10%占空比大功率半导体激光器线阵列

利用金属有机化合物气相淀积(MOCVD)技术生长了分别限制应变单量子阱激光器材料。利用该材料制成半导体激光(LD)线阵列的峰值波长为939．5nm．光谱的半高全宽(FWHM)为2．3nm．在400μs、250Hz的输入电流下，输出峰值功率达到65W(75A)．斜率效率高达1W／A．阈值电流密度为185A／cm^2，最高转换效率可达42%。     

900mm高功率半导体激光器线阵列

利用金属有机化台物气相淀积(MOCVD）技术生长了InGaAs/GaAs分别限制应变单量子阱激光器工作物质。利用它制成半导体激光器线阵列，其峰值波长为900nm，光谱半高全宽小于4nm，在脉宽1000μs、13Hz的输入电流抽运下．输出峰值功率接近60W（室温，电流87A)，斜率效率为0．64W／A。     

双端抽运的30 W光纤激光器实验研究

报道了双端抽运连续输出的掺Yb^3 双包层高功率光纤激光器。实验采用了中心波长在975nm附近的两种输出形式的半导体激光器(LD)作为抽运源，测量了不同抽运条件下的输出功率特性和光谱特性。在仅尾纤输出的半导体激光器抽运下获得了斜率效率为42％，峰值波长为1103．8nm的9．2W激光输出；在仅准直输出的半导体激光器抽运下获得了斜率效率为57％，峰值波长为1104．4nm的20．0W激光输出；当两个半导体激光器在双端同时抽运时，获得光纤激光最大输出功率为30．6W，输出峰值波长为1108．4nm，以及49％的总体光一光转换效率。     

InGaAs/AlGaAs半导体激光器二维阵列

用金属有机化合物气相淀积 (MOCVD)技术外延生长了InGaAs/AlGaAs分别限制应变单量子阱激光器材料。利用该材料制成半导体激光器一维线阵列 ,然后再串联组装成二维阵列 ,在 1 0 0 0 μs的输入脉宽下 ,输出峰值功率达到 730W (77A) ,输出光功率密度为 4 87W/cm2 ,中心激射波长为 90 3nm ,光谱半宽 (FWHM )为 4 4nm。在此条件下可以稳定工作 86 0 0h以上     

GaAlAs/GaAs单量子阱列阵半导体激光器

分析了影响列阵半导体激光器输出功率的因素。利用分子束外延生长法生长出 Ga Al As/Ga As梯度折射率分别限制单量子阱材料 ( GRIN- SCH- SQW)。利用该材料制作出的列阵半导体激光器输出功率达到 10 W(室温 ,连续 ) ,峰值波长为 80 6～ 80 9nm     

808nm GaAs/AlGaAs大功率半导体激光器波长的影响因素及控制

通过对影响GaAs／AlGaAs激光器波长的各种因素的分析讨论与实验研究，制备了性能优良的808umGaAs／AlGaAs大功率激光器材料．应用此材料制作的激光器的结果表明，器件室温连续输出功率1W时，激射波长仍可保持在808nm附近，器件的室温连续输出功率已达2.3W．     

900nm高功率半导体激光器线阵列

利用金属有机化合物气相淀积(MOCVD)技术生长了InGaAs/GaAs分别限制应变单量子阱激光器工作物质.利用它制成半导体激光器线阵列,其峰值波长为900nm,光谱半高全宽小于4nm,在脉宽1000μs、13Hz的输入电流抽运下,输出峰值功率接近60W(室温,电流87A),斜率效率为0.64W/A.     

掺Yb3+光纤环形激光器特性研究

本文利用国产半导体激光器泵浦掺Yb3+光纤环形激光器获得成功．掺Yb3+光纤长3 m,与1053 nm／980 nm波分复用器(WDM)构成交叉耦合型全光纤环形腔．总腔长为4 m,泵浦波长980 nm,激光波长为1042．3 nm,斜率效率9．6％,激光阈值低于0．5 mW,利用可调谐钛宝石激光器泵浦,得到该光纤激光器的最佳泵浦波长为978 nm．     

高占空比大功率激光器阵列

设计并研制了1cm长折射率渐变分别限制单量子阱(GRIN—SCH—SQW)单条激光器阵列。占空比为20％，在70A工作电流下，输出功率达到61．8W，阈值电流密度为220A／cm^2，斜率效率为1．1W／A，激射波长为808．2nm。     

980nm高功率列阵半导体激光器

分析了影响列阵半导体激光器输出功率的因素。利用分子束外延生长方法生长出InGaAs/GaAs应变量子阱激光器材料。利用该材料制作出的应变量子阱列阵半导体激光器准连续（100Hz,100μs）输出功率达到80W（室温）,峰值波长为978－981nm。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.