Mechanical properties and intermetallic compound formation at the Sn/Ni and Sn-0.7wt.%Cu/Ni joints

The Ni/Sn/Ni and Ni/Sn-0.7wt.%Cu/Ni couples are reacted at 200°C for various lengths of time. The tensile strengths of these annealed specimens are determined at room temperature. In addition, the interfacial reactions and fracture surfaces of the specimens are examined as well. These properties are important for the evaluation of the usage of Sn-0.7wt.%Cu lead-free solders, which has been not available in the literature. Only the Ni₃Sn₄ phase is formed at the Sn/Ni interface, but both the Cu₆Sn₅ and Ni₃Sn₄ phases are formed at the Sn-0.7wt.%Cu/Ni interface. The thickness of the intermetallic compound layers grows, while the joint strength decreases with longer reaction time. With a 1-h reaction at 200°C, the fracture surface is in the solder matrix for both of the two kinds of couples. Shifting toward the compound layer with longer reaction time, the fracture surface is in the Ni₃Sn₄ layer in the Sn/Ni couple and is at the interface between the Cu₆Sn₅ and Ni₃Sn₄ in the Sn-0.7wt.%Cu/Ni after reacting at 200°C for 240 h.     

Compound formation for electroplated Ni and electroless Ni in the under-bump metallurgy with Sn-58Bi solder during aging

The Ni-based under-bump metallurgies (UBMs) are of interest because they have a slower reaction rate with Sn-rich solders compared to Cu-based UBMs. In this study, several UBM schemes using Ni as the diffusion barrier are investigated. Joints of Sn-58Bi/Au/electroless nickel (EN)/Cu/Al₂O₃ and Sn-58Bi/Au/electroplated nickel/Cu/Al₂O₃ were aged at 110°C and 130°C for 1–25 days to study the interfacial reaction and microstructural evolution. The Sn-Bi solder reacts with the Ni-based multimetallization and forms the ternary Sn-Ni-Bi intermetallic compound (IMC) during aging at 110°C. Compositions of ternary IMC were (78–80)at.%Sn-(12–16)at.%Ni-(5–8)at.%Bi in joints of Sn-58Bi/Au/Ni-5.5wt.%P/Cu, Sn-58Bi/Au/Ni-12wt.%P/Cu, and Sn-58Bi/Au/Ni/Cu. Elevated aging at 130°C accelerates the IMC growth rate and results in the formation of (Ni,Cu)₃Sn₄ and (Cu,Ni)₆Sn₅ adjacent to the ternary Sn-Ni-Bi IMC for the Sn-58Bi/Au/Ni-12wt.%P/Cu and Sn-58Bi/Au/Ni/Cu joints, respectively. The Cu content in the (Cu,Ni)₆Sn₅ IMC is six times that in (Ni,Cu)₃Sn₄. Electroplated Ni fails to prevent Cu diffusion toward the Ni/solder interface as compared to EN-based joints. Cracks are observed in the Sn-58Bi/Au/Ni-5.5wt.%P/Cu/Al₂O₃ joint aged at 130°C for 25 days. It is more favorable to employ Ni-12wt.%P for the Sn-58Bi/Au/EN/Cu joint. Electroless nickel, with the higher P content of 12 wt.%, is a more effective diffusion barrier during aging. In addition, P enrichment occurs near the interface of the EN/solder, and the degree of P enrichment is enhanced with aging time. The Au(Sn,Bi)₄, with pyramidal and cubic shape, is observed in the Sn-58Bi/Au/Ni/Cu/Al₂O₃ joint.     

Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates

The growth kinetics of an intermetallic compound (IMC) layer formed between Sn-3.5Ag-0.5Cu (SAC) solders and Cu-Zn alloy substrates was investigated for samples aged at different temperatures. Scallop-shaped Cu₆Sn₅ formed after soldering by dipping Cu or Cu-10 wt.%Zn wires into the molten solder at 260°C. Isothermal aging was performed at 120°C, 150°C, and 180°C for up to 2000 h. During the aging process, the morphology of Cu₆Sn₅ changed to a planar type in both specimens. Typical bilayer of Cu₆Sn₅ and Cu₃Sn and numerous microvoids were formed at the SAC/Cu interfaces after aging, while Cu₃Sn and microvoids were not observed at the SAC/Cu-Zn interfaces. IMC growth on the Cu substrate was controlled by volume diffusion in all conditions. In contrast, IMC growth on Cu-Zn specimens was controlled by interfacial reaction for a short aging time and volume diffusion kinetics for a long aging time. The growth rate of IMCs on Cu-Zn substrates was much slower due to the larger activation energy and the lower layer growth coefficient for the growth of Cu-Sn IMCs. This effect was more prominent at higher aging temperatures.     

Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder

Long-term, solid-state intermetallic compound (IMC) layer growth was examined in 95.5Sn-3.9Ag-0.6Cu (wt.%)/copper (Cu) couples. Aging temperatures and times ranged from 70°C to 205°C and from 1 day to 400 days, respectively. The IMC layer thicknesses and compositions were compared to those investigated in 96.5Sn-3.5Ag/Cu, 95.5Sn-0.5Ag-4.0Cu/Cu, and 100Sn/Cu couples. The nominal Cu₃Sn and Cu₆Sn₅ stoichiometries were observed. The Cu₃Sn layer accounted for 0.4–0.6 of the total IMC layer thickness. The 95.5Sn-3.9Ag-0.6Cu/Cu couples exhibited porosity development at the Cu₃Sn/Cu interface and in the Cu₃Sn layer as well as localized “plumes” of accelerated Cu₃Sn growth into the Cu substrate when aged at 205°C and t>150 days. An excess of 3–5at.%Cu in the near-interface solder field likely contributed to IMC layer growth. The growth kinetics of the IMC layer in 95.5Sn-3.9Ag-0.6Cu/Cu couples were described by the equation x=x_o+Atⁿexp [−ΔH/RT]. The time exponents, n, were 0.56±0.06, 0.54±0.07, and 0.58±0.07 for the Cu₃Sn layer, the Cu₆Sn₅, and the total layer, respectively, indicating a diffusion-based mechanism. The apparent-activation energies (ΔH) were Cu₃Sn layer: 50±6 kJ/mol; Cu₆Sn₅ layer: 44±4 kJ/mol; and total layer: 50±4 kJ/mol, which suggested a fast-diffusion path along grain boundaries. The kinetics of Cu₃Sn growth were sensitive to the Pb-free solder composition while those of Cu₆Sn₅ layer growth were not so.     

Effect of Ag Content and the Minor Alloying Element Fe on the Mechanical Properties and Microstructural Stability of Sn-Ag-Cu Solder Alloy Under High-Temperature Annealing

This study compares the high-Ag-content Sn-3Ag-0.5Cu with the low- Ag-content Sn-1Ag-0.5Cu solder alloy and the three quaternary solder alloys Sn-1Ag-0.5Cu-0.1Fe, Sn-1Ag-0.5Cu-0.3Fe, and Sn-1Ag-0.5Cu-0.5Fe to understand the beneficial effects of Fe on the microstructural stability, mechanical properties, and thermal behavior of the low-Ag-content Sn-1Ag-0.5Cu solder alloy. The results indicate that the Sn-3Ag-0.5Cu solder alloy possesses small primary β-Sn dendrites and wide interdendritic regions consisting of a large number of fine Ag₃Sn intermetallic compound (IMC) particles. However, the Sn-1Ag-0.5Cu solder alloy possesses large primary β-Sn dendrites and narrow interdendritic regions of sparsely distributed Ag₃Sn IMC particles. The Fe-bearing SAC105 solder alloys possess large primary β-Sn dendrites and narrow interdendritic regions of sparsely distributed Ag₃Sn IMC particles containing a small amount of Fe. Moreover, the addition of Fe leads to the formation of large circular FeSn₂ IMC particles located in the interdendritic regions. On the one hand, tensile tests indicate that the elastic modulus, yield strength, and ultimate tensile strength (UTS) increase with increasing Ag content. On the other hand, increasing the Ag content reduces the total elongation. The addition of Fe decreases the elastic modulus, yield strength, and UTS, while the total elongation is still maintained at the Sn-1Ag-0.5Cu level. The effect of aging on the mechanical behavior was studied. After 720 h and 24 h of aging at 100°C and 180°C, respectively, the Sn-1Ag-0.5Cu solder alloy experienced a large degradation in its mechanical properties after both of the aging conditions, whereas the mechanical properties of the Sn-3Ag-0.5Cu solder alloy degraded more dramatically after 24 h of aging at 180°C. However, the Fe-bearing SAC105 solder alloys exhibited only slight changes in their mechanical properties after both aging procedures. The inclusion of Fe in the Ag₃Sn IMC particles suppresses their IMC coarsening, which stabilizes the mechanical properties of the Fe-bearing SAC105 solder alloys after aging. The results from differential scanning calorimetry (DSC) tests indicate that the addition of Fe has a negligible effect on the melting behavior. However, the addition of Fe significantly reduces the solidification onset temperature and consequently increases the degree of undercooling. In addition, fracture surface analysis indicates that the addition of Fe to the Sn-1Ag-0.5Cu alloy does not affect the mode of fracture, and all tested alloys exhibited large ductile dimples on the fracture surface.     

Interfacial Reactions Between Pb-Free Solders and In/Ni/Cu Multilayer Substrates

This study investigates the interfacial reactions between Sn-3.0wt.% Ag-0.5wt.%Cu (SAC) and Sn-0.7wt.%Cu (SC) on In/Ni/Cu multilayer substrates using the solid–liquid interdiffusion bonding technique. Samples were reflowed first at 160°C, 180°C, and 200°C for various periods, and then aged at 100°C for 100 h to 500 h. The scalloped Cu₆Sn₅ phase was formed at the SAC/In/Ni/Cu and SC/In/Ni/Cu interfaces. When the reflowing temperatures were 160°C and 180°C, a ternary Ni-In-Sn intermetallic compound (IMC) was formed when the samples were further aged at 100°C. This ternary Ni-In-Sn IMC could be the binary Ni₃Sn₄ phase with extensive Cu and In solubilities, or the ternary Sn-In-Ni compound with Cu solubility, or even a quaternary compound. As the reflow temperature was increased to 200°C, only one Cu₆Sn₅ phase was formed at the solder/substrate interface with the heat treatment at 100°C for 500 h. Mechanical test results indicated that the formation of the Ni-In-Sn ternary IMC weakened the mechanical strength of the solder joints. Furthermore, the solid–liquid interdiffusion (SLID) technique in this work effectively reduced the reflow temperature.     

Interfacial Reactions in Sn-Ag/Co Couples

Sn-Ag alloys are important solders, and Co and Co alloys are investigated as barrier layers. Interfacial reactions in Sn-Ag/Co couples were examined in this study for Ag contents of 1.0 wt.%, 2.0 wt.%, and 3.5 wt.% and reaction temperatures of 250°C, 200°C, and 150°C. Only CoSn₃ formed in Sn-Ag/Co couples reacted at 250°C, but both CoSn₃ and Ag₃Sn formed in couples reacted at 200°C and 150°C. The reaction layer was 100 μm thick in Sn-3.5 wt.%Ag/Co couples reacted at 200°C for 110 h. The reaction rates were lower if Ag was added, but remained very fast compared with those for Ni and Ni-based substrates.     

Intermetallic growth kinetics for Sn-Ag, Sn-Cu, and Sn-Ag-Cu lead-free solders on Cu, Ni, and Fe-42Ni substrates

Soldering with the lead-free tin-base alloys requires substantially higher temperatures (∼235–250°C) than those (213–223°C) required for the current tin-lead solders, and the rates for intermetallic compound (IMC) growth and substrate dissolution are known to be significantly greater for these alloys. In this study, the IMC growth kinetics for Sn-3.7Ag, Sn-0.7Cu, and Sn-3.8Ag-0.7Cu solders on Cu substrates and for Sn-3.8Ag-0.7Cu solder with three different substrates (Cu, Ni, and Fe-42Ni) are investigated. For all three solders on Cu, a thick scalloped layer of η phase (Cu₆Sn₅) and a thin layer of ε phase (Cu₃Sn) were observed to form, with the growth of the layers being fastest for the Sn-3.8Ag-0.7Cu alloy and slowest for the Sn-3.7Ag alloy. For the Sn-3.8Ag-0.7Cu solder on Ni, only a relatively uniform thick layer of η phase (Cu,Ni)₆Sn₅ growing faster than that on the Cu substrate was found to form. IMC growth in both cases appears to be controlled by grain-boundary diffusion through the IMC layer. For the Fe-42Ni substrate with the Sn-3.8Ag-0.7Cu, only a very thin layer of (Fe,Ni)Sn₂ was observed to develop.     

Effects of Co Alloying and Size on Solidification and Interfacial Reactions in Sn-57 wt.%Bi-(Co)/Cu Couples

Solidification and interfacial reactions in Sn-57 wt.%Bi-(Co)/Cu couples are investigated. The addition of 0.05 wt.% Co and 0.5 wt.% Co and changes between 2 g and 20 mg solder sizes have no significant effects on the undercooling of Sn-57 wt.%Bi solders. Both η-Cu₆Sn₅ and ε-Cu₃Sn phases are formed in Sn-57 wt.%Bi/Cu couples reacted at 80°C, 100°C, and 100°C, whereas only η-Cu₆Sn₅ is formed at 160°C. The formation of ε-Cu₃Sn is suppressed and only η-Cu₆Sn₅ is found in the couple with 0.05 wt.% Co and 0.5 wt.% Co addition in Sn-57 wt.%Bi solder. Both the growth rate of η-Cu₆Sn₅ and the dissolution rate of the Cu substrate increase with Co addition. The morphology of η-Cu₆Sn₅ is also altered with Co addition, becoming a porous structure with solder trapped in the voids.     

Interfacial Reactions of Sn-9Zn-<Emphasis Type="Italic">x</Emphasis>Cu (<Emphasis Type="Italic">x</Emphasis> = 1, 4, 7, 10) Solders with Ni Substrates

This study investigates the effects of various reaction times and Cu contents on the interfacial reactions between Sn-9Zn-xCu alloys and Ni substrates. After aging at 255°C for 1 h to 3 h, the Ni₅Zn₂₁ and Cu₅Zn₈ phases formed at the interface of Sn-9Zn/Ni and Sn-9Zn-1wt.%Cu/Ni couples, respectively. The (Ni,Zn)₃Sn₄ phase was found in the Sn-9Zn-4wt.%Cu/Ni couple, and the (Cu,Ni)₆Sn₅ and Cu₆Sn₅ phases formed, respectively, in the Sn-9Zn-7wt.%Cu/Ni and Sn-9Zn-10wt.%Cu/Ni couples. As the reaction time was increased from 5 h to 24 h, the (Cu₅Zn₈ + Ni₅Zn₂₁) phases replaced the Cu₅Zn₈ phase to form in the Sn-9Zn-1wt.%Cu/Ni couple; the (Ni,Zn)₃Sn₄ phase formed in the Sn-9Zn-4wt.%Cu/Ni couple, and (CuZn + Cu₆Sn₅) formed in the Sn-9Zn-10wt.%Cu alloys. Experimental results indicate that intermetallic compound (IMC) formation in Sn-9Zn-xCu/Ni couples changes dramatically with reaction time and Cu content. The Sn-Zn-Ni, Sn-Cu-Ni, and Sn-Zn-Cu ternary isothermal sections greatly help us to understand the IMC evolutions in the Sn-9Zn-xCu/Ni couples.     

Effects of Ni Additions on the Growth of Cu<Subscript>3</Subscript>Sn in High-Lead Solders

In reactions between solders and Cu, additions of minor alloying elements, such as Fe, Co or Ni, to solders often reduce the Cu₃Sn growth rate. Nevertheless, the mechanism for this effect remains unresolved. To provide more experimental observations that are essential for uncovering this mechanism, growth of Cu₃Sn in the reaction between Cu and high-lead solders with or without Ni additions has been studied. The solders used for this study were 10Sn-90Pb and 5Sn-95Pb doped with 0 wt.%, 0.03 wt.%, 0.06 wt.%, 0.1 wt.% or 0.2 wt.% Ni. Reaction conditions included one reflow at 350°C for 2 min and solid-state aging at 160°C for up to 2000 h. The effect of Ni on the growth of Cu₃Sn is discussed in detail based on the experimental results.     

Effect of Ag on the Microstructure of Sn-8.5Zn-xAg-0.01Al-0.1Ga Solders Under High-Temperature and High-Humidity Conditions

The effect of Ag on the microstructure and thermal behavior of Sn-Zn and Sn-8.5Zn-xAg-0.01Al-0.1Ga solders (x from 0.1 wt.% to 1 wt.%) under high-temperature/relative humidity conditions (85°C/85% RH) for various exposure times was investigated. Scanning electron microscopy (SEM) studies revealed that, in all the investigated solders, the primary α-Zn phases were surrounded by eutectic β-Sn/α-Zn phases, in which fine Zn platelets were dispersed in the β-Sn matrix. SEM micrographs revealed that increase of the Ag content to 1 wt.% resulted in coarsening of the dendritic plates and diminished the Sn-9Zn eutectic phase in the microstructure. Differential scanning calorimetry (DSC) studies revealed that the melting temperature of Sn-8.5Zn-xAg-0.01Al-0.1Ga solder decreased from 199.6°C to 199.2°C with increase of the Ag content in the solder alloy. Both ZnO and SnO₂ along with Ag-Zn intermetallic compound (IMC) were formed on the surface when Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder was exposed to high-temperature/high-humidity conditions (85°C/85% RH) for 100 h. The thickness of the ZnO phase increased as the Ag content and exposure time were increased. Sn whiskers of various shapes and lengths varying from 2 μm to 5 μm were extruded from the surface when the investigated five-element solder with Ag content varying from 0.5 wt.% to 1 wt.% was exposed to similar temperature/humidity conditions for 250 h. The length and density of the whiskers increased with further increase of the exposure time to 500 h and the Ag content in the solder to 1 wt.%. The Sn whisker growth was driven by the compressive stress in the solder, which was generated due to the volume expansion caused by ZnO and Ag-Zn intermetallic compound formation at the grain boundaries of Sn.     

Interfacial reactions in Ag-Sn/Cu couples

Interfacial reactions between Sn-3.5 wt.%Ag, Sn-25 wt.%Ag, and Sn-74 wt.%Ag alloys with Cu substrate at 240°C and 450°C have been studied here by examining the reaction couples. It is found that Sn is the fastest diffusion species among the three elements during the reaction, while Ag is the slowest. The reaction path is liquid/η/ɛ₁/Cu for the Sn-3.5 wt.%Ag/Cu couples reacted at 240°C. The paths are liquid/ɛ₁/δ/Cu, liquid/ɛ₁/δ/Cu, ɛ₂/ζ/ɛ₁/δ/Cu, for the Sn-3.5 wt.%Ag/Cu, Sn-25 wt.%Ag/Cu, and Sn-74 wt.%Ag/Cu couples at 450°C, respectively. These reaction paths are in agreement with the isothermal sections of the Ag-Sn-Cu ternary system at 240°C and 450°C. The isothermal sections are proposed based on the limited ternary phase equilibria data and the phase diagrams of its three constituent binary systems, Ag-Sn, Cu-Sn, and Ag-Cu.     

Dissolution and Interfacial Reactions of (Cu,Ni)6Sn5 Intermetallic Compound in Molten Sn-Cu-Ni Solders

(Cu,Ni)₆Sn₅ is an important intermetallic compound (IMC) in lead-free Sn-Ag-Cu solder joints on Ni substrate. The formation, growth, and microstructural evolution of (Cu,Ni)₆Sn₅ are closely correlated with the concentrations of Cu and Ni in the solder. This study reports the interfacial behaviors of (Cu,Ni)₆Sn₅ IMC (Sn-31 at.%Cu-24 at.%Ni) with various Sn-Cu, Sn-Ni, and Sn-Cu-Ni solders at 250°C. The (Cu,Ni)₆Sn₅ substrate remained intact for Sn-0.7 wt.%Cu solder. When the Cu concentration was decreased to 0.3 wt.%, (Cu,Ni)₆Sn₅ significantly dissolved into the molten solder. Moreover, (Cu,Ni)₆Sn₅ dissolution and (Ni,Cu)₃Sn₄ formation occurred simultaneously for the Sn-0.1 wt.%Ni solder. In Sn-0.5 wt.%Cu-0.2 wt.%Ni solder, many tiny (Cu,Ni)₆Sn₅ particulates were formed and dispersed in the solder matrix, while in Sn-0.3 wt.%Cu-0.2 wt.%Ni a lot of (Ni,Cu)₃Sn₄ grains were produced. Based on the local equilibrium hypothesis, these results are further discussed based on the liquid–(Cu, Ni)₆Sn₅–(Ni,Cu)₃Sn₄ tie-triangle, and the liquid apex is suggested to be very close to Sn-0.4 wt.%Cu-0.2 wt.%Ni.     

Interfacial Reactions of Sn-8wt.%Zn-3wt.%Bi Solder with Cu,Ag, and Ni Substrates

Sn-Zn-Bi alloys are promising Pb-free solders. Interfacial reactions between the Sn-8wt.%Zn-3wt.%Bi (Sn-13.80at.%Zn-1.62at.%Bi) alloy and the Cu, Ag, and Ni substrates are examined. Two different kinds of substrates, the bulk plate and the electroplating layer, are used, and the reactions are carried out at 250°C and 220°C. Although the Zn content is only 13.8 at.%, two Zn-Cu compounds, γ-Cu₅Zn₈ and ε-CuZn₅ phases, are formed in the Sn-13.80at.%Zn-1.62at.%Bi/Cu couples. The ε-CuZn₅ phase is scallop shaped, and the γ-Cu₅Zn₈ phase is planar. In the Sn-13.80at.%Zn-1.62at.%Bi/Ag couples, three Zn-Ag compounds are observed, and they are ε-AgZn₃, γ-Ag₅Zn₈, and ζ-AgZn phases. In the Sn-13.80at.%Zn-1.62at.%Bi/Ni couples, a Zn-Ni compound, γ-Ni₅Zn₂₁ phase, is formed. Similar results are found in the couples prepared with an electroplating layer: the reaction phases are the same, but the growth rates are different.     

Co Solubility in Sn and Interfacial Reactions in Sn-Co/Ni Couples

It has been reported that minute Co additions to Sn-based solders are very effective for reducing undercooling, probably due to low Co solubility in Sn. In this study, Co solubility in molten Sn was determined experimentally. According to results of metallographic analysis, Co solubility in molten Sn is as low as 0.04 wt.% at 250°C. Interfacial reactions in Sn-Co/Ni couples at 250°C were examined for Co contents from 0.01 wt.% to 0.4 wt.%. The Ni₃Sn₄ phase was the only interfacial reaction phase in almost the entire Sn-0.01 wt.%Co/Ni couple. For Sn-Co/Ni couples with a Co content higher than 0.01 wt.%, a thin, continuous Ni₃Sn₄ layer and a discontinuous decahedron (Ni,Co)Sn₄ phase were formed in the initial stage of reaction. The reaction products evolved with time. With longer reaction time, the Sn content in the decahedron (Ni,Co)Sn₄ phase decreased, and the (Ni,Co)Sn₄ phase transformed into the (Ni,Co)Sn₂ phase and cleaved into a sheet, which then detached from the interface, after which Ni₃Sn₄ began to grow significantly with longer reaction times.     

The Sn/Ni-7Wt.%V interfacial reactions

Ni-7wt.%V(8at.%V) is an important under bump metallization material, and Sn is the primary element in most solders. This study examines the Sn/Ni-8at.%V interfacial reactions at 160°C, 200°C, 250°C, 300°C, 325°C, 350°C, and 400°C. Unlike the interfacial reactions in the Sn/Ni couples, a ternary T phase and the binary Ni₃Sn₄ phase are formed at 160°C. The vanadium solubility in the Ni₃Sn₄ phase is only 0.2 at.%, while the T phase contains 13.9at.%V. Similar results are found in the couples at 200°C, and the reaction paths are Sn/Ni₃Sn₄/T/Ni-V. The reaction paths are liquid/T/Ni₃Sn₄/Ni-V at 250°C and 300°C and are liquid/Ni₃Sn₄/Ni-V at 350°C and 400°C. Because the reaction products and the reaction rates in the Sn/Ni-8at.%V and Sn/Ni couples are different, reliabilities of the electronic products with the Ni-8at.%V barrier layer should not be assessed based only on the results of the Sn/Ni couples.     

Microstructure and Tensile Properties of Sn-1Ag-0.5Cu Solder Alloy Bearing Al for Electronics Applications

This work investigates the effects of 0.1?wt.% and 0.5?wt.% Al additions on bulk alloy microstructure and tensile properties as well as on the thermal behavior of Sn-1Ag-0.5Cu (SAC105) lead-free solder alloy. The addition of 0.1?wt.% Al reduces the amount of Ag₃Sn intermetallic compound (IMC) particles and leads to the formation of larger ternary Sn-Ag-Al IMC particles. However, the addition of 0.5?wt.% Al suppresses the formation of Ag₃Sn IMC particles and leads to a large amount of fine Al-Ag IMC particles. Moreover, both 0.1?wt.% and 0.5?wt.% Al additions suppress the formation of Cu₆Sn₅ IMC particles and lead to the formation of larger Al-Cu IMC particles. The 0.1?wt.% Al-added solder shows a microstructure with coarse ??-Sn dendrites. However, the addition of 0.5?wt.% Al has a great effect on suppressing the undercooling and refinement of the ??-Sn dendrites. In addition to coarse ??-Sn dendrites, the formation of large Sn-Ag-Al and Al-Cu IMC particles significantly reduces the elastic modulus and yield strength for the SAC105 alloy containing 0.1?wt.% Al. On the other hand, the fine ??-Sn dendrite and the second-phase dispersion strengthening mechanism through the formation of fine Al-Ag IMC particles significantly increases the elastic modulus and yield strength of the SAC105 alloy containing 0.5?wt.% Al. Moreover, both 0.1?wt.% and 0.5?wt.% Al additions worsen the elongation. However, the reduction in elongation is much stronger, and brittle fracture occurs instead of ductile fracture, with 0.5?wt.% Al addition. The two additions of Al increase both solidus and liquidus temperatures. With 0.5?wt.% Al addition the pasty range is significantly reduced and the differential scanning calorimetry (DSC) endotherm curve gradually shifts from a dual to a single endothermic peak.     

封装中无铅焊锡与不锈钢及铁镍的界面反应

文章介绍了Sn、Sn-3.0Ag-0.5Cu(SAC)、Sn-0.7Cu(SC)、Sn-9Zn(SZ)、Sn-58Bi(SB)等五种无铅焊锡与金/镍/不锈钢(Au/Ni/SUS304)与铁-42wt%Ni(Alloy42)基材的界面反应。在不锈钢基材方面:与Sn反应仅生成Ni3Sn4相,与SAC反应初期生成Ni3Sn4相。随反应时间增长则生成(Cu,Ni)6Sn5相且剥离界面;另于界面处则有FeSn2相生成。与SC反应则生成层状(Cu,Ni)6Sn5相,随反应延长产生大规模剥离,并在界面生成FeSn2相。仅有Ni5Zn21相生成于SZ/Au//Ni/SUS304系统。SB/Au//Ni/SUS304系统也仅有Ni3Sn4相生成。在Alloy42基材方面:与纯Sn的界面反应仅生成FeSn2相。SAC焊锡与Alloy42基材反应生成(Fe,Ni,Cu)Sn2相,随反应时间延长该相形态变成连续及块状两层结构。在SC/Alloy42反应系统中仅观察到FeSn2相的生成。仅有(Ni,Fe)5Zn21层生成于SZ/Alloy42系统。与SC/Alloy42系统相似,与SB/Alloy42系统只有FeSn2相的生成,并无其他介金属相的生成。     

Interfacial Reactions in Sn-0.7wt.%Cu/Ni-V Couples at 250°C

The Delco process is a major flip chip under-bump metallurgy process and its contact is soldered with the Ni-7wt.%V substrate; there are, however, only a few studies on the interfacial reactions between solders and Ni-V alloys. This study examines the interfacial reactions of the Sn-0.7wt.%Cu alloy with the Ni-7wt.%V, Ni-5wt.%V, and Ni-3wt.%V substrates at 250°C. It is found that the interfacial reactions between Sn-0.7wt.%Cu and Ni-V alloys are different from those between Sn-0.7wt.%Cu and pure Ni. In addition to the formation of the Cu₆Sn₅ phase, a new Sn-rich phase, denoted the Q phase, is found in the Ni-V substrate couples. Nucleation of the Ni₃Sn₄ phase is at a much earlier stage and the rates of consumption of Ni are much higher in Ni-V substrate couples than in Ni substrate couples. Knowledge of these different reactions is important for proper assessment of the flip chip products.