Parasitic resistance in an MOS transistor used as on-chipdecoupling capacitance

Adding on-chip decoupling capacitance has become a popular method to reduce dI/dt noise in integrated circuits. The most area-efficient realization of on-chip capacitance in a standard CMOS process is to use the gate capacitance of MOS transistors. In this paper, the inevitable parasitic resistance of an MOS transistor is estimated, which is important for two reasons. The resistive noise caused by this parasitic must be kept low, and, if properly sized, this resistance can be used to dampen potential resonance oscillations     

Monolithic integration of 5 V CMOS and high-voltage devices

A fully CMOS-compatible HVIC technology has been developed that features 5 V high-performance digital CMOS with high-voltage devices of more than 400 V. This technology uses only one or two masks in addition to standard p-well CMOS technology. Design optimization has been achieved to meet the needs of both CMOS and high-voltage devices. A large number of different devices are available in this technology, including bipolar transistors, lateral MOS gate power devices, and high-voltage p-channel power devices     

On-chip high voltage charge pump in standard low voltage CMOS process

An on-chip high voltage tolerant 4VDD charge pump with symmetrical architecture in a standard low voltage 1.8 V 0.18 /spl mu/m CMOS process is presented. For a 250 k/spl Omega/ load, circuit efficiency of the charge pump is approximately 71%. All the MOS transistors satisfy typical voltage stress related reliability requirements for standard low voltage CMOS devices.     

A methodology for measuring the gate-drain capacitance of CMOSdevices

In this paper, the author presents a new methodology for measuring the gate drain capacitance of CMOS devices using an accelerated dc measurement scheme. The gate-drain capacitance was measured using a floating gate MOS transistor, i.e., an MOS transistor with an additional capacitor placed in series with the gate oxide capacitance. This was implemented within a standard p-well CMOS process using two matched transistors. The top capacitance couples charge onto the gate oxide capacitor and the gate-drain capacitor. The amount of coupling is determined by the ratio of these two capacitors     

An efficient approach to the measurement and characterization of MOSFET capacitances

This article describes an improved methodology of estimation of the components of MOS transistor gate capacitances. It uses transistors on a test structure, which was designed for the purpose of a general characterization of CMOS technology and devices. The presented method is based on a comparison of the appropriate C–V characteristics of transistors of different gate dimensions. This allows efficient elimination of undesired parasitic capacitances of the measurement setup.     

High-power SOI vertical DMOS transistors with lateral drain contacts: Process developments, characterization, and modeling

Silicon-on-insulator (SOI) high-power vertical double-diffused MOS (VDMOS) transistors are demonstrated with a CMOS compatible fabrication process. A new backend trench formation process ensures a defect free device layer. Scanning electron microscope micrographs show that it is nearly free of defects. This has been achieved by moving the trench formation steps toward the end of the process. Our electrical measurements indicate that the transistors are fully functional. Electrothermal simulations show that unclamped inductive switching (UIS) test involves a substantial risk of turning the parasitic bipolar transistor (BJT) on. The UIS test is used to characterize the performance of power devices under unclamped inductive loading conditions. Extreme operating condition can be expected when all the energy stored in the inductor is released directly into device. Our measurements of the fabricated SOI VDMOSFET in the static region are in good agreement with the expected impact of the self-heating on the saturation behavior. The experiments at ambient temperature of 100/spl deg/C show that the break down voltage decreases as the drain voltage increases. This indicates that a parasitic BJT has been turned on.     

Recent progress of submicron CMOS using 6H-SiC for smart powerapplications

Silicon carbide (SiC) CMOS circuits have been developed recently to provide monolithic control for SiC MOS power switching devices. Although SiC CMOS is not well suited for high-end microprocessor applications, it must provide the necessary response time performance required for safe operation in high-voltage power switching applications. Despite previous developments in SiC CMOS process technology; which have enabled digital circuit operation using a 5 V power supply, circuit switching speeds were in the microsecond range. An obvious way to improve circuit performance is to scale device lateral and vertical dimensions. This paper describes recent progress in the development of a submicron, single metal, p-well CMBS process technology using 6H-SiC. Conventional NMOS transistors are fabricated with 0.5-mm (drawn) channel lengths and exhibit acceptable short-channel effects. Conventional PMOS transistors exhibit punchthrough at 0.8-mm channel lengths and require considerable channel engineering efforts which are also presented. Several digital logic gates and a ring oscillator have been fabricated with nanosecond gate switching performance. Performance limiting factors like parasitic series resistance is also investigated     

3D CMOS devices in recrystallized silicon

A 2 μm scale three-dimensional CMOS process has been developed which allows the fabrication of MOS devices in two independent active device layers. NMOS transistors have been fabricated in the substrate and CMOS devices, including inverters and ring oscillators, in a thin laser-recrystallized polysilicon layer. The processing parameters were determined carefully in order to obtain a monocrystalline top layer and to avoid any damage to the underlying devices already existing.     

CMOS implementation of a multiple-valued logic signed-digit fulladder based on negative-differentiaI-resistance devices

This paper presents a fully integrated implementation of a multivalued-logic signed-digit full adder (SDFA) circuit using a standard 0.6-μm CMOS process. The radix-2 SDFA circuit, based on two-peak negative-differentiaI-resistance (NDR) devices, has been implemented using MOS-NDR, a new prototyping technique for circuits that combine MOS transistors and NDR devices. In MOS-NDR, the folded current-voltage characteristics of NDR devices such as resonant-tunneling diodes (RTDs) are emulated using only nMOS transistors. The SDFA prototype has been fabricated and correct function has been verified. With an area of 123.75 by 38.7 μm² and a simulated propagation delay of 17 ns, the MOS-NDR prototype is more than 15 times smaller and slightly faster than the equivalent hybrid RTD-CMOS implementation     

采用多输入浮栅MOS器件的四值编-译码电路设计

提出一种采用多输入浮栅MOS管设计具有可控阈值功能的电压型多值逻辑电路的方法.对每个浮栅MOS管的逻辑功能均采用传输开关运算予以表示以实现有效综合。在此基础上提出了一种新的电压型多输入浮栅MOS四值编码器和译码器设计。所提出的电路在结构上得到了非常明显的简化,并可采用标准的双层多晶硅CMOS工艺予以实现。此外,这些电路具有逻辑摆幅完整、延迟小等特点。采用TSMC0.35μm双层多晶硅CMOS工艺参数的HSPICE模拟结果验证了所提出设计方案的正确性。     

Translinear circuits in subthreshold MOS

In this paper we provide an overview of translinear circuit design using MOS transistors operating in subthreshold region. We contrast the bipolar and MOS subthreshold characteristics and extend the translinear principle to the subthreshold MOS ohmic region through a drain/source current decomposition. A front/back-gate current decomposition is adopted; this facilitates the analysis of translinear loops, including multiple input floating gate MOS transistors. Circuit examples drawn from working systems designed and fabricated in standard digital CMOS oriented process are used as vehicles to illustrate key design considerations, systematic analysis procedures, and limitations imposed by the structure and physics of MOS transistors. Finally, we present the design of an analog VLSI translinear system with over 590,000 transistors in subthreshold CMOS. This performs phototransduction, amplification, edge enhancement and local gain control at the pixel level.     

A simplified low-voltage smart power technology

A novel self-isolated low-voltage smart power technology, based on a conventional polysilicon-gate VDMOS process, has been developed for applications where cost is a crucial factor. The low mask count (eight) and the optimization of the VDMOS power device are the main process characteristics. Besides, different devices (high-voltage PMOS, low-voltage CMOS, vertical and lateral n-p-n bipolar transistors, diodes, Zeners, and high-value isolated capacitors) are also fabricated, all MOS transistors being self-aligned to the gate     

Wide-Linear-Range Subthreshold OTA for Low-Power, Low-Voltage, and Low-Frequency Applications

We propose a novel configuration of linearized subthreshold operational transconductance amplifier (OTA) for low-power, low-voltage, and low-frequency applications. By using multiple input floating-gate (MIFG) MOS devices and implementing a cubic-distortion-term-canceling technique, the linear range of the OTA is up to 1.1 Vpp under a 1.5-V supply for less than 1% of transconductance variation, according to testing results from a circuit designed in a double-poly, 0.8-$muhbox m$, CMOS process. The power consumption of the OTA remains below 1$muW$for biasing currents in the range between 1–200 nA. The offset voltage due to secondary effects (contributed by parasitic capacitances, errors and mismatches of parameters, charge entrapment, etc.) is of the order of a few ten millivolts, and can be canceled by adjusting biasing voltages of input MIFG MOS transistors.     

Modified Model for Settling Behavior of Operational Amplifiers in Nanoscale CMOS

An accurate time-domain model for the settling behavior of folded-cascode operational amplifiers is presented. Using a velocity–saturation model for MOS transistors makes the proposed model suitable for nanoscale CMOS technologies. Both linear and nonlinear settling regimes and their combination are considered. Transistor-level HSPICE simulation results of a fully differential single-stage folded-cascode amplifier using BSIM4v3 models of a standard 90-nm CMOS process are presented to verify the accuracy of the proposed models.      

Operating CMOS after a Si-MBE process: a precondition for futurethree-dimensional circuits

Complete CMOS integrated circuits grown by Si molecular beam epitaxy (MBE) are discussed. The morphology of the MBE films and the electrical performance of the CMOS transistors were investigated. The CMOS time-keeping circuits work after an MBE process. Indications of radiation damage (threshold shift up to 200 mV) induced by the Si electron-beam evaporator at epitaxial temperatures of 550°C are observed. These are completely gone at 750°C, at which temperature virtually no effect of the MBE process on the CMOS characteristics could be determined. The observed compatibility of Si-MBE with CMOS ICs is an important prerequisite for the monolithic integration of Si-based devices with the complexity level provided by MOS technologies     

High-voltage solutions in CMOS technology

This paper presents trends on CMOS high-voltage techniques for power integrated circuits (PICs). Several fully CMOS compatible drain engineering techniques will be presented. Experimental devices were fabricated in standard CMOS processes from three different lithography generations (2, 0.7 and 0.5 μm) without resorting to any extra processing steps. MOS devices layout specificity towards performance improvement, namely breakdown, parasitic effects and degradation, will be emphasized.A recently developed technique used to enlarge high-voltage devices safe-operating area and reduce leakage current will also be presented due to the very promising experimental results.Comparison with more sophisticated and expensive technologies still reveals CMOS as a highly accessible and versatile technology for future PICs.     

An advanced bipolar-MOS-I2L technology with a thin epitaxial layer for analog-digital VLSI

A novel Bi-MOS technology, Advanced Bipolar CMOS (ABC), is proposed. Bipolar transistors (n-p-n, p-n-p, I²L) and MOS transistors (both n- and p-channel) have been successfully fabricated on the same chip with no decrease in performance by using a 3-µm design rule. Thin epitaxial layer (leq 2 microm) is used in order to obtain small-size high-performance (3-GHz) bipolar devices. Device size is reduced by using a shallow junction and self-aligning technique. n-channel MOS transistors are formed in p-well regions designed to reach p-type substrate, and p-channel MOS transistors are formed in epitaxial layer with an n⁺buried layer. This technology has the potential for monolithic multifunctional analog-digital VLSI.     

Negative-resistance MOS transistor

The author proposes a novel approach for implementing a negative-resistance MOSFET that uses a non-uniform drain-current flow within one integrated structure. This MOS device exhibits a negative output conductance within a specific bias range as a consequence of current sharing between two MOSFETs of different geometries. The author describes a negative-resistance MOS transistor and discusses in detail its principle of operation, design, and electrical characteristics. The MOSFET is a three-terminal voltage-controlled device that consists of two MOS transistors with the same type of channel conductivities and can be implemented either in n-channel or p-channel versions. The proposed device is a compact element that can be fabricated together with other semiconductor devices using a standard CMOS technology     

Microwave CMOS-device physics and design

This paper discusses design issues and the microwave properties of CMOS devices. A qualitative understanding of the microwave characteristics of MOS transistors is provided. The paper is directed toward helping analog IC circuit designers create better front end radio-frequency CMOS circuits. The network properties of CMOS devices, the frequency response, and the microwave noise properties are reviewed, and a summary of the microwave scaling rules is presented     

Analogue and mixed-signal IC design

Recent developments in fabrication technology have led to the advent of double-poly CMOS processes, which are attractive for analogue ICs. The process allows high-value capacitors to be made using the two polysilicon layers as the conducting plates, thus using a much smaller area than that required by earlier metal-poly capacitors. The BiCMOS process is particularly relevant to making mixed analogue/digital devices; it blends N- and P-channel complementary MOS devices with NPN bipolar devices in the same process, giving the ability to produce CMOS and bipolar transistors on a single chip. This means that high-performance analogue circuits can be mixed with high-density, low-power digital circuits, offering a single-package mixed-signal system. The authors highlight the rapid growth in the mixed-signal ASIC market. They examine the crucial developments taking place in analogue CAD environments, and in the device technologies on which the growth critically depends