共查询到16条相似文献,搜索用时 78 毫秒
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主要研究活化剂、表面活性剂和缓蚀剂3种组分对环保型免清洗助焊剂腐蚀性能的影响。采用交流阻抗法研究了各组分对铜电极缓蚀性能的影响;通过扫描电镜观察测试了各组分对梳形试件的腐蚀;借助热分析研究了组分残留及相互作用。结果表明,随活化剂酸性的减弱,助焊剂体系的腐蚀性逐渐减弱;壬基酚聚氧乙烯醚系列的非离子表面活性剂有助于降低体系的腐蚀性能;缓蚀剂苯并三氮唑(BTA)的添加能显著改善助焊剂体系的缓蚀性能。用壬基酚聚氧乙烯(50)醚(w=0.2%)作表面活性剂、丁二酸和苹果酸复配(w=1.6%)作活化剂,BTA作缓蚀剂(w=0.06%)制备的助焊剂体系的膜电阻最大,在湿热条件下助焊剂对梳形试件的腐蚀明显降低,缓蚀性能最佳。热分析结果表明,体系缓蚀性能的改善可能是有机酸与丙三醇发生的酯化反应所致。 相似文献
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以丁二酸、苹果酸(w=2.00%)为活化剂,乙二醇、异丙醇和乙二醇丁醚(w=3.00%)为助溶剂,聚乙二醇-6000(w=0.25%)为成膜剂,咪唑(IM)、苯并咪唑(BIA)和苯并三氮唑(BTA)分别为缓蚀剂,配制系列水基免清洗助焊剂。用静态失重法、电化学阻抗谱法和扫描电子显微镜等方法研究了三种缓蚀剂对金属铜的缓蚀作用。结果表明:随三种缓蚀剂含量的增加,缓蚀率均表现出先提高后降低的趋势。其中BTA的添加量为0.08%时,缓蚀率达88.78%,金属膜电阻Rf达1.25×106·cm2,缓蚀效果最佳。研究还表明:缓蚀剂总量为0.08%时,BIA和BTA复配(0.04%BIA+0.04%BTA),缓蚀率达94.25%,Rf达2.26×106·cm2,显示出明显的缓蚀协同效应。助焊剂铺展实验也表明,复配缓蚀剂的最佳添加量为0.04%BIA和0.04%BTA。 相似文献
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以丁二酸、苹果酸(w= 2.00%)为活化剂,乙二醇、异丙醇和乙二醇丁醚(w= 3.00%)为助溶剂,聚乙二醇-6000(w= 0.25%)为成膜剂,咪唑(IM)、苯并咪唑(BIA)和苯并三氮唑(BTA)分别为缓蚀剂,配制系列水基免清洗助焊剂。用静态失重法、电化学阻抗谱法和扫描电子显微镜等方法研究了三种缓蚀剂对金属铜的缓蚀作用。结果表明:随三种缓蚀剂含量的增加,缓蚀率均表现出先提高后降低的趋势。其中BTA的添加量为0.08%时,缓蚀率达 88.78%,金属膜电阻Rf 达1.25×106 Ω·cm2,缓蚀效果最佳。研究还表明:缓蚀剂总量为0.08%时,BIA和BTA复配(0.04%BIA + 0.04% BTA),缓蚀率达94.25%,Rf 达2.26×106 Ω·cm2,显示出明显的缓蚀协同效应。助焊剂铺展实验也表明,复配缓蚀剂的最佳添加量为0.04% BIA和0.04% BTA。 相似文献
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电子封装用无卤素免清洗助焊剂的研制 总被引:2,自引:0,他引:2
研制了一种新的用于电子封装的无卤素助焊剂,并参考日本工业标准和相关国家标准对其进行了全面的性能测试.结果表明,该助焊剂在可焊性、绝缘性、腐蚀性等方面均符合标准,且具有焊接效果良好、无卤素、无毒、环保,焊后免清洗等优点. 相似文献
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通过实验优选了环保型水性免清洗助焊剂所用的活化剂、成膜剂和表面活性剂等组分。采用交流阻抗法确定了缓蚀剂苯并三氮唑(BTA)的最佳配比,探究了体系中各组分对助焊剂缓蚀性能的影响。结果表明,酸–胺复配可以降低助焊剂的腐蚀性,而缓蚀剂BTA能显著提高助焊剂体系的缓蚀性能。当苹果酸和己二酸以1∶5的物质的量之比与三乙醇胺复配,n复配酸∶n三乙醇胺=11∶1,且酸–胺复合液的质量分数为3.15%、表面活性剂聚乙二醇2000的质量分数为0.2%、缓蚀剂BTA的质量分数为0.05%,助溶剂异丙醇和乙二醇丁醚的质量分数均为1.5%,成膜剂聚乙烯醇的质量分数为0.2%时,所制备的助焊剂体系的缓蚀性能最佳,膜电阻最大,为6.2×105Ω·cm2。该助焊剂体系对基底金属铜板的腐蚀性较弱。 相似文献
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《Journal of Adhesion Science and Technology》2013,27(1):109-121
Tin-lead solders have been used as joining materials in the electronics industry for many years. As present there are great concerns about the potential harm of lead-containing solders to human beings and many efforts have been made to remove the lead from the electronics packages. However, there is no no-flow underfill currently on the market that is compatible with the lead-free solder. In this study, a new no-flow underfill for flip chip bumped with lead-free solder has been developed based on a curing agent and catalysts with high curing latency. The curing agent itself has the fluxing ability, so the need of extra flux is eliminated. Compared with the underfill for lead-containing solder, the new underfill has a higher curing temperature, compatible with the melting profile of lead-free solder. The wetting compatibility of the underfill with the lead-free solder has been studied by wetting experiments. The material properties of the underfill have been investigated using DSC, TGA, TMA and DMA. The results show that the newly developed underfill material has the potential to be used in lead-free interconnects. 相似文献
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《Ceramics International》2017,43(6):5302-5310
Sn-0.7Cu is among the least expensive types of lead-free solders available. However, its poor mechanical properties have limited its application. In this study, Sn-Cu lead-free solder reinforced with amorphous silica (SiO2) nanoparticles was synthesized through powder metallurgy route. Desired mixtures of raw materials was mechanically milled, compressed, sintered and extruded to prepare bulk solder samples. The samples were characterized by optical and electron microscopy as well as mechanical tests. The results showed that mechanical properties were increased by addition of SiO2 nanoparticles to the solder matrix. Addition of 1.5 wt% ceramic reinforcement to the composite increased tensile, yield and compressive strengths up to 27%, 23% and 41%, respectively, compared to those of the monolithic sample. In addition, the ceramic nanoparticles caused an up to 50% decrease in the wetting angle between the substrate and the nanocomposite solder. 相似文献
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以苯丙乳液为主要成膜物质,添加新型防锈颜料PAST-1,制备出一种具有较高防腐性能的集装箱底架漆。重点考察了成膜基料的种类及用量,防锈颜料的种类及用量,防流挂助剂的用量,颜填料体积浓度(PVC),消泡剂及成膜助剂等对漆膜性能的影响。结果表明,当苯丙乳液B和苯丙乳液C以1∶2的质量比进行复配作为成膜基料,环保型PAST-1颜料作为防锈颜料且添加量为10%,气相二氧化硅E的用量为0.6%,消泡剂H的用量为0.4%,颜填料体积浓度(PVC)为30%时,制备的水性集装箱底架漆盐雾试验800 h无起泡、无生锈,50°C贮存30 d无异常,具有良好的施工性,涂膜综合性能优于企业标准。 相似文献