Properties and origins of high‐performance poly(phenylene oxide)/cyanate ester resins for high‐frequency copper‐clad laminates

A high‐performance matrix is the key base for the fabrication of high‐frequency copper‐clad laminates. A high‐performance resin system based on commercial poly(phenylene oxide) (PPO) and 2,2′‐bis(4‐cyanatophenyl) isopropylidene (BADCy), coded as PPO‐n/BADCy (where n is the weight parts of PPO per 100 weight parts of BADCy), was developed. The effect of PPO on the key properties, including the dielectric and thermal properties, water resistance, and toughness, of the cured resins was investigated extensively. The results show that PPO not only catalyzed the curing reaction of BADCy but also reacted with BADCy to form a single‐phase structure. Furthermore, compared with the cured BADCy resin with 1 phr epoxy resin as a catalyst, the cured PPO‐n/BADCy resins had significantly increased impact strengths and decreased dielectric constants, loss, and water resistance. The reasons behind these desirable improvements are discussed from the view of structure–property relationships. These results suggest that the PPO‐n/BADCy system has great potential to be used as a matrix for high‐frequency copper‐clad laminates or other advanced composites. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Wavelength‐shift fluorescent probes for monitoring of polymerization

The feasibility of using wavelength‐shift fluorescent probes for cure monitoring of an epoxy resin and an acrylic resin was evaluated. 4‐(N,N‐dihexylaminostyryl)‐4′‐pyridinium propylsulfonate (DHASP‐PS), as well as each of other wavelength‐shift fluorescent probes, was dissolved in the epoxy resin, a stoichiometric mixture of diglycidyl ether of bisphenol A and 4,4′‐methylene‐bis(cyclohexylamine). The fluorescence and the excitation spectra of each of the probes dissolved in the epoxy resin were then measured at various times during the cure of the epoxy resin at 60°C. The fluorescence and the excitation spectra of the probe DHASP‐PS dissolved in methyl methacrylate (MMA) were also measured at various times during the cure of the acrylic resin at 55°C. Since the peak fluorescence wavelength of each of the wavelength‐shift fluorescent probes decreased during the cure of the epoxy resin or MMA, these fluorescent probes can be used for monitoring the polymerization reactions of epoxy resins and vinyl resins. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 747–750, 2006     

Microwave‐assisted polycondensation of 4,4′‐(hexafluoroisopropylidene)‐N,N′‐bis(phthaloyl‐L‐leucine) diacid chloride with aromatic diols

A new facile and rapid polycondensation reaction of 4,4′‐(hexafluoroisopropylidene)‐N,N′‐bis(phthaloyl‐L ‐leucine) diacid chloride (1) with several aromatic diols such as phenol phthalein (2a), bis phenol‐A (2b), 4,4′‐hydroquinone (2c), 1,4‐dihydroxyanthraquinone (2d), 1,8‐dihydroxyanthraquinone (2e), 1,5‐dihydroxy naphthalene (2f), dihydroxy biphenyl (2g), and 2,4‐dihydroxyacetophenone (2h) was performed by using a domestic microwave oven in the presence of a small amount of a polar organic medium such as o‐cresol. The polymerization reactions proceeded rapidly, compared with the conventional solution polycondensation, and was completed within 10 min, producing a series of optically active poly(ester‐imide)s with quantitative yield and high inherent viscosity of 0.50–1.12 dL/g. All of the above polymers were fully characterized by IR, elemental analyses, and specific rotation. Some structural characterization and physical properties of this optically active poly(ester‐imide)s are reported. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 3003–3009, 2000     

Preparation and properties of glass cloth‐reinforced polyimide composites with improved impact toughness for microelectronics packaging substrates

A series of glass cloth‐reinforced thermosetting polyimide composites (EG/HTPI) were prepared from E‐glass cloth (EG) and polyimide matrix resins. The polyimide resins were derived from 1,4‐bis(4‐amino‐2‐ trifluoromethyl‐phenoxy)benzene, p‐phenylenediamine, diethyl ester of 3,3′,4,4′‐benzophenonetetracarboxylic acid, and monoethyl ester of cis‐5‐norbornene‐endo‐2,3‐dicarboxylic acid. Based on the rheological properties of the B‐staged polyimide resins, the optimized molding cycles were designed to fabricate the EG/HTPI laminates and the copper‐clad laminates (Cu/EG/HTPI). Experimental results indicated that the EG/HTPI composites exhibited high thermal stability and outstanding mechanical properties. They had flexural strength of >534 MPa, flexural modulus of >20.0 GPa, and impact toughness of >46.9 kJ/m². The EG/HTPI composites also showed good electrical and dielectric properties. Moreover, the EG/HTPI laminates exhibited peel strength of ～ 1.2 N/mm and great isothermal stability at 288°C for 60 min, showing good potential for application in high density packaging substrates. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Synthesis and characterization of the two novel liquid crystalline epoxy resins based on bisphenol‐s mesogen

Two novel liquid crystalline epoxy resins (LCER) based on bisphenol‐S mesogen, 4,4′‐Bis‐(2,3‐epoxypropyloxy)‐sulfonyl bis(1,4‐phenylene) (p‐BEPSBP) and sulfonyl bis(4,1‐phenylene) bis[4‐(2,3‐epoxypropyloxy)benzoate] (p‐SBPEPB), were synthesized. Their liquid crystalline behavior and structure were characterized by Fourier transmittance infrared ray (FTIR), differential scanning calorimetry (DSC), ¹HNMR, polarized optical microscopy (POM) and X‐ray diffraction (XRD). The results show that p‐BEPSBP is a kind of thermotropic liquid crystal and has a smectic mesophase with a melting point (T_m) at 165°C; the p‐SBPEPB is a kind of nematic mesophase with the temperature range of 155–302°C from the T_m to the clearing point T_i. The curing behaviors and texture of the liquid crystalline epoxy resins with 4,4′‐diaminodiphenyl ether (DDE) were also studied by DSC and some kinetic parameters were evaluated according to the Ozawa's method. The dynamic mechanical properties of curing products were also investigated by torsional braid analysis (TBA), and the results suggest that the dynamic mechanical loss peak temperature (T_p) of p‐BEPSBP/DDE and p‐SBPEPB/DDE is 120 and 130°C, respectively. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Phosphorus‐containing epoxy resins: Thermal characterization

Three novel aromatic phosphorylated diamines, i.e., bis N,N′‐{3‐[(3‐aminophenyl)methyl phosphinoyl] phenyl} pyromellitamic acid (AP), 4,4′‐oxo bis N,N′‐{3‐[(3‐aminophenyl)methyl phosphinoyl] phenyl}phthalamic acid (AB) and 4,4′‐hexafluoroisopropylidene‐bis N,N′‐{3‐[(3‐aminophenyl)methyl phosphinoyl] phenyl}phthalamic acid (AF) were synthesized and characterized. These amines were prepared by solution condensation reaction of bis(3‐aminophenyl)methyl phosphine oxide (BAP) with 1,2,4,5‐benzenetetracarboxylic acid anhydride (P)/3,3′,4,4′‐benzophenonetetracarboxylic acid dianhydride (B)/4,4′‐(hexafluoroisopropylidene)diphthalic acid anhydride (F), respectively. The structural characterization of amines was done by elemental analysis, DSC, TGA, ¹H‐NMR, ¹³C‐NMR and FTIR. Amine equivalent weight was determined by the acetylation method. Curing of DGEBA in the presence of phosphorylated amines was studied by DSC and curing exotherm was in the temperature range of 195–267°C, whereas with conventional amine 4,4′‐diamino diphenyl sulphone (D) a broad exotherm in temperature range of 180–310°C was observed. Curing of DGEBA with a mixture of phosphorylated amines and D, resulted in a decrease in characteristic curing temperatures. The effect of phosphorus content on the char residue and thermal stability of epoxy resin cured isothermally in the presence of these amines was evaluated in nitrogen atmosphere. Char residue increased significantly with an increase in the phosphorus content of epoxy network. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 2235–2242, 2002     

Synthesis,characterization, and thermal properties of tris (3‐aminophenyl) phosphine oxide‐based nadimide resins

This article describes the synthesis, characterization, and thermal properties of nadimides obtained by reacting endo‐5‐norbornene‐2,3‐dicarboxylic acid anhydride (nadic anhydride) (NA), 4,4′‐oxodiphthalic anhydride (ODA), 1,4,5,8‐naphthalene tetra carboxylic dianhydride (NTDA) in glacial acetic acid/DMF. Structural characterization of the resins was done by elemental analysis, IR, ¹H‐NMR, and ¹³C‐NMR. The DSC scan showed the endothermic transition in the temperature range of 120–270°C. Multistep decomposition was observed in the TG scan of uncured resins in nitrogen atmosphere. Isothermal curing of the resins was done at 250 and 300°C for 1 h in an air atmosphere. These cured resins were stable to (350 ± 30)°C and decomposed in a single step above this temperature. This may be due to the retro Diels Alder (RDA) reaction. The char yield of the resins increased significantly on curing. The char yield was highest for P‐2N resin and this could be due to the presence of rigid skeleton i.e. naphthalene. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

A novel latent initiator for cationic polymerizations of epoxides: Composite catalysts containing aluminum complexes phase‐separated in epoxides

A novel latent initiator for cationic polymerizations of epoxides heterogeneous aluminum complex/phenol initiator (HAP) is reported. Phase transitions are newly employed for realizing the latent property. The initiator consists of 4,4′‐dihydroxydiphenylsulfone and aluminum tris(alkyl acetoacetate), with the alkyl group containing more than 18 carbons. The composite initiator is phase‐separated and dispersed uniformly in epoxy resins at room temperature. When the mixture is heated to a temperature greater than 70°C, the composite initiator makes clear mixtures with epoxy resins because of the phase change in the aluminum complexes. Homogeneous epoxy resins containing these composite initiators are ready for various types of processing, including impregnation and injection. Gelation occurs rapidly at temperatures greater than 100°C. The phase change in the initiator makes it possible for the epoxy compounds to have a long storage stability at room temperature and a high curing speed at greater than 100°C. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 1046–1053, 2002     

Synthesis and properties of epoxies containing rigid rods in the side chains

A novel epoxy containing rigid rods in the side chain (SR‐epoxy) was synthesized by bulk polymerization. The SR‐epoxy resins were characterized by Fourier transform infrared. The cured SR‐epoxies showed excellent mechanical properties and high thermal stabilities. Scanning electron microscopy (SEM) of the cured SR‐epoxy illustrated a fiber‐like morphology. The thermal properties, dynamic mechanical properties, compatibility, and morphology of the SR‐epoxies were extensively investigated in the study. SEM photographs showed that there were some fiber‐like structures in the system of the SR‐epoxy containing the rigid‐rod group 4,4′‐bis(6‐hydroxyhexoxy) biphenyl, which formed a self‐reinforcing composite. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 4030–4036, 2006     

Structural and material properties of a rapidly cured thermoplastic‐toughened epoxy system

Thermoplastic‐toughened epoxy resins are widely used as matrices in modern composite prepreg systems. Rapid curing of thermoplastic‐toughened epoxy matrix composites results in different mechanical properties. To investigate the structure–property relationship, we investigated a poly(ether sulfone)‐modified triglycidylaminophenol/4,4′‐diamino diphenyl sulfone system that was cured at different heating rates. An intermediate dwell was also applied during the rapid heating of the thermoplastic‐modified epoxy system. We found that a higher heating rate led to a larger domain size of the phase‐separated macrostructure and also facilitated more complete phase separation. The intermediate dwell helped phase separation to proceed even further, leading to an even larger domain size of the macrostructure. A carbon‐fiber‐reinforced polymer matrix composite prepreg based on the poly(ether sulfone)‐modified multifunctional epoxy system was cured with the same schedule. The rapidly heated composite laminates exhibited higher mode I delamination fracture toughness than the slowly heated material. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Curing of epoxy resin using imide‐amines

The curing behavior of diglycidyl ether of bisphenol‐A (DGEBA) was investigated by differential scanning calorimetry, using varying molar ratios of imide‐amines and 4,4′‐diaminodiphenyl sulfone (DDS). The imide‐amines were prepared by reacting 1 mol of pyromellitic dianhydride (P) with excess (2.5 mol) of 4,4′‐diaminodiphenyl ether (E), 4,4′‐diaminodiphenyl methane (M), or 4,4′‐diaminodiphenyl sulfone (S) and designated as PE, PM, PS. Structural characterization was done using FTIR, ¹H NMR, ¹³C NMR spectroscopic techniques and elemental analysis. The mixture of imide‐amines and DDS at ratio of 0 : 1, 0.25 : 0.75, 0.5 : 0.5, 0.75 : 0.25, and 1 : 0 were used to investigate the curing behavior of DGEBA. The multiple heating rate method (5, 10, 15, and 20°C/min) was used to study the curing kinetics of epoxy resins. The peak exotherm temperature was found to be dependent on the heating rate, structure of imide‐amine, and also on the ratio of imide‐amine : DDS used. Activation energy was highest in case of epoxy cured using a mixture of DDS : imide‐amine of a ratio of 0.75 : 0.25. Thermal stability of the isothermally cured resins was also evaluated in a nitrogen atmosphere using dynamic thermogravimetry. The char yield was highest in case of resins cured using mixture of DDS : PS (0.25 : 0.75; EPS‐3), DDS : PM (0.25 : 0.75; EPM‐3), and DDS : PE (0.75 : 0.25; EPE‐1). © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 3502–3510, 2006     

Phosphorus‐containing epoxy resin for an electronic application

A phosphorus‐containing epoxy resin, 6‐H‐dibenz[c,e][1,2] oxaphosphorin‐6‐[2,5‐bis(oxiranylmethoxy)phenyl]‐6‐oxide (DOPO epoxy resin), was synthesized and cured with phenolic novolac (Ph Nov), 4,4′‐diaminodiphenylsulfone (DDS), or dicyandiamide (DICY). The reactivity of these three curing agents toward DOPO epoxy resin was found in the order of DICY > DDS > Ph Nov. Thermal stability and the weight loss behavior of the cured polymers were studied by TGA. The phosphorus‐containing epoxy resin showed lower weight loss temperature and higher char yield than that of bisphenol‐A based epoxy resin. The high char yields and limiting oxygen index (LOI) values as well as excellent UL‐94 vertical burn test results of DOPO epoxy resin indicated the flame‐retardant effectiveness of phosphorus‐containing epoxy resins. The DOPO epoxy resin was investigated as a reactive flame‐retardant additive in an electronic encapsulation application. Owing to the rigid structure of DOPO and the pendant P group, the resulting phosphorus‐containing encapsulant exhibited better flame retardancy, higher glass transition temperature, and thermal stability than the regular encapsulant containing a brominated epoxy resin. High LOI value and UL‐94 V‐0 rating could be achieved with a phosphorus content of as low as 1.03% (comparable to bromine content of 7.24%) in the cured epoxy, and no fume and toxic gas emission were observed. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 353–361, 1999     

Kinetics and thermal characterization of epoxy‐amine systems

The curing behavior of epoxy resins was analyzed based on a simple kinetic model. We simulated the curing kinetics and found that it fits the experimental data well for both diglycidylether of bisphenol A–4,4′‐methylene dianiline and diglycidylether of bisphenol A–carboxyl‐terminated butadiene acrylonitrile–4,4′‐methylene dianiline systems. The kinetic results showed the curing of epoxy resins involves different reactive process and reaction stages, and the value of activation energy is dependent on the degree of conversion. By analyzing the effect of vitrification, at low curing temperature, we found the curing reaction at the later stage was practically diffusion‐controlled for unmodified resin, and the rubber component did not markedly decrease T_g at the early stage of reaction as would be expected. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 71: 2401–2408, 1999     

Effect of backbone moiety in epoxies on thermal conductivity of epoxy/alumina composite

We chose two commercial epoxies, bisphenol A diglycidyl ether (DGEBA) and 3,3′,5,5′‐tetramethyl‐4,4′‐biphenol diglycidyl ether (TMBP), and synthesized one liquid crystalline epoxy (LCE), 4′4′‐bis(4‐hydroxybenzylidene)‐diaminophenylene diglycidyl ether (LCE‐DP) to investigate the effect of backbone moiety in epoxies on the thermal conductivity of epoxy/alumina composite. The DGEBA structure shows an amorphous state and the TMBP structure displays a crystal phase, whereas the LCE‐DP structure exhibits a liquid crystalline phase. The curing behaviors of them were examined employing 4,4′‐diaminodiphenylsulfone (DDS) as a curing agent. The heat of curing of epoxy resin was measured with dynamic differential scanning calorimetry (DSC). Alumina (Al₂O₃) of commercial source was applied as an inorganic filler. Thermal conductivity was measured by laser flash method and compared with value predicted by two theoretical models, Lewis‐Nielsen and Agari‐Uno. The results indicated that the thermal conductivity of the LCE‐DP structure was larger than that of the commercial epoxy resins such as TMBP and DGEBA and the experimental data fitted quite well in the values estimated by Agari‐Uno model. POLYM. COMPOS., 2013. © 2013 Society of Plastics Engineers     

Glass fiber-reinforced epoxy composites

Glass fiber-reinforced epoxy composites were prepared from the matrix resins tetraglycidyl diaminodiphenylmethane

1 Systematic name: N,N,N′,N′-Tetrakis(2,3-epoxypropyl)-4,4′-diaminodiphenylmethane.

(TGDDM) and tetraglycidyl bis(o-toluidino)-methane

2 Systematic name: N,N,N′,N′-Tetrakis(2,3-epoxypropyl)-4,4′-bis(o-toluidino)methane.

(TGMBT) using various amines like 4,4′-diaminodiphenylmethane (DDM), 4,4′-diaminodiphenylsulfone (DDS) and diethylene triamine (DETA) as curing agents. The fabricated laminates were evaluated for their mechanical and dielectrical properties and chemical resistance. The composites prepared using an epoxy fortifier (20 phr) showed significant improvement in the mechanical properties.     

Synthesis and thermal,mechanical and gas permeation properties of aromatic polyimides containing different linkage groups

Two series of aromatic polyimides containing various linkage groups based on 2,7‐bis(4‐aminophenoxy)naphthalene or 3,3′‐dimethyl‐4,4′‐diaminodiphenylmethane and different aromatic dianhydrides, namely 4,4′‐(4,4′‐isopropylidenediphenoxy)bis(phthalic anhydride), 4,4′‐(hexafluoroisopropylidene)bis(phthalic anhydride), 3,3′,4,4′ benzophenonetetracarboxylic dianhydride, 9,9‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]fluorene dianhydride and 4,4′‐(4,4′‐hexafluoroisopropylidenediphenoxy)bis(phthalic anhydride), were synthesized and compared with regard to their thermal, mechanical and gas permeation properties. All these polymers showed high thermal stability with initial decomposition temperature in the range 475–525 °C and glass transition temperature between 208 and 286 °C. Also, the polymer films presented good mechanical characteristics with tensile strength in the range 60–91 MPa and storage modulus in the range 1700–2375 MPa. The macromolecular chain packing induced by dianhydride and diamine segments was investigated by examining gas permeation through the polymer films. The relationships between chain mobility and interchain distance and the obtained values for gas permeability are discussed. © 2014 Society of Chemical Industry     

Fracture and adhesion behaviors of epoxy resins modified with poly(amine‐quinone)

An amine‐quinone monomer, i.e. 2,5‐bis(4,4′‐methylenedianiline)‐1,4‐benzoquinone (BB), was synthesized by the Michael addition of 4,4′‐diaminodiphenyl methane with 1,4‐benzoquinone. To evaluate the effect of BB content on the glass transition temperature (T_g) and crosslinking density (ρ) of cured diglycidyl ether of bisphenol A (DGEBA)/BB systems, storage modulus and loss factor measurements were obtained using dynamic mechanical analysis. The mechanical properties of the systems were determined in terms of the fracture toughness, impact strength, and adhesion strength. As a result, the ρ values of the systems were found to decrease systematically as the BB content increased. The fracture toughness and adhesion strength of the systems increased with increasing BB content. These results indicate that the addition of BB into epoxy resins increases the free volume of the epoxy network and absorbs the deformation energy, resulting in an improvement of the mechanical properties of the DGEBA/BB systems. Copyright © 2006 Society of Chemical Industry     

Synthesis and properties of novel phosphorus‐containing bismaleimide/epoxy resins

A novel soluble phosphorus‐containing bismaleimide (BMI) monomer, bis(3‐maleimidophenyl)phenylphosphine oxide (BMIPO), was synthesized by the imidization of bis(3‐aminophenyl) phenylphosphine oxide, in which its structural characterization was identified with ¹H‐NMR, ¹³C‐NMR, and Fourier transform infrared spectra. The BMIPO resin, with five‐membered imide rings and high phenyl density, was an excellent flame retardant with a high glass‐transition temperature (T_g), onset decomposition temperature, and limited oxygen index. In phosphorus‐containing BMI/epoxy/4,4′‐methylene dianiline (DDM)‐cured resins, homogeneous products were obtained from all proportions without phase separation. Because of the higher reactivity of BMIPO/DDM relative to that of 4,4′‐bismaleimidodiphenylmethane (BMIM)/DDM, the increase in the BMIPO/BMIM ratio in this blending resin increased the recrosslinking hazards of the postcuring stage and so lowered the T_g value and thermal stability. The thermal stability of the BMI/epoxy‐cured system was lower than that of the epoxy‐cured system because of the introduction of a phosphide group into BMIPO, whereas for the T_g value and flame retardancy, the former was significantly higher than the latter: the higher the BMIPO content in the blend, the higher the flame retardancy. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 2080–2089, 2002; DOI 10.1002/app.10607     

Phosphorous‐containing epoxy resins from a novel synthesis route

The ? P(O)‐H in 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) was used as an active group to react with the carbonyl group in 4,4′‐dihydroxybenzophenone (DHBP) to result a novel phosphorous‐containing biphenol compound (DOPO‐2OH). Phosphorous‐containing epoxy resins were therefore obtained from reacting DOPO‐2OH with epichlorohydrin or with diglycidylether bisphenol A. The synthesized compounds were characterized with FTIR, ¹H and ³¹P NMR, elemental analysis, and epoxide equivalent weight titration to demonstrate the their chemical structures. Cured epoxy resins were prepared via thermal curing the epoxy resins with various curing agents. Thermal analysis results (differential scanning calorimetry and thermogravimetric analysis) revealed that these cured epoxy resins exhibited high glass transition temperatures and high thermal stability. High char yields at 700°C and high LOI (limited oxygen index) values were also found for the cured epoxy resins to imply that the resins were possessing high flame retardancy. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 1697–1701, 2002