Nature of the edge electroluminescence peak in the Si:(Er,O) diode breakdown mode

Electroluminescence (EL) of erbium-and oxygen-doped Si:(Er,O) diodes at λ=1.00–1.65 μm has been studied in the p-n junction breakdown and forward current modes. The EL was measured at room temperature from the front and back surfaces of the diodes. A peak corresponding to the absorption band edge of silicon was observed in the EL spectra of some diodes in the p-n junction breakdown mode. The peak is associated with the injection of minority carriers from the metal contact into silicon, with subsequent band-to-band radiative recombination. The band-to-band recombination intensity increases sharply on reaching a certain current density that depends on the fabrication technology. This threshold current density decreases with the temperature of post-implantation annealing of Si:(Er,O) diodes increasing in the range 900–1100°C. __________ Translated from Fizika i Tekhnika Poluprovodnikov, Vol. 36, No. 4, 2002, pp. 453–456. Original Russian Text Copyright ? 2002 by Emel’yanov, Nikolaev, Sobolev.     

A p-silicon nanowire/n-ZnO thin film heterojunction diode prepared by thermal evaporation

This paper represents the electrical and optical characteristics of a SiNW/ZnO heterojunction diode and subsequent studies on the photodetection properties of the diode in the ultraviolet （UV） wavelength region. In this work, silicon nanowire arrays were prepared on p-type （100）-oriented Si substrate by an electroless metal deposition and etching method with the help of ultrasonication. After that, catalyst-free deposition of zinc oxide （ZnO） nanowires on a silicon nanowire （SiNW） array substrate was done by utilizing a simple and cost-effective thermal evaporation technique without using a buffer layer. The SEM and XRD techniques are used to show the quality of the as-grown ZnO nanowire film. The junction properties of the diode are evaluated by measuring current-voltage and capacitance-voltage characteristics. The diode has a well-defined rectifying behavior with a rectification ratio of 190 at -t-2 V, turn-on voltage of 0.5 V, and barrier height is 0.727 eV at room temperature under dark conditions. The photodetection parameters of the diode are investigated in the bias voltage range of ± 2 V. The diode shows responsivity of 0.8 A/W at a bias voltage of 2 V under UV illumination （wavelength = 365 nm）. The characteristics of the device indicate that it can be used for UV detection applications in nano-optoelectronic and photonic devices.     

Evidence from spectral emissometry for conduction intraband transitions in the intrinsic regime for silicon

From emissometry measurements in lightly doped Si at elevated temperatures, we have observed an anomalous absorption band in the wavelength range of 1–5 μm. The wavelength at which the band peaks, λ≈2.3 μm, shows a negligible dependence on temperature while the peak intensity increases with temperature presumably as a result of the increasing intrinsic carrier concentration. Spitzer and Fan reported a similar absorption band in direct absorption measurements at room temperature for n-type Si with extrinsic electron concentrations of 10¹⁴ to 10¹⁹cm⁻³. No such structure was found in extrinsic p-type Si. Spitzer and Fan were unable to identify the mechanism for this anomalous absorption. In both the experiments, this absorption of free electrons is due to intraband transitions in the conduction band from the Δ₁ conduction band edge across an energy gap of E ∼ 0.5 eV to a higher lying Δ₂′ conduction band.     

Electronic structure and optical properties of F-doped β-Ga2O3 from first principles calculations

The effects of F-doping concentration on geometric structure, electronic structure and optical property of β-Ga₂O₃ were investigated. All F-doped β-Ga₂O₃ with different concentrations are easy to be formed under Ga-rich conditions, the stability and lattice parameters increase with the F-doping concentration. F-doped β-Ga₂O₃ materials display characteristics of the n-type semiconductor, occupied states contributed from Ga 4s, Ga 4p and O 2p states in the conduction band increase with an increase in F-doping concentration. The increase of F concentration leads to the narrowing of the band gap and the broadening of the occupied states. F-doped β-Ga₂O₃ exhibits the sharp band edge absorption and a broad absorption band. Absorption edges are blue-shifted, and the intensity of broad band absorption has been enhanced with respect to the fluorine content. The broad band absorption is ascribed to the intra-band transitions from occupied states to empty states in the conduction band.     

Temperature dependent IDS-VGS characteristics of an N-channel Si tunneling field-effect transistor with a germanium source on Si（llO） substrate

We fabricated n-type Si-based TFETs with a Ge source on Si（110） substrate. The temperature dependent IDS-VGS characteristics of a TFET formed on Si（110） are investigated in the temperature range of 210 to 300 K. A study of the temperature dependence of/Leakage indicates that/Leakage is mainly dominated by the Shockley-Read- Hall （SRH） generation-recombination current of the n＋ drain-Si substrate junction, ION increases monotonically with temperature, which is attributed to a reduction of the bandgap at the tunneling junction and an enhancement of band-to-band tunneling rate. The subthreshold swing S for trap assisted tunneling （TAT） current and band-to- band tunneling （BTBT） current shows the different temperature dependence. The subthreshold swing S for the TAT current degrades with temperature, while the S for BTBT current is temperature independent.     

Gas selectivity of SILAR grown CdS nano-bulk junction

Nano-particles of cadmium sulphide were deposited on cleaned copper substrate by an automated sequential ionic layer adsorption reaction (SILAR) system.The grown nano-bulk junction exhibits Schottky diode behavior.The response of the nano-bulk junction was investigated under oxygen and hydrogen atmospheric conditions.The gas response ratio was found to be 198％ for Oxygen and 34％ for Hydrogen at room temperature.An increase in the operating temperature of the nano-bulk junction resulted in a decrease in their gas response ratio.A logarithmic dependence on the oxygen partial pressure to the junction response was observed,indicating a Temkin isothermal behavior.Work function measurements using a Kelvin probe demonstrate that the exposure to an oxygen atmosphere fails to effectively separate the charges due to the built-in electric field at the interface.Based on the benefits like simple structure,ease of fabrication and response ratio the studied device is a promising candidate for gas detection applications.     

Study and modeling of the transport mechanism in a Schottky diode on the basis of a GaAs semiinsulator

The current through a metal-semiconductor junction is mainly due to the majority carriers.Three distinctly different mechanisms exist in a Schottky diode:diffusion of the semiconductor carriers in metal,thermionic emission-diffusion（TED） of carriers through a Schottky gate,and a mechanical quantum that pierces a tunnel through the gate.The system was solved by using a coupled Poisson-Boltzmann algorithm.Schottky BH is defined as the difference in energy between the Fermi level and the metal band carrier majority of the metal-semiconductor junction to the semiconductor contacts.The insulating layer converts the MS device in an MIS device and has a strong influence on its current-voltage（I-V） and the parameters of a Schottky barrier from 3.7 to 15 eV.There are several possible reasons for the error that causes a deviation of the ideal behaviour of Schottky diodes with and without an interfacial insulator layer.These include the particular distribution of interface states,the series resistance, bias voltage and temperature.The GaAs and its large concentration values of trap centers will participate in an increase in the process of thermionic electrons and holes,which will in turn act on the I-V characteristic of the diode,and an overflow maximum value[NT = 3×10²⁰]is obtained.The I-V characteristics of Schottky diodes are in the hypothesis of a parabolic summit.     

压力下光学声子对应变纤锌矿AlN/GaN异质结中电子迁移率的影响

A variational method combined with solving the force balance equation is adopted to investigate the influence of strain and hydrostatic pressure on electronic mobility in a strained wurtzite AlN/GaN heterojunction by considering the scattering of optical-phonons in a temperature ranges from 250 to 600 K. The effects of conduction band bending and an interface barrier are also considered in our calculation. The results show that electronic mobility decreases with increasing hydrostatic pressure when the electronic density varies from 1.0 × 1012 to 6.5 × 1012 cm-2. The strain at the heterojunction interface also reduces the electronic mobility, whereas the pressure influence becomes weaker when strain is taken into account. The effect of strain and pressure becomes more obvious as temperature increases. The mobility first increases and then decreases significantly, whereas the strain and hydrostatic pressure reduce this trend as the electronic density increases at a given temperature （300 K）. The results also indicate that scattering from half space phonon modes in the channel side plays a dominant role in mobility.     

Effect of the annealing temperature on erbium ion electroluminescence in Si:(Er,O) diodes with (111) substrate orientation

The influence of the temperature of secondary annealing, stimulating the formation of optically and electrically active centers, on the erbium ion electroluminescence (EL) at λ≈1.54 μm in (111) Si:(Er,O) diodes has been studied. The diodes were fabricated by the implantation of 2.0 and 1.6 MeV erbium ions at doses of 3×10¹⁴ cm⁻² and oxygen ions (0.28 and 0.22 MeV, 3×10¹⁵ cm⁻²). At room temperature, the EL intensity in the breakdown mode grows with the annealing temperature increasing from 700 to 950°C. At annealing temperatures of 975–1100°C, no erbium EL is observed in the breakdown mode owing to the formation of microplasmas. The intensity of the injection EL at 80 K decreases with the annealing temperature increasing from 700 to 1100°C. __________ Translated from Fizika i Tekhnika Poluprovodnikov, Vol. 35, No. 10, 2001, pp. 1224–1227. Original Russian Text Copyright ? 2001 by Sobolev, Emel’yanov, Nikolaev.     

PIN二极管变温度高频动态建模方法

The PIN diode model for high frequency dynamic transient characteristic simulation is important in conducted EMI analysis. The model should take junction temperature into consideration since equipment usually works at a wide range of temperature. In this paper, a temperature-variable high frequency dynamic model for the PIN diode is built, which is based on the Laplace-transform analytical model at constant temperature. The relationship between model parameters and temperature is expressed as temperature functions by analyzing the physical principle of these parameters. A fast recovery power diode MUR1560 is chosen as the test sample and its dynamic performance is tested under inductive load by a temperature chamber experiment, which is used for model parameter extraction and model verification. Results show that the model proposed in this paper is accurate for reverse recovery simulation with relatively small errors at the temperature range from 25 to 120 ℃.     

Ga掺杂ZnO透明电极的研究

An 8 μ m thick Ga-doped ZnO (GZO) film grown by metal-source vapor phase epitaxy was deposited on a GaN-based light-emitting diode (LED) to substitute for the conventional ITO as a transparent conduct layer (TCL). Electroluminescence spectra exhibited that the intensity value of LED emission with a GZO TCL is markedly improved by 23.6% as compared to an LED with an ITO TCL at 20 mA. In addition, the forward voltage of the LED with a GZO TCL at 20 mA is higher than that of the conventional LED. To investigate the reason for the increase of the forward voltage, X-ray photoelectron spectroscopy was performed to analyze the interface properties of the GZO/p-GaN heterojunction. The large valence band offset (2.24± 0.21 eV) resulting from the formation of Ga₂O₃ in the GZO/p-GaN interface was attributed to the increase of the forward voltage.     

JFET输入运算放大器辐射损伤的退火行为

The elevated and room temperature annealing behavior of radiation damage in JFET-input operational amplifiers （op-amps） were investigated. High- and low-dose-rate irradiation results show that one of the JFET-input op-amps studied in this paper exhibits enhanced low-dose-rate sensitivity and the other shows time-dependent effect. The offset voltage of both op-amps increases during long-term annealing at room temperature. However, the offset voltage decreases at elevated temperature. The dramatic difference in annealing behavior at room and elevated temperatures indicates the migration behavior of radiation-induced species at elevated and room temperatures. This provides useful information to understand the degradation and annealing mechanisms in JFET-input op-amps under total ionizing radiation. Moreover, the annealing of oxide trapped charges should be taken into consideration, when using elevated temperature methods to evaluate low-dose-rate damage.     

Prospects of β-SiC Based IMPATT Oscillator for Application in THz Communication and Growth of β-SiC p-n Junction on Ge Modified Si <100> Substrate to Realize THz IMPATTs

The prospects of p+ n n+ cubic Silicon Carbide (3C-SiC/ß-SiC) based IMPATT diode as a potential solid-state Terahertz source is studied for the first time through a modified generalized simulation scheme. The simulation predicts that the device is capable of generating a RF power output of 63.0 W at 0.33 THz with an efficiency of 13%. The effects of parasitic series resistance on the device performance and exploitable RF power level are further simulated. The studies clearly establish the potential of 3C-SiC as a base semiconductor material for high-power THz IMPATT device. Based on the simulation results an attempt has been made to fabricate β- SiC based IMPATT devices in THz region. Single crystalline, epitaxial 3C-SiC films are deposited on silicon (Si) <100> substrates by Rapid Thermal Chemical Vapour Deposition (RTPCVD) at a temperature as low as 800 0C using a single precursor methylsilane, which contains Si and C atoms in the same molecule. No initial surface carbonization step is required in this method. A p-n junction with n-type doping conc. of 4 x 10^24 m-3 (which is similar to the simulated design data) has been grown successfully and the characterization of the grown 3C-SiC film is reported in this paper. It is found that the inclusion of Ge improves the crystal quality and reduces the surface roughness.     

Light emitting devices based on Si nanoclusters： the integration with a photonic-crystal and electroluminescence properties

We present the properties and potentialities of light emitting devices based on amorphous Si nanoclusters. Amorphousnanostructures may constitute an interesting alternative to Si nanocrystals for the monolithic integration of optical andelectrical functions in Si technology. In fact, they exhibit an intense room temperature electroluminescence (EL). The ELproperties of these devices have been studied as a function of current and of temperature. Moreover, to improve theextraction efficiency of the light, we have integrated the emitting system with a 2D photonic crystal structure opportunelyfabricated by using conventional optical lithography to reduce the total internal reflection of the emitted light. The extractionefficiency in such devices increases by a factor of 4 at a resonance wavelength.     

Effect of temperature on the intensity and carrier lifetime of an AlGaAs based red light emitting diode

The influence of temperature on the intensity of light emitted by as well as the carrier life time of a standard AlGaAs based light emitting diode has been investigated in the temperature range from 345 to 136 K. The open-circuit voltage decay(OCVD) technique has been used for measured the carrier lifetime. Our experimental results reveal a 16% average increase in intensity and a 163.482-19.765 ns variation in carrier lifetime in the above temperature range. Further, theoretical and experimental analysis show that for negligible carrier density the intensity is inversely proportional to carrier lifetime for this sample.     

Photoluminescence origin of nanocrystalline SiC films

The nanocrystalline SiC films were prepared on Si then annealed at 800℃ and 1 000℃ for 30 minutes （111） substrates by rf magnetron sputtering and in a vacuum annealing system. The crystal structure and crystallization of as-annealed SiC films were determined by the Fourier transform infrared （FIR） absorption spectra and the X-ray diffraction （XRD） analysis. Measurement of photoluminescence （PL） of the nanocrystalline SiC （nc-SiC） films shows that the blue light with 473 nm and 477 nm wavelengths emitted at room temperature and that the PL peak shifts to shorter wavelength side and the PL intensity becomes stronger as the annealing temperature decreases. The time-resolved spectrum of the PL at 477 nm exhibits a bi-exponential decay process with lifetimes of 600 ps and 5 ns and a characteristic of the direct band gap. The strong blue light emission with short PL lifetimes suggests that the quantum confinement effect of the SiC nanocrystals resulted in the radiative recombination of the direct optical transitions.     

Influence of oxygen on the photoluminescence intensity of erbium (at 1.54 µm) in erbium-doped a-Si:H films

The influence of oxygen on the photoluminescence (PL) of erbium (at 1.54 μm) in erbium-doped hydrogenated amorphous silicon (c-Si〈Er〉) is investigated. The a-Si:H〈Er〉 films studied are fabricated by cosputtering Si and Er targets using the technology of dc silane decomposition in a magnetic field. The oxygen concentration is varied from 10¹⁹ to 10²¹ cm⁻³ by increasing the partial pressure of oxygen in the chamber. It is shown that, as in the case of erbium-doped crystalline silicon (c-Si〈Er〉), oxygen has an effect on the intensity of the 1.54 μm photoluminescence in a-Si:H〈Er〉 films. The values of the erbium and oxygen concentrations at which the maximum Er PL intensity is observed are two orders of magnitude higher than in crystalline silicon. The increase in the Er PL intensity at room temperature and the weaker temperature dependence of the Er PL in comparison to c-Si〈Er,O〉 attest to the prospect of using a-Si:H〈Er〉 films in optoelectronic applications. Fiz. Tekh. Poluprovodn. 32, 1384–1389 (November 1998)     

Hetero-gate-dielectric double gate junctionless transistor (HGJLT) with reduced band-to-band tunnelling effects in subthreshold regime

We propose a hetero-gate-dielectric double gate junctionless transistor （HGJLT）, taking high-k gate insulator at source side and low-k gate insulator at drain side, which reduces the effects ＆band-to-band tunnelling （BTBT） in the sub-threshold region. A junctionless transistor （JLT） is turned off by the depletion of carriers in the highly doped thin channel （device layer） which results in a significant band overlap between the valence band of the channel region and the conduction band of the drain region, due to off-state drain bias, that triggers electrons to tunnel from the valence band of the channel region to the conduction band of the drain region leaving behind holes in the channel.These effects of band-to-band tunnelling increase the sub-threshold leakage current, and the accumulation of holes in the channel forms a parasitic bipolar junction transistor （n-p-n BJT for channel JLT） in the lateral direction by the source （emitter）, channel （base） and drain （collector） regions in JLT structure in off-state. The proposed HGJLT reduces the subthreshold leakage current and suppresses the parasitic BJT action in off-state by reducing the band-to-band tunnelling probability.     

光注入型SiC BCCD的可行性分析

An SiC optoinjected charge-coupled device with buried channels(BCCD)is designed for the detection of ultraviolet light(UV),and its feasibility is studied by means of Silvaco numerical simulation software.Charge storageandtransfercharacteristicsoftheBCCDcanbeconformedbysimulationresults.Theburiedchanneldesign is a key point to realize the high sensitivity of the device.The channel mobility of electrons in the 6H-SiC BCCD can be changed from 47 to 200 cm2/(V s)when the channel is replaced from surface to the subsurface of 0.2 m.With the optimized device parameters,the density of stored electrons can reach up to 1.062 1011cm2and the number of stored electrons is up to 1.826 108for UV light with wavelengths from 200 to 380 nm and an intensity of 0.1 W/cm2under a driving voltage of 15 V at room temperature.