Sialon结合SiC复合材料的制备与性能

利用天然高岭土,通过碳热还原氮化法合成β-Sialon（Si₃Al₃O₃N₅）粉体,并制备出Sialon结合SiC复合材料,同时测定该材料的机械性能和热力学性能,Sialon结合SiC复合材料可在1550～1640℃烧结,烧结体的体积密度可达2．26g／cm³,三点抗弯强度42．0MPa,1200℃恒温20min后,经15℃冷水淬冷10次仍保持原有强度,1350℃空气流中灼烧失重率低于0．035％／cm²．     

高性能细晶粒氧化铝陶瓷材料的制备与研究

本文对商用γ－Al₂O₃粉体预处理后,采用热压工艺,制备了高性能细晶粒纯氧化铝陶瓷材料,1450℃／30min热压获得晶粒尺寸为0．5μm、抗弯强度为500±45MPa;1550℃／30min获得断裂韧性为5．7±0．5MPa·m^1／2的氧化铝材料．并对氧化镁添加剂的作用进行了研究：在1420℃／30min制备了相对密度为99.3％,抗弯强度为584±51MPa的氧化铝材料;并发现了氧化镁在氧化铝中的不同作用机理．     

高能球磨结合SPS技术制备Al2O3-TiC复合材料及其性能研究

以TiO₂、Al、C(石墨)为原料,首先采用高能球磨引导铝热反应合成了Al_2O3-TiC 纳米复合粉体,然后采用放电等离子体烧结纳米复合粉体制备了Al₂O₃-TiC复合材料.结果表明,在氩气氛围下高能球磨3h后,原料粉末就发生了铝热反应,合成的Al₂O₃-TiC复合粉体粒子尺寸大约在100nm左右.采用SPS技术在1450℃保温4min烧结的试样致密度达99.6%,并且结构精细(大部分晶粒<1μm),两相分布比较均匀,有较好的力学性能和电导性能,抗弯强度为650±21MPa.,硬度为19.1±0.2GPa,断裂韧性为4.5±0.2MPa·m^1/2,电导率为2.3828×105Ω^-1·m^-1.     

TiC-TiB2/Cu复合材料的自蔓延高温合成研究

采用SHS/PHIP工艺制备了TiC-TiB₂/Cu复合材料,通过实验研究了该系列复合材料的微观结构特征和力学性能。结果表明,TiC-TiB₂/Cu复合材料中只有TiC、TiB₂和Cu相存在;随着Cu含量的增加,燃烧温度下降,材料的颗粒尺寸变小;TiC-TiB₂/Cu复合材料的相对密度、抗弯强度和断裂韧性均随Cu含量的增加呈先增后减趋势,当Cu含量为20％时强度最高为580MPa,Cu含量为40％时韧性最高为8.1MPa·m^1/2。     

TiN-Al2O3纳米复合材料的力学性能和导电性能

以纳米TiN和α-Al₂O₃粉体为原料,采用球磨混合法制备了纳米TiN-Al₂O₃复合粉体,通过热压烧结得到致密烧结体.研究了纳米TiN颗粒对Al₂O₃材料力学性能和导电性能的影响,实验结果表明:在Al₂O₃基体中加入15vol％TiN纳米颗粒时,Al₂O₃材料的弯曲强度和断裂韧性分别从370MPa和3.4MPa·m^1/2提高到690MPa和5.1MPa·m^1/2,随着TiN添加量的增加,复合材料的电阻率逐渐降低,在25vol％TiN时达到最低值(6.5×10^-3Ω·cm).     

放电等离子快速烧结SiC晶须增强Si3N4BN层状复合材料

采用放电等离子烧结技术(SPS)快速烧结了SiC晶须增强的Si₃N₄/BN层状复合材料.利用SPS技术,在烧结温度为1650℃、保温15min的条件下,材料的密度可达3.18g/cm³,抗弯强度高达600MPa,断裂功达到3500J/m².研究表明:特殊的层状结构、SiC晶须的拔出与折断是材料断裂功提高的主要原因.X射线衍射及扫描电子显微镜研究表明:α-Si₃N₄已经在短短的烧结过程中全部转变成长柱状的β-Si₃N₄,并且长柱状的β-Si₃N₄和SiC晶须具有明显的织构.     

温度脉冲方法制备碳/碳化硅复合材料界面的微观结构与性能研究

采用温度脉冲化学气相渗透沉积的方法制备了碳/碳化硅复合材料界面. 以六甲基二硅胺烷(Hexamethyldisilazane , HMDS) 为前驱体, 以3k, 三维四向的石墨化碳纤维编织体为预制体, 通过强制流动热力学梯度化学气相渗透沉积的方法(FCVI)制备出密度为1.98g·cm^-3的C _f/SiC复合材料. 运用透射电子显微镜(TEM)对复合材料的界面微观结构进行了分析. 复合材料的平均弯曲强度为458MPa, 平均断裂韧性为19.8MPa·m^1/2. 应用扫描电子显微镜(SEM)对复合材料的断裂形貌进行了分析研究.     

烧结温度对Cf/SiC复合材料结构及性能的影响

以碳纤维为增强体, 热压烧结制备了C_f/SiC复合材料, 研究了烧结温度对C_f/SiC复合材料密度、结构及性能的影响. 研究发现: 提高烧结温度能够促进C_f/SiC复合材料的致密度; 当烧结温度低于1850℃时, 升高烧结温度, 复合材料的强度和断裂韧性也随之提高. 当烧结温度为1850℃时, 复合材料的性能最优, 弯曲强度达500.1MPa, 断裂韧性为16.9MPa·m ^1/2. 当烧结温度达到1880℃时, 复合材料性能反而下降.     

(La2/3Ca1/3)(Mn(3-x)/3)Fex/3)O3体系磁电阻行为的研究

通过系统地测量（La_2/3Ca_1/3）（Mn_{（3-x）／3}Fe_x／3）O₃（x＝0、0.1、0．2、0．3的体系样品的电阻率-温度关系以及一定温度下磁电阻率与磁场的关系,发现随x的变化其磁电阻率峰和电阻率峰均发生位移,磁电阻率峰值增大,并伴生磁电阻率峰展宽效应．作者认为由于Fe的替代,引起体系中Mn³⁺／Mn⁴⁺比率及磁矩的变化,加之外场对磁有序结构的调制作用,从而影响了Mn³⁺－O^－Mn⁴⁺的双交换作用,最终导致磁电阻行为发生变化．     

SiCw/Al复合材料的一种界面结构

应用透射电镜技术研究了用高压凝固铸造法(Squeeze casting)制备的碳化硅晶须增强铝(SiCw/Al)复合材料界面两侧晶须与基体的位向关系。结果表明,碳化硅晶须与基体铝之间至少存在一种匹配关系,这种关系是:<110>_SiC//<110>_Al,<111>_SiC//<100>_Al(约差4°)。由此提出了SiCw/Al复合材料的半共格界面结构模型。      

PROCESSING AND PERFORMANCE OF SEVERAL SiC WHISKER-REINFORCED Al2O3 MATRIX COMPOSITES

The influence of different SiC whiskers on the processing and performance of Al₂O₃ matrix composites were investigated. Three types of commercial SiC whiskers produced in the United States were used. The composites contained 30 v/o of SiC whisker and were consolidated by both hot pressing (HP) and hot pressing followed by hot isostatic pressing (HP/HIP) techniques. The microstructure, mechanical properties, fracture behavior and toughening mechanisms of the composites were evaluated. The results show that the whisker types and processing techniques have profound effect on the densification and the properties of the composites.     

SiC w/BAS复合材料的显微结构及力学性能的研究

本文采用热压烧结法制备出致密的SiCw增强BAS玻璃陶瓷基复合材料．结果表明,BAS基体晶化后获得以钡长石为主晶相和莫来石为次晶相的复相BAS玻璃陶瓷．晶须的加入对BAS基体有显著的强韧化效果,加入30vol％SiCw可使材料的室温抗弯强度和断裂韧性分别由基体的156MPa和1．40MPa·m1/2提高到356MPa和4．06MPa·m1/2．TEM观察结果表明,晶须／基体界面结合良好,无界面反应物和非晶层的存在．断口形貌和压痕裂纹扩展路径的SEM观察结果表明,复合材料的主要增韧机制为裂纹偏转、晶须的拔出和桥接．     

Fabrication,characterization and mechanical properties of SiC-whisker-reinforced Y-TZP composites

The microstructure and mechanical properties of hot-pressed yttria-stablized tetragonal zirconia polycrystals (Y-TZP) reinforced with up to 30 vol % SiC whiskers were investigated. The homogeneously dispersed and fully dense SiC whisker/Y-TZP composites were fabricated by wet-mixing the constitutents and uniaxially hot-pressing the resulting powder. The grain size of the matrix depended on the whisker volume fraction and the hot-pressing temperature. The significant increase of fracture toughness of about MPa m^1/2 at 10 Vol % SiC and a small increase in strength were achieved by uniformly dispersing the whiskers in the Y-TZP matrix. Fracture surfaces revealed evidence of toughening by the mechanisms of crack deflection, pullout, and crack bridging by the whiskers and also a phase transformation of ZrO₂. The observed increase in the fracture toughness of Y-TZP due to the addition of SiC whiskers was correlated with existing models of toughening mechanisms. Good agreement was achieved between the theoretical predictions and the experimental toughness values, obtained from the Y-TZP/SiC_w composites.     

SiCw/BAS复合材料的显微结构及力学性能的研究

本文采用热压烧结法制备出致密的SiC_w增强BAS玻璃陶瓷基复合材料．结果表明,BAS基体晶化后获得以钡长石为主晶相和莫来石为次晶相的复相BAS玻璃陶瓷．晶须的加入对BAS基体有显著的强韧化效果,加入30vol％SiC_w可使材料的室温抗弯强度和断裂韧性分别由基体的156MPa和1．40MPa·m^1/2提高到356MPa和4．06MPa·m^1/2．TEM观察结果表明,晶须／基体界面结合良好,无界面反应物和非晶层的存在．断口形貌和压痕裂纹扩展路径的SEM观察结果表明,复合材料的主要增韧机制为裂纹偏转、晶须的拔出和桥接．     

ZrB2-SiC陶瓷的注浆成型与无压烧结

研究了以聚乙烯亚胺 (PEI) 为分散剂,ZrB₂粉体在水相中的分散性能. 结果显示ZrB₂的等电点在pH为5.7,加入PEI后的等电点移到pH为11.5. 以PEI为分散剂,在pH为8.0处制备了固含量达45vol%的ZrB₂-20vol%SiC陶瓷浆料. 采用注浆成型方法制备了相对密度为53%的ZrB₂-SiC陶瓷坯体,并对其进行了无压烧结,同时研究了硼粉为烧结助剂对其致密化及性能的影响. 结果表明：硼粉为烧结助剂,实现了ZrB₂-SiC陶瓷的完全致密化的同时,也降低了ZrB₂-SiC陶瓷的烧结温度,2100℃烧结3h后的陶瓷维氏硬度为(17.5±0.5)GPa,弯曲强度为(406±41)MPa,断裂韧性为(4.6±0.4)MPa·m^1/2.     

CaSO4晶须在PVC复合体系中的应用研究

用红外分光光度计、X射线粉末衍射仪和光学显微镜对CaSO4晶须A、B和C进行结构表征和形貌观察。结果表明,晶须A、B和C的长径比为5.2、9.1和3.3,经改性的晶须B晶体结构规整,缺陷最少。分别制备了以3种晶须为补强材料的PVC复合体系,讨论了晶须结构对CaSO4晶须/PVC复合体系的力学性能、绝缘电阻和200℃静态热稳定时间的影响。用光学显微镜、扫描电镜和热重分析仪分析了晶须在复合体系中的分散形态和体系的热稳定性。研究发现,长晶须A和B对复合材料的增强增韧和热稳定作用好于短晶须C、CaCO3和气相法白炭黑。经改性的晶须B与PVC树脂有良好的相容性和界面结构,体系的拉伸强度、断裂伸长率和热稳定时间分别达到了23.20MPa、380.85%和95min,可以看出,长径比大,结晶性良好,且经过改性的CaSO4晶须能明显提高复合体系的综合性能。     

Microstructure and mechanical properties of SiC<Subscript>P</Subscript>/SiC and SiC<Subscript>W</Subscript>/SiC composites by CVI

37.2 vol.% SiC_P/SiC and 25.0 vol.% SiC_W/SiC composites were prepared by chemical vapor infiltration (CVI) process through depositing SiC matrix in the porous particulate and whisker preforms, respectively. The particulate (or whisker) preforms has two types of pores; one is small pores of several micrometers at inter-particulates (or whiskers) and the other one is large pores of hundreds micrometers at inter-agglomerates. The microstructure and mechanical properties of 37.2 vol.% SiC_P/SiC and 25.0 vol.% SiC_W/SiC composites were studied. 37.2 vol.% SiC_P/SiC (or 25.0 vol.% SiC_W/SiC) consisted of the particulate (or whisker) reinforced SiC agglomerates, SiC matrix phase located inter-agglomerates and two types of pores located inter-particulates (or whiskers) and inter-agglomerates. The density, fracture toughness evaluated by SENB method, and flexural strength of 37.2 vol.% SiC_P/SiC and 25.0 vol.% SiC_W/SiC composites were 2.94 and 2.88 g/cm³, 6.18 and 8.34 MPa m^1/2, and 373 and 425 MPa, respectively. The main toughening mechanism was crack deflection and bridging.     

The effect of sintering additive on fracture behavior of carbon-whisker-reinforced silicon carbide composites

Hot-pressed silicon carbide composites reinforced with carbon fiber were prepared. Aluminum and yttrium oxides served as sintering additives and low-cost phase SiC was used as starting powder, instead of the more expensive β-SiC. In the sintering process, the SiC-matrix grains grew larger via solution reprecipitation. Reaction of Al₂O₃/Y₂O₃ additives with SiO₂ on the surface of SiC or its oxidation products caused formation and distribution of a low-eutectic-point phase around the SiC grains and carbon whiskers. Such amorphous films can be found in triple-junctions and boundaries of SiC grains. Excess sintering additives improve the room-temperature flexural strength, but reduce the fracture toughness. Coupled with a higher sintering temperature, they contribute to the diffusion of yttrium ions into carbon fiber, and make the reaction layer thicker. Non-homogeneous amorphous inclusions between grains and whiskers are harmful for mechanical properties. A combination of grain bridging, crack deflection and whisker debonding can improve fracture toughness.