柔性聚酰亚胺衬底非晶硅薄膜太阳电池空间可靠性研究

重点分析了柔性聚酰亚胺衬底非晶硅太阳电池的结构、材料和工艺特点,认为非晶硅薄膜制备工艺和材料本身、聚酰亚胺以及其他封装材料是影响柔性聚酰亚胺衬底非晶硅太阳电池可靠性的关键因素。研究了这些关键材料的典型失效模式及其对柔性聚酰亚胺衬底非晶硅太阳电池可靠性的影响。初步探讨了提高电池空间可靠性的新工艺和新材料。     

一种耐高温聚酰亚胺胶粘剂的合成

以醚胺(ODA)、砜胺(DDS)和醚酐(ODPA)、酮酐(BTDA)为原料,采用冷却法和加热法分别合成了一种耐高温聚酰亚胺胶粘剂。通过搭接试验和聚酰亚胺膜结构表征,比较了两种不同合成方法所得聚酰亚胺胶粘剂的性能差异。通过试验选择了亚胺胶的搭接工艺和固化工艺,从而使聚酰亚胺胶粘剂的粘接性能达到最佳。     

使用聚酰亚胺通过两次刻蚀制备微马达线圈

采用感光性聚酰亚胺和高粘附性聚酰亚胺双层刻蚀技术,在基片上制备了微马达线圈的定子绕组。该工艺不仅工艺简单,而且保留聚酰亚胺作为线圈的绝缘层,提高了微马达线圈的绝缘性能和耐热性能,使微马达的整体性能得到了提高。     

高性能聚酰亚胺纤维

本文综述了聚酰亚胺纤维的性能及其制备工艺,以及聚酰亚胺纤维在结构方面的研究及纤维成型新技术、新工艺。     

基于双酚AF的含氟聚酰亚胺单体合成

以双酚AF为起始原料,分别合成了含氟聚酰亚胺单体2,2-双(3-氨基-4-羟基苯基)六氟丙烷和2,2-双[4-(4-氨基苯氧基)苯基]-1,1,1,3,3,3-六氟丙烷。该两种产品的合成工艺均适合工业化生产。     

聚酰亚胺泡沫材料

介绍了聚酰亚胺泡沫材料的种类、合成方法和制备工艺 ,以及它们在航天航空电子等高科技领域中的应用。指出了聚酰亚胺泡沫的研究发展趋势     

主链含长柔性链的聚酰亚胺的合成与性能研究

以α,ω－二（４－氨基苯氧基）ｎ烷与六氟叉丙基二－（３,４－邻葳二甲酸酐）缩聚并经化学亚胺化合成了主链含长柔性链的聚酰亚胺。该类聚酰亚胺在ＤＭＡ、ＤＭＦ、ＮＭＰ、ＴＨＦ、间甲酚氯仿中有很好的溶解性,且与柔性链的长度无关。     

ODPA/异构ODA共聚酰亚胺的合成及其性能研究

采用3,3′,4,4′-二苯醚四甲酸二酐(3,3′,4,4′-ODPA),4,4′-二氨基二苯醚(4,4′-ODA)和3,4’-二氨基二苯醚(3,4′-ODA)为原料合成了共聚酰亚胺,实验中还以邻苯二甲酸酐(PA)为分子量调节剂,制备了理论分子量为10000的共聚酰亚胺,主要研究了其热性能和结晶性能。结果表明,与均聚型聚酰亚胺(ODPA/4,4′-ODA为原料合成)比较,间位异构体3,4′-ODA的加入使聚酰亚胺的玻璃化转变温度降低。经过等温结晶处理后,能够在DSC测试中出现较明显的熔融峰,而且延长结晶时间或者升高结晶温度有利于晶体的进一步完善。但是当共聚单体3,4′-ODA的加入量增加到10%(摩尔比)时,即使经过较长时间的等温处理,该共聚酰亚胺依然为无定形结构。     

透明聚酰亚胺薄膜

高技术材料透明聚酰亚胺薄膜具有广阔的应用前景。本文介绍了它的结构特征、性能指标和应用领域,描述了一些专利发明的技术要旨,介绍了采用不同技术路线制作透明聚酰亚胺薄膜的方法。指出全面提高我国聚酰亚胺的整体产业化水平应加大研发投入力度,尤其是信息资源的投入。重中之重是强化对专利技术信息的了解与运用。     

脂环族聚酰亚胺的研究进展

脂环族聚酰亚胺因其独特的结构而具有低介电常数和更好的透光性,满足了近年来高端微电子产业对封装材料的性能要求,而受到愈来愈多的关注.综述了近年来国内外脂环族聚酰亚胺领域的研究热点,就脂环族聚酰亚胺的单体一脂环族二酐和二胺的合成方法进行了系统分类和总结,同时从脂环族聚酰亚胺材料的合成、性能及应用等方面进行了阐述.     

Surface properties of aromatic polymer film during thermal treatment

Aromatic polyimide films are processed from polyamic acid solutions. This process involved the simultaneous loss of solvent and chemical conversion of polyamic acid to polyimide, and implied structural reorganization which led to changed physical properties. Polymer films generated from benzophenonetetracarboxylic dianhydride and 4,4′-diamino-3,3′-dimethyl diphenylmethane have been investigated at different stages of thermal treatment. The surface polarity, which was determined by the presence of polar COOH and CONH groups, changed during polyamic acid thermal treatment. These polar groups were removed step by step by imidization process leading to the modification of the physical properties of the polymer film.     

Anisotropic behaviour of the glass transition temperature in thin films of Langmuir-Blodgett deposited side chain polymers

Langmuir-Blodgett (LB) films of side chain polyamic acids were formed, deposited onto optical waveguides and imidized via heating to the corresponding polyimides on the optical waveguides. The LB film formation of the side chain polyamic acids, the imidization reaction and the glass transition behaviour of the polyimide thin films were investigated. Polarisation dependent waveguide mode spectroscopy was applied therefore. It was found that the glass transition temperature (Tg) of bulk and LB thin film samples of these polymers are identical and only depend on the spacer length between the side chain and backbone, not on film thickness. Our investigation shows that in the case of the ultrathin film geometry, the glass transition temperature exhibits an anisotropic behaviour. We find the classical kink in the temperature scan (a change in slope of the free volume vs. temperature plot) due to the thermal expansion change at Tg, in p-polarisation only, which is perpendicular to the main chain orientation. In the s-polarisation measurements (parallel to the main chains) no kink was found, only an offset in the vicinity of Tg. We attribute the anisotropic thermal behaviour to a transition, the freezing of segmental motion, in the side chains only.     

明胶改性聚酰胺酸的合成与表征

通过明胶链上的-NH_2与低分子酸酐封端的聚酰胺酸链端酸酐首先在较高温度下缩合反应生成改性预聚体,然后再对改性预聚体扩链,得到明胶改性聚酰胺酸.通过测定明胶改性聚酰胺酸的特性黏度,研究了改性预聚体反应阶段不同反应条件对聚合物特性黏度的影响,同时采用红外光谱和示差扫描量热测定了明胶改性聚酰胺酸的结构与热性能.结果表明,在改性预聚体合成阶段,当明胶用量为35%、反应温度为40℃和反应时间为25min时,明胶改性聚酰胺酸的特性黏度最大.经过明胶改性,改变了聚酰胺酸的结构,使其化学亚胺化薄膜的玻璃化温度比聚酰胺酸化学亚胺化薄膜的降低39℃.     

Preparation and properties of porous polyimide films with TiO2/polymer double shell hollow spheres

Without the template removal process, double shell hollow spheres were prepared by encapsulating the polymeric hollow spheres with TiO₂ shells. TiO₂ encapsulated hollow spheres were incorporated with the polyamic acid solutions and imidized to prepare the porous polyimide films. The final porous texture of the film depends on the as-doped arrangement and the properties of the hollow spheres. The TiO₂ shell exhibits good thermal stability and chemical resistance to prevent the collapse of hollow spheres during the polyamic acid solution/hollow particle mixing and the imidization procedures. The effects of preparation conditions on the morphology of the encapsulated hollow spheres were investigated. The dielectric constant of the porous polyimide films (pore diameter around 0.6 µm) decreased to 2.8. The influences of hollow particles on the porous textures, the dielectric and dynamic mechanical properties of the porous films were studied.     

聚酰亚胺薄膜增塑形变的结构与性能研究

采用带柔性基团的4,4’-二氨基二苯醚（ODA）和均苯四甲酸二酐（PMDA）为单体用两步法合成聚酰亚胺（PI）。合成过程中,在中间产物聚酰胺酸中加入离子液体（IL）将高分子链阻隔开来,然后再对其进行酰亚胺化得到PI／IL杂化材料．对杂化材料进行热拉伸,然后水洗除去IL,再进行热拉伸致密化处理得到最终的PI。利用动态力学分析（DMA）、红外（IR）、拉伸、和x衍射（XRD）等时材料的微观结构和力学性能进行了研究。结果表明,经离子液体增塑后,PI的拉伸强度提高了3倍,取向度由无取向提高到60％。     

芳香聚酰亚胺化学若干问题

本文以均酐－二苯醚二胺（ＰＭＤＡ－ＯＤＡ）体系为基础，对聚酰亚胺（ＰＩ）的母体聚酰胺酸（ＰＡ）的溶液聚合，及其以薄膜形式实现亚胺化转变为ＰＩ过程的若干重要化学问题和规律及与性能的关系，进行了系统介绍和讨论。     

Surface modification of silica particles with polyimide by ultrasonic wave irradiation

Spherical silica particles were dispersed in a polyamic acid varnish (PAAV) solution, and ultrasonic wave irradiation resulted in high-speed condensation of conversion to polyimide and in coating of the silica particles. The imidization reaction was verified by Fourier transform IR analysis, thermogravimetry, gel-permeation chromatography and moisture analysis. In addition, the particle coating was observed by transmission electron microscopy. Adsorption of polyimide acid onto the surface of the silica particles while achieving an imidization reaction by ultrasonic wave irradiation has been clearly shown to enhance the rate of the imidization reaction.     

可溶性PI／SiO2纳米复合材料中SiO2微相结构变化的研究

选取可溶性聚酰亚胺（PI）作为有机高聚物基本，通过正硅酸四乙酯（TEOS）在聚酰胺酸（PAA）的N－甲基－2－毗咯烷酮（NMP）溶液中进行溶液－凝胶反应,制备出新型的聚酰亚胺／二氧化硅（PI／SiO2)纳米复合材料，并用UV－Vis-FT-IR,SEM和光子相关法等对其溶胶－凝胶转变过程，二氧化硅微相结构的变化进行了研究，并对溶中粒子间的团聚行为作了进一步探讨，结果表明随着处理温度的升高，PAA逐步亚胺化，同时TEOS水解后的硅烃基（Si-OH)逐步缩合，由线型结构向环状结构过渡，原位生成SiO2凝胶网络，实验结果还发现热处理温的升高对二氧化硅元化粒子的尺寸无明显的影响，而光子相关法结果则表明颗粒表面活性Si-OH的存在是引起团聚的一个重要因素。     

含碳硼烷单元聚酰亚胺材料的制备及其耐热机制

聚酰亚胺是先进复合材料重要的基体材料之一。在聚酰亚胺主链中成功引入碳硼烷笼状单元,制备出一系列有机-无机杂化的聚酰亚胺材料。从单体设计入手,设计合成了含邻碳硼烷单元的二胺单体(DNCB),再与4,4’-二氨基二苯醚(ODA)和3,3’,4,4’-苯甲酮四羧酸二酐(BTDA)进行共聚反应,合成前驱体聚酰胺酸(PAA)溶液并制备PAA薄膜,再经高温热亚胺化处理得到含碳硼烷单元的聚酰亚胺。对制备的聚酰亚胺材料的耐热性能和耐热氧化稳定性进行了系统研究,结果表明,碳硼烷单元的引入使聚酰亚胺基体的热稳定性和热氧化稳定性得到显著提升。当二胺单体中DNCB摩尔分数为40%时,N₂气氛下,5wt%热失重温度T_5%提升近13℃,T10%提升近43℃,质量残留率高达82.6wt%;空气氛围下,T_5%提升近36℃,T_10%提升近64℃,质量残留率高达83.1wt%。X-射线光电子能谱(XPS)及扫描电镜(SEM)结果表明在聚酰亚胺主链中引入碳硼烷笼状单元后在高温环境中易在材料表面形成氧化硼(B₂O     

Fabrication of copper nanoparticles in a thick polyimide film cured by rapid thermal annealing

We investigated the imidization of a polyimide (PI) and the formation of Cu nanoparticles in a PI film by curinga precursor of PI (polyamic acid (PAA) dissolved in n-methyl-2-pyrrolidinone) in a reducing atmosphere in the rapid thermal annealing (RTA) system. A Cu film was deposited onto the SiO2/Si substrate, and the PAA was spin-coated onto the Cu film. After the PAA reacted with the Cu film, soft-baking was performed to evaporate the solvent. Finally, the PAA was imidized to PI at 450 degrees C by curing in a reducing atmosphere with the RTA. Fourier transform infrared spectroscopy showed that the PAA was successfully imidized by the RTA. X-ray diffraction patterns revealed that Cu nanoparticles formed by RTA curing at 450 degrees C for 5 minutes in a reducing atmosphere, and transmission electron microscopy showed that Cu nanoparticles about 6.5 nm in size were uniformly dispersed in the PI film. Curing by RTA is an attractive method because it takes only a few minutes.