Formation mechanism of InxGa1−xAs ohmic contacts to n-type GaAs prepared by radio frequency sputtering

The formation mechanisms of InAs/Ni/W ohmic contacts to n-type GaAs prepared by radio-frequency (rf) sputtering were studied by measuring contact resistances (R_c) using a transmission line method and by analyzing the interfacial structure mainly by x-ray diffraction and transmission electron microscopy. Current-voltage characteristics of the InAs/Ni/W contacts after annealing at temperatures above 600°C showed “ohmic-like behavior.” In order to obtain the “ohmic” behavior in the contacts, pre-heating at 300°C prior to high temperature annealing was found to be essential. The contacts showed ohmic behavior after annealing at temperatures in the range of 500∼850°C and contact resistance values of as low as ∼0.3Ω-mm were obtained. By analyzing the interfacial structures of these contacts, In_xGa_1−xAs layers with low density of misfit dislocations at the In_xGa_1−xAs and GaAs interface were observed to grow epitaxially on the GaAs substrate upon heating at high temperatures. This intermediate In_xGa_1−xAs layer is believed to divide the high energy barrier at the contact metal and GaAs interface into two low barriers, resulting in reduction of the contact resistance. In addition, Ni was found to play a key role to relax a strain in the In_xGa_1−xAs layer (introduced due to lattice mismatch between the In_xGa_1−xAs and GaAs) by forming an intermediate Ni_xGaAs layer on the GaAs surface prior to formation of the In_xGa_1−xxAs layer.     

Dislocation-Induced deep level states in In0.08Ga0.92As/GaAs heterostructures

We have performed luminescence experiments on In_0.08Ga_0.92As/GaAs heterointerfaces to explore the energy distribution of deep level states in the bandgap for two cases: (1) unrelaxed, pseudomorphic In_0.08Ga_0.92As films (200Å thick), which have few if any dislocations at the interface, and (2) partially relaxed In_0.08Ga_0.92As films (1000Å thick) which are expected to have a substantial interfacial dislocation density. A combined photoluminescence and cathodoluminescence technique is used which allows us to profile the sample luminescence through the buried interface region. Our results show the existence of deep level luminescent features characteristic of the GaAs substrate and features common to In_0.08Ga_0.92As and GaAs, as well as the existence of a deep level feature near 1 eV photon energy which undergoes a shift in energy depending upon the degree of strain relaxation in the In_0.08Ga_0.92As film. In addition, a deep level feature near 0.83 eV becomes prominent only in In_0.08Ga_0.92As films which have relaxed, and thus contain misfit dislocations at the interface. These deep level differences may be due to bandgap states associated with the intrinsic dislocation structure, impurities segregated at the dislocation, or bulk point defects, or threading dislocations generated during the strain relaxation. Previous work has determined that a deep level state 0.7 eV above the valence band edge would account for the electrical behavior of relaxed In_0.08Ga_0.92As/GaAs interfaces, which is in good agreement with the range of deep level transitions near 0.8 eV photon energy which we observe. These measurements suggest that photo- and cathodoluminescence measurements of deep level emission in these III-V semiconductors can provide a useful indicator of electrically active defect densities associated with misfit dislocations.     

Low threading dislocation density GaAs on Si(100) with InGaAs/GaAs strained-layer superlattice grown by migration-enhanced epitaxy

This paper reports a promising approach for reducing the density of threading dislocations in GaAs on Si. In _x Ga_1-x As/GaAs strained-layer superlattices (SLSs) grown by migration-enhanced epitaxy at 300° C on GaAs/Si acted as barriers to threading dislocations. Unlike conventional high-temperature-grown SLSs, the low-temperature-grown SLSs were hardly relaxed by the formation of misfit dislocations at GaAs/SLS interfaces, and this allowed them to accumulate considerable strain. New threading dislocation generation due to the misfit dislocation was also suppressed. These factors caused effective bending of threading dislocations and significantly reduced the dislocation density. For the samples that had an SLS withx = 0.3, the average etch-pit density was 7 × 10⁴ cm^-2, which is comparable to that of GaAs substrates.     

S-Graded Buffer Layers for Lattice-Mismatched Heteroepitaxial Devices

We have conducted a theoretical study of the equilibrium strain and misfit dislocation density profiles for ??S-graded?? buffer layers of In _x Ga_1?x As on GaAs (001) substrates in which the compositional profile follows a normal cumulative distribution function. On the basis of this modeling work we show that the S-graded layer exhibits misfit dislocation-free regions near the substrate interface and the free surface (or device interface). The equilibrium peak misfit dislocation density as well as the thicknesses of the dislocation-free regions may be tailored by design of the compositional profile; this in turn should enable minimization of the density of electronically active threading dislocations at the top surface. S-graded buffer layers may therefore facilitate the achievement of metamorphic device structures with improved performance compared with similar structures having uniform or linearly graded buffers.     

Critical Layer Thickness in Exponentially Graded Heteroepitaxial Layers

Exponentially graded semiconductor layers are of interest for use as buffers in heteroepitaxial devices because of their tapered dislocation density and strain profiles. Here we have calculated the critical layer thickness for the onset of lattice relaxation in exponentially graded In _x Ga_1?x As/GaAs (001) heteroepitaxial layers. Upwardly convex grading with \( x = x_{\infty } \left( {1 - {\rm e}^{ - \gamma /y} } \right) \) was considered, where y is the distance from the GaAs interface, γ is a grading length constant, and x _∞ is the limiting mole fraction of In. For these structures the critical layer thickness was determined by an energy-minimization approach and also by consideration of force balance on grown-in dislocations. The force balance calculations underestimate the critical layer thickness unless one accounts for the fact that the first misfit dislocations are introduced at a finite distance above the interface. The critical layer thickness determined by energy minimization, or by a detailed force balance model, is approximately \( h_{\rm{c}} \approx <Exponentially graded semiconductor layers are of interest for use as buffers in heteroepitaxial devices because of their tapered dislocation density and strain profiles. Here we have calculated the critical layer thickness for the onset of lattice relaxation in exponentially graded In _x Ga_1−x As/GaAs (001) heteroepitaxial layers. Upwardly convex grading with x = x_￥ ( 1 - e ^{- g/y} ) x = x_{\infty } \left( {1 - {\rm e}^{ - \gamma /y} } \right) was considered, where y is the distance from the GaAs interface, γ is a grading length constant, and x _∞ is the limiting mole fraction of In. For these structures the critical layer thickness was determined by an energy-minimization approach and also by consideration of force balance on grown-in dislocations. The force balance calculations underestimate the critical layer thickness unless one accounts for the fact that the first misfit dislocations are introduced at a finite distance above the interface. The critical layer thickness determined by energy minimization, or by a detailed force balance model, is approximately h_c ? < h_{\rm{c}} \approx < Although these results were developed for exponentially graded In _x Ga_1−x As/GaAs (001), they may be generalized to other material systems for application to the design of exponentially graded buffer layers in metamorphic device structures such as modulation-doped field-effect transistors and light-emitting diodes.     

Internal strain and dislocations in Ga1−xAs crystals grown by liquid phase epitaxy/electroepitaxy

Strain relaxed, low dislocation density In_xGa_1−xAs crystals, 0 < x <0.2, have been successfully grown by liquid phase electroepitaxy on the GaAs substrate, despite the crystal/substrate lattice mismatch. Residual strain in these novel substrates is below 10⁻⁴, at least an order of magnitude lower than in the molecular beam epitaxially (MBE) or metalorganic chemical vapor deposition-grown ternary buffer layers of similar composition. Threading dislocation density induced by both the crystal/substrate lattice mismatch and unavoidable composition variations has been reduced from the low 10⁶ cm⁻² range, while growing directly on GaAs, to the mid 10⁴ cm^-2 by employing both the MBE grown ternary buffer layer and selective lateral overgrowth of an SiO₂ mask which, prior to the crystal growth, was deposited on the buffer layer and patterned by photolithography with 10 μm wide, oxide free seeding windows. The full width at half maximum of the rocking curves measured for In_xGa_1−xAs crystals grown by liquid phase epitaxy/electroepitaxy on patterned, closely lattice matched buffer layers was in the 20–23 arc s range. Further reduction of the dislocation density and a more uniform dislocation distribution is expected by modifying the initial growth conditions, improving substrate preparation, and optimizing the seeding window geometry.     

Efficient 2.0–2.6 μm wavelength photoluminescence from narrow bandgap InAsP/InGaAs double heterostructures grown on InP substrates

Photoluminescence spectra and efficiency have been measured for several strained InAs_yP_1−yIn_xGa_1−xAs (0.28 < y ≤ 0.62; 0.66 ≤ x ≤ 0.83) double heterostructures grown by vapor phase epitaxy on InP substrates with graded InAsP buffer layers. Luminescence peak positions between the wavelengths of 1.99 and 2.57 (μm at a temperature of 295K are consistent with bandgap luminescence from the In_xGa_1−xAs active regions. Despite a high density of dislocations in the buffer layers, internal radiative recombination efficiencies of from 25 to 50% for the structures are found at 295K.     

Characterization survey of Ga<Subscript>x</Subscript>In<Subscript>1−x</Subscript>As/InAs<Subscript>y</Subscript>P<Subscript>1−y</Subscript> double heterostructures and InAs<Subscript>y</Subscript>P<Subscript>1−y</Subscript> multilayers grown on InP

Low-bandgap, lattice-mismatched Ga_xIn_1−xAs (GaInAs) grown using InAs_yP_1−y (InAsP) compositional-step grades on InP is a primary choice for lightabsorbing, active layers in high-efficiency thermophotovoltaic (TPV) devices. The GaInAs/InAsP double heterostructures (DHs) show exceptional minority carrier lifetimes of up to several microseconds. We have performed a characterization survey of 0.4–0.6-eV GaInAs/InAsP DHs using a variety of techniques, including transmission electron microscopy (TEM). Dislocations are rarely observed to thread into the GaInAs active layers from the InAsP buffer layers that terminate the graded regions. Nearly complete strain relaxation occurs in buried regions of the InAsP grades. The buffer-layer strain prior to deposition of the active layer is virtually independent of the net misfit. Foreknowledge of this buffer-layer strain is essential to correctly lattice match the buffer to the GaInAs active layer.     

Orthorhombic distortion of mismatched In X Ga1−X As/InP heterostructures

Thin, mismatched epilayers tetragonally distort to form coherent interfaces. Beyond the critical thickness, misfit dislocations relieve strain. These dislocations form in an asymmetric pattern on (001) zinc-blende substrates. We show that this results in a change of crystal symmetry from tetragonal to orthorhombic for partially relaxed, mismatched In _x Ga_1−x As epilayers in either tension or compression on InP. This distortion is detected by both double-crystal x-ray diffraction and ellipsometry. The orthorhombic symmetry must be taken into account when measuring the composition of partially-relaxed epilayers by x-ray diffraction.     

Critical thickness determination of InxGa1-xAs/GaAs strained-layer system by transmission electron microscopy

The critical thicknesses of In_xGa_1-xAs/GaAs and GaAs/In_xGa_1-xAs/GaAs strained-layer systems were determined by transmission electron microscopy using the lift-off technique. The onset of misfit dislocation generation has been observed for the first time and the geometries of the misfit dislocations in both uncapped and capped layers correspond to the predicted models. A comparison is given between the predicted and experimental critical thicknesses.     

Improved quality of AlxGa1−x as grown on se-Doped AlxGa1−x as substrate-Layers by metalorganic chemical vapor deposition

Al_xGa_1−xAs epilayers were grown directly on different Al_xGa_1−xAs substrate-layers by metalorganic chemical vapor deposition (MOCVD). The quality of Al_xGa_1−-xAs layers was significantly improved when Se-doped Al_xGa_1−xAs substrate-layers were used. Al_0.13Ga_0.87As epilayers with excellent morphology, optical, and crystal quality were grown on Se-doped Al_0.26Ga_0.74As. The full width at half maximum of the bound exciton peak as low as 4.51 meV was measured by low-temperature (14.9K) photoluminescence. The improvement is attributed to a Se passivation effect at the surface of Se-doped Al_xGa_1−xAs substrate-layers. Results suggest that Se will reduce and delay the formation of native oxides.     

Metallurgical amd electroluminescence characteristics of vapor-phase and liquid-phase epitaxial junction structures of InxGa1−xAs

In_xGa_1−xAs (x = 0.05 to 0.32) p-n junction structures have been grown on GaAs substrates by vapor-phase epitaxy (VPE) and liquid-phase epitaxy (LPE). It is shown that by step-grading the VPE material, lattice-mismatch strain can be absorbed by dislocations at the grading interfaces, leaving the final constant-composition device layers relatively dislocation free. In contrast, the dislocation density for LPE In_xGa_1−xAs increases with increasing InAs concentration. For both materials, diffusion lengths, electroluminescence efficiencies, and 77°K laser-diode parameters (threshold and efficiency) can be correlated with their dislocation densities. The VPE materials have electrical and luminescence properties that are independent of InAs concentration, and match those of their GaAs counterparts. The LPE materials exhibit properties that degrade with increasing InAs concentration. This research was supported in part by the Air Force Avionics Laboratory, WPAFB, Ohio, under Contract No. F33615-73-C-1177     

High C-doping of MOVPE grown thin AlxGa1−xAs layers for AlGaAs/GaAs interband tunneling devices

High hole concentrations in LP-MOVPE grown GaAs and AlGaAs layers can be achieved by intrinsic C-doping using TMGa and TMAl as carbon sources. Free carrier concentrations exceeding 10²⁰ cm⁻³ were realised at low growth temperatures between 520–540°C and V/III ratios <1.2. The C-concentration increases significantly with the Al-content in Al_xGa_1−xAs layers. We observed an increase in the atom- and free carrier concentration from 5·10¹⁹ cm⁻³ in GaAs to 1.5·10²⁰ cm⁻³ in Al_0.2Ga_0.8As for the same growth conditions. Interband tunneling devices with n-type Si and p-type C-doped AlGaAs layers and barriers made of Al_0.25Ga_0.26In_0.49P have been investigated.     

The thermal stability of lattice mismatched InGaAs grown on patterned GaAs

Patterning and etching substrates into mesas separated by trenches before the growth of mismatched (by about 1% or less) epitaxial layers considerably reduces the interface misfit dislocation density when the layer thickness exceeds the critical thickness. Such films are in a metastable state, since misfit dislocations allow the epitaxial layers to relax to an in-plane lattice parameter closer to its strain-free value. Thermal annealing (from 600 to 850° C) has been used to study the stability of these structures to explore the properties of the misfit dislocations and their formation. The misfit dislocation density was determined by counting the dark line defects at the InGaAs/GaAs interface, imaged by scanning cathodoluminescence. InGaAs epitaxial layers grown on patterned GaAs substrates by organometallic chemical vapor deposition possess a very small as-grown misfit dislocation density, and even after severe annealing for up to 300 sec at 800° C the defect density is less than 1500 cm⁻¹ for a In_0.04Ga_0.96As, 300 nm thick layer (about 25% of the dislocation density found in unpatterned material that has not been annealed). The misfit dislocation nucleation properties of the material are found to depend on the trench depth; samples made with deeper (greater than 0.5 μm) trenches are more stable. Molecular beam epitaxially grown layers are much less stable than the above material; misfit dislocations nucleate in much greater numbers than in comparable organo-metallic chemical vapor deposited material at all of the temperatures studied.     

Properties and use of ln0.5(AlxGa1-x)0.5P and AlxGa1-x as native oxides in heterostructure lasers

Data are presented demonstrating the formation of native oxides from high Al composition In_0.5(Al_xGa_1-x)_0.5P (x≳ 0.9) by simple annealing in a “wet” ambient. The oxidation occurs by reaction of the high Al composition crystal with H₂O vapor (in a N₂ carrier gas) at elevated temperatures (≥500° C) and results in stable transparent oxides. Secondary ion mass spectrometry (SIMS) as well as scanning and transmission electron microscopy (SEM and TEM) are employed to evaluate the oxide properties, composition, and oxide-semiconductor interface. The properties of native oxides of the In_0.5(Al_xGa_1-x)_0.5P system are compared to those of the Al_xGa_1-xAs system. Possible reaction mechanisms and oxidation kinetics are considered. The In_0.5(Al_xGa_1-x)_0.5P native oxide is shown to be of sufficient quality to be employed in the fabrication of stripe-geometry In_0.5(Al_xGa_1-x)_0.5P visible-spectrum laser diodes.     

Visible light-emitting diodes grown on optimized ∇x[InxGa1−x]P/GaP epitaxial transparent substrates with controlled dislocation density

Epitaxial transparent-substrate light-emitting diodes (ETS-LEDs) have been fabricated on optimized graded buffers of In_xGa_1−xP on GaP (∇_x[In_xGa_1−x]P/GaP) that feature controlled threading dislocation densities of 3×10⁶ cm⁻². The ETSLEDs show increasing efficiency from 575 nm to 655 nm, in marked contrast to previous reports where performance drops above 600 nm, and feature the lowest spectral widths ever reported in ∇_x[In_xGa_1−x]P/GaP. The improvement over earlier reports is attributed to large mean dislocation spacings in optimized ∇_x[In_xGa_1−x]P/GaP, which are an order of magnitude greater than the mean carrier diffusion length. A slight performance decline remains at 655 nm, but the overall performance of this first generation of ETS-LEDs is promising.     

Electron microscope studies of InxGav1−xAs/GaAs/Si grown by metalorganic chemical vapor deposition

The microstructure of In_xGa_1−xAs/GaAs (5 nm/5 nm, x < 0 to 1.0), as grown by a metalorganic chemical vapor deposition two-step growth technique on Si(100) at 450‡C, and subsequently annealed at 750‡C, is investigated using plan-view and cross-sectional transmission electron microscopy. The variations in resultant island morphology and strain as a function of the In content were examined through the comparison of the misfit dislocation arrays and moirés observed. The results are discussed in relation to the ways in which the island relaxation process changes for high In content.     

Local electronic properties of AlGaN/GaN heterostructures probed by scanning capacitance microscopy

Local electronic properties in Al_xGa_1−xN/GaN heterostructure field-effect transistor epitaxial layer structures are probed using scanning capacitance microscopy. Acquisition of scanning capacitance images over a wide range of bias voltages combined with theoretical analysis and numerical simulation allows the presence, detailed nature, and possible structural origins of nanometer- to micronscale inhomogeneities in electronic structure to be elucidated. Substantial lateral variations in local threshold voltages for transistor channel formation are observed, at length scales ranging from submicron to >2 μm, and found to arise primarily from local variations in Al_xGa_1−xN layer thickness. Features in electronic structure are also observed that are consistent with the existence of networks of negatively charged threading edge dislocations, as might be formed at island coalescence boundaries during epitaxial growth. The negative charge associated with these structures appears to lead to local depletion of carriers from the channel in the Al_xGa_1−xN/GaN transistor epitaxial layer structure.     

Structural and optical investigation of InGaN/GaN multiple quantum well structures with various indium compositions

We have studied the influence of indium (In) composition on the structural and optical properties of In_x Ga_1−xN/GaN multiple quantum wells (MQWs) with In compositions of more than 25% by means of high-resolution x-ray diffraction (HRXRD), photoluminescence (PL), and transmission electron microscopy (TEM). With increasing the In composition, structural quality deterioration is observed from the broadening of the full width athalf maximum of the HRXRD superlattice peak, the broad multiple emission peaks oflow temperature PL, and the increase of defect density in GaN capping layers and InGaN/GaN MQWs. V-defects, dislocations, and two types of tetragonal shape defects are observed within the MQW with 33% In composition by high resolution TEM. In addition, we found that V-defects result in different growth rates of the GaN barriers according to the degree of the bending of InGaN well layers, which changes the period thickness of the superlattice and might be the source of the multiple emission peaks observed in the In_xGa_1−xN/GaN MQWs with high in compositions.     

In0.2Ga0.8As/GaAs quantum well laser with C doped cladding and ohmic contact layers

Carbon doping in Al_xGa_1−xAs was achieved using different approaches. The moderate growth temperature of 650°C was employed to grow C bulk-doped Al_xGa_1−xAs with a high Al mole fraction. The hole-density was altered using different V/III ratios. The trimethylaluminum (TMAl) was used as an effective C δ-doping precursor for growth of C δ-doped pipi doping superlattices in Al_xGa_1−xAs. the average hole-density of C δ-doped pipi superlattices was greater than 2−3 × 10¹⁹ cm⁻³. Zn-free GRINSCH In_0.2Ga_0.8As/GaAs laser structures were then grown using the C bulk-doped Al_xGa_1−xAs and C δ-doped pipi superlattice as a cladding and ohmic contact layer, respectively. The ridge waveguide laser diodes were fabricated and characterized to verify flexibility of these two doping approaches for device structures.