低VOCs无卤素水基免清洗助焊剂的研制与应用

无卤素水基助焊剂普遍存在表面张力大,活性差,残留多以及易发霉等难题,文章通过对活性剂、助溶剂、缓蚀剂以及表面活性剂等组分的优化较好地解决了这些问题,研制了一种无卤素水基免清洗助焊剂NC902。经检测,该助焊剂的各项性能均达到国家相关助焊剂标准要求。助焊剂对无铅焊料Sn0.7Cu的平均铺展率达到80.75%。采用SAT-5100可焊性测试仪测试了该焊剂的润湿性能,结果显示零交时间为0.90秒,润湿时间为1.35秒,最大润湿力为3.47 m N,平均润湿角为25.60°。     

新型水基波峰焊助焊剂的研究

研制了一种以水作溶剂的波峰焊助焊剂。根据助焊剂各组份的特点，分别对其活性剂、表面活性剂、成膜剂以及添加物进行筛选。依据标准对所制备的助焊剂进行性能测试。结果表明：该助焊剂各方面都符合国家标准，并且无卤化物，无刺激性气味，环保，安全，节省成本。最后对该助焊剂在波峰焊中的应用给出一些意见。     

环保型免清洗助焊剂组分对其腐蚀性能的影响及其机理

主要研究活化剂、表面活性剂和缓蚀剂3种组分对环保型免清洗助焊剂腐蚀性能的影响。采用交流阻抗法研究了各组分对铜电极缓蚀性能的影响;通过扫描电镜观察测试了各组分对梳形试件的腐蚀;借助热分析研究了组分残留及相互作用。结果表明,随活化剂酸性的减弱,助焊剂体系的腐蚀性逐渐减弱;壬基酚聚氧乙烯醚系列的非离子表面活性剂有助于降低体系的腐蚀性能;缓蚀剂苯并三氮唑（BTA）的添加能显著改善助焊剂体系的缓蚀性能。用壬基酚聚氧乙烯(50)醚（w=0.2%）作表面活性剂、丁二酸和苹果酸复配（w=1.6%）作活化剂,BTA作缓蚀剂（w=0.06%）制备的助焊剂体系的膜电阻最大,在湿热条件下助焊剂对梳形试件的腐蚀明显降低,缓蚀性能最佳。热分析结果表明,体系缓蚀性能的改善可能是有机酸与丙三醇发生的酯化反应所致。     

NCSF—1新型免清洗助焊剂的研制

报道一种不含卤素，松香和树脂，低固含量新型免清洗助焊剂的研制及其市场应用前景。     

免清洗助焊剂

免清洗助焊剂与溶剂清洗型、水清洗型助焊剂相比,具有无松香、不用清洗处理、无接触故障、无卤化物、焊接质量好等优点,是环境友好产品。文章详细介绍了国内外主要免清洗助焊剂的活性成分、溶剂和特殊成分,并介绍了免清洗助焊剂的铜镜腐蚀测试、铬酸银试纸测试、表面绝缘阻抗测试和软铣焊性试验等4种测试方法。     

一种温控器用水基低卤助焊剂的研制

针对前期研制并已商用的波纹管温控器有机溶剂过多,卤素含量过高等问题,研制了一种水基低卤助焊剂。助焊剂以选用丁二酸、己二酸、有机卤盐活化剂M作为活性剂,OP-10复配蔗糖酯作为表面活性剂,聚乙二醇作为成膜剂,并使用正交实验法确定各组分配比。研制的水基低卤助焊剂对温控器造成的腐蚀更小、产品可靠性更高。     

无铅水基热风整平助焊剂的研究

使用水溶性载体、活化剂、抗氧剂、表面活性剂和去离子水,制备出一种无铅水基热风整平助焊剂。探讨组分配比对无铅热风整平焊接后,印制板焊盘、孔上铅锡的饱满度、腐蚀性以及单产率等的影响。结果表明,助焊剂的最佳组成为水溶性载体75%,活化剂1.5%,抗氧剂0.3%,表面活性剂0.01%,其余为去离子水。该助焊剂粘度低、助焊效果好、腐蚀性小、耐高温,可适用于新的无铅焊料体系。     

缓蚀剂对水基环保免清洗助焊剂缓蚀性能的影响

以丁二酸、苹果酸(w=2.00%)为活化剂,乙二醇、异丙醇和乙二醇丁醚(w=3.00%)为助溶剂,聚乙二醇-6000(w=0.25%)为成膜剂,咪唑(IM)、苯并咪唑(BIA)和苯并三氮唑(BTA)分别为缓蚀剂,配制系列水基免清洗助焊剂。用静态失重法、电化学阻抗谱法和扫描电子显微镜等方法研究了三种缓蚀剂对金属铜的缓蚀作用。结果表明:随三种缓蚀剂含量的增加,缓蚀率均表现出先提高后降低的趋势。其中BTA的添加量为0.08%时,缓蚀率达88.78%,金属膜电阻Rf达1.25×106·cm2,缓蚀效果最佳。研究还表明:缓蚀剂总量为0.08%时,BIA和BTA复配(0.04%BIA+0.04%BTA),缓蚀率达94.25%,Rf达2.26×106·cm2,显示出明显的缓蚀协同效应。助焊剂铺展实验也表明,复配缓蚀剂的最佳添加量为0.04%BIA和0.04%BTA。     

缓蚀剂对水基环保免清洗助焊剂缓蚀性能的影响

以丁二酸、苹果酸（w= 2.00%）为活化剂,乙二醇、异丙醇和乙二醇丁醚（w= 3.00%）为助溶剂,聚乙二醇-6000（w= 0.25%）为成膜剂,咪唑（IM）、苯并咪唑（BIA）和苯并三氮唑（BTA）分别为缓蚀剂,配制系列水基免清洗助焊剂。用静态失重法、电化学阻抗谱法和扫描电子显微镜等方法研究了三种缓蚀剂对金属铜的缓蚀作用。结果表明：随三种缓蚀剂含量的增加,缓蚀率均表现出先提高后降低的趋势。其中BTA的添加量为0.08%时,缓蚀率达 88.78%,金属膜电阻R_f 达1.25×10⁶ Ω·cm²,缓蚀效果最佳。研究还表明：缓蚀剂总量为0.08%时,BIA和BTA复配（0.04%BIA + 0.04% BTA）,缓蚀率达94.25%,R_f 达2.26×10⁶ Ω·cm²,显示出明显的缓蚀协同效应。助焊剂铺展实验也表明,复配缓蚀剂的最佳添加量为0.04% BIA和0.04% BTA。     

电子封装用无卤素免清洗助焊剂的研制

研制了一种新的用于电子封装的无卤素助焊剂,并参考日本工业标准和相关国家标准对其进行了全面的性能测试.结果表明,该助焊剂在可焊性、绝缘性、腐蚀性等方面均符合标准,且具有焊接效果良好、无卤素、无毒、环保,焊后免清洗等优点.     

免清洗水性助焊剂主要组分的选择及其缓蚀性能研究

通过实验优选了环保型水性免清洗助焊剂所用的活化剂、成膜剂和表面活性剂等组分。采用交流阻抗法确定了缓蚀剂苯并三氮唑(BTA)的最佳配比,探究了体系中各组分对助焊剂缓蚀性能的影响。结果表明,酸–胺复配可以降低助焊剂的腐蚀性,而缓蚀剂BTA能显著提高助焊剂体系的缓蚀性能。当苹果酸和己二酸以1∶5的物质的量之比与三乙醇胺复配,n复配酸∶n三乙醇胺=11∶1,且酸–胺复合液的质量分数为3.15%、表面活性剂聚乙二醇2000的质量分数为0.2%、缓蚀剂BTA的质量分数为0.05%,助溶剂异丙醇和乙二醇丁醚的质量分数均为1.5%,成膜剂聚乙烯醇的质量分数为0.2%时,所制备的助焊剂体系的缓蚀性能最佳,膜电阻最大,为6.2×105Ω·cm2。该助焊剂体系对基底金属铜板的腐蚀性较弱。     

Development of a high curing latency no-flow underfill with self-fluxing ability for lead-free solder interconnects

Tin-lead solders have been used as joining materials in the electronics industry for many years. As present there are great concerns about the potential harm of lead-containing solders to human beings and many efforts have been made to remove the lead from the electronics packages. However, there is no no-flow underfill currently on the market that is compatible with the lead-free solder. In this study, a new no-flow underfill for flip chip bumped with lead-free solder has been developed based on a curing agent and catalysts with high curing latency. The curing agent itself has the fluxing ability, so the need of extra flux is eliminated. Compared with the underfill for lead-containing solder, the new underfill has a higher curing temperature, compatible with the melting profile of lead-free solder. The wetting compatibility of the underfill with the lead-free solder has been studied by wetting experiments. The material properties of the underfill have been investigated using DSC, TGA, TMA and DMA. The results show that the newly developed underfill material has the potential to be used in lead-free interconnects.     

Synthesis and characterization of ceramic nanoparticles reinforced lead-free solder

Sn-0.7Cu is among the least expensive types of lead-free solders available. However, its poor mechanical properties have limited its application. In this study, Sn-Cu lead-free solder reinforced with amorphous silica (SiO₂) nanoparticles was synthesized through powder metallurgy route. Desired mixtures of raw materials was mechanically milled, compressed, sintered and extruded to prepare bulk solder samples. The samples were characterized by optical and electron microscopy as well as mechanical tests. The results showed that mechanical properties were increased by addition of SiO₂ nanoparticles to the solder matrix. Addition of 1.5 wt% ceramic reinforcement to the composite increased tensile, yield and compressive strengths up to 27%, 23% and 41%, respectively, compared to those of the monolithic sample. In addition, the ceramic nanoparticles caused an up to 50% decrease in the wetting angle between the substrate and the nanocomposite solder.     

水性集装箱底架漆的研制

以苯丙乳液为主要成膜物质,添加新型防锈颜料PAST-1,制备出一种具有较高防腐性能的集装箱底架漆。重点考察了成膜基料的种类及用量,防锈颜料的种类及用量,防流挂助剂的用量,颜填料体积浓度(PVC),消泡剂及成膜助剂等对漆膜性能的影响。结果表明,当苯丙乳液B和苯丙乳液C以1∶2的质量比进行复配作为成膜基料,环保型PAST-1颜料作为防锈颜料且添加量为10%,气相二氧化硅E的用量为0.6%,消泡剂H的用量为0.4%,颜填料体积浓度(PVC)为30%时,制备的水性集装箱底架漆盐雾试验800 h无起泡、无生锈,50°C贮存30 d无异常,具有良好的施工性,涂膜综合性能优于企业标准。     

燃气轮机水基清洗剂的研制

经过大量试验验究,立足国产原材料研制出的燃气轮机水基清洗剂的性能指标达到美国军用标准 Ｍ Ｉ Ｌ－ Ｃ－ ８５７０４ Ｂ 的要求,具有清洗效率高、无腐蚀等特点,是燃气轮机压气机清洗的良好清洗剂．