A 16 Gb/s adaptive bandwidth on-chip bus based on hybrid current/voltage mode signaling

This paper describes an adaptive bandwidth bus (ABB) architecture based on hybrid current/voltage mode repeaters for long global RC interconnect static busses that achieves high-data rates while minimizing the static power dissipation associated with current-mode signaling. Attaining a maximum aggregate bandwidth of 16 Gb/s (i.e., 1 Gb/s per line) across lossy on-chip interconnects spanning 1.75 cm in length, the bus core fabricated in 0.35 /spl mu/m CMOS technology dissipates approximately 93 mW with a supply of 2.5 V and signal activity of 0.5, equivalent to 5.71 pJ/bit. Experimental results using a 16-bit reference bus design that can be externally programmed to operate in voltage, current or adaptive modes indicate a 50% reduction in power dissipation over current-mode (CM) sensing, and an improvement in interconnection delay and signaling bandwidth of 35%-70% and 66% over voltage-mode (VM) sensing, respectively.     

High-speed completion detection for current sensing on-chip interconnects

A novel completion detection technique for delay insensitive current sensing on-chip interconnects is presented. The scheme is based on sensing currents on the data wires and comparing the sum of these currents to an appropriately set reference. The goal is to solve the performance bottleneck caused by conventional voltage-mode detection methods. With the channel width of 64 bits, the proposed method is 4.65 times faster and takes 36% less area than the voltage-mode scheme. Furthermore, its speed does not degrade when increasing the channel bit width. It is implemented in a 65 nm CMOS technology.     

Current-mode signaling in deep submicrometer global interconnects

This paper addresses propagation delay and power dissipation for current mode signaling in deep submicrometer global interconnects. Based on the effective lumped element resistance and capacitance approximation of distributed RC lines, simple yet accurate closed-form expressions of delay and power dissipation are presented. A new closed-form solution of delay under step input excitation is first developed, exhibiting an accuracy that is within 5% of SPICE simulations for a wide range of parameters. The usefulness of this solution is that resistive load termination for current mode signaling is accurately modeled. This model is then extended to a generalized delay formulation for ramp inputs with arbitrary rise time. Using these expressions, the optimum-line width that minimizes the total delay for current mode circuits is found. Additionally, a new power-dissipation model for current-mode signaling is developed to understand the design tradeoffs between current and voltage sensing. Based on the results and derived formulations, a comparison between voltage and current mode repeater insertion for long global deep submicrometer interconnects is presented.     

Moment computation of lumped and distributed coupled RC trees withapplication to delay and crosstalk estimation

In today's deep submicrometer technology the coupling capacitances among individual on-chip RC trees have an essential effect on the signal delay and crosstalk, and the interconnects should be modeled as coupled RC trees. In this paper we provide simple exact explicit formulas for the Elmore delay and higher order voltage moments and a linear order recursive algorithm for the voltage moment computation for lumped and distributed coupled RC trees. By using the formulas and algorithms, the moment-matching method can be efficiently implemented to deal with delay and crosstalk estimation, model order reduction, and optimal design of interconnects. As an application of the algorithm, we provide a new efficient and accurate model for crosstalk estimation in coupled RC trees. Simulation results show it works better than existing methods     

Designing fast on-chip interconnects for deep submicrometer technologies

This paper proposes a solution to the problem of improving the speed of on-chip interconnects, or wire delay, for deep submicron technologies where coupling capacitance dominates the total line capacitance. Simultaneous redundant switching is proposed to reduce interconnect delays. It is shown to reduce delay more than 25% for a 10-mm long interconnect in a 0.12-/spl mu/m CMOS process compared to using shielding and increased spacing. The paper also proposes possible design approaches to reduce the delay in local interconnects.     

Predictions of CMOS compatible on-chip optical interconnect

Interconnect has become a primary bottleneck in the integrated circuit design process. As CMOS technology is scaled, the design requirements of delay, power, bandwidth, and noise due to the on-chip interconnects have become more stringent. New design challenges are continuously emerging, such as delay uncertainty induced by process and environmental variations. It has become increasingly difficult for conventional copper interconnect to satisfy these design requirements. On-chip optical interconnect has been considered as a potential substitute for electrical interconnect. In this paper, predictions of the performance of CMOS compatible optical devices are made based on current state-of-the-art optical technologies. Electrical and optical interconnects are compared for various design criteria based on these predictions. The critical dimensions beyond which optical interconnect becomes advantageous over electrical interconnect are shown to be approximately one-tenth of the chip edge length at the 22 nm technology node.     

Current-Sensing and Repeater Hybrid Circuit Technique for On-Chip Interconnects

In this paper, hybrids based on current-sensing and repeaters are proposed for on-chip interconnects in an effort to overcome the limitations of these techniques. A novel receiver for current-sensing results in static power savings and allows an easier transition from current-sensing to traditional full rail voltage signals. Measurements of hybrids on a 0.18-m CMOS technology show significant gains over repeater insertion in delay across wire lengths. Hybrids can also be used in placement constrained and low-noise scenarios to achieve delay and power benefits.     

Optimum voltage swing on on-chip and off-chip interconnect

Reduced voltage swings are often used for saving power on interconnects. In this paper, we demonstrate the existence of an optimum voltage swing for minimum power consumption, for on-chip and off-chip interconnects. Actual values of optimum swings and corresponding power savings for high performance interconnects are estimated     

一种低延迟低功耗的片上全局互连方法

提出了一种用于片上全局互连的混合插入方法. 该方法利用中继驱动器和低摆幅差分信号电路在驱动不同长度连线时的优点，将它们混合插入到连线的合适位置，从而降低互连的延时和功耗. 模拟结果表明，该方法与已有方法相比在延时、能耗、能耗延时积以及面积等方面都获得了一定程度的改善.     

Analysis and optimization of coplanar RLC lines for GSI global interconnection

Compact physical models are derived for the delay and crosstalk of on-chip coplanar transmission lines, which are used in state-of-the-art high-speed microprocessors. These lines are mainly used for long global interconnects that are relatively thick and wide and have prominent inductive effects. The models are then used to optimize the design of coplanar global interconnects.     

一种面向单片DC/DC的低压高效片上电流检测技术

本文提出并实现了一种面向电流模式单片开关DC/DC转换器的低压高效片上电流采样电路.该电路利用功率管等效电阻电流检测技术和无需OP放大器的源极输入差分电压放大技术,使电路的应用范围可低达2.3V;-3dB带宽12MHz;在最大负载电流情况下的静态电流峰值仅19μA,比常规采用功率管镜像电流检测技术的静态电流峰值低1.5个量级左右.转换器基于0.5μm 2P3M Mixed Signal CMOS工艺设计制作.测试结果表明,电流检测电路的最大检测电流1.1A,转换器的输入最低电压2.3V,重负载转换效率高于93%.     

Optimization of Driver Preemphasis for On-Chip Interconnects

In modern digital systems, on-chip interconnects have become the system bottleneck, limiting the performance of high-speed clock distributions and data communications in terms of speed and power dissipation. An inverse signaling analysis is developed to optimize the driving signal waveforms for lossy interconnects. By specifying the performance parameters, i.e., the signal swing and edge rate of the interconnect output signal, the corresponding input signals can be derived analytically. The result can be used to guide and optimize the design of interconnect preemphasis drivers. Numerical examples are shown for both lossy RC and RLC distributed lines. Analysis shows that optimized driving voltage and current can increase the interconnect bandwidth without voltage overshoot at the output. The significance of an interconnect inductance is also evaluated with this technique.     

Analysis and optimization of shielded RLC global interconnects for gigascale integration

Compact physical models are presented for on-chip double-sided shielded transmission lines, which are mainly used for long global interconnects where inductance effects should not be ignored. The models are then used to optimize the width and spacing of long global interconnects with repeater insertion. The impacts of increasing line width and spacing on various performance parameters such as delay, data-flux density, power dissipation and total repeater area are analysed. The product of data-flux density and reciprocal delay per unit length are defined as a figure of merit (FOM). By maximizing the FOM, the optimal width and spacing of shielded RLC global interconnects are obtained for various international technology roadmap for semiconductors (ITRS) technology nodes.     

High-accuracy current sensing circuit with current compensation technique for buck–boost converter

A novel on-chip current sensing circuit with current compensation technique suitable for buck–boost converter is presented in this article. The proposed technique can sense the full-range inductor current with high accuracy and high speed. It is mainly based on matched current mirror and does not require a large proportion of aspect ratio between the powerFET and the senseFET, thus it reduces the complexity of circuit design and the layout mismatch issue without decreasing the power efficiency. The circuit is fabricated with TSMC 0.25 µm 2P5M mixed-signal process. Simulation results show that the buck-boost converter can be operated at 200 kHz to 4 MHz switching frequency with an input voltage from 2.8 to 4.7 V. The output voltage is 3.6 V, and the maximum accuracy for both high and low side sensing current reaches 99% within the load current ranging from 200 to 600 mA.     

Delay analysis of buffer inserted sub-threshold interconnects

In this paper, an analysis of interconnect delay minimization by CMOS buffer insertion in sub-threshold regime is presented. Analytical expressions are developed to calculate the total delay and optimum number of buffers required for delay minimization in sub-threshold interconnects. Considering delay minimization by buffer insertion, the effects of voltage-scaling on the delay and optimum number of buffers have been analyzed. It is demonstrated that voltage scaling in sub-threshold regime reduces the number of buffers required to attain the minimum delay. This is one more advantage of voltage-scaling in addition to the usual reduction in power dissipation, in the sense that lesser silicon area is consumed. For a wide variety of typical interconnect loads, analytically obtained results are in good agreement with SPICE extracted results for most of the cases more than 90 %. Finally, the variability analysis of sub-threshold interconnects is investigated using Monte Carlo analysis.     

A 32-Gb/s On-Chip Bus With Driver Pre-Emphasis Signaling

This paper describes a differential current-mode bus architecture based on driver pre-emphasis for on-chip global interconnects that achieves high-data rates while reducing bus power dissipation and improving signal delay latency. The 16-b bus core fabricated in 0.25- $mu$m complementary metal–oxide–semiconductor (CMOS) technology attains an aggregate signaling data rate of 32 Gb/s over 5–10-mm-long lossy interconnects. With a supply of 2.5 V, 25.5–48.7-mW power dissipation was measured for signal activity above 0.1, equivalent to 0.80–1.52 pJ/b. This work demonstrates a 15.0%–67.5% power reduction over a conventional single-ended voltage-mode static bus while reducing delay latency by 28.3% and peak current by 70%. The proposed bus architecture is robust against crosstalk noise and occupies comparable routing area to a reference static bus design.      

On-chip CMOS current-sensing circuit for DC-DC buck converter

An on-chip CMOS current-sensing circuit for a DC-DC buck converter is presented. The circuit can measure the inductor current through sensing the voltage of the switch node during the converter on-state. By matching the MOSFETs, the achieved sense ratio is almost independent of temperature, model and supply voltage. The proposed circuit is suitable for low power DC-DC applications with high load current.     

Enhanced Low Complex Double Error Correction Coding with Crosstalk Avoidance for Reliable On-Chip Interconnection Link

As the technology scales down, shrinking geometry and layout dimension, on- chip interconnects are exposed to different noise sources such as crosstalk coupling, supply voltage fluctuation and temperature variation that cause random and burst errors. These errors affect the reliability of the on-chip interconnects. Hence, error correction codes integrated with noise reduction techniques are incorporated to make the on-chip interconnects robust against errors. The proposed error correction code uses triplication error correction scheme as crosstalk avoidance code (CAC) and a parity bit is added to it to enhance the error correction capability. The proposed error correction code corrects all the error patterns of one bit error, two bit errors. The proposed code also corrects 7 out of 10 possible three bit error patterns and detects burst errors of three. Hybrid Automatic Repeat Request (HARQ) system is employed when burst errors of three occurs. The performance of the proposed codec is evaluated for residual flit error rate, codec area, power, delay, average flit latency and link energy consumption. The proposed codec achieves four magnitude order of low residual flit error rate and link energy minimization of over 53 % compared to other existing error correction schemes. Besides the low residual flit error rate, and link energy minimization, the proposed codec also achieves up to 4.2 % less area and up to 6 % less codec power consumption compared to other error correction codes. The less codec area, codec power consumption, low link energy and low residual flit error rate make the proposed code appropriate for on chip interconnection link.     

A novel compact circuit for 4-PAM energy-efficient high speed interconnect data transmission and reception

Transmission of signals, whether on-chip or off-chip, places severe constraints on timing and extracts a large price in energy. New silicon device technologies, such as back-plane CMOS, provide a programmable and adaptable threshold voltage as an additional tool that can be used for low power design. We show that one particularly desirable use of this freedom is energy-efficient high-speed transmission across long interconnects using multi-valued encoding. Our multi-valued CMOS circuits take advantage of the threshold voltage control of the transistors, by using the signal-voltage-to-threshold-voltage span, in order to make area-efficient implementations of 4-PAM (pulse amplitude modulation) transceivers operating at high speed. In a comparison of a variety of published technologies, for signal transmission with interconnects of 10-15 mm length, we show up to 50% improvement in energy for on-chip signal transmission over binary encoding together with higher limits for operating speeds without a penalty in circuit noise margin.