)导电复合材料;并研究了偶联剂、抗静电剂、阻燃剂、增韧剂、碳纤维对CB/聚乙烯(PE)复合材料电性能的影响。其中偶联剂、抗静电剂、阻燃剂、碳纤维对电性能起正作用,能有效降低体系的体积电阻率;新增韧剂在质量分数小于15%之前起正作用,添加量增加则为反作用,不利于炭黑的分散,使材料转变为绝缘体。试验中运用均匀设计的方法对体系配方进行了优化,经过电学、力学和燃烧测试后,筛选得到了综合性能较好的样品。     

Electrical conductivity of carbon fibers/ABS resin composites mixed with carbon blacks

In this article, the electrical conductivity of composites with different ratios of carbon fiber (CF) content to carbon black (CB) content was studied. The CF content is the main factor to determine the resistivity of the composites filled with CF and CB. The conduction mechanism for this kind of composite is discussed. From comparison of the resistivity of the composites filled with CF and CB with that of the composites filled with CF only, it is shown that using CB as a substitute for part of the CF in CF-filled composites can decrease the production cost, but hardly change the conductivity. The optimum substitution amount is 5% when CF content is beyond 10% in the composites. © 1996 John Wiley & Sons, Inc.     

High performance thermoplastic composites: Study on the mechanical,thermal, and electrical resistivity properties of carbon fiber‐reinforced polyetheretherketone and polyethersulphone

High temperature processing thermoplastic polymers, polyetheretherketone (PEEK) and polyethersulphone (PES), were melt blended with carbon fibers (CFs) to make composites. These composites were investigated for their mechanical, thermal, and electrical properties. Mechanical properties that are expressed in terms of storage modulus, loss, and damping were enhanced with the addition of CFs. Thermal properties were determined by DSC and TGA. These methods help to understand the effects of fiber content and fiber–matrix adhesion in the composites. Composites were also tested for their electrical and thermal conductivity because CFs leave the composites thermally and electrically conductive. CFs enhanced the crystallinity of the PEEK appreciably that in turn influenced thermal conductivity, electrical resistivity, and the stiffness of PEEK/CF (composites of PEEK with CFs). PES/CF (composites of PES with CF) shows a different behavior due to the amorphous nature of PES. The work involves one filler and two different matrices, and so it provides an interesting comparison of how matrix morphology can influence the properties of composites. POLYM. COMPOS. 28:785–796, 2007. © 2007 Society of Plastics Engineers.     

Improved interfacial adhesion in carbon fiber/poly (ether ether ketone) composites with the sulfonated poly (ether ether ketone) sizing treatment

A water-soluble sulfonated poly (ether ether ketone) (SPEEK) sizing agent is prepared and applied to improve the interfacial adhesion of carbon fiber/poly (ether ether ketone) (CF/PEEK) composites. The surface morphology, surface roughness, surface chemistries, and surface free energy of SPEEK sized CF are obtained to understand the sizing effect. The results reveal the increased surface free energy and surface roughness of SPEEK sized CF. In addition, a chemical reaction between the CF surface and sizing layer is proved based on the results of XPS, IR, and ¹H NMR. The interfacial structure of CF/PEEK composites is further ascertained by AFM and the appearance of gradient interface could be verified for SPEEK sized CF/PEEK composites. The formation of the gradient interface is due to the chemical reaction between the CF and sizing agent as well as the improved compatibility between the sized CF and matrix, which benefits the improvement of interfacial adhesion.     

Effect of Mixing Process and Morphologies on the Electrical Conductivity of PA6/EVA/CB Composites

Nylon6 (PA6)/Ethylene-(vinyl acetate) (EVA)/carbon black (CB) composites with different electrical conductivity were prepared in an internal mixer. The factors influencing the electrical conductivity of the ternary composites were investigated, including mixing mode, mixing time and mass ratio of PA6 and EVA, and so on. Among three kinds of PA6/EVA/CB composites, including ones prepared by directly mixing (composites A), EVA and CB were mixed prior to melt-compounding with PA6 (composites B) and PA6 and CB were mixed prior to melt-compounding with EVA (composites C), the mixing time only significantly influenced the electrical conductivity of composites A. Good conductivity of the composites could be realized because the distance between CB particles became closer with the increasing of mixing time. However, the mixing time has no effect on the electrical properties of the composites B and the composites C, due to there were no CB particles migrated phenomenon happened. Scanning electron microscopy (SEM) was used to assess the fracture surface morphologies and the dispersion of the CB particles. The results showed that the dispersion of the CB particles significantly affects the electrical conductivity of the composites. Based on the study of the influence of various mass ratios of EVA and PA6 on the morphologies and electrical properties of PA6/EVA composites filled with 10 phr (parts per hundred resins) CB particles, we suggested that the mass ratio of EVA and PA6 affected the volume resistivity of the ternary composites significantly. In addition, the composites were almost insulation when the mass ratios of EVA and PA6 were 80/20 and 70/30, while the composites became conductivity with the mass ratio of EVA and PA6 higher than 60/40. The PA6/EVA/CB composites which CB particles locate at the interface of EVA and PA6 have the lowest volume resistivity when the mass ratio of two components was 60/40.