Cr与B对镍基高温钎料在Cf/SiC陶瓷基复合材料上润湿性的影响

研究了Cr和B元素对镍基高温钎料在3D-Cf/SiC陶瓷基复合材料上的润湿性的影响.试验结果发现,在真空度小于10-3 Pa,工作温度1100 ℃,保温时间10 min条件下,当钎料中的Cr元素含量为15%,B元素含量为0.6%时,镍基钎料在Cf/SiC上的润湿角为10°,然而B元素含量增加到2.4%后,润湿角增大到62°,表明钎料中的元素B降低钎料在Cf/SiC上的润湿性.钎料中的活性元素Cr对润湿有重要影响.镍基钎料在Cf/SiC上的润湿过程属于反应润湿,润湿界面生成多种碳化物和硅化物.采用扫描电镜与能谱仪分析界面的微观结构与成分,通过X射线衍射仪检测界面产物.     

Al2O3陶瓷活性连接用AgCuInTi合金钎料性能

通过在Ag-26Cu-5Ti钎料中添加21. 5%In,设计开发了一种新型Ag Cu In Ti合金钎料,用于实现Al2O3陶瓷与无氧铜的活性连接,同时改善流动性,提高活性。对钎料的固液相温度与润湿铺展性能进行分析,并测试了Al_2O_3/Ag Cu In Ti/Cu试验件抗拉强度和气密性。通过金相显微镜、扫描电子显微镜观察试验件微观界面组织,进一步探究Ag Cu In Ti合金钎料的活性连接反应机理。结果表明,Ag Cu In Ti合金钎料在750℃实现了对陶瓷和金属的真空活性连,降低了钎焊温度,满足分级钎焊和补焊的需求,且形成结合紧密的反应界面,证明其对陶瓷具有良好的润湿性;钎焊过程中合金钎料中的Ti元素向Al_2O_3陶瓷界面富集,形成多个界面产物,而合金钎料中Ag元素、Cu元素、In元素与无氧铜发生溶解扩散,生成新的化合物相,最终实现陶瓷与金属的冶金结合。     

银基钎料活性钎焊C/SiC-Ti55与Al2O3-Ti55接头界面组织

以Ag-28Cu和Ag-9Pd-9Ga两种银基钎料钎焊C/SiC复合材料和Al2O3陶瓷与Ti55钛合金接头,考察了钎料和钎焊工艺对接头焊缝组织形貌变化影响. 结果表明,采用Ag-28Cu钎料在850～920 ℃温度区间钎焊C/SiC-Ti55和Al2O3-Ti55接头均在陶瓷基体近钎焊界面区域开裂,原因为Ti55合金中Ti元素大量溶解扩散并与铜反应生成的大量脆性Cu-Ti化合物恶化焊缝塑性. Ag-9Pd-9Ga钎料则可以获得完整接头,钎焊过程中Pd,Ga元素在Ti55侧钎焊界面富集并与Ti元素反应生成PdTi, Ti2Ga, Ti4Pd化合物的反应层,有效抑制了元素往焊缝中的溶解扩散.     

两种Pd-Ni基高温钎料在Si3N4陶瓷上的润湿性

采用座滴法研究了两种钎料PdNi-(15～22)v和PdNi-(16～24)Cr在Si3N4陶瓷上的润湿性.结果表明,两种钎料的熔点及润湿性均有很大差别,PdNi-(16～24)Cr钎料对Si3N4陶瓷的润湿铺展良好.PdNi-(16～24)Cr钎料与Si3N4陶瓷形成的扩散反应层中,Cr元素主要分布在扩散反应层区域,根据各元素所占比例,Cr元素主要与母材扩散出的N元素形成Cr2N相.由于Cr原子向母材界面扩散,从而改善了钎料的润湿性.     

填充泡沫Ti/AlSiMg的SiC陶瓷钎焊接头的组织与性能

为丰富SiC陶瓷钎焊所用钎料的设计思路,提出了一种泡沫Ti/AlSiMg新型复合钎料,通过Ti元素的溶入提高钎料与SiC陶瓷之间的界面结合力,利用泡沫Ti与Al基钎料之间的界面反应获得原位增强的钎缝,从而提升接头力学性能. 采用钎焊温度700 ℃、保温时间60 min和焊接压力10 MPa进行SiC陶瓷真空钎焊,利用光学显微镜、扫描电镜、能谱分析、X射线衍射、电子探针和万能试验机对接头组织、成分和性能进行分析,探索泡沫Ti/AlSiMg复合钎料在SiC陶瓷钎焊中的可用性. 结果表明,填充泡沫Ti/AlSiMg复合钎料所得接头结构为SiC/Al/Ti(Al,Si)₃/Ti(Al,Si)₃原位增强Ti基钎缝/ Ti(Al,Si)₃/Al/SiC,断裂发生在铝合金界面层和SiC陶瓷之间,Ti元素的溶入提高了铝合金界面层与SiC陶瓷之间的界面结合力,接头抗剪强度达111 MPa.     

Cu含量对Ag-Cu钎料钎焊透氧膜

采用Ag-Cu钎料用于透氧膜与不锈钢支撑体之间的封接,研究了Cu含量对Ag-Cu钎料钎焊透氧膜界面结构的影响。利用SEM对连接界面的显微组织进行观察,并用EDS对界面的相组成进行分析。结果表明:纯Ag与透氧膜陶瓷之间的连接界面无元素互扩散;Ag中少量1at%Cu的添加并未明显改善钎焊连接界面;当Cu含量增加到3.3at%时,在透氧膜一侧生成一层由Cu和Ag扩散所致的厚度约200μm的反应层,反应层的生成表明Ag-3.3Cu钎料与透氧膜之间具有良好的润湿性和界面结合。     

SiC陶瓷真空钎焊接头界面结构及机理分析

采用Ti-Zr-Ni-Cu钎料对SiC陶瓷进行了真空钎焊,研究了SiC陶瓷真空钎焊接头的界面显微组织和界面形成机理.试验中采用扫描电子显微镜(SEM)对接头组织进行了观察,并进行了局部能谱分析.结果表明,接头界面产物主要有TiC,Ti5Si3,Zr2Si,Zr(s,s),Ti(s,s)+Ti2(Cu,Ni)和(Ti,Zr)(Ni,Cu)等.接头的界面结构可以表示为:SiC/TiC/Ti5Si3+Zr2Si/Zr(s,s)/Ti(s,s)+Ti2(Cu,Ni)/(Ti,Zr)(Ni,Cu).钎焊过程分为五个阶段:钎料与母材的物理接触;钎料熔化和陶瓷侧反应层开始形成;钎料液相向母材扩散、陶瓷侧反应层厚度增加,钎缝中液相成分均匀化;陶瓷侧反应层终止及过共晶组织形成;钎缝中心金属间化合物凝固.在钎焊温度960℃,保温时间10 min时,接头抗剪强度可达110 MPa.     

添加Zn对AgCu钎料在TiC金属陶瓷表面润湿性的影响

分别采用AgCu共晶钎料和AgCu共晶钎料中添加30%(质量分数)Zn的AgCuZn钎料在TiC金属陶瓷表面进行润湿试验.结果表明,Zn元素的添加显著改善了钎料在TiC金属陶瓷表面的润湿性;AgCu钎料润湿TiC金属陶瓷时,从近钎料外表面到钎料/陶瓷界面,组织依次为Ag(s.s)+Cu(s.s)/(Cu,Ni)+Ag(s.s)/TiC金属陶瓷+Ag(s.s)+Cu(s.s)/TiC金属陶瓷;而采用AgCuZn钎料润湿TiC金属陶瓷后,从近钎料外表面到钎料/陶瓷界面,组织依次为Ag(s.s)+Cu(s.s)+(Cu,Ni)/Ag(s.s)+Cu(s.s)/(Cu,Ni)/TiC金属陶瓷+Ag(s.s)+Cu(s.s)/TiC金属陶瓷.Zn元素在真空中挥发促进了界面处Ni原子的溶解和扩散,使钎料在陶瓷表面的润湿角由120.6°减小到33.9°.     

Cu-Sn-Ti钎料钎焊立方氮化硼界面微结构分析

采用Cu、Sn、Ti单质金属粉混合制备了活性钎料,在真空炉中对CBN进行了钎焊连接,实现了CBN与Q235钢基体的高强度连接。运用SEM、EDS分析了CBN与钎料的界面微观组织、元素分布。结果表明:混合金属粉实现了钎料合金化,对CBN的润湿性较好,钎料与CBN、钢基体发生了界面反应,生成了含Ti的化合物,钢基体中的少量Fe元素随Ti扩散到CBN并形成白色块状TiFe化合物。     

Ni-Fe-Cr-Ti及Co-Ni-Fe-Cr-Ti(Si,B)系高温钎料对Si3N4陶瓷的润湿与界面连接

采用座滴法研究了Ni-Fe-Cr-(14-29)Ti(质量分数,%,下同)合金在Si3N4陶瓷上的润湿行为结果表明,在1493 K,10 min的真空加热条件下,随着含Ti量的增加,合金的润湿性逐渐改善,含Ti量为24%-29%时合金的润湿角达到27.3°.微观分析表明,钎料中的元素Cr向Ni-Fe-Cr-(24-29)Ti/Si3N4界面区扩散和富集,生成了复杂的Cr-Ni-Fe-Si四元化合物.分析了Ti元素含量的增加对于合金润湿性改善的原因.合金中加入元素Co并降低Ni含量可增强Ti,Cr的活性,导致形成不同的界面反应产物并对合金润湿能力及界面结合能力产生重要影响.成分调整后的Co-Ni-Fe-Cr-(14-20)Ti合金对Si3N4的润湿角可达到20.0°,形成牢固的润湿界面.     

CVD金刚石膜的钎焊界面反应层及微结构

借助扫描电镜和电子探针,分析了金刚石与Ag-Cu-Ti活性钎料界面反应层的微观组织结构、界面新生化合物的形成机理以及焊接工艺条件对界面结构的影响,建立了钎焊接头界面结构物理模型.结果表明,在一定的钎焊工艺条件下,金刚石/钎料界面存在灰色的新生化合物TiC,与TiC相邻的是蜂窝状的TiCu相;接头断裂不仅仅发生在TiC相中,有时断裂也发生在TiCu层.钎焊加热温度、保温时间、钎料层的含Ti量对CVD金刚石厚膜与硬质合金的接头结构模型有重要影响.     

银基钎料钎焊金刚石的界面结构及TiC生长机制

在合适的工艺下,采用Ag-Cu-Ti钎料实现了金刚石与钢基体的高强度连接,并剖析了Ag-Cu-Ti钎料与金刚石的界面微区结构.通过对界面处的成分分布和深腐蚀后碳化物TiC形貌的观察,分析了Ti的作用机理、新生化合物TiC的形貌及生长规律.结果表明:在一定的条件下,Ti元素与组成金刚石的碳元素发生反应形成TiC层;碳化物层使钎料与金刚石之间产生冶金结合,并在其界面上形成了金刚石/TiC/钎料/钢基体的梯度结合层.     

Simulation of cracking phenomena during laser brazing of ceramics and cemented carbide

To investigate the mechanism of the occurrence of the microcracks produced in laser brazing of silicon carbide and cemented carbide using a silver–copper–titanium alloy as the filler metal, a numerical simulation for thermal cycle and thermal stress was performed using the finite element method. The laser-irradiated area of the cemented carbide was heated selectively, and almost uniform temperature distribution in the filler metal was obtained. The tensile thermal stress in the silicon carbide appeared near the interface between the silicon carbide and the filler metal, and the maximum principle stress at about 400 K during the cooling process reached the fracture strength of the silicon carbide. This resulted in the formation of microcracks in the silicon carbide which was observed in the experiment.     

Brazing of Coated Al Foil Filler to AIN CeramicEI北大核心CSCD

The wettabilities of molten metals on ceramics are poor normally. In order to improve the wettability, all existing ceramic brazing methods introduce a compound transition layer formed by the reaction of active metal and ceramic. The transition layer between brazing seam and ceramic however creates negative effect on the properties of brazing joints. Although Al is the scarce metal which can wet some ceramics such as AIN and Al2O without reaction, the difficulty of removing oxide layer on surface prevents it being ceramic brazing filler. This work proposed a kind of coated Al foil filler able to remove its own Al2O3 film and an elevating temperature brazing process to enhance Al/AIN joint strength. Removing Al2O3. film effect of vapor deposited Ni/Al double layer film on Al foil and the effect of brazing temperature on improving joint strength were studied. The results showed that due to buried by Ni/Al double layer film, Al2O3 film on Al foil original surface broken and was swept in Al-1%Ni (atomic fraction) alloy liquid during heating and melting process. As a result, the direct brazing of Al to AIN without interface reaction transition layer was realized. The joint strength was significantly enhanced by elevating brazing temperature. When brazing at 680 degrees C, the joint fractured along the interface between Al seam and AIN and the sheer strength was 79 MPa because of Al liquid not wetting AIN. With the elevating of brazing temperature, the wettability and interface strength of Al/AIN improved. The fracture gradually transferred to brazing seam from interface. The joint strength increased and reached to the maximum value of 146 MPa at 840 degrees C.     

热扩散对镀锡银钎料界面组织及熔化特性的影响

对带锡镀覆层的银钎料进行热扩散处理,采用差示扫描量热仪(DSC)、扫描电镜(SEM)、X射线衍射仪(XRD)研究热扩散工艺对其熔化温度和扩散界面组织、物相的影响. 结果表明,在扩散时间一定条件下,随着扩散温度升高,扩散界面层厚度增加;随着扩散温度升高或扩散时间延长,钎料的固、液相线温度均降低,熔化温度区间缩小;扩散界面层物相主要由棒状Ag₃Sn相和块状Cu₃Sn相组成;最佳热扩散工艺为220 ℃,24 h. 经最佳工艺处理后,扩散界面层厚度为9.1 μm,钎料中Sn含量为7.2%,此时钎料熔化温度区间为642.34 ℃~676.37 ℃. 与传统熔炼合金化方法相比,钎料中Sn含量提高近31%.     

The effect of silicon on the nanoprecipitation of cementite

The current work presents a comprehensive study that aims at understanding the role of silicon on θ precipitation, as well as on the ε → θ carbide transition in tempered martensite. Cementite nucleation was modelled under paraequilibrium conditions in order to ensure the presence of silicon in the carbide, where both thermodynamic and misfit strain energies were calculated to evaluate the overall free energy change. The growth stage was investigated using in situ synchrotron radiation; three alloys containing 1.4–2.3 wt.% silicon contents have been studied. Silicon appears to play a significant role in carbide growth. It was observed throughout tempering that cementite precipitation was slower in the higher silicon content alloy. Literature reports that cementite growth is accompanied by silicon partitioning, where the silicon content inside the carbide decreases as tempering progresses. Therefore it appears that the limiting factor of the growth kinetics is the rate at which silicon is rejected from the carbide; the silicon piles up at the carbide–matrix interface, acting as a barrier for further growth.     

Removal of Si from recycled aluminium alloys

Abstract

Recycling of aluminium alloys is beneficial to the environment since it uses less energy than primary metal production. However, some instances, such as recycling of brazing sheets used for heat exchanger applications, lead to increased silicon content in Al–Mn alloys (3xxx series) due to the presence of clad layer of eutectic Al–Si alloy. In the present study, the removal of excess Si from recycled Al alloys has been investigated. The feasibility of removing silicon was evaluated using thermodynamic calculations. This was followed by some simple experiments by adding calcium to alloys with known silicon content to reduce it. It was found that the Si content can be reduced by 50% by this process.     

镀锡AgCuZnSn钎料熔化特性的热力学分析

以BAg50CuZn钎料为基材,采用电镀热扩散组合工艺制备了镀锡AgCuZnSn钎料。为了揭示镀锡银钎料的热力学特性,借助差示扫描量热仪(DSC)测定了镀锡银钎料的熔化温度,运用热分析动力学中的非等温微分法和积分法分析了镀锡银钎料的相变热力学特性,并利用金相显微镜和X射线衍射仪(XRD)对钎料熔化后润湿界面的显微组织和物相进行了分析。研究表明,随着Sn含量升高,在吸热峰镀锡银钎料由固态向液态转变的温度区间变窄,非等温微分法和积分法得到的钎料相变活化能均逐渐增大。在Sn含量为7.2%时,镀锡银钎料的相变活化能和指前因子最大,分别为555.56kJ/mol、1.41×10~(32),此时镀锡银钎料相变速率方程的表达式为:k=1.41×10~(32)exp(-5.56×10~5/RT)。7.2%Sn含量的镀锡银钎料在304不锈钢表面熔化后,润湿界面组织主要由Ag相、Cu相、CuZn相、Cu_5Zn_8相、Cu_(41)Sn_(11)相、Ag_3Sn相组成。     

Vacuum Brazing of WC-8Co Cemented Carbides to Carbon Steel Using Pure Cu and Ag-28Cu as Filler Metal

The wetting and spreading behavior of commercial pure Cu and Ag-28Cu alloy on WC-8Co cemented carbide were investigated by the sessile drop technique. The contact angle of both systems obviously decreases with moderately increasing the wetting temperature. Vacuum brazing of the WC-8Co cemented carbide to SAE1045 steel using the pure Cu or Ag-28Cu as filler metal was further carried out based on the wetting results. The interfacial interactions and joint mechanical behavior involving microhardness, shear strength and fracture were analyzed and discussed. An obvious Fe-Cu-Co transition layer is detected at the WC-8Co/Cu interface, while no obvious reaction layer is observed at the whole WC-8Co/Ag-28Cu/SAE1045 brazing seam. The microhardness values of the two interlayers and the steel substrate near the two interlayers increase more or less, while those of WC-8Co cemented carbide substrates adjacent to the two interlayers decrease. The WC-8Co/SAE1045 joints using pure Cu and Ag-28Cu alloy as filler metals obtain average shear strength values of about 172 and 136 MPa, and both of the joint fractures occur in the interlayers.     

高温钎焊过程中Ni-Cr合金对金刚石磨粒静压强度的影响

采用C类(Ni82Cr7Si4.5B3.1Fe3)和E类(BNi76Cr15P9)两种钎料对金刚石进行真空炉中钎焊。通过静压强度测试对各种状态下的金刚石钎焊性能进行评价,并借助SEM以及拉曼光谱仪对金刚石表面碳化物的形貌和金刚石的石墨化进行检测分析。结果表明:钎焊高温对金刚石强度的影响较合金钎料的化学侵蚀作用而言小很多;触媒元素Ni、Fe和强碳化物形成元素Cr等引起的化学侵蚀,是导致金刚石静压强度降低的两个主要原因;不同品质的金刚石经过高温钎焊后,静压强度值出现不同程度的降低。