双平面掺杂AlGaAs／InGaAs功率PHEMT

双平面掺杂ＡｌＧａＡｓ／ＩｎＧａＡｓ功率ＰＨＥＭＴ陈效建，刘军，李拂晓，郑雪帆，华培忠（南京电子器件研究所，２１００１６）Ｄｏｕｂｌｅ－ｐｌａｎａｒ－ｄｏｐｅｄＡｌＧａＡｓ／ＩｎＧａＡｓＰｏｗｅｒＰＨＥＭＴ￥ＣｈｅｎＸｉａｏｊｉａｎ；ＬｉｕＪｕｎ；Ｌ...     

Influences of sulfur passivation on temperature-dependent characteristics of an AlGaAs/InGaAs/GaAs PHEMT

The influences of (NH/sub 4/)/sub 2/S/sub x/ treatment on an AlGaAs/InGaAs/GaAs pseudomorphic high electron mobility transistor (PHEMT) are studied and demonstrated. Upon the sulfur passivation, the studied device exhibits better temperature-dependent dc and microwave characteristics. Experimentally, for a 1/spl times/100 /spl mu/m/sup 2/ gate/dimension PHEMT with sulfur passivation, the higher gate/drain breakdown voltage of 36.4 (21.5) V, higher turn-on voltage of 0.994 (0.69) V, lower gate leakage current of 0.6 (571) /spl mu/A/mm at V/sub GD/=-22 V, improved threshold voltage of -1.62 (-1.71) V, higher maximum transconductance of 240 (211) mS/mm with 348 (242) mA/mm broad operating regime (>0.9g/sub m,max/), and lower output conductance of 0.51 (0.53) mS/mm are obtained, respectively, at 300 (510) K. The corresponding unity current gain cutoff frequency f/sub T/ (maximum oscillation frequency f/sub max/) are 22.2 (87.9) and 19.5 (59.3) GHz at 250 and 400 K, respectively, with considerably broad operating regimes (>0.8f/sub T/,f/sub max/) larger than 455 mA/mm. Moreover, the relatively lower variations of device performances over wide temperature range (300/spl sim/510 K) are observed.     

GaAs/AlGaAs and InGaAs/AlGaAs MODFET inverter simulations

Although MODFET's have exhibited the fastest switching speed for any digital circuit technology, there is as yet no clear consensus on optimal inverter design rules. We therefore have developed a comprehensive MODFET device model that accurately accounts for such high gate bias effects as transconductance degradation and increased gate capacitance. The device model, which agrees with experimental devices fabricated in this laboratory, is used in the simulation of direct-coupled FET logic (DCFL) inverters with saturated resistor loads. Based on simulation results, the importance of large driver threshold voltage not only for small propagation delay times but for wide logic swings and noise margins is demonstrated. Furthermore, minimum delay times are found to occur at small supply voltages as seen experimentally. Both of these results are attributed to the reduction of detrimental high gate bias effects. The major effect of reducing the gate length on delay time is to decrease the load capacitance of the gate. Using 0.25-µm gates, delay times of 5 and 3.6 ps at 300 and 77 K, respectively, are predicted. Finally, the recently introduced In-GaAs/AlGaAs MODFET's are shown to have switching speeds superior to those of conventional GaAs/AlGaAs MODFET's.     

Self-aligned AlGaAs/GaAs HBT with InGaAs emitter cap layer

A new self-aligned AlGaAs/GaAs HBT with an InGaAs emitter cap layer is presented. This HBT has nonalloyed ohmic contacts to the emitter and base that are formed simultaneously and in a self-aligned manner. The low emitter contact resistance of 1.4×10-7 ?cm2 and the high transconductance per unit area of 3.3 mS/?m2 demonstrate the effectiveness of this structure.     

Comparison of OMVPE Grown GaAs/AlGaAs and GaAs/InGaP HEMT and PHEMT structures

Symmetric δ-doped InGaP and AlGaAs PHEMT structures have been grown by organometallic vapor phase epitaxy with properties that approach those of MBE grown AlGaAs structures. The 300 and 77K carrier concentrations for the InGaP PHEMT were 2.72 and 2.56 × 10¹² cm^{2 −2} and the mobilities were 5,920 and 22,000 cm^{2 2}/V.s. These excellent values suggest that problems associated with switching the anion at the channel heterojunction have been overcome. The corresponding values for the AlGaAs PHEMT were 2.51 and 2.19 × 10¹² cm^{2 −2} and 6,500 and 20,400 cm²/V.s. The uniformity in the indium concentration in the InGaAs layer as determined by photoluminescence, photoreflection, double crystal x-ray diffraction, and Rutherford backscattering was found to be good, but the percent In in the AlGaAs pseudo-morphic high electron mobility transistor (PHEMT) was less than that in the InGaP PHEMT even though the programmed values were the same. The uniformity in the doping distribution as determined by secondary ion mass spectroscopy and electrochemical capacitance-voltage measurements was found to be good, but it decreased with distance from the center of the susceptor. Also, most of the dopants in the δ-doped InGaP and AlGaAs layers were activated.     

MOCVD-grown InGaAs/GaAs/AlGaAs laser structures with a broad-area contact

A metal-organic chemical vapor deposition (MOCVD) technique is developed for a diode laser heterostructure in a system of InGaAs/GaAs/AlGaAs solid solutions; the optimal sizes and the doping profile of the structure are determined to minimize the internal optical losses. Mesa-strip diode lasers with a threshold density of current J _th=150–200 A/cm², internal optical loss factor α_i=1.6–1.9 cm^?1, and an internal quantum yield η_i=85–95% were fabricated. In the continuous lasing mode of a diode laser with a 100-µm-wide aperture and a wavelength of 0.98 µm, the optical power output was as high as 6.5 W and was limited by the catastrophic optical degradation of mirrors. The radiation divergence in the plane normal to the p-n junction amounts to θ_⊥. The use of wide-gap waveguide layers, which deepens the potential electron well in the active region, is shown to reduce the temperature sensitivity of the InGaAs/GaAs/AlGaAs laser heterostructures in the temperature range from 0 to 70°C.     

AlGaAs/GaAs photovoltaic cells with an array of InGaAs QDs

Specific features of the fabrication of AlGaAs/GaAs single-junction photovoltaic cells with an array of quantum dots (QDs) by molecular beam epitaxy have been studied. It was shown for the first time that, in principle, vertically coupled QDs can be incorporated, with no dislocations formed, into the structure of photovoltaic cells without any noticeable deterioration of the structural quality of the p-n junction. Owing to the additional absorption of the long-wavelength part of the solar spectrum in the QD medium and to the subsequent effective separation of photogenerated carriers, a ～1% increase in the short-circuit current density J _sc was demonstrated for the first time in the world for photovoltaic cells with QDs. The maximum efficiency of the photovoltaic cells was 18.3% in conversion of the unconcentrated ground level solar spectrum AM1.5G.     

AlGaAs/InGaAs/GaAs quantum-well power MISFET at millimeter-wavefrequencies

An AlGaAs/InGaAs/GaAs quantum-well MISFET developed for power operation at millimeter-wave frequencies is described. The InGaAs channel is heavily doped to increase the sheet carrier density, resulting in a maximum current density of 700 mA/mm with a transconductance of 480 mS/mm. The 0.25-μm×50-μm device delivers a power density of 0.76 W/mm with 3.6-dB gain and 19% power-added efficiency at 60 GHz. At 5.2 dB gain, the power density is 0.55 W/mm. A similar device built on an undoped InGaAs channel had much poorer power performance and no speed advantage     

Functional AlGaAs/GaAs heterostructure-emitter bipolar transistor with a pseudomorphic InGaAs/GaAs quantum-well base

A new functional AlGaAs/GaAs heterostructure-emitter bipolar transistor (HEBT) with a pseudomorphic InGaAs/GaAs quantum-well (QW) base structure is presented. Due to the insertion of an InGaAs QW between the emitter–base (E–B) junction, the valence band discontinuity can be enhanced. The excellent transistor characteristics including a high current gain of 280 and a low offset voltage of 100 mV are obtained. In addition, an interesting multiple S-shaped negative differential resistance (NDR) phenomenon is observed under the inverted operation mode. This may be attributed to an avalanche multiplication and sequential two-stage barrier lowering effect.     

Record power characteristics of InGaAs/AlGaAs/GaAs heterostructure lasers

Continuous-wave output powers of 9.2 W at a constant heatsink temperature of 10°C and 12.2 W at a stabilized temperature of the active region have been obtained on an InGaAs/AlGaAs laser with a 0.4-μm-thick waveguide, operating at 1.03 μm. Record-breaking output mirror power densities of, respectively, 29.9 and 40 MW/cm² have been achieved without catastrophic optical mirror damage in the two temperature-stabilization regimes. A maximum power conversion efficiency of 66% has been achieved in a laser with a cavity length of 2 mm. __________ Translated from Fizika i Tekhnika Poluprovodnikov, Vol. 35, No. 3, 2001, pp. 380–384. Original Russian Text Copyright ? 2001 by Livshits, Egorov, Kochnev, Kapitonov, Lantratov, Ledentsov, Nalyot, Tarasov. Deceased.     

Quantum-well p-channel AlGaAs/InGaAs/GaAs heterostructureinsulated-gate field-effect transistors with very high transconductance

Quantum-well p-channel pseudomorphic AlGaAs/InGaAs/GaAs heterostructure insulated-gate field-effect transistors with enhanced hole mobility are described. The devices exhibit room-temperature transconductance, transconductance parameter, and maximum drain current as high as 113 mS/mm, 305 mS/V/mm, and 94 mA/mm, respectively, in 0.8-μm-gate devices. Transconductance, transconductance parameter, and maximum drain current as high as 175 mS/mm, 800 mS/V/mm, and 180 mA/mm, respectively were obtained in 1-μm p-channel devices at 77 K. From the device data hole field-effect mobilities of 860 cm²/V-s at 300 K and 2815 cm²/V-s at 77 K have been deduced. The gate current causes the transconductance to drop (and even to change sign) at large voltage swings. Further improvement of the device characteristics may be obtained by minimizing the gate current. To this end, a type of device structure called the dipole heterostructure insulated-gate field-effect transistor is proposed     

The detection limit of curved InGaAs/AlGaAs/GaAs hall bars

The work is devoted to the study of noise characteristics of curved Hall bars based on InGaAs/AlGaAs/GaAs semiconductor heterostructures. The noise spectral density S_N(f) was investigated experimentally and the magnetic field detection limit B_N of a flat and similar Hall bar rolled in a tube was defined. The low-frequency spectra of 1/f noise were studied and the dimensionless Hooge noise parameter α_H was determined. The ability to use the curved Hall bars in the devices for measuring weak magnetic fields (<1 μT) was predicted.     

Millimeter-wave power operation of an AlGaAs/InGaAs/GaAs quantumwell MISFET

The authors have developed state-of-the-art millimeter-wave power transistors using quantum-well MISFETs. MISFETs with both undoped InGaAs wells and doped InGaAs wells have been built. The f_t of the MISFETs with doped well was higher than that of MISFETs with undoped wells, indicating that the device speed does not degrade when the charge transport layer is doped. The power performance of the MISFETs with doped wells was far superior. The best device delivered a power density of 1.0 W/mm with 3.2-dB gain and 27% power-added efficiency at 60 GHz     

AlGaAs/InGaAs/GaAs quantum well doped channel heterostructure fieldeffect transistors

The results of experimental and theoretical studies of pseudomorphic AlGaAs/InGaAs/GaAs quantum-well doped-channel heterostructure field effect transistors (QW-DCHFETs) are presented. The channel doping was introduced in two ways: during growth by molecular beam epitaxy or by direct ion implantation. The latter technique may be advantageous for fabrication of complementary DCHFET circuits. Peak transconductances of 471 mS/mm and peak drain currents of 660 mA/mm in 0.6-μm-gate doped-channel devices were measured. The results show the advantages of the DCHFET over standard heterostructure FET structures and their potential for high-speed IC applications. Self-consisted calculations of the subband structure show that the potential barrier between the quasi-Fermi level in the channel and the bottom of the conduction band in the barrier layer is considerably larger for the doped channel structure than for the structure with an undoped channel. This lowers the thermionic emission gate current of the doped channel device compared to the undoped channel device     

Double pulse doped InGaAs/AlGaAs/GaAs pseudomorphic high-electron-mobility transistor heterostructures

Double pulse doped (δ-doped) InGaAs/AlGaAs/GaAs pseudomorphic high-electron-mobility transistor (HEMT) heterostructures were grown by molecular-beam epitaxy using a multiwafer technological system. The room-temperature electron mobility was determined by the Hall method as 6550 and 6000 cm²/(V s) at sheet electron densities of 3.00 × 10¹² and 3.36 × 10¹² cm⁻², respectively. HEMT heterostructures fabricated in a single process feature high uniformity of structural and electrical characteristics over the entire area of wafers 76.2 mm in diameter and high reproducibility of characteristics from process to process.     

Improved AlGaAs/GaAs HBT performance by InGaAs emitter cap layer

The effects of the emitter resistance reduction on the DC and high-frequency characteristics in an AIGaAs/GaAs HBT with an InGaAs emitter cap layer are investigated. In fabricated devices, a transconductance per unit area of 16mS/?m2 and a cutoff frequency of 80 GHz have been achieved.     

Effect of Gate Sinking on the Device Performance of the InGaP/AlGaAs/InGaAs Enhancement-Mode PHEMT

An enhancement-mode InGaP/AlGaAs/InGaAs pseudomorphic high-electron mobility transistor using platinum (Pt) as the Schottky contact metal was investigated for the first time. Following the Pt/Ti/Pt/Au gate metal deposition, the devices were thermally annealed at 325 degC for gate sinking. After the annealing, the device showed a positive threshold voltage (V_th) shift from 0.17 to 0.41 V and a very low drain leakage current from 1.56 to 0.16 muA/mm. These improvements are attributed to the Schottky barrier height increase and the decrease of the gate-to-channel distance as Pt sinks into the InGaP Schottky layer during gate-sinking process. The shift in the V_th was very uniform across a 4-in wafer and was reproducible from wafer to wafer. The device also showed excellent RF power performance after the gate-sinking process     

Theory and operation of a GaAs/AlGaAs/InGaAs superlatticephototransistor with controlled avalanche gain

The principle of operation of a bipolar transistor with controlled multiplication of one type of carrier is outlined. The ideal device, with a few periods of a staircase superlattice in the base-collector depletion region, has high current outputs at extremely low bias voltages and high current gains. The principle is experimentally demonstrated in a GaAs/AlGaAs/InGaAs phototransistor where three periods of a periodic pseudomorphic structure, in which electrons should predominantly multiply, are included in the collector depletion region. Independent measurements of the electron and hole avalanche multiplication rates, M_n and M_p, in these structures confirm that M_n/M_p M_n/M_p and α/β are ~2-4, depending on bias voltage. The observed photocurrent characteristics agree reasonably well with Monte Carlo calculations made to simulate the transport of electrons through the collector region. Measured optical gains are as high as 142 in an n-p-n phototransistor with a 2000-Å p-base region     

High-f/sub max/ AlGaAs/InGaAs and AlGaAs/GaAs HBT's with p/sup +//p regrown base contacts

The present paper describes a new approach to fabricating high performance HBT's with low base resistance. Their base contact resistance is reduced by using MOMBE selective growth in the extrinsic base region-a key process in the fabrication of high-f/sub max/ AlGaAs/InGaAs and AlGaAs/GaAs HBT's. A p/sup +//p regrown base structure, which consists of a 40-nm-thick graded InGaAs strained layer and a heavily C-doped regrown contact layer, is used for the AlGaAs/InGaAs HBT's to reduce both their base transit time and base resistance, while preventing aluminum oxide incorporation at the regrowth interface. An h/sub fe/ of 93, an f/sub T/ of 102 GHz, and an f/sub max/ of 224 GHz are achieved for a 1.6-/spl mu/m/spl times/4.6-/spl mu/m HBT, together with reduced base push-out effects and improved reliability. AlGaAs/GaAs HBT's with an 80-nm-thick uniform base layer that have high f/sub max/ values ranging from 140-216 GHz are also fabricated using the selective growth technique. These results confirm the high potential of the proposed HBT's, especially for microwave and millimeter-wave applications.<>     

Hot-electron effects on AlGaAs/InGaAs/GaAs PHEMTs under accelerated DC stresses

The behavior of Schottky gate characteristics before and after hot-electron stress has been a relatively neglected topic. Thus, this paper discussed the effects of hot-electron accelerated stress on the DC characteristics of AlGaAs/InGaAs/GaAs PHEMTs as they relate to Schottky gate characteristics. It also presents studies of reverse Schottky gate characteristics before and after hot-electron stresses, as related to two major mechanisms: (1) the widening of the depletion region under the gate; and (2) the impact of the carriers trapped under the gate. The former induces a larger Schottky barrier height with a smaller reverse leakage current density than the latter, while the latter induces the opposite. Two hot-electron conditions are used to investigate the impact of the hot-electron stress on the gate leakage current. The gate leakage current decreases after a hot-electron stress, due the effect of hot-electron stress on the Schottky diode characteristics. Moreover, improvement in the noise performance is expected, due to the decrease in the gate leakage current. Both pre- and post-stress noise measurements have been done to demonstrate this.