聚酰亚胺胶粘剂改性技术研究进展

介绍了近年来聚酰亚胺(PI)胶粘剂的常见改性方法。重点分析和总结了PI胶膜表面化学改性方法(包括等离子体改性、离子束改性、化学试剂改性和表面接枝聚合改性等)和PI胶粘剂材料化学改性方法,并对PI胶粘剂改性技术的未来发展趋势进行了展望。     

聚酰亚胺胶粘剂改性研究进展

总结了近年来PI(聚酰亚胺)胶粘剂改性方法的研究进展。重点介绍了目前典型的无机粒子[如黏土、多壁碳纳米管(MWNT)、纳米二氧化硅(SiO2)、纳米二氧化钛(TiO2)和纳米氧化铝(Al2O3)等]与PI形成的复合胶粘剂的改性进展。最后对PI胶粘剂的发展前景进行了展望。     

新型耐高温PI胶粘剂用单体的合成及表征

为了提高聚酰亚胺(PI)胶粘剂的耐热性能,将碳硼烷引入PI分子链中,首次合成出一种新型含碳硼烷的PI单体,并采用红外光谱(FT-IR)法对其结构进行了表征。结果表明:含碳硼烷的PI单体在400～500℃升温过程中可交联固化;以此作为PI胶粘剂的基体,可赋予PI胶粘剂极佳的热稳定性能(500～1 300℃时热失重变化不大),从而为制备耐高温胶粘剂提供了新的途径和新的方法。     

B_4C用于PI和804胶粘剂的改性与耐温性能研究

综述了PI(聚酰亚胺)系列胶粘剂和804有机硅树脂胶粘剂的改性方案。采用B_4C(碳化硼)作为耐高温填料剂,通过NMP(N-甲基吡咯烷酮)调节胶粘剂浓度和控制B4C掺混比例,对PI胶粘剂和804胶水进行改性,并用于铝箔玻纤布的复合和耐温性能测试。研究结果表明:PI与NMP改性后的PI和804胶水,其耐温性能提升不明显;玻纤布中SiO_2(二氧化硅)易与B_4C发生反应,造成玻纤布强度明显下降,且对粘接特性改善作用不显著。     

耐高温胶粘剂研究进展

综述了国内外耐高温胶粘剂的发展概况,对环氧树脂(EP)、聚酰亚胺(PI)、酚醛树脂(PF)、聚氨酯(PU)等耐高温有机胶粘剂和磷酸盐、硅酸盐等耐高温无机胶粘剂的合成和改性研究现状作了详细论述,并对今后耐高温胶粘剂的发展趋势进行了展望。     

一种聚酰亚胺胶粘剂的结构剖析

采用傅里叶变换红外(FT-IR)光谱、核磁共振(NMR)光谱、气相色谱(GC)和液相色谱(HPLC)等方法,对某种聚酰亚胺(PI)类胶粘剂中PI的结构进行了剖析。分析结果表明,该PI胶粘剂是由3,3′-二氨基二苯砜和3,4,3′,4′-联苯四酸二酐(BPDA)在N-甲基吡咯烷酮(NMP)中聚合而成的。     

耐高温聚酰亚胺类胶粘剂的国内外研究进展

综述了近几年耐高温聚酰亚胺（PI）胶粘剂的研究和应用进展,总结了PI胶粘剂的结构特点、分类、改性及其功能性的发展状况。重点介绍了将挠性基导入到PI主链、体系中加入单体共聚等PI胶粘剂的结构改性以及环氧树脂、聚氨酯、碳纳米管、环氧树脂改性PI等有机/无机改性PI胶粘剂的研究进展。最后对高性能PI胶粘剂在工业上的应用前景作了展望。     

聚酰亚胺胶粘剂

聚酰亚胺(PI)胶粘剂是一种新型的耐高温胶粘剂,广泛用于航空材料,特别是如“波音”系列先进的超音速飞机材料的粘接。本文综述了国外有关PI胶粘剂的发展情况及目前研究动向。     

聚酰亚胺胶粘剂的研究进展

聚酰亚胺(PI)作为一种特殊的功能材料,可以用作胶粘剂且具有极大的发展空间。按PI胶粘剂的粘接对象进行分类,并依次介绍了其最新的研究进展。     

耐低温面砖胶粘剂的研究进展

介绍了耐低温面砖胶粘剂的研究进展(包括改性水泥砂浆型耐低温面砖胶粘剂、环氧树脂型耐低温面砖胶粘剂、丙烯酸酯型耐低温面砖胶粘剂和聚氨酯型耐低温面砖胶粘剂等)。依据我国实际情况对耐低温面砖胶粘剂的发展前景进行了展望。     

聚氨酯胶粘剂的研究与应用

简述了聚氨酯胶粘剂的发展状况、粘接特性,以及其存在的不足之处和相应的改性研究。对其在包装业、建筑业、汽车制造、木材粘接、书籍装订、印刷业等方面的应用进行了详细介绍。指出新型高性能、可生物降解的环保型聚氨酯胶粘剂是今后研究的重要方向。     

Preparation and properties of high-strength-high-modulus polyimide cords/natural rubber composites

High-strength-high-modulus polyimide (PI) cords reinforced natural rubber (NR) composites are prepared, and the PI cords are treated with resorcinol-formaldehyde-latex (RFL) adhesive to enhance the interfacial adhesion with NR matrix. The influence of RFL adhesive variables, such as the ratio of R/F and RF/L, on the adhesion between PI cords and NR is investigated. Furthermore, sorbitol glycidyl ether (SGE) and caprolactam blocked methylene diisocyanate (CBI) are adhered to the surface of the PI cords through a dip-coating procedure to introduce epoxy and NCO groups and graft with more RFL adhesive. The H pull-out force of SGE/CBI-RFL treated PI cords/NR composites reaches as high as 193.9 N, which is 580% higher than that of untreated PI ones. Additionally, the SGE/CBI-RFL treated PI cords/NR composites exhibit superior adhesion, aging, and fatigue resistance together with better mechanical properties as compared with SGE/CBI-RFL treated poly(para-phenylene terephtalamide) (PPTA) cords/NR composites.     

聚丙烯酸酯乳液胶粘剂在建筑行业的应用

聚丙烯酸酯乳液胶粘剂(PAEA)具有易于制备、性能优良且粘接面宽广等诸多优点,故其自20世纪以来一直保持着较高的发展速度。综述了聚丙烯酸酯乳液(PAE)在水泥改性、涂料及密封剂等建筑领域的应用。最后,从分子设计等不同角度对PAEA未来的研究方向进行了展望。     

Asymptotic Fields in Adhesive Fracture

This paper presents the asymptotic singular fields associated with the fracture analysis of adhesive joints and the micromechanics of adhesive failure. The fracture parameters used in adhesives are examined and their validity and use in applications is evaluated. Contrary to conventional fracture mechanics of homogeneous media the asymptotic field in most adhesive fracture is a function of the following: the adhesive and adherend properties, the dimensionality of the crack geometry, and their relationship to the interface. The Finite Element Iterative Method (FEIM) is used in analyzing the asymptotic fields. The results of the singularities for interfacial cracks of various geometries and material properties are presented and discussed in relation to adhesive failures.     

Asymptotic Fields in Adhesive Fracture

This paper presents the asymptotic singular fields associated with the fracture analysis of adhesive joints and the micromechanics of adhesive failure. The fracture parameters used in adhesives are examined and their validity and use in applications is evaluated. Contrary to conventional fracture mechanics of homogeneous media the asymptotic field in most adhesive fracture is a function of the following: the adhesive and adherend properties, the dimensionality of the crack geometry, and their relationship to the interface. The Finite Element Iterative Method (FEIM) is used in analyzing the asymptotic fields. The results of the singularities for interfacial cracks of various geometries and material properties are presented and discussed in relation to adhesive failures.     

我国聚氨酯胶粘剂发展概况（下）

4．5运输、建筑业用聚氨酯胶粘剂、密封剂 4。5．1运输业用聚氨酯胶粘剂、密封剂促进PU胶发展速度快的原因之一是运输和建筑2大支柱产业的需用量增大。密封剂又是这2个工业领域应用的主导品类。     

Synthesis and properties of fluorene‐based polyimide adhesives

Five kinds of fluorene‐based polyimides (PIs) based on 4,4′‐oxydiphthalicanhydride (ODPA), 9,9′‐bis(4‐aminophenyl)fluorene (BAFL), and 3,4′‐diaminodiphenyl ether (3,4′‐ODA) were synthesized through two‐step method. The partially or fully imidized PI films were cast from poly(amic acid) (PAA) solution and were imidized by far‐infrared radiation at various temperatures. The degree of imidization was characterized by FT‐IR and TGA. The fully imidized PI films were characterized by DMTA, TGA, and tensile tests. The partially imidized PI films were adhered to stainless steel plates for preparing the single lap joints. Lap shear strength (LSS) at room temperature was measured to compare the adhesive strength of single lap joint. Fractured surfaces were analyzed using scanning electron microscopy (SEM). The effects of fluorene content on thermal, tensile, and adhesion properties of PIs were elaborately studied. The results showed that PI films exhibited high glass transition temperature (T_g), good thermalplasticity, and thermal stability. The LSS of PIs increased abruptly with the incorporation of fluorene groups. The LSS of PI‐50/50 was the highest, which was 22.3 MPa. The LSS of PI‐50/50 was also measured at high temperature to investigate the thermal resistance of fluorene‐based PI adhesive. POLYM. ENG. SCI., 2011. © 2011 Society of Plastics Engineers.