Synthesis and polymerization of novel epoxy compounds having an adamantane ring and evaluation of their heat resistance and transparency

Three adamantane derivatives substituted by epoxy groups, 1,3‐bis(glycidyloxy)adamantane ( 2a ), 5,7‐dimethyl‐1,3‐bis(glycidyloxy)adamantane ( 2b ), 1,3,5‐tris(glycidyloxy)adamantane ( 2c ), were synthesized from the corresponding adamantanediol or triol in good yields. These three epoxy compounds were polymerized with an acid anhydride, and the heat resistance of the resulting resins was evaluated. The resin prepared from 2c exhibited high heat resistance with the glass transition temperature (T_g) of 208°C and low degree of coloring by heating. The epoxy compounds were also found to be potentially useful as the precursors of high heat‐resistant resins by thermal homopolymerization. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Phosphorus‐containing epoxy resins: Thermal characterization

Three novel aromatic phosphorylated diamines, i.e., bis N,N′‐{3‐[(3‐aminophenyl)methyl phosphinoyl] phenyl} pyromellitamic acid (AP), 4,4′‐oxo bis N,N′‐{3‐[(3‐aminophenyl)methyl phosphinoyl] phenyl}phthalamic acid (AB) and 4,4′‐hexafluoroisopropylidene‐bis N,N′‐{3‐[(3‐aminophenyl)methyl phosphinoyl] phenyl}phthalamic acid (AF) were synthesized and characterized. These amines were prepared by solution condensation reaction of bis(3‐aminophenyl)methyl phosphine oxide (BAP) with 1,2,4,5‐benzenetetracarboxylic acid anhydride (P)/3,3′,4,4′‐benzophenonetetracarboxylic acid dianhydride (B)/4,4′‐(hexafluoroisopropylidene)diphthalic acid anhydride (F), respectively. The structural characterization of amines was done by elemental analysis, DSC, TGA, ¹H‐NMR, ¹³C‐NMR and FTIR. Amine equivalent weight was determined by the acetylation method. Curing of DGEBA in the presence of phosphorylated amines was studied by DSC and curing exotherm was in the temperature range of 195–267°C, whereas with conventional amine 4,4′‐diamino diphenyl sulphone (D) a broad exotherm in temperature range of 180–310°C was observed. Curing of DGEBA with a mixture of phosphorylated amines and D, resulted in a decrease in characteristic curing temperatures. The effect of phosphorus content on the char residue and thermal stability of epoxy resin cured isothermally in the presence of these amines was evaluated in nitrogen atmosphere. Char residue increased significantly with an increase in the phosphorus content of epoxy network. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 2235–2242, 2002     

Phosphorus‐containing epoxy resin for an electronic application

A phosphorus‐containing epoxy resin, 6‐H‐dibenz[c,e][1,2] oxaphosphorin‐6‐[2,5‐bis(oxiranylmethoxy)phenyl]‐6‐oxide (DOPO epoxy resin), was synthesized and cured with phenolic novolac (Ph Nov), 4,4′‐diaminodiphenylsulfone (DDS), or dicyandiamide (DICY). The reactivity of these three curing agents toward DOPO epoxy resin was found in the order of DICY > DDS > Ph Nov. Thermal stability and the weight loss behavior of the cured polymers were studied by TGA. The phosphorus‐containing epoxy resin showed lower weight loss temperature and higher char yield than that of bisphenol‐A based epoxy resin. The high char yields and limiting oxygen index (LOI) values as well as excellent UL‐94 vertical burn test results of DOPO epoxy resin indicated the flame‐retardant effectiveness of phosphorus‐containing epoxy resins. The DOPO epoxy resin was investigated as a reactive flame‐retardant additive in an electronic encapsulation application. Owing to the rigid structure of DOPO and the pendant P group, the resulting phosphorus‐containing encapsulant exhibited better flame retardancy, higher glass transition temperature, and thermal stability than the regular encapsulant containing a brominated epoxy resin. High LOI value and UL‐94 V‐0 rating could be achieved with a phosphorus content of as low as 1.03% (comparable to bromine content of 7.24%) in the cured epoxy, and no fume and toxic gas emission were observed. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 353–361, 1999     

Toughening of epoxy novolac resin using cardanol based flexibilizers

In this work, two different cardanol based epoxies (Cardolite NC‐514 and Cardanol NC‐547) were employed as flexibilizers to toughen an epoxy novolac resin namely, poly[(phenylglycidyl ether)‐co‐formaldehyde] (PPGEF). 4,4′‐Diamino‐3,3′‐dimethyl dicyclohexyl methane (BMCHA) was used as a curing agent. Differential scanning calorimetry and dynamic mechanical thermal analysis of the composites showed a gradual decrease in glass transition temperatures (T_g) with increase in cardolite content confirming the incorporation of flexible moieties into the brittle resin matrix. Improvement in toughening of PPGEF/Cardolite composites was manifested by increase in the izod impact strength of both the composites. The tensile strength increased marginally for composites with increasing amount of Cardolite NC‐514 but decreased for the composites containing Cardolite NC‐547. This was attributed to the lack of rotational motion in the chain due to close proximity of rigid phenyl rings in NC‐547. SEM of the cryo‐fractured surfaces of composites showed good compatibility between PPGEF and cardanol based flexibilizers. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 43318.     

Synthesis and characterization of diamide–diimide–diamines based on p‐amino benzoic acid and their curing and thermal behavior with epoxy blends containing phosphorus/silicon in the main chain

Diimide–diacid ( I ) having an imide group in its rigid structure was synthesized by the refluxing of 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride [4,4′‐carbonyldiphthalic anhydride (BTDA)] and p‐amino benzoic acid in a mixture of acetic acid and pyridine (3 : 2 v/v). The chloroderivative of the diacid ( I ) was synthesized by its reaction with thionyl chloride, this was followed by condensation with different diamines with phenyl, naphthyl, ether, sulfide, and cardo groups to generate a series of diamide–diimide–diamines (DADIDAs). The resultant DADIDAs were characterized by elemental analysis and spectroscopic techniques, namely, Fourier transform infrared spectroscopy and NMR spectroscopy, and were used as epoxy curing agents to impart flame retardancy to the epoxy system. Two epoxy blends (designated as ES and EP) were prepared by the homogeneous mixing of diglycidyl ether of bisphenol A (DGEBA) with 1,3‐bis(3‐glycidyloxypropyl)tetramethyl disiloxane and DGEBA with tris(glycidyloxy)phosphine oxide: each in a ratio of 3 : 2 respectively. The synergistic effect of phosphorus/silicon with nitrogen on the thermal properties of the modified epoxy system was studied. The curing behavior of the epoxy resins formulated by the reaction of stoichiometric amounts of ES/EP with the synthesized DADIDAs were determined by differential scanning calorimetry, and the thermal stabilities of the cured epoxies were evaluated by thermogravimetric analyses (TGAs) under nitrogen and air. TGA indicated that the residual weight percentage of polymers at 800°C was in the range 36.4–60.0 in nitrogen, and in air, it was up to 6.5. However, the major loss in weight in air occurred at elevated temperature; this demonstrated their potential use as flame‐retardant epoxy systems for electronic/electrical encapsulants. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Physical and mechanical properties of dental nanocomposites composed of aliphatic epoxy resin and epoxidized aromatic hyperbranched polymers

Aliphatic epoxy resin (UVR6105) and epoxidized aromatic hyperbranched polymers (HBP) were used as dental resin matrixes, siliane‐treated inorganic nanoparticles as inorganic fillers, ethyl 4‐dimethylaminobenzoate, camphorquinone, and 4‐[(2‐hydroxytetradecyl)oxy] phenyl‐phenyliodoniumhexafluoroantimonate (CD1012) as initiators to formulate new kinds of dental nanocomposites. Their physical and mechanical properties were tested and the inner structure was observed by using scanning electron microscope (SEM) and transmission electron microscope (TEM), respectively. The 7 series thermal analysis system was used to determine the glass transition temperature of dental resins. Compressive strengths of dental nanocomposites are lower, diametral tensile strengths are comparable with, flexural strengths are higher than those of commercial hybrid composite (Spectrum‐TPH). The addition of HBP decreased the glass transition temperature of aliphatic epoxy resin. SEM photo micrograph shows that the nanoparticles were well dispersed and inlayed in the resin matrixes. TEM photo micrograph shows that the inner structure of dental resins presents club‐shaped. Epoxidized aromatic hyperbranched polymer can strengthen and toughen aliphatic epoxy resin. These nanocomposites are potential for dental application. POLYM. COMPOS., 2009. © 2008 Society of Plastics Engineers     

Development of high‐performance epoxy/clay nanocomposites by incorporating novel phosphonium modified montmorillonite

Novel organoclays were synthesized by several kinds of phosphonium cations to improve the dispersibility in matrix resin of composites and accelerate the curing of matrix resin. The possibility of the application for epoxy/clay nanocomposites and the thermal, mechanical, and adhesive properties were investigated. Furthermore, the structures and morphologies of the epoxy/clay nanocomposites were evaluated by transmission electron microscopy. Consequently, the corporation of organoclays with different types of phosphonium cations into the epoxy matrix led to different morphologies of the organoclay particles, and then the distribution changes of silicate layers in the epoxy resin influenced the physical properties of the nanocomposites. When high‐reactive phosphonium cations with epoxy groups were adopted, the clay particles were well exfoliated and dispersed. The epoxy/clay nanocomposite realized the high glass‐transition temperature (T_g) and low coefficient of thermal expansion (CTE) in comparison with those of neat epoxy resin. On the other hand, in the case of low‐reactive phoshonium cations, the dispersion states of clay particles were intercalated but not exfoliated. The intercalated clay did not influence the T_g and CTE of the nanocomposite. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Epoxy‐amine networks with varying epoxy polydispersity

Solid, high molecular weight DGEBA‐based epoxies were blended with high purity liquid DGEBA to create several resins with equivalent epoxy equivalent weights, but with polydispersity indices (PDIs) ranging from 3 to over 10. The resins were cured with a stoichiometric amount of polyetheramine and compared to a nonblended epoxy with PDI of 1.8. Modulus, glass transition temperatures, and molecular weight between cross‐links were measured using dynamic mechanical analysis. Coefficients of thermal expansion (CTE) were measured and used to extend room temperature density measurements as a function of temperature. Fracture properties were also measured. Overall, the increased polydispersity has almost negligible effect, with the main difference occurring in the slope of the glassy CTE, with more polydisperse epoxies having a slower increase in CTE. In comparison to previous work where bimodal amines were blended with DGEBA, we conclude that epoxy resins are far more sensitive to distributions in the flexible portion, rather than the more rigid one. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41503.     

Low k epoxy resin containing cycloaliphatic hydrocarbon with high crosslinking density

High performance epoxy resins have attracted much research interest in the last decades. Herein, two novel epoxy monomers containing cycloaliphatic hydrocarbon, 1,4‐bis(4‐(N,N‐diglycidylamino)phenoxy)cyclohexane (CyhEP) and 1,3‐bis(4‐(N,N‐diglycidylamino)phenoxy)adamantane (AdaEP) were synthesized and characterized. They were cured with 4‐methylhexahydrophthalic anhydride (MHHPA) to prepare the highly crosslinked thermosets. Both epoxy resins show good thermal stability (T_d5 > 300 °C), high glass transition temperature (> 200 °C), and high storage modulus (> 3.2 GPa) due to their highly crosslinked structure. The AdaEP/MHHPA resin shows a low dielectric constant (3.4 at 1 MHz) because of the introduction of bulky rigid adamantane into the polymer. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 43456.     

Curing kinetics and thermal properties of diglycidylether of bisphenol A with various diamines

To prepare a high‐performance epoxy, we synthesized three types of diamines {N,N′‐(4,4′‐diphenylether)‐bis(4‐aminophthalimide), 4,4′‐bis(p‐aminophenoxy)dibenzalphentaerythriol, and 2,2′‐bis[4‐(p‐aminobenzoyl)phenyl]propane} as epoxy curing agents with a two‐step reaction sequence. The structures of the synthesized diamines were confirmed with Fourier transform infrared and nuclear magnetic resonance spectroscopy. The curing kinetics and thermal stability of the cured epoxy resin with diglycidylether of bisphenol A were estimated with differential scanning calorimetry and thermogravimetric analysis under a nitrogen atmosphere. The kinetics parameters were determined with the Ozawa and Kissinger equations. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 279–284, 2001     

Rigid interpenetrating polymer network foams prepared from a rosin-based polyurethane and an epoxy resin

A series of rigid interpenetrating polymer network (IPN) foams, based on a rosin-based polyurethane and an epoxy resin, were prepared by a simultaneous polymerization technique. The changes in the chemical structure, dynamic mechanical properties, and morphology of the rigid IPN foams were investigated by Fourier transform infrared (FTIR) spectroscopy, dynamic mechanical thermal analysis, and scanning electron microscopy. The FTIR analysis showed clearly that the cure rate of the rosin-based rigid polyurethane foam and the epoxy resin were different and, as a result, these two networks formed sequentially in the final rigid IPN foams. All of the rigid IPN foams exhibited a single, broad glass transition that shifted to lower temperature as the epoxy resin content increased. The experimental composition dependence of T_g's of the rigid IPN foams showed slight positive deviation from the Fox equation for homogeneous polymer systems. No phase separation was observed from the scanning electron microscopy investigation. It could be concluded that these two component networks were compatible in the final rigid IPN foams. This compatibility could be attributed to a graft structure in the polyurethane and the epoxy resin networks arising from the reaction of the hydroxyl groups of the epoxy resin with the isocyanate groups of MDI, and from the reaction of the hydroxyl groups of the polyols with the epoxide groups of the epoxy resin, as suggested by FTIR analysis. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 69: 271–281, 1998     

Synthesis,characterization, and properties of a novel epoxy resin containing both binaphthyl and biphenyl moieties

A new epoxy resin containing both binaphthyl and biphenyl moieties in the skeleton (BLBPE) was synthesized and confirmed by electrospray ionization mass spectroscopy, ¹H‐nuclear magnetic resonance spectroscopy, and infrared spectroscopy. To evaluate the combined influence of two moieties, one epoxy resin containing binaphthyl moiety and another containing biphenyl moiety were also synthesized, and a commercial biphenyl‐type epoxy resin (CER3000L) was introduced. Thermal properties of their cured polymers with phenol p‐xylene resins were characterized by differential scanning calorimetry, dynamic mechanical, and thermogravimetric analyses. The cured polymer obtained from BLBPE showed remarkably higher glass transition temperature and lower moisture absorption, as well as comprehensively excellent thermal stability. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Syntheses of epoxy‐bridged polyorganosiloxanes and the effects of terminated alkoxysilanes on cured thermal properties

A series of epoxy‐bridged polyorganosiloxanes have been synthesized by reacting multifunctional aminoalkoxysilanes with diglycidyl ether of bisphenol A (DGEBA) epoxy resin. The reactions of trifunctional 3‐aminopropyltriethoxysilane (APTES), difunctional 3‐aminopropylmethyldiethoxysilane (APMDS), and monofunctional 3‐aminopropyldimethylethoxysilane (APDES) with DGEBA epoxy have been monitored and characterized by FTIR, ¹H NMR, and ²⁹Si NMR spectra in this study. The synthesized epoxy‐bridged polyorganosiloxanes precursors, with different terminated alkoxysilane groups, are thermally cured with or without the addition of curing catalysts. Organometallic dibutyltindilaurate, and alkaline tetrabutylammonium hydroxide have been used as curing catalysts to investigate the thermal curing behaviors and cured properties of epoxy‐bridged polyorganosiloxanes precursors. The maximum exothermal curing temperatures of epoxy‐bridged polyorganosiloxanes precursors are found to appear around the same region of 120°C in DSC analysis. The addition of catalysts to the epoxy/APTES precursor shows significant influence on the cured structure; however, the catalysts exhibit less influence on the cured structure of epoxy‐APMDS precursor and epoxy/APDES precursor. Curing catalysts also show significant enhancement in increasing the thermal decomposition temperature (T_d50s) of cured network of trifunctional epoxy‐bridged polyorganosiloxane (epoxy/APTES). High T_d50s of 518.8 and 613.6 in the cured hybrids of epoxy/APTES and epoxy/APMDS precursors are also observed, respectively. When trialkoxysilane‐terminated epoxy‐bridged polyorganosiloxanes precursor are cured, with or without the addition of catalyst, no obvious T_g transition can be found in the TMA analysis of cured network. The cured network of trialkoxysilane‐terminated epoxy‐bridged polyorganosiloxanes also exhibits the lowest coefficient of thermal expansion (CTE) among the three kinds of alkoxysilane‐terminated epoxy‐bridged polyorganosiloxanes investigated. The organic–inorganic hybrid, from epoxy‐bridged polyorganosiloxanes after the thermal curing process, shows better thermal stability than the cured resin network of pure epoxy‐diaminopropane. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 99: 3491–3499, 2006     

Phosphorus-containing epoxy for flame retardant. III: Using phosphorylated diamines as curing agents

Two phosphorus-containing diamine compounds, bis(4-aminophenoxy)-phenyl phosphine oxide and bis(3-aminophenyl)phenyl phosphine oxide, were synthesized for use as curing agents of epoxy resins. Phosphorylated epoxy resins were obtained by curing Epon 828 and Eponex 1510 with these two diamine agents. For raising the phosphorus contents of the resulting epoxy resins, the phosphorus-containing epoxy, bis(glycidyloxy)phenyl phosphine oxide (BGPPO), was also used. These two diamine agents showed similar reactivity toward epoxies. Their reactivities were higher than DDS and lower than DDM. High char yields in TGA evaluation were found for all the phosphorylated epoxy resins, implying their high flame retardancy. The excellent flame-retardant properties of these phosphorylated epoxy resins were also demonstrated by the high limiting oxygen index (LOI) values of 33 to 51. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 63: 895–901, 1997     

Thermal and mechanical properties of tetra‐functional mesogenic type epoxy resin cured with aromatic amine

A novel tetra‐functional epoxy monomer with mesogenic groups was synthesized and characterized by ¹H‐NMR and FTIR. The synthesized epoxy monomer was cured with aromatic amine to improve the thermal property of epoxy/amine cured system. The glass transition temperature (T_g) and coefficient of thermal expansion (CTE) of the cured system were investigated by dynamic mechanical analysis and thermal mechanical analysis. The properties of the cured system were compared with the conventional bisphenol‐A type epoxy and mesogenic type epoxy system. The storage modulus of the tetra‐functional mesogenic epoxy cured systems showed the value of 0.96 GPa at 250 °C, and T_g‐less behavior was clearly observed. The cured system also showed a low CTE at temperatures above 150 °C without incorporation of inorganic components. These phenomena were achieved by suppression of the thermal motion of network chains by introduction of both mesogenic groups and branched structure to increase the cross linking density. The temperature dependency of the tensile property and thermal conductivity of the cured system was also investigated. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46181.     

Studies of the properties of a thermosetting epoxy modified with block copolymers

Poly[(n‐butyl acrylate)‐block‐poly(methyl methacrylate)‐co‐(glycidyl methacrylate)] (BMG) diblock copolymers incorporating an epoxy‐reactive functionality in one block have been synthesized and used as modifiers for the model epoxy resin E‐51 cured with 4,4′‐diaminodiphenyl methane (DDM). The properties and morphologies of the modified epoxy thermosets were investigated by dynamic mechanical analysis (DMA), impact testing and scanning electron microscopy (SEM). The results reveal that addition of the block copolymers leaves the glass transition temperatures of the blends relatively unchanged, with small decreases in the storage moduli at room temperature. The toughening effect is dependent on the chemical structures of the block copolymers and an increase in the impact strength by a factor of two was obtained by the addition of ‘relatively symmetrical’ block copolymers. Moreover, the impact test results are consistent with the morphologies of the fracture surfaces as evidenced by SEM. Copyright © 2005 Society of Chemical Industry     

Preparation and properties of halogen‐free flame‐retarded phthalonitrile–epoxy blends

Halogen‐free flame‐retarded blends composed of 2,2‐bis[4‐(3,4‐dicyanophenoxy) phenyl] propane (BAPh) and epoxy resin E‐44 (EP) were successfully prepared with 4,4′‐diaminodiphenyl sulfone as a curing additive. The structure of the copolymers was characterized by Fourier transform infrared spectroscopy, which showed that epoxy groups, a phthalocyanine ring, and a triazine ring existed. The limiting oxygen index values were over 30, and the UL‐94 rating reached V‐0 for the 20 : 80 (w/w) BAPh/EP copolymers. Differential scanning calorimetry and dynamic rheological analysis were employed to study the curing reaction behaviors of the phthalonitrile/epoxy blends. Also, the gelation time was shortened to 3 min when the prepolymerization temperature was 190°C. Thermogravimetric analysis showed that the thermal decomposition of the phthalonitrile/epoxy copolymers significantly improved with increasing BAPh content. The flexible strength of the 20:80 copolymers reached 149.5 MPa, which enhanced by 40 MPa compared to pure EP. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Properties of a reactive‐graphitic‐carbon‐nanofibers‐reinforced epoxy

Our previous studies showed that herringbone graphitic GNFs surface‐derivatized with reactive linker molecules bearing pendant primary amino functional groups capable of binding covalently to epoxy resins. Of special importance, herringbone GNFs derivatized with 3,4′‐oxydianiline (GNF‐ODA) were found to react with neat butyl glycidyl ether to form mono‐, di‐, tri‐, and tetra‐glycidyl oligomers covalently coupled to the ODA pendant amino group. The resulting reactive GNF‐ODA (butyl glycidyl)_n nanofibers, r‐GNF‐ODA, are especially well suited for reactive, covalent incorporation into epoxy resins during thermal curing. Based on these studies, nanocomposites reinforced by the r‐GNF‐ODA nanofibers at nanofiber loadings of 0.15–1.3 wt% were prepared. Flexural property of cured r‐GNF‐ODA/epoxy nanocomposites were measured through three‐point‐bending tests. Thermal properties, including glass transition temperature (T_g) and coefficient of thermal expansion (CTE) for the nanocomposites, were investigated using thermal mechanical analysis. The nanocomposites containing 0.3 wt% of the nanofibers gives the highest mechanical properties. At this 0.3‐wt% fiber loading, the flexural strength, modulus and breaking strain of the particular nanocomposite are increased by about 26, 20, and 30%, respectively, compared to that of pure epoxy matrix. Moreover, the T_g value is the highest for this nanocomposite, 14°C higher than that of pure epoxy. The almost constant change in CTEs before and after T_g, and very close to the change of pure epoxy, is in agreement with our previous study results on a chemical bond existing between the r‐GNF‐ODA nanofibers and epoxy resin in the resulting nanocomposites. POLYM. COMPOS., 28:605–611, 2007. © 2007 Society of Plastics Engineers     

Improving thermal and flame‐retardant properties of epoxy resins by a new imine linkage phosphorous‐containing curing agent

A new reactive phosphorus‐containing curing agent with imine linkage called 4, 4′‐[1, 3‐phenyl‐bis(9, 10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐yl)dimethyneimino)]diphenol (2) was synthesized both via two‐pot and one‐pot procedure. The chemical structure of this curing agent was confirmed by FTIR, ¹H, ¹³C, and ³¹P NMR spectra. A series of thermosetting systems were prepared by using conventional epoxy resins (E51), 4, 4′‐diaminodiphenyl methane (DDM) and (2). Resins with different phosphorus contents were obtained by changing the DDM/(2) molar ratios. Their dynamic mechanical thermal, thermal and flame‐retardant properties were evaluated by dynamic mechanical thermal analysis (DMTA), thermogravimetric analysis (TGA), and limiting oxygen index (LOI), respectively. All samples had a single T_g, which showed that these epoxy resins were homogeneous phase. Both the two char yields under nitrogen and air atmospheres increased with increasing content of (2) and the LOI values increased from 24.5 for standard resin to 37.5 for phosphorus‐containing resin, which indicated that incorporation of (2) could impart good thermal stability and excellent flame retardancy to the conventional epoxy thermosets. POLYM. ENG. SCI., 56:441–447, 2016. © 2016 Society of Plastics Engineers     

Effects of chemical structure changes on thermal,mechanical, and crystalline properties of rigid rod epoxy resins

Effects of chemical structure changes on the thermal, mechanical, and crystalline properties of rigid rod epoxy resins have been studied for azomethine epoxy, biphenol epoxy, and tetramethyl biphenol epoxy. Rigid rod epoxies have exhibited better properties than those of the flexible bisphenol A epoxy. The chemical structures of both rigid rod epoxy and curing agent control the properties of cured rigid rod epoxies. When a flexible curing agent (methyl cyclohexane 1,2‐dicarboxylic anhydride) was used, the chemical structure of rigid rod epoxy has dominated effects on the properties. Thus, the azomethine epoxy has shown the best thermal and mechanical properties among three rigid rod epoxies. While a rigid curing agent (sulfanilamide) was used, the physical properties of cured epoxies are not only dependent on the chemical structures of epoxies but also on the ease of formation of ordered network. Among the cured rigid rod epoxies, only the biphenol epoxy cured by sulfanilamide exhibits a liquid crystalline network. It has the highest glass transition temperature (219°C) and the lowest coefficient of thermal expansion (20.8 μm/m°C). However, the most thermal stable system is azomethine epoxy cured with sulfanilamide. It has a weight loss (39%) at 450°C. Their excellent thermal and mechanical properties of rigid rod epoxies are useful in composites, printed wiring boards, integrated circuit encapsulations, etc. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 78: 446–451, 2000