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1.
用透射电子显微镜(TEM)和X射线双晶衍射仪(DCXRD)对在Si(111)衬底上生长的InGaN/GaN多量子阱(MQW)LED外延材料的微结构进行了观察和分析.从TEM高分辨像观察到,在Si和AlN界面处未形成SixNy非晶层,在GaN/AlN界面附近的GaN上有堆垛层错存在,多量子阱的阱(InGaN)和垒(GaN)界面明锐、厚度均匀;TEM和DCXRD进一步分析表明MQW附近n型GaN的位错密度为10acm-2量级,其中多数为b=1/3〈112-0〉的刃位错.  相似文献   

2.
本文采用高分辨透射电子显微技术对在Si衬底生长的GaN基多量子阱外延材料的位错特征、外延层与衬底的晶体取向关系及界面的结晶形态等微观结构进行了分析和研究.结果表明:Si衬底生长的GaN与衬底有一定的取向关系;材料在MQW附近的穿透位错密度达108 cm-2量级,且多数为刃型位错;样品A的多量子阱下方可见平行于界面方向的...  相似文献   

3.
用透射电子显微镜对Si衬底生长GaN/InGaN多量子阱材料进行横断面测试,在衬底和缓冲层区域进行高分辨电子显微成像(HRTEM)、电子衍射衬度成像、选区电子衍射成像,在量子阱附近区域进行了双束近似电子衍衬像对其位错特性进行研究;用场发射扫描电子显微镜对饱和KoH溶液腐蚀前后材料成像.结果发现,AIN缓冲层具有多孔结构,高温GaN层位错平均密度达108cm-2,同扫描电子显微镜得到的六角腐蚀坑密度一致,量子阱以下发现大量位错发生90°弯曲,而使穿过量子阱位错密度大大降低.在线位错中,以刃位错居多,其次是混合位错,所观察区域几乎未见螺位错.  相似文献   

4.
用透射电子显微镜对Si衬底生长GaN/InGaN多量子阱材料进行横断面测试,在衬底和缓冲层区域进行高分辨电子显微成像(HRTEM)、电子衍射衬度成像、选区电子衍射成像,在量子阱附近区域进行了双束近似电子衍衬像对其位错特性进行研究;用场发射扫描电子显微镜对饱和KoH溶液腐蚀前后材料成像.结果发现,AIN缓冲层具有多孔结构,高温GaN层位错平均密度达108cm-2,同扫描电子显微镜得到的六角腐蚀坑密度一致,量子阱以下发现大量位错发生90°弯曲,而使穿过量子阱位错密度大大降低.在线位错中,以刃位错居多,其次是混合位错,所观察区域几乎未见螺位错.  相似文献   

5.
设计了InGaN/GaN超晶格垒层替代p-GaN和n-GaN附近传统GaN垒层的InGaN/GaN多量子阱(MQW)发光二极管(LEDs)结构。通过数值方法模拟出两种LED结构的光功率-电压(L-V)曲线、电致发光(EL)谱、能带图、电子浓度分布和辐射复合速率。结果表明InGaN/GaN超晶格替代n-GaN附近GaN垒层的LED结构比替代p-GaN附近GaN垒层的LED显示出更高的发光强度。这种发光增强的原因是InGaN/GaN超晶格替代n-GaN附近GaN垒层可以提高电子注入效率和辐射复合速率。  相似文献   

6.
InGaN基量子阱作为太阳电池器件的有源区时,垒层厚度设计以及实际生长对其光学特性的影响极为重要.采用金属有机化学气相沉积(MOVCD)技术,在蓝宝石衬底上外延生长了垒层厚度较厚的InGaN/GaN多量子阱,使用高分辨X射线衍射和变温光致发光谱研究了垒层厚度对InGaN多量子阱太阳电池结构的界面质量、量子限制效应及其光学特性的影响.较厚垒层的InGaN/GaN多量子阱的周期重复性和界面品质较好,这可能与垒层较薄时对量子阱的生长影响有关.同时,厚垒层InGaN/GaN多量子阱的光致发光光谱峰位随温度升高呈现更为明显的“S”形(红移-蓝移-红移)变化,表现出更强的局域化程度和更高的内量子效率.  相似文献   

7.
硅衬底GaN基LED外延生长的研究   总被引:1,自引:1,他引:0  
采用在AlN缓冲层后原位沉积SiN掩膜层,然后横向外延生长GaN薄膜.通过该法在硅衬底上获得了1.7 μm无裂纹的GaN薄膜,并在此基础上外延生长出了GaN基发光二极管(LED)外延片,其外延片的总厚度约为1.9 μm.采用高分辨率双晶X-射线衍射(DCXRD)、原子力显微镜(AFM)测试分析.结果表明,GaN薄膜(0002)面的半峰全宽(FWHM)降低到403 arcsec,其表面平整度得到了很大的改善;InGaN/GaN多量子阱的界面较平整,结晶质量良好.光致发光谱表明,GaN基LED峰值波长为469.2 nm.  相似文献   

8.
采用金属有机物化学气相沉积(MOCVD)技术生长了具有高In组分InGaN阱层的InGaN/GaN多量子阱(MQW)结构,高分辨X射线衍射(HRXRD)ω-2θ扫描拟合得到阱层In含量28%。比较大的表面粗糙度表明有很大的位错密度。室温下光致荧光(PL)研究发现该量子阱发射可见的红橙光,峰位波长在610 nm附近。变温PL(15~300 K)进一步揭示量子阱在低温下有两个发光机制,对应的发射峰波长分别为538 nm和610 nm。由于In分凝和载流子的局域化导致的载流子动力改变,使得量子阱PL发光峰值随温度增加呈明显的"S"变化趋势。  相似文献   

9.
对氮化镓(InGaN/GaN)型MQW(多量子阱)结构的蓝宝石衬底LED(发光二极管)受自发和压电极化效应的影响进行了研究。为了分析LED的输出特性,利用MATLAB软件对传统水平结构的InGaN/GaN型MQW蓝光LED芯片进行了模拟。研究表明,LED各个界面极化电荷同比例增加能稍微改善LED的电学特性,但却显著降低了LED的光输出功率和内量子效率,这主要是由于界面电荷改变了能带结构,阻碍了空穴的扩散与漂移,降低了辐射复合系数。可以通过改变位错密度来降低极化电荷对LED的影响,改善LED的性能。  相似文献   

10.
对蓝宝石衬底上的InGaN/GaN和InGaN/AlGaN多量子阱结构和经激光剥离去除衬底的InGaN/GaN和InGaN/AlGaN多量子阱结构薄膜样品,进行了光致发光谱、高分辨XRD和喇曼光谱测量.PL测量结果表明,相对于带有蓝宝石衬底的样品,InGaN/GaN多量子阱薄膜样品的PL谱峰值波长发生较小的蓝移,而InGaN/AlGaN多量子阱薄膜样品的PL谱峰值波长发生明显的红移;喇曼光谱的结果表明,激光剥离前后E2模的峰值从569.1减少到567.5cm-1.这说明激光剥离去除衬底使得外延层整体的压应力得到部分释放,但InGaN/GaN与InGaN/AlGaN多量子阱结构中阱层InGaN的应力发生了不同的变化.XRD的结果证实了这一结论.  相似文献   

11.
Waveguide multilayer optical card (WMOC) is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling & processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic (VB) language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.  相似文献   

12.
IntroductionNanoimprint Lithography is a well-acknowl-edged low cost, high resolution, large area pattern-ing process. It includes the most promising methods,high-pressure hot embossing lithography (HEL) [2],UV-cured imprinting (UV-NIL) [3] and micro contactprinting (m-CP, MCP) [4]. Curing of the imprintedstructures is either done by subsequent UV-lightexposure in the case of UV-NIL or by cooling downbelow the glass transition temperature of the ther-moplastic material in case of HEL…  相似文献   

13.
The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.  相似文献   

14.
Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.  相似文献   

15.
A doping system consisting of NPB and PVK is employed as a composite hole transporting layer (CHTL). By adjusting the component ratio of the doping system, a series of devices with different concentration proportion of PVK : NPB are constracted. The result shows that doping concentration of NPB enhances the competence of hole transporting ability, and modifies the recombination region of charge as well as affects the surface morphology of doped film. Optimum device with a maximum brightness of 7852 cd/m^2 and a power efficiency of 1.75 lm/W has been obtained by choosing a concentration proportion of PVK : NPB at 1:3.  相似文献   

16.
An insert layer structure organic electroluminescent device(OLED) based on a new luminescent material (Zn(salen)) is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn(salen)/Liq/LiF/A1/CuPc/NPD/Zn(salen)/Liq/LiF/A1. Effective insert electrode layers comprising LiF(1nm)/Al(5 nm) are used as a single semitransparent mirror, and bilayer cathode LiF(1 nm)/A1(100 nm) is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.  相似文献   

17.
Due to variable symbol length of digital pulse interval modulation(DPIM), it is difficult to analyze the error performances of Turbo coded DPIM. To solve this problem, a fixed-length digital pulse interval modulation(FDPIM) method is provided. The FDPIM modulation structure is introduced. The packet error rates of uncoded FDPIM are analyzed and compared with that of DPIM. Bit error rates of Turbo coded FDPIM are simulated based on three kinds of analytical models under weak turbulence channel. The results show that packet error rate of uncoded FDPIM is inferior to that of uncoded DPIM. However, FDPIM is easy to be implemented and easy to be combined, with Turbo code for soft-decision because of its fixed length. Besides, the introduction of Turbo code in this modulation can decrease the average power about 10 dBm, which means that it can improve the error performance of the system effectively.  相似文献   

18.
It is a key problem to accurately calculate beam spots' center of measuring the warp by using a collimated laser. A new method, named double geometrical center method (DGCM), is put forward for the first time. In this method, a plane wave perpendicularly irradiates an aperture stop, and a charge couple device (CCD) is employed to receive the diffraction-beam spots, then the geometrical centers of the fast and the second diffraction-beam spots are calculated respectively, and their mean value is regarded as the center of datum beam. In face of such adverse instances as laser intension distributing defectively, part of the image being saturated, this method can still work well. What's more, this method can detect whether an unacceptable error exits in the courses of image receiving, processing and calculating. The experimental results indicate the precision of this method is high.  相似文献   

19.
DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.  相似文献   

20.
From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.  相似文献   

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