增材制造金属零件抛光加工技术研究进展

金属增材制造在航空航天、医用植入等领域有良好的应用前景,但成型表面质量差,未经后处理加工无法满足高使役性要求,抛光加工是高性能金属增材制造技术链中的关键环节。概述了增材制造金属零件应用现状和生长过程固有的阶梯效应、球化效应、粉末粘附等特性,以及成型表面高粗糙度等形貌特征。在此基础上,重点综述了增材制造金属零件抛光加工中应用较广的电化学、激光、磨料流三种抛光技术的研究进展,以不同制造工艺、不同金属粉末材质、不同结构形式(多孔结构、高长径比流道等)的增材制造样件为主线,通过表面粗糙度、材料去除、表层残余应力、廓形精度保持性等技术指标,对增材制造金属零件抛光加工研究成果进行了归纳总结。最后展望了增材制造金属零件抛光技术的发展方向。     

金属钼圆基片平面研磨及其表面创成机理研究

目的 实现金属钼圆基片高效平坦化加工,获得超光滑表面。方法 采用游离磨料对钼圆基片进行平面研磨加工,研究磨料种类及研磨盘转速、研磨压力、研磨时间等工艺参数对研磨效果的影响规律,通过材料去除率(MRR)与表面粗糙度(Ra)的建模分析,对比钼材与高硬脆和高塑性材料,揭示其研磨工艺特性、探究其表面创成机理。结果 钼圆基片材料去除快慢和表面形貌受各因素作用的综合影响。CeO2磨料适合钼圆基片的研磨加工,材料去除方式为二体、三体摩擦塑性去除;在研磨过程中,MRR随研磨盘转速、研磨压力的递增而先增大后减小,在研磨盘转速为60 r/min、研磨压力为0.026 MPa条件下MRR达到最大;除磨料因素外,其他工艺因素对表面粗糙度的影响较小;MRR和Ra随加工时间的延长而趋于稳定;使用粒径W1 CeO2磨料在研磨盘转速为60 r/min、研磨压力为0.026 MPa下研磨40 min后,表面粗糙度Ra由46 nm降至9.53 nm,MRR达1.16 mg/min。结论 采用游离磨料研磨方法在优化工艺条件下可以有效降低表面粗糙度,获得良好表面。     

Influence of workpiece hardness on EDM performance

The aim of this research is to show the influence of the hardness of the alloy steel on the material removal rate and on the workpiece surface roughness.The Taguchi methodology was used to study that influence. The result of the verification test for workpiece surface roughness was a strong confirmation. This type of outcome allows the use of the additive model to predict the workpiece surface roughness with an average error of 0.4%.The result of the verification test for material removal rate was a poor confirmation due to an interaction of parameters. This type of outcome does not allow the additive model to predict the material removal rate with accuracy. Therefore, a linear regression model was developed for material removal rate using workpiece hardness and its interactions, among other variables. This model predicts the material removal rate with an average error of 1.06%.These results show that workpiece hardness and its interactions have influence on the material removal rate and on the workpiece surface roughness.     

材料表面润湿性的影响因素及预测模型

目的预测不同材料表面和液体之间的润湿性能。方法选取9种不同板材以及14种实验液体,采用60—1200目砂纸打磨所有平板,得到具有不同粗糙度和表面能的实验材料。利用控制变量法,分别研究了液体表面张力、固体粗糙度和固体表面能对接触角的影响。然后进行了三因素十水平的均匀设计实验,并应用SPSS软件对实验结果进行了线性分析。结果在不同液体的作用下,随着表面张力的增加,接触角不断增大,其中蒸馏水的表面张力最大,为70.13 m N/m,其在三种材料中的接触角也最大。在具有相同粗糙度的材料表面,随着表面能的增加,接触角减小,固体表面能最大(67.72 m J/m2)时,接触角达到最小值,为25.1°。在具有相同表面能的材料表面,随着粗糙度的增加,接触角呈现两种相反的趋势:当θ90°时,随着粗糙度的增加,接触角不断增大;θ90°时,随着粗糙度的增加,接触角不断减小。通过均匀设计得到了接触角的预测模型,发现液体表面张力对接触角影响的权重最大,固体表面能次之,粗糙度最小。结论通过SPSS软件拟合得到了真实材料表面接触角与其影响因素的定量关系式,针对现场管材和液体的选型进行了理论指导,从而有效降低了输送过程中的阻力损失。     

Study on the system matching of ultrasonic vibration assisted grinding for hard and brittle materials processing

Ultrasonic vibration assisted grinding (UAG) is an effective processing method for hard and brittle materials. Compared with common grinding (CG), both of grinding force and workpiece surface quality is improved by UAG, but the principle of improvement is still unclear. In order to reveal the mechanism of grinding force reduction and grinding quality improvement in UAG, this paper presents a mathematical model for system matching in UAG of brittle materials. Assuming that brittle fracture is the primary mechanism of material removal in UAG of brittle materials, the system matching model is developed step by step. On the basis of this mathematical model, the mechanism of grinding force reduction and surface roughness forming are discussed. The advantage of UAG processing brittle materials is pointed out in theory. Using the model developed, influences of input variables on grinding force are predicted. These predicted influences are compared with those determined experimentally. This model can serve as a useful foundation for development of grinding force models in UAG of brittle materials and models to predict surface roughness in UAG.     

基于响应曲面法的304不锈钢化学机械抛光工艺参数优化

采用响应曲面法,以材料去除率RMRR和表面粗糙度Ra为评价指标,研究抛光过程中抛光盘转速、压力、时间等3种参数对RMRR和Ra的影响.根据抛光试验结果,建立材料去除率和表面粗糙度的回归模型,得出其响应曲面和等高线图,并进行详细分析.结果表明:回归模型较显著,证明了响应曲面法预测及优化304不锈钢化学机械抛光工艺参数的可...     

Investigation of the effects of electrode orientation and fluid flow rate in near-dry EDM milling

This research investigates the effects of electrode lead and tilt angles and dielectric fluid flow rate on material removal rate, tool electrode wear ratio, and surface roughness in near-dry electrical discharge machining (EDM) milling process. Computational fluid dynamics (CFD) model is developed to predict the dielectric fluid flow rate and qualitatively compare with the experimentally measured EDM material removal rate. The optimum lead angle, which maximized material removal rate and minimized tool electrode wear ratio, was found. The decrease in the lead angle has a negative effect on the roughness of machined surface. The increase in tilt angle reduces the material removal rate and increases the tool electrode wear ratio. The change in tilt angle does not have a significant effect on the surface roughness and can be used to prevent gouging in finishing EDM milling. This study shows that the material removal rate is linearly proportional to the mass flow rate of air and kerosene mixture, the tool electrode wear ratio is inversely related to the mass flow rate of air and kerosene mixture, and the average surface roughness does not have a good correlation with the flow rate of the mixture.     

固结磨料研磨石英玻璃的工艺参数优化

以石英玻璃的材料去除率和表面粗糙度为评价指标,以转速(A)、压力(B)和研磨液种类(C)为影响因素,进行石英玻璃固结磨料研磨正交试验,对其试验结果进行回归分析并建立3因素下石英玻璃材料去除率和表面粗糙度的影响规律模型。结果表明:影响石英玻璃材料去除率的显著性因素顺序为B>C>A,影响其表面粗糙度的显著性因素顺序为A>B>C。材料去除率最佳的研磨工艺参数组合为转速100 r/min,压力27.580 kPa,三乙醇胺研磨液;表面粗糙度最佳的工艺参数组合为转速100 r/min,压力27.580 kPa,乙二胺研磨液。同时,材料去除率与转速的关系为二次函数形式,材料去除率与压力的关系为指数函数形式;而表面粗糙度与转速及压力的关系均为幂函数形式。以材料去除率为优先考虑目标时可选择三乙醇胺研磨液,以表面质量为优先考虑目标时则可选择乙二胺研磨液。      

磨料射流铣削工艺参数优化

目的对表面粗糙度和材料去除率作为输出参数的磨料水射流铣削45#钢过程进行研究,旨在寻找最优加工参数。方法对射流去除材料机理进行了分析,设计并进行了以磨料粒度、射流压力、横向进给距离、靶距为加工工艺参数的田氏正交实验。采用Minitab对不同实验参数组合下磨料水射流加工45#钢的表面粗糙度、材料去除效率进行了数据分析,并从材料去除机理方面,对4种加工工艺参数对于铣削表面质量和材料去除效率的影响程度和影响趋势,以及各因素之间的交互作用进行了分析。结果对射流铣削面表面粗糙度影响较显著的因素是横向进给距离,射流压力次之;对于材料去除效率,磨料粒径的影响最显著,横向进给距离次之。结论综合材料去除效率和表面粗糙度值,选出最优加工参数:磨料粒径2000目,射流压力120~160 MPa,喷嘴横移距离1.0~1.5 mm,靶距约30 mm。     

Effects of mixed abrasive grits in slurries on free abrasive machining (FAM) processes

Effects of mixed abrasive grits in slurries on free abrasive machining (FAM) processes are studied using a single-sided lapping machine. Impacts of mixing abrasives on various parameters such as amount of material removed, material removal rate, surface roughness, particle size distribution and relative angular velocity are studied. The material removed is monitored as a function of time. The experimental results suggest that (i) mixing abrasive grits can increase the amount of material removed, (ii) smaller abrasives can directly or indirectly affect the material removal process, (iii) slurries undergo severe grain size transition during lapping, and (iv) the surface roughness did not change significantly under different loading. The results of this study may have profound implication on the FAM processes that practitioners use today because the mixed abrasive grits increase material removal rate and reduce the grain size transition, while rendering similar surface roughness.     

陶瓷结合剂研磨盘制备及研磨蓝宝石性能研究

为提高蓝宝石基片的研磨效率和质量,研制2种不同硬度的陶瓷结合剂固结金刚石研磨丸片并制作了相应的研磨盘,对蓝宝石基片进行研磨工艺试验以评估其研磨性能.结果表明:研磨时间延长,蓝宝石的材料去除率(R MRR)和表面粗糙度(R a)均逐渐降低最后趋于稳定;研磨盘转速提高,2种研磨盘获得的工件材料去除率均先升高后降低,在研磨盘...     

基于航空铸造钛合金Ti-6Al-4V高速铣削参数的表面质量及切削效率优化

目的研究高速铣削参数对航空铸造钛合金Ti-6Al-4V表面质量的影响规律及交互作用,并基于高速铣削参数对表面质量和材料去除率进行优化。方法采用Box-Behnken设计和二次回归正交实验法,建立高速铣削参数与表面粗糙度的显著不失拟回归模型,获得铣削参数影响表面粗糙度的显著性差异,挖掘高速铣削参数交互作用与表面粗糙度的关系;基于表面粗糙度回归模型及材料去除率,采用遗传算法(GA),对高速铣削参数进行多目标优化。结果铣削参数影响航空铸造钛合金Ti-6Al-4V试件表面粗糙度的显著性顺序为:切削深度>每齿进给量>切削宽度>主轴转速,其中切削宽度和主轴转速、每齿进给量和主轴转速的交互作用较为明显。利用遗传算法对铣削参数优化后,Ti-6Al-4V表面粗糙度较优化前提高44%,材料去除率提高70%,遗传算法优化后的试件表面粗糙度显著降低,表面刀路行距减小,纹理平均高度降低。结论由实验验证可知,通过响应曲面建立表面粗糙度显著不失拟回归模型具有较高的预测精度,基于遗传算法优化获得的铣削参数可有效提高表面质量和切削效率,对保证航空铸造钛合金Ti-6Al-4V表面质量具有较好的指导意义。     

Investigation of grinding modes in horizontal surface grinding of optical glass BK7

Grinding is one of the most important processes to manufacture hard-brittle materials such as optical glass. It is often desired to increase the material removal rate while maintaining the desired surface quality. The success of this approach relies on the better understanding of the relationship between the grinding modes and the characteristics of surface and subsurface integrities. Based on the kinematic analysis of horizontal surface grinding as well as the features of grinding-induced cracks, four grinding modes were proposed. They are brittle mode, semi-brittle mode, semi-ductile mode and ductile mode. The horizontal surface grinding of optical glass BK7 has been studied using diamond grinding wheel. The four different grinding modes have been investigated with the characteristics of surface morphologies before and after etching, surface roughness, subsurface damages as well as indentation depth. It was found that the level of surface roughness and depth of subsurface damage were strongly dependent on grinding mode. This study provides valuable insights into the material removal mechanism and the dependence of surface and subsurface integrities on grinding mode.     

多通管接头磨粒流光整均匀性研究

目的 提升航空油路中多通管接头内壁磨粒流光整加工效果.方法 以三通、四通金属管接头为研究对象,针对零件的材料特性、结构特性设计相关实验,研究多通管接头管道内表面磨粒流光整工艺中加工时间及加工流道对管道内壁粗糙度、材料去除量、表面质量一致性的影响.结果 加工开始时管道表面糙度Ra下降缓慢,在60 s后粗糙度开始加速下降,...     

非晶态合金薄膜铜衬底超精密抛光的实验研究

本文采用聚氨酯抛光盘和绒布抛光垫对铜衬底进行超精密抛光工艺研究,对铜衬底的表面粗糙度、材料去除率以及铜衬底表面组织结构变化过程进行了研究,并讨论了铜衬底在超精密抛光时,不同抛光条件对其表面粗糙度和材料去除率的影响,以及抛光压力对铜衬底的表面形成过程的影响。结果表明,采用聚氨酯抛光盘和绒布抛光垫可以消除划痕,抛光后的铜衬底表面粗糙度可达Ra6 nm。     

基于GA-BP的6061Al切削参数优化

针对6061Al铣削中表面粗糙度预测精度低、切削参数选择不合理的问题,提出一种基于遗传神经网络与遗传算法结合的优化模型,对6061Al切削参数进行优化。采用遗传神经网络(GA-BP)构建表面粗糙度预测模型;基于表面粗糙度预测,以材料去除率为目标函数构建切削参数优化模型;利用遗传算法进行优化求解,对6061Al切削参数进行优化。研究结果表明:所建预测模型表面粗糙度预测精度在97%以上;同时,优化模型能优化6061Al切削参数,达到较好的全局寻优效果,为铝合金工件铣削加工切削参数优化提供参考。     

单晶SiC基片的铜基研磨盘加工特性研究!

采用铜基螺旋槽研磨盘对6H-SiC单晶基片的Si面和C面进行了单面研磨加工,研究研磨压力、研磨盘转速和金刚石磨粒尺寸对SiC基片材料去除率和表面粗糙度的影响。结果表明,单晶SiC的C面和Si面具有明显的差异性,C面更易加工,其材料去除率比Si面大。研磨压力是影响材料去除率和表面粗糙度的主要原因,研磨压力越大,材料去除率越高,但同时表面粗糙度变大,较大的研磨压力会导致划痕的产生。在达到最佳表面粗糙度时,C面加工所需的转速比Si面大。磨粒团聚会严重影响加工表面质量,采用粒度尺寸3 μm的金刚石磨料比采用粒度尺寸1 μm的金刚石效果好,经粒度尺寸3 μm的金刚石磨料研磨加工5 min后,Si面从原始粗糙度R_a 130 nm下降到R_a 5.20 nm,C面下降到R_a 5.49 nm,表面质量较好。      

氮化铝基片超精密加工的实验研究

氮化铝材料具有较高的热导率和良好的介电性能，机械强度高，热膨胀系数与半导体硅材料相近，非常适于制造大功率或快速半导体器件的散热基片和封装材料。本文采用游离磨料加工方法对氮化铝基片表面进行了研磨、抛光，讨论了不同加工参数对试件表面粗糙度和材料去除率的影响。采用表面粗糙度仪和厚度仪分别对超精密加工后AIN基片的表面粗糙度及去除厚度进行了测量。实验结果表明，在本实验条件下可以获得表面粗糙度Ra为8nm的超光滑表面。实验还采用XJZ-5型电子显微镜对加工过程中AIN的表面结构进行了观察，分析了不同超精密加工阶段的材料去除机理，同时发现晶粒间孔隙会降低AIN基片的可加工性能。     

Amorphization and C segregation based surface generation of Reaction-Bonded SiC/Si composites under micro-grinding

Micro-grinding of Reaction-Bonded SiC/Si composites (RB–SiC/Si) were conducted to investigate the surface generation mechanism. The results showed that amorphization occurred for both SiC and Si phases, and C segregation appeared on SiC surface and at the interface of SiC and Si. The surface generation mechanism changed from micro-breaking to smoother surface, but accompanied by formation of many micro-pits at phase boundaries with the decrease of feed rate. It was identified that the material removal mode was closely related to amorphization and C segregation (i.e. amorphization would promote ductile material removal while C segregation would aggravate surface fracture and increase the number of micro-pits). Furthermore, it was found that the distribution of micro-pits corresponded with the random and stochastic properties of diamond grits, and the formation of micro-pits during machining process determined the surface roughness. To explain the mechanism of micro-pits formation, a simple interaction model between diamond grit and workpiece was proposed.     

单晶SiC基片的磁流变化学复合抛光

基于芬顿反应的磁流变化学复合抛光加工原理,对单晶SiC基片进行磁流变化学复合抛光试验,研究工艺参数对其抛光效果的影响。结果表明：随着金刚石磨粒粒径的增大,材料去除率先增大后减小,而表面粗糙度先减小后增大;随着磨粒质量分数的增大,材料去除率增大,而表面粗糙度先减小后增大;当羰基铁粉质量分数增大时,材料去除率增大,而表面粗糙度呈先减小后增大的趋势;随着氧化剂质量分数增大,材料去除率先增大后减小,而表面粗糙度呈现先减小后增大的趋势;加工间隙对材料去除率的影响较大,加工间隙为1.0 mm时,加工表面质量较好;随着工件转速和抛光盘转速增大,材料去除率均先增大后减小,表面粗糙度均先减小后增大。获得的优化的工艺参数为：磨粒粒径,1.0μm;磨粒质量分数,5%;羰基铁粉质量分数,25%;过氧化氢质量分数,5%;加工间隙,1.0 mm;工件转速,500 r/min;抛光盘转速,20 r/min。采用优化的工艺参数对表面粗糙度约为40.00 nm的单晶SiC进行加工,获得表面粗糙度为0.10 nm以下的光滑表面。