Nonlinear identification and optimal feedforward friction compensation for a motion platform

In this study, we present a method of nonlinear identification and optimal feedforward friction compensation for an industrial single degree of freedom motion platform. The platform has precise reference tracking requirements while suffering from nonlinear dynamic effects, such as friction and backlash in the driveline. To eliminate nonlinear dynamic effects and achieve precise reference tracking, we first identified the nonlinear dynamics of the platform using Higher Order Sinusoidal Input Describing Function (HOSIDF) based system identification. Next, we present optimal feedforward compensation design to improve reference tracking performance. We modeled the friction using the Stribeck model and identified its parameters through a procedure including a special reference signal and the Nelder–Mead algorithm. Our results show that the RMS trajectory tracking error decreased from 0.0431 deg/s to 0.0117 deg/s when the proposed nonlinear identification and friction compensation method is utilized.     

Least squares based and gradient based iterative identification for Wiener nonlinear systems

This paper derives a least squares-based and a gradient-based iterative identification algorithms for Wiener nonlinear systems. These methods separate one bilinear cost function into two linear cost functions, estimating directly the parameters of Wiener systems without re-parameterization to generate redundant estimates. The simulation results confirm that the proposed two algorithms are valid and the least squares-based iterative algorithm has faster convergence rates than the gradient-based iterative algorithm.     

水箱模型辨识及PID参数自整定技术研究

为了达到对液位控制模型进行实时模型参数辨识,并实时计算出较为理想的PID参数对水箱进行实时控制的目的,采用最小二乘算法改进法及基于Ziegler-Nichols整定法的改良公式,进行水箱液位控制实验。得到对水箱液位进行实时控制的结果,其中超调量、控制时让均较为理想。结果证明此方法合理可行,具有对变化模型进行实时辨识的特点,结合动态辨识与基于模型的PID自整定法对非常规模型进行控制。     

多样式拼装电气主接线模拟屏实验创新平台的设计研究

针对电气主接线模拟屏实验/实训设备接线形式的固定性、单一性,提出一种多样式可拼装的电气主接线模拟屏实验平台的新设计方法。运用带有磁性的基板和拼插模块组装不同电气主接线的接线形式,满足电气主接线相关知识点的教学和培训,实现应用型创新人才培养的目标。     

Modelling and identification of the asymmetric hysteresis in the viscoelastic response of the fingertip under indentation: A multistate friction model with switching parameters

This paper presents a dynamic model for the identification of asymmetric hysteresis in the force response of the fingertip under cyclic local deformation of the fingertip soft tissues. Viscoelastic effects, marked anisotropy and nonlinearity contribute to the hysteretic behaviour of the force of the fingertip undergoing indentation. The fingertip force in response to an indentation stimulus varies along the loading and unloading cycles; the resulting hysteresis loops are asymmetric. The asymmetry arises from the simultaneous convexity of the branches of the hysteresis loop. The proposed model belongs to the class of multistate friction models that can effectively describe the hysteresis in the presliding regime of motion of general mechanisms with friction, by exploiting a mechanical analogy obtained through the concatenation of multiple elasto-plastic elements. The multistate model, which provides the mechanical representation of the fingertip response through a set of newly-conceived switching elements and viscoelastic blocks, can reproduce the convex and asymmetric hysteresis loops of the fingertip mechanical response, including the viscoelastic effects of stress relaxation and the influence of time interval between consecutive cycles of indentation.The model has been validated through the experimental identification of fingertip indentation tests performed on an optomechanical test-rig. This model potentially opens the way for efficient model-based control strategies of servomechanisms involved in tactile and haptic displays and interfaces.     

Experimental method and FE simulation model for evaluation of wafer probing parameters

Wafer probing technology is a critical testing technology that is used in the semiconductor manufacturing and packaging process. A well-designed probing system must enable low and stable contact resistance when each needle-like probe makes contact with the IC chip-bonding pad. Mechanical contact using excessive probe force causes over-sized scrub marks that may damage the die pad and sizably deform the probe tip. In this paper, an experimental setup of a single tungsten needle probe making contact with an Al pad was employed to investigate the relationships between the overdrive, contact force, and scrub mark length. A three-dimensional computational probing simulation model was developed for analyzing dynamic deformations of the contact phenomena during wafer testing. The mechanical tensile strength of the tungsten needle was tested with a micro-tester to examine the tensile stress-strain relationship. The elastoplastic behaviors of the probe and die were taken into account in the simulation model. The resultant scrub lengths from the simulation were verified against the experimental data. Additional critical data, such as data of the scrub mark sinking on the die surface and the maximum Von-Mises stress level location at the probe tips, can be predicted. The experimental and numerical methods presented here can be used as useful performance evaluation tools to support the choice of suitable probe geometry and wafer probe testing parameters.