Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole

The high speed and low power trend has imposed more and more importance on the design of the power distribution network (PDN) using multilayer printed circuit boards (PCBs) for modern microelectronic packages. This paper presents a fast and efficient analysis methodology in frequency domain for the design of a PDN with a power/ground plane pair, which considers the effect of irregular shape of the power/ground plane and densely populated via-holes. The presented method uses parallel-plate transmission line theory with equivalent circuit model of unit-cell grid considering three-dimensional geometric boundary conditions. Characteristics of PDNs implemented by perforated planes including a densely populated via-hole structure is quantitatively determined based on full-wave analysis using the finite-difference time-domain (FDTD) periodic structure modeling method and full-wave electromagnetic field solver. Using a circuit simulator such as popularly used SPICE and equivalent circuit models for via-hole structure and perforations, the authors have analyzed input-impedance of the power/ground plane pair. Since the presented method gives an accurate and fast solution, it is very useful for an early design of multilayer PCBs.     

Time-domain approach for synthesising SPICE-compatible models of power delivery networks of printed circuit board

Resonance noise, or power/ground bounce noise, between the power and ground planes of high-speed circuit packages is one of the main concerns of signal integrity or power integrity issues. A novel time-domain approach is proposed to extract the equivalent circuit models of power/ground planes by time-domain reflection and time-domain transmission waveforms. The extracted model can accurately predict the resonance behaviour of power/ground planes over a wide frequency range. These models can be efficiently incorporated into the HSPICE simulator for the consideration of power/ground bouncing noise in high-speed circuits.     

Efficient Simulation of Power Distribution Network by Using Integral-Equation and Modal-Decoupling Technology

A novel integral-equation equivalent-circuit method is proposed for the efficient electrical simulation of the power distribution network in the electronic package and printed circuit board. The total electromagnetic field inside the power distribution network is decoupled into two modes: the parallel-plate mode sandwiched between the power and ground planes and the transmission line mode propagating along the signal traces. An integral-equation method is then proposed to solve the parallel-plate mode. By discretizing the integral equation, the power-ground planes pair is equivalent to a ground network. Finally, this ground network is recombined with the transmission line mode to simulate the entire power distribution network. Meanwhile, the discontinuity due to the thru-hole via is also considered by an analytic formula. The proposed method decomposes the complex 3-D problem into two simple 2-D problems, and then extracts the equivalent circuits. Therefore, it greatly reduces the computing time and memory requirement. Through several examples, its accuracy and efficiency are validated.     

Composite effects of reflections and ground bounce for signal line through a split power plane

The signal propagating along a microstrip line over a slot on the power plane will suffer from composite effects of reflected noise by a discontinuity in signal return path and ground bounce between power and ground planes. A new equivalent circuit model is proposed and simulations are performed for multilayer structures to characterize these composite effects. An experimental setup is devised to demonstrate significant coupling between signal lines due to the slot-induced ground bounce. Favorable comparison between the simulation and measured results validates the proposed equivalent circuit model and analysis approach.     

Hybrid analytical modeling method for split power bus in multilayered package

As multiple chips are being integrated into a single package with increased operating frequency, switching noise coupling on power buses has become an important design issue. To reduce the noise coupling, a split power bus structure has been generally used in package substrates having multilayered power and ground planes. Consequently, there is an increasing need for an efficient method to analyze a split power bus in a multilayered package. This paper introduces a hybrid analytical modeling method for characterizing a split power bus in a multilayered package. The proposed method uses a resonant cavity model combined with a segmentation method. Furthermore, a port assignment technique and an associated calculation method for the equivalent circuit model parameter of the split gap are proposed. The proposed port assignment technique and the analytical equation make it possible to analyze a split power bus, especially in a multilayered package. To verify the proposed method, multilayered test packages are fabricated and tested by means of frequency-domain measurements. In addition, an optimal power bus design method was successfully demonstrated for suppressing noise coupling between chips on a single package. Finally, the proposed method and optimal power bus design method was verified using a series of frequency-domain and time-domain measurements.     

Modeling and transient simulation of planes in electronic packages

This paper presents a modeling and simulation approach for ground/power planes in high speed packages. A plane pair structure is first characterized in terms of its impedance (Z) matrix at arbitrary port locations in the frequency domain. This solution is then extended for multiple plane pairs under the assumption that skin effect is prominent at higher frequencies causing isolation between the layers. Since the solutions are in analytical form, the frequency and transient response can be computed efficiently requiring small computational time. To develop spice models, equivalent circuits are constructed using resonator models with passive elements using model order reduction methods. This paper also discusses a method for incorporating decoupling capacitors into the plane models. The simulation results show good correlation with measured data     

A bandwidth enhancement technique for mobile handset antennas using wavetraps

A novel technique for enhancing the impedance bandwidth of wireless terminal antennas is presented. By introducing resonant short circuit transmission lines to the long sides of the chassis edges, an effective electrical shortening of the terminal ground plane is achieved. This effect has been used to realize terminal ground planes with resonant lengths at high frequencies, such as GSM 1800/1900 MHz or UMTS 2 GHz, thereby extending the impedance bandwidth. The proposed technique has been validated by simulations and measurements. Three typical applications are presented where the introduction of wavetraps improves the bandwidth and/or in-band performance.     

Cavity resonance suppression in power delivery systems using electromagnetic band gap structures

The utilization of electromagnetic band gap (EBG) structures is a new and promising approach in plane pair noise cavity resonance suppression. In this paper, EBG/plane pair structures are studied with full-wave methods and results are experimentally verified. A new equivalent circuit modeling approach of characterizing the frequency behavior of the entire EBG/plane pair structure is presented. The equivalent circuit of the unit cell is proposed and the procedure to extract circuit parameters is described. The influence of EBG patch parameters on the band gap characteristics is quantified and the results provide some design rules to circuit designers. Examples of applications of EBG structures to power/ground plane noise suppression are given.     

基于EBG结构的新型超宽带低噪声电源/地平面设计

将电磁带隙（EBG）结构加载在电源/地平面之间,依据理论分析对模型结构以及各项参数进行优化.设计出抑制深度为-80 dB、禁带宽度为10 GHz的超宽禁带电源/地平面,在拥有优良抑制电磁干扰能力的同时,也保证了信号的完整性.在禁带内,该平面可以有效地抑制电路之间特别是共用电源/地平面的数字电路与射频电路之间所引起的电磁干扰.仿真实验表明,该设计取得了理想的效果.     

A Novel Time-Domain Approach for Extracting Broadband Models of Power Delivery NetworksWith Resonance Effect

Resonance noise, or power/ground bounce noise, on the power and ground planes of high-speed circuit packages is one of the main concerns of signal integrity or power integrity issues. A novel time-domain approach is proposed to synthesize the broadband models of the power/ground planes with resonance effect. Using waveforms either from measurements by time-domain reflectrometry or simulations by the finite-difference time-domain method, the time-domain step response of the planes is characterized with a pole-residue representation obtained through the matrix pencil method. Lumped circuit equivalent circuit models are then synthesized through the pole-residue representations. The synthesized model can accurately predict the resonance behavior of power/ground planes over a wide frequency range. These models can be efficiently incorporated into the currently available circuit simulator such as HSPICE for the consideration of power/ground bouncing noise in high-speed circuits. Three cases are tested to demonstrate the validity and broadband accuracy of the proposed approach.      

高速电路电源/地层间阻抗参数计算与分析

为了快速准确地计算高速电路地层与电源层之间的阻抗参数,基于边界积分方程提出了有效的计算方法.该方法充分利用了实际电源层/地层的结构特征,将三维电磁场问题转化为二维问题,减少了计算时间.由于在计算中不需要考虑整个 电源层/地层结构的格林函数,故该方法可以用于任意边界形状的电路板.基于提出的积分方程法,分析了介质相对电介质...     

Suspended Ring Resonator for Dielectric Constant Measurement of Foams

The present study introduces a microstrip-based resonant device that is specifically intended for measurements of polymer foam permittivity at frequencies of 1 to 10 GHz. The device utilizes the standard microstrip ring resonator. However, the ring and the ground plane/feed network are physically located in separate planes, enabling the placement of an arbitrary sample of material to be measured in the substrate of the ring resonator. A transmission line model is developed and tested in order to predict the frequency response of the circuit. Experimental data is reported and compared with theory. The measurements indicate a high potential resolution of the method.     

Crossing the planes at high speed. Signal integrity issues at splitground and power planes

This article discusses a specific design situation that represents quite a broad class of problems in the study of signal integrity. The article focuses on the effects on high-speed signals that need to cross split ground planes and split power planes that act as signal references or partial references. Such configurations are frequently needed in the layout of printed circuit boards (PCBs), multichip modules (MCMs), and even single-chip modules. Examples of split ground and power planes are discussed first. The conventional effective inductance model is described briefly, and an accurate and efficient transmission line model is then discussed in detail. Examples of modeling and design trade-offs are also presented     

A small dielectric TEM mode resonator with a crossing slot and itsapplication to a cellular radio VCO

A small TEM-mode dielectric resonator which features a crossing slot on the outer ground conductor plane is presented. The slot, functioning as a short-ended stub line serially inserted into the transmission line, can tune the resonant frequency down. The resonant frequency in a stripline resonator structure is rigorously analyzed by a method based on the spectral domain approach and the equivalent circuit is derived. This resonator is used in a cellular radio VCO with a varactor connected across the slot. The performance of the VCO in the 900-MHZ cellular band is described     

Small signal equivalent circuit modeling of resonant converters

A general analytical procedure is presented for the equivalent circuit modeling of resonant converters, using the series and parallel resonant converters as examples. The switched tank elements of a resonant converter are modeled by a lumped parameter equivalent circuit. The tank element circuit model consists, in general, of discrete energy states, but may be approximated by a low-frequency continuous time model. These equivalent circuit models completely characterize the terminal behavior of the converters and are solvable for any transfer function or impedance of interest. With the approximate model it is possible to predict the lumped parameter poles and zeros, and to quickly determine the relevant DC gains of the output impedance and the control to output transfer function. Closed-form solutions are given for the equivalent circuit models of both converter examples. Experimental verification is presented for the control-to-output transfer functions of both series and parallel resonant converters, and good agreement between theoretical prediction and experimental measurement is obtained     

Modeling and analysis of power distribution networks for Gigabit applications

As the operating frequency of digital systems increases and voltage swing decreases, it becomes very important to characterize and analyze power distribution networks (PDNs) accurately. This paper presents the modeling, simulation, and characterization of the PDN in a high-speed printed circuit board (PCB) designed for chip-to-chip communication at a data rate of 3.2 Gbps. The test board consists of transmitter and receiver chips wirebonded onto plastic ball grid array (PGBA) packages on a PCB. In this paper, a hybrid method has been applied for analysis, which consists of the transmission matrix method (TMM) in the frequency domain and macromodeling method in the time domain. As an initial step, power/ground planes have been modeled using TMM. Then, the macromodel of the power/ground planes has been generated at the desired ports using macromodeling. Finally, the macromodel of the planes, transmission lines, and nonlinear drivers have been simulated in standard SPICE-based circuit simulators for computing power supply noise. In addition to noise computation, the self and transfer impedances of power/ground planes have been computed and the effect of decoupling capacitors on power supply noise has been analyzed. The methods discussed have been validated using hardware measurements.     

Reducing power bus impedance at resonance with lossy components

Power bus structures in printed circuit boards with solid power and ground planes exhibit resonances. When the power bus is resonant, the power bus impedance can increase dramatically. This paper explores the effect of component equivalent series resistance (ESR) on power bus resonances. General guidelines for selecting an optimum ESR are provided and are supported by laboratory measurements and numerical simulations.     

Modeling of multilayered power distribution planes using transmission matrix method

This paper presents a method for analyzing multilayered rectangular and irregular shaped power distribution planes in the frequency and time domain. The analysis includes the effect of vias on the power distribution network. The planes are modeled using a two dimensional array of distributed RLCG circuit elements. Planes are connected in parallel using vias, which are modeled as self and mutual inductors. For the computation of the power distribution impedances at specific points in the network, a multiinput and multioutput transmission matrix method has been used. This is much faster than Spice and requires smaller memory. Using the transmission matrix method, via effects and the effects of multiple rectangular power/ground plane pairs without and with decoupling capacitors have been analyzed for realistic structures.     

基于PEEC结合网络缩减算法和递归卷积分析高速MCM电路中同步开关噪声

本文提出了一种分析高速MCM电路系统中电源/接地板上同步开关噪声的高效方法,即基于PEEC结合块缩减算法和递归卷积公式.该方法具有参数提取简单、高效率、高精度特点.同时,还提出了一种分级建模方法,若已知小尺寸电源/接地板的时域宏模型,利用该方法可在时域直接分析大尺寸电源/接地板上同步开关噪声.最后,不仅运用平面电路公式验证了新方法的精度,而且还通过分析高速MCM电源/接地板上同步开关噪声的两个例子,进一步阐明该方法的精度高、效率高特点.