Highly reliable mobile liquid crystal display using AlOx deposited by atomic layer deposition for side sealing structure

A side sealing structure including, outside a sealant, AlO_x deposited using an atomic layer deposition apparatus was employed for a low‐frequency driving liquid crystal display (LCD) with a bezel width of 0.7 mm. This side‐sealing structure can effectively prevent the entry of external moisture. Prevention of decrease in voltage‐holding ratio was confirmed with a test cell having this structure. A narrow‐bezel LCD with c‐axis‐aligned a‐b‐plane‐anchored crystal In‐Ga‐Zn Oxide backplane can have long‐term high reliability as a low‐frequency driving LCD.     

Impact of bending on flexible metal oxide TFTs and oscillator circuits

Thin‐film circuits on plastic capable of high‐frequency signal generation have important applications in large‐area, flexible hybrid systems, enabling efficient wireless transmission of power and information. We explore oscillator circuits using zinc‐oxide thin‐film transistors (ZnO TFTs) deposited by the conformal, layer‐by‐layer growth technique of plasma‐enhanced atomic layer deposition. TFTs on three substrates—glass, 50‐µm‐thick freestanding polyimide, and 3.5‐µm‐thick spin‐cast polyimide—are evaluated to identify the best candidate for high‐frequency flexible oscillators. We find that TFTs on ultrathin plastic can endure bending to smaller radii than TFTs on commercial 50‐µm‐thick freestanding polyimide, and their superior dimensional stability furthermore allows for smaller gate resistances and device capacitances. Oscillators on ultrathin plastic with minimized parasitics achieve oscillation frequencies as high as 17 MHz, well above the cutoff frequency f_T. Lastly, we observe a bending radius dependence of oscillation frequency for flexible TFT oscillators and examine how mitigating device parasitics benefits the oscillator frequency versus power consumption tradeoff.     

Letter: Solution‐processed flexible zinc‐tin oxide thin‐film transistors on ultra‐thin polyimide substrates

In this letter, solution‐processed flexible zinc‐tin oxide (Z_0.35T_0.65O_1.7) thin‐film transistors with electrochemically oxidized gate insulators (AlOx:Nd) fabricated on ultra‐thin (30 µm) polyimide substrates are presented. The AlOx:Nd insulators exhibited wonderful stability under bending and excellent insulating properties with low leakage current, high dielectric constant, and high breakdown field. The device exhibited a mobility of 3.9 cm²/V · s after annealing at 300 °C. In addition, the flexible device was able to maintain the electricity performance under various degrees of bending, which was attributed to the ultra‐thin polyimide substrate.     

Development of 8‐in. oxide‐TFT‐driven flexible AMOLED display using high‐performance red phosphorescent OLED

An 8‐in. flexible active‐matrix organic light‐emitting diode (AMOLED) display driven by oxide thin‐film transistors (TFTs) has been developed. In‐Ga‐Zn‐O (IGZO)‐TFTs used as driving devices were fabricated directly on a plastic film at a low temperature below 200 °C. To form a SiO_x layer for use as the gate insulator of the TFTs, direct current pulse sputtering was used for the deposition at a low temperature. The fabricated TFT shows a good transfer characteristic and enough carrier mobility to drive OLED displays with Video Graphic Array pixels. A solution‐processable photo‐sensitive polymer was also used as a passivation layer of the TFTs. Furthermore, a high‐performance phosphorescent OLED was developed as a red‐light‐emitting device. Both lower power consumption and longer lifetime were achieved in the OLED, which used an efficient energy transfer from the host material to the guest material in the emission layer. By assembling these technologies, a flexible AMOLED display was fabricated on the plastic film. We obtained a clear and uniform moving color image on the display.     

Truly wearable display comprised of a flexible battery,flexible display panel,and flexible printed circuit

In an effort to create a truly flexible and wearable display having a flexible battery as well as a flexible organic light‐emitting diode panel and a flexible printed circuit, a flexible lithium‐ion battery has been developed, and a prototype wrist‐wearable or arm‐wearable display has been fabricated. Owing to improvements in the internal structure and exterior of the lithium‐ion battery, no remarkable changes in charge and discharge curves and the internal state of the electrodes were observed even after conducting a 10,000‐cycle bending test. Therefore, this flexible lithium‐ion battery prototype demonstrated remarkable bending resistance. Thus, we succeeded in fabricating a truly flexible and wearable display comprised of a flexible organic light‐emitting diode panel, a flexible printed circuit, and a flexible battery.     

Ferroelectric liquid crystal aligned on SiO2 thin films using ion‐beam deposition

Abstract— Results for a ferroelectric‐liquid‐crystal (FLC) display cell, aligned on inorganic SiO₂ thin‐film surfaces by using oblique ion‐beam sputtering deposition on the substrates, is presented. A large deposition angle from 60° to 80° can be employed for the thin alignment layer, with thicknesses varying from 5 to 40 nm. Two types of uniform alignment, chevron (before electrical treatment) and quazi‐bookshelf (after electrical treatment), were studied. High‐quality alignment on large‐sized substrates was also easily be achieved because of the linear design of the ion‐beam sputtering source, which was previously a significant challenge for FLC on SiO_x layers.     

Flexible AMOLED displays on stainless‐steel foil

Abstract— The world's thinnest flexible full‐color 5.6‐in. active‐matrix organic‐light‐emitting‐diode (AMOLED) display with a top‐emission mode on stainless‐steel foil was demonstrated. The stress in the stainless‐steel foil during the thermal process was investigated to minimize substrate bending. The p‐channel poly‐Si TFTs on stainless‐steel foil exhibited a field‐effectmobility of 71.2 cm²/N‐sec, threshold voltage of ?2.7 V, off current of 6.7 × 10¹³ A/μm, and a subthreshold slope of 0.63 V/dec. These TFT performances made it possible to integrate a scan driver circuit on the panel. A top‐emission EL structure was used as the display element, and thin‐film encapsulation was performed to realize a thin and flexible display. The full‐color flexible AMOLED display on stainless‐steel foil is promising for mobile applications because of its thin, light, rugged, and flexible properties.     

Low‐temperature amorphous‐silicon backplane technology development for flexible displays in a manufacturing pilot‐line environment

Abstract— A low‐temperature amorphous‐silicon (a‐Si:H) thin‐film‐transistor (TFT) backplane technology for high‐information‐content flexible displays has been developed. Backplanes were integrated with frontplane technologies to produce high‐performance active‐matrix reflective electrophoretic ink, reflective cholesteric liquid crystal and emissive OLED flexible‐display technology demonstrators (TDs). Backplanes up to 4 in. on the diagonal have been fabricated on a 6‐in. wafer‐scale pilot line. The critical steps in the evolution of backplane technology, from qualification of baseline low‐temperature (180°C) a‐Si:H process on the 6‐in. line with rigid substrates, to transferring the process to flexible plastic and flexible stainless‐steel substrates, to form factor scale‐up of the TFT arrays, and finally manufacturing scale‐up to a Gen 2 (370 × 470 mm) display‐scale pilot line, will be reviewed.     

Flexible thin‐film transistors application of amorphous tin oxide‐based semiconductors

The structural, optical, and electrical properties of Si‐doped SnO₂ (STO) films were investigated in terms of their potential applications for flexible electronic devices. All STO films were amorphous with an optical transmittance of ~90%. The optical band gap was widened as the Si content increased. The Hall mobility and carrier density were improved in the SnO₂ with 1 wt% Si film, which was attributed to the formation of donor states. Si (1 wt%) doped SnO₂ thin‐film transistor exhibited a good device performance and good stability with a saturation mobility of 6.38 cm²/Vs, a large I_on/I_off of 1.44 × 10⁷, and a SS value of 0.77 V/decade. The device mobility of a‐STO TFTs at different bending radius maintained still at a high level. These results suggest that a‐STO thin films are promising for fabricating flexible TFTs.     

Flexible active‐matrix OLED displays: Challenges and progress

Abstract— Organic light‐emitting‐device (OLED) devices are very promising candidates for flexible‐display applications because of their organic thin‐film configuration and excellent optical and video performance. Recent progress of flexible‐OLED technologies for high‐performance full‐color active‐matrix OLED (AMOLED) displays will be presented and future challenges will be discussed. Specific focus is placed on technology components, including high‐efficiency phosphorescent OLED technology, substrates and backplanes for flexible displays, transparent compound cathode technology, conformal packaging, and the flexibility testing of these devices. Finally, the latest prototype in collaboration with LG. Phillips LCD, a flexible 4‐in. QVGA full‐color AMOLED built on amorphous‐silicon backplane, will be described.     

World's first large size 77‐inch transparent flexible OLED display

Large flexible organic light‐emitting diode (OLED) display provides various electronic applications such as curved, bendable, rollable, and commercial display, because of its thinness, light weight, and design freedom. In this work, the process flow and key technologies to fabricate the world's first large size 77‐inch transparent flexible OLED display are introduced. “White OLED on TFT + color filter” method is used to fabricate the aforementioned display. On both thin‐film transistor and color filter substrates, transparent polyimide (PI) was used as plastic substrate with multi‐barrier. In case of a transparent flexible display, the multi‐barrier is required for the additional consideration to overcome the decrease of transmittance due to the difference in refractive index of the conventional multi‐barrier. We developed the special multi‐barrier to increase transparency with superior water vapor transition rate characteristic. The optimized amorphous indium gallium zinc oxide thin‐film transistors were employed on the multi‐barrier, and it shows the highly uniform electrical performance and reliability on plastic substrate. Also, the typical panel failure mechanism during laser lift‐off process caused by a particle in PI is studied, and a sacrificial layer was suggested between PI and a carrier glass to reduce the panel failure. Finally, we successfully realized the world's first 77‐inch transparent flexible OLED display with ultra‐high‐definition resolution, which can be rolled up to a radius of 80 mm with a transmittance of 40%.     

Characteristics of a‐IZO TFTs with high‐κ HfSiOx gate insulator annealed in various conditions

In this work, we investigate the enhanced performance of amorphous indium zinc oxides‐based thin film transistors with hafnium silicate (HfSiO_x) gate insulators. HfSiO_x gate insulators annealed at various conditions are deposited by cosputtering of hafnium oxide and Si. The structural properties of HfSiO_x are investigated using the atomic force microscopy, X‐ray diffraction, and x‐ray photoelectron spectroscopy (XPS). techniques. Furthermore, the electrical characteristics of HfSiO_x are analyzed to investigate the effect of annealing conditions. We obtain optimal results for thin film transistors with HfSiO_x gate insulators annealed for 1 h at 100 °C, with a saturation mobility of 1.2 cm²/V · s, threshold voltage of 2.2 V, on current/off current ratio of 2.0 × 10⁶, and an insulator surface roughness of 0.187 nm root mean square.     

5.8‐inch QHD flexible AMOLED display with enhanced bendability of LTPS TFTs

By applying the curve‐type thin film transistor (TFT) with longitudinal strain, TFT parameters do change little down to the 2R bending. The mobility variation range reduces down to 4% compared with 28% of the line‐type channel with transverse strain. The smaller variation is preferred for a high quality display. We clarified that majority carrier's effective mass and scattering rate are dominant factors influencing the bended TFT's performance, which can be controlled by the strain orientation and channel shape. This understanding and improvement was embedded in the 5.8″ flexible QHD active matrix organic light emitting diode panel with multi edge curvature of Galaxy S8. Through this achievement, we made our flexible premium active matrix organic light emitting diode panels more performable, reliable, and highly productive in small R bending circumstance.     

Fabrication of flexible organic light‐emitting‐diode display with a flexible color filter driven by In—Ga—Zn—Oxide TFTs

Abstract— A novel flexible active‐matrix organic light‐emitting‐diode (OLED) display fabricated on planarized stainless—used‐steel substrates with a resolution of 85 dpi in a 4.7‐in. active area has been demonstrated. Amorphous indium—gallium—zinc—oxide thin‐film transistors were used as the backplane for the OLED display with high device performance, high electrical stability, and long lifetime. A full‐color moving image at a frame frequency of 60 Hz was also realized by using a flexible color filter directly patterned on a plastic substrate with a white OLED as the light source.     

Temporary bond—debond technology for high‐performance transistors on flexible substrates

Abstract— A processing technology based upon a temporary bond—debond approach has been developed that enables direct fabrication of high‐performance electronic devices on flexible substrates. This technique facilitates processing of flexible plastic and metal‐foil substrates through automated standard semiconductor and flat‐panel tool sets without tool modification. The key to processing with these tool sets is rigidifying the flexible substrates through temporary bonding to carriers that can be handled in a similar manner as silicon wafers or glass substrates in conventional electronics manufacturing. To demonstrate the power of this processing technology, amorphous‐silicon thin‐film‐transistor (a‐Si:H TFT) backplanes designed for electrophoretic displays (EPDs) were fabricated using a low‐temperature process (180°C) on bonded‐plastic and metal‐foil substrates. The electrical characteristics of the TFTs fabricated on flexible substrates are found to be consistent with those processed with identical conditions on rigid silicon wafers. These TFTs on plastic exhibit a field‐effect mobility of 0.77 cm²/V‐sec, on/off current ratio >10⁹ at Vds = 10 V, sub‐threshold swing of 365 mV/dec, threshold voltage of 0.49 V, and leakage current lower than 2 pA/μm gate width. After full TFT‐array fabrication on the bonded substrate and subsequent debonding, the flexible substrate retains its original flexibility; this enables bending of the EPD display without loss in performance.     

Fabrication of 5.8‐in. OTFT‐driven flexible color AMOLED display using dual protection scheme for organic semiconductor patterning

Abstract— A 5.8‐in. wide‐QQVGA flexible color active‐matrix organic light‐emitting‐diode (AMOLED) display consisting of organic thin‐film transistors (OTFTs) and phosphorescent OLEDs was fabricated on a plastic film. To reduce the operating voltage of the OTFTs, Ta₂O₅ with a high dielectric constant was employed as a gate insulator. Pentacene was used for the semiconductor layer of the OTFTs. This layer was patterned by photolithography and dry‐etched using a dual protection layer of poly p‐xylylene and SiO₂ film. Uniform transistor performance was achieved in the OTFT backplane with QQVGA pixels. The RGB emission layers of the pixels were formed by vacuum deposition of phosphorescent small molecules. The resulting display could clearly show color moving images even when it was bent and operated at a low driving voltage (below 15 V).     

Current and future technology of low‐temperature poly‐Si TFT‐LCDs

Abstract— The state of the art of large‐area low‐temperature TFT‐LCDs will be reported in this paper. High‐performance poly‐Si TFTs are expected to realize various applications such as system display where various signal‐processing functions are added to the display. In the past few years, low‐temperature poly‐Si thin‐film‐transistor (LTPS TFT) technology has made great progress, especially in the areas of excimer laser annealing (ELA) of high‐quality poly‐Si film, ion doping for large‐area doping, and high‐quality gate SiO₂ film formation by using the low‐temperature PE‐CVD method. Also, technology trends and possible applications, such as a system displays, will be discussed.     

A video‐speed reflective display based on electrowetting: principle and properties

Abstract— Electrowetting is presented as a novel principle for a reflective display. By contracting a colored oil film electrically, an optical switch is obtained with many attractive properties that make it very suitable for use as a reflective display, for instance, as electronic paper. Firstly, it has the high reflectivity (>40%) and contrast ratio (15) required for a paper‐like optical appearance. In addition, the principle shows a video‐rate response time (<10 msec) and has a clear route toward a high‐brightness color display. Finally, the electro‐optical response is independent of cell‐gap thickness, which will be very beneficial when moving toward a flexible display.     

High‐temperature thin‐film barriers for foldable AMOLED displays

We present a thin‐film dual‐layer bottom barrier on polyimide that is compatible with 350°C backplane processing for organic light‐emitting diode displays and that can facilitate foldable active‐matrix organic light‐emitting diode devices with a bending radius of <2 mm. We demonstrate organic light‐emitting diodes that survive bending over 0.5 mm radius for 10.000× based on the high‐temperature bottom barrier. Furthermore, we show compatibility of the bottom barrier with the backplane process by fabricating active‐matrix organic light‐emitting diode displays on GEN1‐sized substrates.     

A 5.8‐in. phosphorescent color AMOLED display fabricated by ink‐jet printing on plastic substrate

Abstract— A flexible phosphorescent color active‐matrix organic light‐emitting‐diode (AMOLED) display on a plastic substrate has been fabricated. Phosphorescent polymer materials are used for the emitting layer, which is patterned using ink‐jet printing. A mixed solvent system with a high‐viscosity solvent is used for ink formulation to obtain jetting reliability. The effects of evaporation and the baking condition on the film profile and OLED performances were investigated. An organic thin‐film‐transistor (OTFT) backplane, fabricated using pentacene, is used to drive the OLEDs. The OTFT exhibited a current on/off ratio of 10⁶ and a mobility of 0.1 cm²/V‐sec. Color moving images were successfully shown on the fabricated display.