Porous Silicon： Volume-Specific Surface Area Determination from AFM Measurement Data

Porous silicon layers manufactured by using （100）, 1-5 ohm-cm p-type （boron doped） wafer by electrochemical etching in HF etanol solution. Photoluminescence （PL） spectra of anodically etched silicon obtained for different conditions studied and surface characteristics are investigated by AFM. This study gives a simple way to determine specific surface are of porous silicon which plays a major role with porosity for explaining the blue shift in photoluminescence peak. Properties such as specific surface area, pore size, and pore size distribution, the main surface properties of layer are investigated from AFM data which are important material characteristics in many processing applications. The ＂specific surface area＂ （Sspecific） generally defined as the area of solid surface per unit mass of material, solid volume or cross section area. From 3-D reconstructions of AFM data, the surface area and the volume of the porous layer can be estimated directly and volume-surface specific area is calculated. For porous silicon this feature can be defined as the total surface area per volume and given by the unit m2/cm3. The method is simple not need to construct a special set up for measurement and non destructive.     

铝诱导晶化法低温制备多晶硅薄膜

为了满足在普通玻璃衬底上制备多晶硅薄膜晶体管有源矩阵液晶显示器,低温（＜６００℃）制备高质量多晶硅薄膜已成为研究热点．本文研究了一种低温制备多晶硅薄膜的新工艺：金属诱导非晶硅薄膜低温晶化法．在非晶硅薄膜上蒸镀金属铝薄膜,并光刻形成铝膜图形,而后于氮气保护中退火．利用光学显微镜和拉曼光谱等测试方法,研究了Ａｌ诱导下非晶硅薄膜的晶化过程,结果表明;在５６０℃退火６ｈ后;铝膜下的非晶硅已完全晶化,确定了所制备的是多晶硅薄膜．初步探讨了非晶硅薄膜金属诱导横向晶化机理．     

Boron induced recrystallization of amorphous silicon film by a rapid thermal process

Rapid thermal process (RTP) is to induce boron-doped amorphous silicon into a high degree of crystallization of polycrystalline silicon in 5 min. In addition to the short time characteristic, it also provides a relatively lower temperature route to prepare high percentage of polycrystalline silicon in comparison with solid phase crystallization method. Before RTP, boron is homogeneously doped into the amorphous silicon film by ion implantation technology. After rapid thermal processing, the grain size of the polycrystalline silicon was found about at 0.1-0.5 μm. The degree crystallization of silicon is reached up to 99.1% with a good hole mobility of 138.6 cm²/V s.     

Thin‐Film Transistors

Thin‐film transistors (TFTs) matured later than silicon integrated circuits, but in the past 15 years the technology has grown into a huge industry based on display applications, with amorphous and polycrystalline silicon as the incumbent technology. Recently, an intense search has developed for new materials and new fabrication techniques that can improve the performance, lower manufacturing cost, and enable new functionality. There are now many new options – organic semiconductor (OSCs), metal oxides, nanowires, printing technology as well as thin‐film silicon materials with new properties. All of the new materials have something to offer but none is entirely without technical problems.     

LASER PROCESSING OF DIAMOND AND DIAMOND-LIKE FILMS

Laser processing of polycrystalline diamond and amorphous carbon films is shown to be a promising technology for micropatterning of these materials in electronics and other applications. By using excimer lasers, holes and pits have been formed in 10-60 μm thick diamond films by physical etching with ablation rates of up to 300 nm/pulse. The channels of micrometer scale width were created in diamond-like carbon films on silicon by chemical etching in oxygen by the scanning with a cw Ar⁺ laser beam. At laser powers below the etching threshold, a transformation of amorphous carbon to graphitic carbon allows the formation of conductive lines of different geometry in dielectric carbon layers.     

Thin film deposition on plastic substrates using silicon nanoparticles and laser nanoforming

Reduced melting temperature of nanoparticles is utilized to deposit thin polycrystalline silicon (c-Si) films on plastic substrates by using a laser beam without damaging the substrate. An aqueous dispersion of 5 nm silicon nanoparticles was used as precursor. A Nd:YAG (1064 nm wavelength) laser operating in continuous wave (CW) mode was used for thin film formation. Polycrystalline Si films were deposited on flexible as well as rigid plastic substrates in both air and argon ambients. The films were analyzed by optical microscopy for film formation, scanning electron microscopy (SEM) for microstructural features, energy dispersive spectroscopy (EDS) for impurities, X-ray photoelectron spectroscopy (XPS) for composition and bond information of the recrystallized film and Raman spectroscopy for estimating shift from amorphous to more crystalline phase. Raman spectroscopy showed a shift from amorphous to more crystalline phases with increasing both the laser power and irradiation time during laser recrystallization step.     

In-situ observation of phase transformation in amorphous silicon during Joule-heating induced crystallization process

During the Joule-heating induced crystallization (JIC) process of amorphous silicon for display applications, its phase transformation from amorphous to polycrystalline phases occurs through two different kinetic paths of either solid-to-solid or solid-to-liquid-to-solid phases. Depending on input conditions such as power density and pulsing time, each path results in nano-crystalline silicon phases or large grain structures produced by lateral growth, respectively. In this study, the phase-transformation phenomena during the JIC process were detected electrically and optically by the in-situ measurements of input voltage/current and normal reflectance at wavelength of 532 nm. The temperature field estimated from a simple conduction model confirms the phase-transformation behavior observed experimentally. In addition we could obtain the poly-Si structure produced by solid phase crystallization having the process time of 250 μs and reaching the highest temperature around 1350 K.     

A low‐cost and reliable optical inspection system for rapid surface roughness measurements of polycrystalline thin films

Excimer laser crystallization is a well‐known industrially used technique to produce high‐performance polycrystalline silicon thin films on the commercially available inexpensive glass substrates for the development of high‐performance low temperature polycrystalline silicon thin‐film transistors in active matrix flat panel displays. A rapid optical measurement system for rapid surface roughness measurement of polycrystalline silicon thin films was developed in this study. Two kinds of thicknesses of polycrystalline silicon thin films were used to study rapid surface roughness measurements. Six different incident angles were employed for measuring surface roughness of polycrystalline silicon thin films. The results reveal that the incident angle of 20° was found to be a good candidate for measuring surface roughness of polycrystalline silicon thin films. Surface roughness (y) of polycrystalline silicon thin films can be determined rapidly from the average value of reflected direct current voltage (x) measured by the optical system developed using the trend equation of y = –8.9854x + 91.496. The maximum measurement error rate of the optical measurement system developed was less than 5.72%. The savings in measurement time was up to 83%.     

Spatially-Resolved Crystallization of Amorphous Silicon Films on the Glass Substrate by Multi-beam Laser Interference

Laser interference induced crystallization of amorphous silicon （a-Si） on the glass substrate was performed using a Q-switched Nd：YAG （yttrium aluminum garnet） laser. White light interferometer （WLI） and atomic force microscope （AFM） were used to characterize the morphology of the structured films, while X-ray diffraction （XRD）, combined with the AFM, was used to analyse the crystalline structure of the film. The experimental results show that the laser energy density above a certain threshold, in the range of 400-500 mJ/cm2,triggers the patterned crystallizations which take the form similar to the laser intensity distribution. For the patterned crystallization under multipulse exposure, a definite polycrystalline structure with individual phases was observed by XRD. The difference in feature form, e.g., deepened craters or heightened lines, is related to the laser energy density relative to the threshold of evaporation of the material.     

Semitransparent passive matrix organic light-emitting displays

There has been an increased interest in developing top emission organic light-emitting diodes (OLEDs) that are able to emit light from both sides of the OLED display. One important application of the top emission device structure is to achieve monolithic integration of a top-emitting OLED on a polycrystalline or amorphous silicon thin film transistors used in active matrix displays. A high performance dual-sided top-emitting polymer OLED developed in this work exhibited a total luminous efficiency of ∼5.0 cd/A at 4.0 V, which is comparable to that observed for a control device having bottom emission structure. A laser ablation technology was developed to define the pixels. The cathode separation was achieved without using the conventional reverse trapezoid type separators that are normally used for pixellated OLED displays. A prototype of semitransparent polymer light-emitting passive matrix display has a matrix of 100 × 32 with a display area of 32.25 mm by 11.15 mm.     

金属诱导晶化法制备多晶硅薄膜研究进展

本文介绍了金属诱导晶化非晶态硅制备多晶硅薄膜的新方法 ,综述了制备金属 /非晶态硅复合薄膜的各种方法与晶化结果 ,着重介绍了金属低温诱导的机理及其在器件应用方面的可行性     

硅表面钝化及对异质结太阳电池特性的影响

研究了不同的晶体硅表面钝化方法,测试分析了硅片的少数载流子寿命以及对晶体硅/非晶硅异质结(HIT)太阳电池性能的影响。发现适当时间的HF溶液处理、氢等离子体处理和表面覆盖约3nm的本征非晶硅层能有效提高硅片的少子寿命,从而提高HIT太阳电池的开路电压。对电池制备工艺综合优化后,得到了基于n型晶体硅的光电转换效率为16.75%(Voc=0.596V,Jsc=41.605mA/cm2,FF=0.676,AM1.5,25℃)的HIT太阳电池。     

Simultaneous recrystallization, phosphorous diffusion and antireflection coating of silicon films using laser treatment

Laser technique application to polycrystalline silicon thin-film solar cell fabrication on glass substrates has received appreciable attention. In this paper, a laser-doping technique is developed for plasma-deposited amorphous silicon film. A process involving recrystallization, phosphorous diffusion and antireflection coating can be achieved simultaneously using the laser annealing process. The doping precursor, a phosphorous-doped titanium dioxide (TiO₂) solution, is synthesized using a sol-gel method and spin-coated onto the sample. After laser irradiation, the polycrystalline silicon grain size was about 0.5∼1.0 μm with a carrier concentration of 2 × 10¹⁹ cm^− 3 and electron mobility of 92.6 cm²/V s. The average polycrystalline silicon reflectance can be reduced to a value of 4.65% at wavelengths between 400 and 700 nm, indicating the upper TiO₂ film of antireflection coating.     

100μm大晶粒多晶硅薄膜的铝诱导法制备

以Corning Eagle 2000玻璃为衬底,用磁控溅射法制备了glass/a-Si/Si O2/Al叠层结构,于Ar气保护下退火,制备了具有很强的(111)择优取向,最大晶粒尺寸达100μm的铝诱导晶化多晶硅薄膜。研究结果表明,非晶硅的氧化时间越长,所制备的多晶硅晶粒尺寸越大,当氧化时间达约47h后,再延长氧化时间对薄膜性能的影响不明显。还发现退火温度越高,晶粒越小,但是反应速率越快。     

金属镍诱导p型多晶硅薄膜的光电性能研究

利用电子束蒸镀方法及重掺杂p型硅为蒸发源在K8玻璃衬底上沉积非晶硅薄膜,采用镍诱导晶化法在氮气氛围下进行退火处理制备出p型多晶硅薄膜.研究了不同温度热处理条件对p型多晶硅薄膜的光电性能的影响,通过霍尔测量、拉曼光谱、原子力显微镜、紫外-可见光吸收光谱等测试手段对薄膜进行分析.结果表明,随着晶化温度的提高晶化程度先增强后...     

A low‐cost dehydrogenation system of amorphous silicon thin films used for fabricating low‐temperature polycrystalline silicon

Low‐temperature polycrystalline silicon thin‐film transistors were widely employed in active‐matrix flat‐panel displays and giant microelectronics. In general, a‐Si thin films prepared by plasma‐enhanced chemical vapor deposition contain hydrogen. To prevent the ablation caused by sudden hydrogen eruption during excimer laser crystallization (ELC), two dehydrogenation systems are developed in this study to reduce hydrogen content before excimer laser crystallization. One is a ceramic heater‐based dehydrogenation system and the other is a quartz tube radiant heater‐based dehydrogenation system. The hydrogenated amorphous silicon (a‐Si : H) thin films prepared by plasma‐enhanced chemical vapor deposition are dehydrogenated by both systems. Fourier‐transform infrared absorption spectra revealed that the hydrogen content reduces after dehydrogenation processing. Raman measurements confirmed that the a‐Si : H thin films are still amorphous phase. The major potential advantages of quartz tube radiant heater‐based dehydrogenation system include rapid heating speed, good dehydrogenation quality, small footprint and low cost. Two‐steps temperature rise method is a good candidate for dehydrogenation processing because it provides sample with low thermal distortion.     

Filter-protected photodiodes for high-throughput enzymatic analysis

This paper relates to the use of a thin film of re-crystallized (polycrystalline) silicon as a low-pass rejection filter in the ultraviolet light range and, more particularly, to the use of this layer as a protective layer for semiconductor diodes. The polycrystalline silicon filters were fabricated by laser annealing a thin film of amorphous silicon deposited by an LPCVD process. A standard component of the polysilicon-gate CMOS process is the boron phosphor silicate glass (BPSG) planarization layer. Since this layer is always applied, the possibility of using it as the isolator between the diode and the filter (and, thereby, omit one SiO/sub 2/ layer) is considered. Using scanning electron microscopy, we compared the crystallization process of the LPCVD silicon film deposited on a glass substrate and on a BPSG layer. The fabrication and the characterization of the filter-protected photodiodes are described in the paper.     

Electrical and optical properties of µc-SiH films

Microcrystalline silicon films have been found quite useful in amorphous silicon solar cells as a contact material in n-i-p cells. Microcrystalline silicon films are obtained when amorphous silicon films are prepared by R.F. glow discharge of SiH₄ + H₂ at higher power ratings. These films possess higher conductivity as well as high transmission than amorphous silicon films. The present paper reports the preparation technique ofμc-SiH films using R.F. capacitive glow discharge of hydrogen-diluted silane. X-ray studies andtem studies of the films indicate microcrystallinity of the films. The electrical and optical properties are also reported.     

等离子体增强化学气相沉积设备的研制

本文介绍非晶硅薄膜太阳能电池生产线的核心设备——等离子体增强化学气相沉积(PECVD, Plasma Enhanced Chemical Vapor Deposition)系统,并阐述了其重要地位.非晶硅太阳能电池制造的关键技术是非晶硅薄膜的制备,目前最常见的制备方法是PECVD技术.PECVD技术凭借其低温沉积、可大面积成膜、成膜均匀等特点,在非晶硅薄膜制备方面迅速发展.PECVD系统用于制备非晶硅太阳能电池的关键结构P、I、N硅薄膜层.本文阐述了该设备的结构特点、技术指标、工作原理及工艺过程,对沉积室的结构和配置进行了详细设计计算,非晶硅太阳能电池稳定后的转化效率可达6％.     

硅半导体太阳能电池进展

太阳能电池是将太阳能直接转化为电能的装置,也是有效利用太阳能最佳途径之一。作为一种绿色能源,尤其是在核电安全问题面临挑战的今天,太阳能电池被认为是解决能源衰竭和环境污染等一系列重大问题的最佳选择。目前,许多国家正在制订中长期太阳能开发计划,准备在21世纪大规模开发太阳能。当前研究最多同时在生产应用的最广泛的当数硅太阳能电池(如单晶硅、多晶硅、非晶硅等)。通过对各类硅太阳能电池的性能、工艺、转化效率以及制备方法等方面作比较并讨论了它们各自性能的优劣,最后结合当前国内外工业化生产状况,对硅太阳能电池研究现状和各自的最新进展作了比较详细的综述,并简要讨论了硅太阳能电池研究和生产上的前景及趋势。