PCVD法对碳化硅陶瓷的表面改性研究

利用等离子辉光放电化学气相沉积技术（ＰＣＶＤ），控制甲烷与磋烷质量流量比、硅烷与氨质量流量比，在碳化硅基体表面分别沉积上无定形碳化硅和氨化硅薄膜，研究其膜的组成、沉积工艺、厚度等对碳化硅陶瓷的强度改性影响．在一定的沉积条件下沉积的碳化硅薄膜可以使基体强度提高２０％达到８５０ＭＰａ，沉积氮化硅薄膜使强度提高３０％达到９００ＭＰａ，改性的效果很明显．     

微弧氧化 Al-Si-O陶瓷涂层的结构与结合强度

使用微弧氧化方法在铝合金表面制备了包含Al—Si—O的复合氧化物陶瓷涂层．利用XRD和SEM分析了陶瓷涂层的组成和结构，通过机械冲击、热冲击和拉伸法评价了涂层与基体的结合强度．结果显示，陶瓷涂层由Q—Al2O3、γ-Al2O3和莫来石组成．涂层表面粗糙，有大量等离子体放电产物．陶瓷涂层能承受机械和600℃热冲击，说明涂层与基体结合好，具有很好的延展性、抗热震性．拉伸结果显示，涂层与基体结合强度高于20MPa．     

氮化硅陶瓷晶界相研究进展

晶界相对氮化硅陶瓷性能有重要作用,研究晶界相的性能对断裂韧性、高温强度的提高有重要意义。介绍了氮化硅陶瓷的显微结构、性能和应用,重点评述了氮化硅陶瓷晶界相的形成、特点、影响因素以及晶界相对力学性能和摩擦磨损性能的影响。提出了当前研究中存在的问题,并展望了未来氮化硅的研究方向。     

包覆成孔剂法制备高性能多孔氮化硅陶瓷工艺

为了制备高强度且分布均匀的氮化硅陶瓷,采用包覆成孔剂法改进普通添加成孔剂的方法,常压烧结氮化硅多孔陶瓷,采用阿基米德法、三点弯曲法分别测试材料的孔隙率及抗弯强度,用扫描电镜和光学放大镜对氮化硅多孔陶瓷显微结构和表观结构进行研究.结果表明,添加包覆过的成孔剂强度比添加未包覆的成孔剂强度高,孔隙率为50%时,强度增加近一倍.强度的提高归因于特殊的微观结构,即气孔的均匀分布和孔与孔之间相间隔分布.     

碳化硅纤维增强氮化硅陶瓷

氮化硅、碳化硅、氧化锆等是高性能的陶瓷,对它们的特性已进行了积极的研究。东芝公司在氮化硅系列陶瓷方面,开发了三氧化二钇(Y_2O_3)系列烧结助剂及晶粒边界间结晶技术,生产出高性能的陶瓷材料。氮化硅系列陶瓷大多强度高,耐热性好,已实用作为各种耐磨、耐腐蚀部件,并     

沙漠车用陶瓷活塞顶的研制

氮化硅陶瓷活塞顶是无冷机的关键部件之一．本工作选用高熔点的稀土氧化物为添加剂,在气氛加压炉内1800～1960℃,0．1～6MPaN₂压力下进行烧结,制备了性能优越的氮化硅陶瓷材料．其常温抗弯强度为750MPa,断裂韧性为7．2MPa·m^1/2,Weibull模数为12．3．使用该材料制备的氮化硅陶瓷活塞顶,装在6105型无水冷柴油机中,在规定的条件下进行耐久考核,已完成700h以上的台架实验,氮化硅陶瓷活塞顶装在EQ2060沙漠车上进行道路试验,已行驶1900km以上,经检验氮化硅陶瓷活塞顶完好无损．     

氮化硅陶瓷的研究进展

氮化硅陶瓷是一种有广阔发展前景的高温高强度结构陶瓷.其具有高性能(如强度高、抗热震稳定性好、疲劳韧性高、室温抗弯强度高、耐磨、抗氧化、耐腐蚀性好等).已广泛应用于各行各业.氮化硅的制备方法主要有反应烧结法(RS)、热压烧结法(HPS)、常压烧结法(PLS)和气压烧结法(GPS)等.目前存在的主要问题是氮化硅陶瓷产品韧性低、成本较高.今后应改善制粉、成型和烧结工艺及氮化硅与碳化硅的复合化,研制出更加优良的氮化硅陶瓷.     

液相连接氮化硅陶瓷的结合强度研究

本文用玻璃焊料研究了氮化硅陶瓷的液相连接,探讨了组份（0～10wt％α－Si₃N₄）、温度（1450～1650℃）和保温时间（10～120min）对结合强度的影响规律．结果表明,α－Si₃N₄的加入提高了液态焊料的粘度,降低了焊料的流动性,导致结合强度下降．采用组份为不含α－Si₃N₄的纯氧化物玻璃焊料在1600℃、保温30min可以得到较为理想的结合强度．     

凝胶注模成型制备高性能的氮化硅陶瓷(Ⅱ)-冷等静压、粉料氧化处理和气压烧结对材料性能的影响

在对氮化硅粉料进行助烧剂包覆和凝胶注模成型的基础上,研究了冷等静压凝胶注模成型氮化硅坯体、氧化氮化硅包覆料和气压烧结制度对凝胶注模成型氮化硅陶瓷的抗弯强度和韦泊尔模数的影响冷等静压有利于提高凝胶注模成型氮化硅陶瓷的力学性能.合适的粉料氧化制度和烧结制度都能提高材料的抗弯强度和韦泊尔模数.实验采用优化的工艺,制备出的氮化硅陶瓷的三点弯曲强度和两参数韦泊尔模数(20个试样)分别高达944.7±29.5MPa和33.9.     

氮化硅基多孔陶瓷的制备技术、孔隙结构控制方法及其研究进展

氮化硅基多孔陶瓷充分发挥了氮化硅陶瓷和多孔陶瓷的特性,受到全球材料界的广泛关注.总结了国内外氮化硅基多孔陶瓷的研究现状,概述了氮化硅基多孔陶瓷的制备技术,重点分析了氮化硅基多孔陶瓷的孔隙结构控制.针对不同应用领域对材料结构和性能的不同要求,指出孔隙结构的精确控制、不同相组成控制方法和降低工艺成本是今后氮化硅基多孔陶瓷的发展趋势.     

Fracture of silicon nitride joined with an aluminium braze

Mechanical Properties of silicon nitride joined with aluminium braze have been investigated using fracture mechanics. The highest bonding temperature, 1133 K, produced the highest four-point bend strength of 417 MPa, the strength depending strongly on stress rate. The fracture parameter,N, for slow crack growth in the joint was 29.7 which was near to that of the silicon nitride. Stress corrosion cracking is believed to be one of the serious problems associated with ceramic joining.     

Herstellung und komplexe Charakterisierung von Metall‐Keramik‐Verbundschichten

Formation and characterization of metal‐ceramic coatings The influence of the formation process and used materials of metal‐ceramic coatings on the structural properties of the deposited layers were investigated and optimized to increase the mechanical properties. There the deposition of the metal‐ceramic‐layers occurred by a combination of electrophoretic and galvanic deposition with siloxane as bonding compound. Layers with a high ceramic content were successfully created. As ceramic components commercial silicon carbide and silicon nitride were used. Nickel and Copper respectively were applied as metal component to fill the porous ceramic structure with the aim to increase the strength of the layers, where nevertheless a pre nickel‐plating or pre cupper plating of the steel substrate X6Cr17 before ceramic component deposition had to be done to increase the adhesion of the layers. The layer characterization was made by optical microscopy and scanning and transmission electron microscopy, where especially the bonding of the single particles by the siloxane was in evidence.     

离子束表面改性氮化硅与钢的焊接研究

氮化硅表面用Ti，Cu，Mo等金属离子处理后，与45号钢在真空中进行焊接。样品分析结果表明，接缝强度与表面处理条件、焊接温度及真空度密切相关。在控制条件下，其剪切强度达220MPa。     

Microstructures and mechanical properties of silicon nitride bonded silicon carbide ceramic foams

Silicon nitride bonded silicon carbide foams have been produced by nitridation of the foamed compacts containing silicon carbide and silicon powders. When no nitridation additive was used the ceramic foams nitrided at all temperatures studied contained a significant amount of whisker phase α-Si₃N₄ formed both inside and outside the cell walls leading to a loose microstructure and a low mechanical strength. When the Al₂O₃ and Y₂O₃ were used as nitridation additives, the ceramic foams nitrided at temperatures of 1360 and 1395 °C containing certain amount of Si₂N₂O and whisker α-Si₃N₄ phases that are bonded by a glassy phase and behave as reinforcements for the ceramic foams exhibited a much higher mechanical strength. At nitridation temperature of 1430 °C, the ceramic foam showed the locally formed β-Si₃N₄ as the main nitrided phase that caused no increase in bonding area between the nitrided phase and the silicon carbide particles. Thus, a relatively lower mechanical strength was observed for the ceramic foam.     

Liquid-phase bonding of silicon nitride ceramics using Y2O3–Al2O3–SiO2–TiO2 mixtures

Hot-pressure sintered β-Si₃N₄ ceramic was bonded to itself using Y₂O₃–Al₂O₃–SiO₂–TiO₂ mixtures. Reactive behavior at interface between Si₃N₄ and Y₂O₃–Al₂O₃–SiO₂–TiO₂ mixtures during silicon nitride ceramic joining was studied by means of scanning electron microscopy (SEM), electron probe microanalyses (EPMA), X-ray diffraction (XRD) and auger electron spectroscopy (AES). The joint strength under different bonding conditions was measured by four-point bending tests. The results of EPMA, AES and XRD analyses show that the liquid glass solder reacts with silicon nitride at interface, forming the Si₃N₄/Y–Si–Al–Ti–O–N glass/TiN/Y–Si–Al–O glass gradient interface. From the results of four-point bending tests, it is known that with increase of bonding temperature and holding time, the joint strength increased reaching a peak, and then decreased. The maximum joint strength of 200 MPa measured by the four-point bending tests is obtained for silicon nitride bonded at 1823 K for 30 min.     

三种机械密封材料的摩擦磨损性能研究

研究了3种核主泵用机械密封陶瓷材料(氮化硅、氧化铝和碳化硅)在室温干摩擦条件下及水润滑条件下分别与氮化硅陶瓷球对磨的摩擦磨损性能。研究结果表明,在与氮化硅球干摩擦的3种材料中氧化铝陶瓷具有最大的摩擦系数和最小的磨损质量,氮化硅具有最小的摩擦系数。在氮化硅陶瓷自配对摩擦副摩擦磨损试验中,水润滑条件下氮化硅摩擦系数及摩擦质量损失都有很大程度的减小,且摩擦系数随转速增加而减小。综合考虑力学性能和摩擦磨损性能,选择氮化硅陶瓷作为核主泵机械密封材料更合适。     

Ceramic matrix composite-metal brazed joints

A silicon nitride fibre-reinforced cordierite glass ceramic matrix composite has been brazed to titanium and stainless steel in argon with four different interlayer materials, copper, nickel, tungsten and a metal matrix composite (mmc). Joints were tested in shear and all but one failed in the ceramic composite. The highest strength joint, using a metal matrix interlayer to join cmc to stainless steel failed in the mmc at 106 MPa. Silver-copper eutectic braze and aluminium braze can be used to join metals to titanium-coated cmc, producing joints with low levels of interfacial defects. Some joints, however, show debonding at the edges where residual shear stresses are highest.     

低介电常数多孔氮化硅陶瓷的制备

采用凝胶注模成型工艺,以SiO2含量大于等于95%的空芯玻璃微珠作造孔剂,通过控制造孔剂的加入量和调节造孔剂的孔径成功制备出低介电常数、高强度的多孔Si3N4陶瓷。结果表明,随着造孔剂含量的增加,试样气孔率增大,弯曲强度降低,ε和tanδ都相应降低,ε最低为1.77;在造孔剂加入量为10%时,随着造孔剂的孔径尺寸变大,试样的孔径变大,弯曲强度降低,试样的ε和tanδ也相应降低。当造孔剂含量为10%、孔径尺寸为80μm时制备的多孔氮化硅陶瓷ε为2.13,弯曲强度达到38MPa,适合作为宽频带天线罩的夹层材料。     

Entwicklung und Verschleißverhalten von Si3N4-Schneidkeramik

Development and wear behaviour of silicon nitride ceramic Cutting tools based on silicon nitride ceramic have been employed successfully in industrial ranges of application especially in cutting of grey cast iron. Nevertheless their availability is still limited due to various reasons, depending on the specific material properties. In order to improve the wear behaviour and the reliability of these tools a new silicon nitride ceramic matrix, bonded with grains of carbides, was developed. The paper presents results obtained during investigations on material specific wear mechanisms in face milling and turning. The responsible wear mechanism in turning are the high tool temperatures. They leads to a softening of the grain boundary phase so that the Si₃N₄-grains can be removed by the chip flow. The wear in milling is due to the high mechanical load accompanied with the frequency in period of cutting