基于CF_4/Ar高密度感应耦合等离子体的BZN薄膜的刻蚀工艺研究

使用CF4/Ar高密度感应耦合等离子体(ICP)对磁控溅射法制得的铌酸锌铋(BZN)薄膜进行了干法刻蚀工艺研究。分析了BZN薄膜的刻蚀速率随工艺气体流量比、总流量和工作压强的改变而出现极大值的原因,展示了BZN薄膜的刻蚀速率随ICP功率的增大而线性增加的趋势。研究结果表明,使用CF4/Ar感应耦合等离子体对BZN薄膜进行刻蚀的机理为物理辅助的化学反应刻蚀。BZN薄膜的最佳刻蚀工艺参数为CF4/Ar流量比3/2、总流量25sccm、工作压强1.33Pa、ICP功率800W,使用此参数对BZN薄膜进行刻蚀,最大刻蚀速率为26nm/min,刻蚀后薄膜边缘齐整、表面光滑、形状完整。     

HfO2在CHF3,Ar和H2的感应耦合等离子体中的刻蚀行为

通过改变偏压功率和气体气压的宏观条件,利用CHF3,Ar和H2的感应耦合等离子体(ICP)对HfO2和RZJ-306光刻胶进行了刻蚀选择性实验研究.结果表明,HfO2与等离子体化学相互作用的刻蚀产物属于非挥发性的,容易造成边墙的堆积而形成"驼峰"形,因而需要借助于Ar 的辅助轰击来消除边墙堆积,典型的HfO2/光刻胶的刻蚀选择比在0.2～0.5之间.在射频源功率400 W、气压0.5 Pa、射频偏压-400 V、流量比为Ar∶CHF3∶H2=40 sccm∶18 sccm∶2 sccm的优化条件下,利用感应耦合等离子体刻蚀特性,对光刻胶作为掩膜的HfO2/BK7玻璃进行刻蚀,扫描电镜的测试结果表明,光栅的图形转移效果较好.红外激光波长为1064 nm时,所测得的光栅二级衍射效率在71%以上.     

Cl2/BCl3 ICP刻蚀蓝宝石研究靠

由于GaN单晶制备比较困难，通常氮化物光电子器件都是制备在蓝宝石衬底上的，而氮化物和蓝宝石大的晶格失配和热膨胀系数的差别，使得在衬底上生长的氮化物材料位错和缺陷密度较大，影响了器件的发光效率和寿命。PSS技术可以有效地减少外延材料的位错和缺陷，在氮化物器件制备中得到了广泛的应用。但是由于蓝宝石很高的硬度和化学稳定性，使其刻蚀难度较大。本文研究了ICP刻蚀蓝宝石中工艺参数对蓝宝石刻蚀速率的影响规律，所用气体为Cl2／BCl3，研究结果表明，蓝宝石的刻蚀速率随着ICP功率、RF功率和气体总流量的增大单调增大；随着压强的减小首先增大，继而减小。当BCl3比例为80％时，刻蚀速率最大。在BCl3流量为80sccm，Cl2流量为20sccm，ICP功率为2500W，RF功率为500W，压强为0．9Pa，温度为60℃时刻蚀速率达到最大值217nm／min。     

新型相变材料Ti0.5Sb2Te3刻蚀工艺及其机理研究

采用CF4和Ar混合气体研究了新型相变材料Ti0.5Sb2Te3(TST)的刻蚀特性,重点优化和研究了刻蚀气体总流速、CF4/Ar的比例、压力和功率等工艺参数对刻蚀形貌的影响。结果表明,当气体总流量为50 sccm、CF4浓度为26%﹑刻蚀功率为400 W和刻蚀压力为13.3 Pa时,刻蚀速度达到126 nm/min,TST薄膜刻蚀图形侧壁平整而且垂直度好(接近90°)﹑刻蚀表面平整(RMS为0.82 nm)以及刻蚀的片内均匀性等都非常好。     

射频辉光放电自偏压对类金刚石碳膜结构和性能的影响

采用高压探头示波器系统研究了射频辉光放电参数对自偏压的影响规律.结果发现自偏压随着射频功率平方根而线性增加,随纯Ar和Ar,C2H2混合气体气压的降低而降低,自偏压随C2H2的比率增大而增加,而且,射频输入功率在500和700 W下,由射频辉光放电所制备的类金刚石薄膜分别通过Raman光谱和纳米压痕技术测试,研究了这些薄膜的微观结构和机械性能.功率500 W制备的类金刚石薄膜(ID/IG为0.66)较700W制备的类金刚石薄膜(ID/IG为1.44)具有较高的硬度和sp3键含量,表明在500 W功率下制备的类金刚石薄膜中有高含量的sp3键.     

室温直流磁控溅射制备ITO膜及光电性能研究

室温条件下,在玻璃衬底上,采用直流磁控溅射法制备了ITO膜.研究了溅射压强,氧流量和溅射功率等工艺参数对薄膜光电性能的影响.结果表明当Ar流量为44.2 sccm和溅射时间20 min等参数不变时,溅射气压0.7 Pa,氧流量0.62 sccm和溅射功率130 W为最佳工艺条件.并得到了电阻率5.02×10-4 Ω·cm,在可见光区平均透过率80%以上ITO薄膜.     

应用于TGV的ICP玻璃刻蚀工艺研究

玻璃通孔(TGV)技术被认为是下一代三维集成的关键技术,该技术的核心为深孔形成工艺。感应耦合等离子体(ICP)刻蚀技术是半导体领域中深孔形成的重要手段之一。本文通过正交实验设计方法,研究ICP石英玻璃刻蚀工艺中工作压强、C4F8流量、Ar流量三个工艺参数对深孔刻蚀的影响,探索提高刻蚀速率的优化组合。实验结果表明,C4F8流量对玻璃刻蚀速率有显著影响,并且随着C4F8/Ar流量比减小,侧壁角度垂直性越好。实验为TGV技术开发和应用提供了实验依据。     

射频磁控溅射室温下制备ITO薄膜的光学性能研究

靶材为铟锡氧化物(In2O3:SnO2=1:1),用射频磁控溅射法在低温下制备了光电性能优良的ITO薄膜.质量流量计调节Ar气压强为0.2～3.0Pa,氧流量为0～10sccm,并详细探讨了溅射时氩气压强和氧流量变化对ITO薄膜光学性能的影响.结果表明:溅射Ar气压强为0.8Pa,氧流量为2.4sccm时,薄膜的折射率最低n=1.97,较接近增透膜的光学匹配.薄膜厚度为241.5nm时,薄膜的最大透过率为89.4%(包括玻璃基体),方阻为75.9Ω/□,电导率为8.8×10-4Ω·cm.     

超硬新材料氮化碳的制备与研究

在金刚石合成研究的经验基础上,对设备加以改进,采用热丝辅助等离子体化学气相沉积+负偏压技术成功地制备了高质量的 CN_x 薄膜。在本研究工作中,使用 X 射线衍射(XRD)、扫描电子显微镜(SEM)、傅立叶变换红外吸收谱(FTIR)等分析测试手段研究了 CN_x 薄膜的化学成分以及 C、N 原子间的化学结合状态,用显微硬度计测量了薄膜的力学显微硬度,着重研究了在CN_x 薄膜制备过程中各种工艺参数(射频功率、衬底负偏压、衬底温度以及氮气与甲烷流量比率等)对薄膜结构和特性的影响,总结出采用本技术所必需的最佳工艺条件,为以后 CN_x 薄膜的深入研究打下了良好基础。具体的试验过程和参数调节范围为:频率13.56MHz 的射频以电容耦合方式输入,射频功率250～350W;热丝温度1600～1800℃;衬底为表面抛光的单晶 Si(100),温度保持在800～1000℃之间,外接直流电源给衬底施加偏压0～-100V;反应气体是 N_2与 CH_4的混合气体,用 H_2稀释到3%(反应气体流量比 CH_4:N_2=1:3～8);反应室预真空1×10~(-3)Pa,反应气压保持在100～200Pa,薄膜厚约2μm。试验表明采用本技术制备 CN_x 薄膜的最佳条件是:衬底温度500～600℃,反应气体总气压110Pa,CH_4与 N_2的流量比1:5.5.衬底负偏压-200V,热丝温度1200℃,射频功率200W。制备出的 CN_x 薄膜石墨含量很少,最高硬度为72.66 GPa。     

基于等离子体氧化技术的医用钛材料亲水性表面制备研究

采用真空射频辉光放电技术对喷砂酸蚀工艺处理后的钛表面进行等离子体氧化工艺的优化研究,以用于牙种植体表面改性。以钛表面的接触角作为正交试验的参考指标,对等离子体氧化工艺进行优化。在试验范围内,优化的参数为:工作压力为6.5 Pa,O2/Ar=1(Ar=5 sccm),基板直流偏压为400 V,射频功率为200 W,氧化时间60 min。利用扫描电子显微镜、接触角测量仪及X射线光电子能谱仪研究了优化后的氧化膜对钛表面形貌、亲水性的影响以及其化学组成和价键状态。结果表明:优化工艺处理后,钛片表面保留了原有的多孔形貌,并获得了平均接触角低于10°的超亲水性表面,但随着暴露空气时间的增加,其接触角会增大;钛表面出现Ti4+和Ti3+离子,其中二者的比例基本相同。     

Nanostructuring of ultra-thin HfO2 layers for high-k/III-V device application

We report on the nanopatterning by electron beam lithography (EBL) and reactive ion etching (RIE) in a SF6/Ar+ plasma of ultra-thin HfO2 films deposited on GaAs (001) substrates for gate oxide application in next generation III-V metal-oxide-semiconductor field effect transistors (MOSFETs). Characterization of the HfO2/GaAs nanostructured samples by atomic force microscopy (AFM), high-resolution scanning electron microscopy (HRSEM), energy-dispersive X-ray spectroscopy microanalysis (EDX) and transmission electron microscopy (TEM) has shown the formation of well defined HfO2 patterns with nanometre-scale linewidth control and anisotropic profiles. In addition, atomically smooth, stoichiometric and residue-free bottom GaAs etched lines with a lateral dimension of approximately 50 nm have been demonstrated.     

Dry etching process of GaAs in capacitively coupled BCl3-based plasmas

Dry etching of GaAs was investigated in BCl₃, BCl₃/N₂ and BCl₃/Ar discharges with a mechanical pump-based capacitively coupled plasma system. Etched GaAs samples were characterized using scanning electron microscopy and surface profilometry. Optical emission spectroscopy was used to monitor the BCl₃-based plasma during etching. Pure BCl₃ plasma was found to be suitable for GaAs etching at > 100 mTorr while producing a clean and smooth surface and vertical sidewall. Adding N₂ or Ar to the BCl₃ helped increase the etch rates of GaAs. For example, the GaAs etch rate was doubled with 20% N₂ composition in the BCl₃/N₂ plasma compared to the pure BCl₃ discharge at 150 W CCP power and 150 mTorr chamber pressure. The GaAs etch rate was ∼ 0.21 µm/min in the 20 sccm BCl₃ plasma. The BCl₃/Ar plasma also increased etch rates of GaAs with 20% of Ar in the discharge. However, the surface morphology of GaAs was strongly roughened with high percentage (> 30%) of N₂ and Ar in the BCl₃/N₂ and BCl₃/Ar plasma, respectively. Optical emission spectra showed that there was a broad BCl₃-related molecular peak at 450-700 nm wavelength in the pure BCl₃ plasma. When more than 50% N₂ was added to the BCl₃ plasma, an atomic N peak (367.05 nm) and molecular N₂ peaks (550-800 nm) were detected. Etch selectivity of GaAs to photoresist decreased with the increase of % N₂ and Ar in the BCl₃-based plasma.     

Reactive ion etching of ZnS films for thin-film electroluminescent devices

Reactive ion etching (RIE), employing CH₄/H₂/Ar plasmas, of ZnS films grown by metalorganic chemical vapor deposition (MOCVD) is reported. The etching rates are investigated as functions of the plasma parameters: pressure, RF power and relative composition of reactive gases. It is found that the amount of CH₄ in a CH₄/H₂/Ar gas discharge will decide whether the polymer will be produced. The optimum composition of the mixed gas is 1CH₄/7H₂/4Ar, when the pressure, RF power and total flow rate are 30 mTorr, 245 W and 30 sccm, respectively. The etching mechanism is also proposed. The quality of the etched surfaces under these conditions is examined by X-ray photoelectron spectroscopy. It is found that the amount of overt damage is small under these etching conditions. A dot-matrix thin-film electroluminescent device employing a ZnS:Mn phosphor layer is also fabricated by this etching process.     

HfO2 etching mechanism in inductively-coupled Cl2/Ar plasma

Etching characteristics and the mechanism of HfO₂ thin films in Cl₂/Ar inductively-coupled plasma were investigated. The etch rate of HfO₂ was measured as a function of the Cl₂/Ar mixing ratio in the range of 0 to 100% Ar at a fixed gas pressure (6 mTorr), input power (700 W), and bias power (300 W). We found that an increase in the Ar mixing ratio resulted in a monotonic decrease in the HfO₂ etch rate in the range of 10.3 to 0.7 nm/min while the etch rate of the photoresist increased from 152.1 to 375.0 nm/min for 0 to 100% Ar. To examine the etching mechanism of HfO₂ films, we combined plasma diagnostics using Langmuir probes and quadrupole mass spectrometry with global (zero-dimensional) plasma modeling. We found that the HfO₂ etching process was not controlled by ion-surface interaction kinetics and formally corresponds to the reaction rate-limited etch regime.     

Formation of high aspect ratio GaAs nanostructures with metal-assisted chemical etching

Periodic high aspect ratio GaAs nanopillars with widths in the range of 500-1000 nm are produced by metal-assisted chemical etching (MacEtch) using n-type (100) GaAs substrates and Au catalyst films patterned with soft lithography. Depending on the etchant concentration and etching temperature, GaAs nanowires with either vertical or undulating sidewalls are formed with an etch rate of 1-2 μm/min. The realization of high aspect ratio III-V nanostructure arrays by wet etching can potentially transform the fabrication of a variety of optoelectronic device structures including distributed Bragg reflector (DBR) and distributed feedback (DFB) semiconductor lasers, where the surface grating is currently fabricated by dry etching.     

The evolution of a-GaAs1−xNx/c-GaAs interface states as a function of Ar-NH3 plasma

This work concerns investigations on electrical properties of amorphous GaAs_1−xN_x thin films grown on GaAs substrates. Film deposition was carried out by RF sputtering of a GaAs target by adding a nitrogen carrier gas (NH₃) to an Ar plasma. Chemical etching of substrates followed by different plasma treatments (like reverse bias and/or NH₃ glow discharge) prior to film deposition have been studied. The effects of substrate and growth temperature and of total pressure in the reactor have been analysed. Electrical characteristics (C–V and C–V(T)) have enabled us to put in evidence the evolution of interface states of the a-GaAs_1−xN_x/c-GaAs junctions. The amorphous GaAs_1−xN_x thin films are potentially interesting to be considered for GaAs-based MIS structures, due to their relatively high resistivity values, or as passivating layers on GaAs devices.     

Antireflective hydrophobic si subwavelength structures using thermally dewetted Ni/SiO2 nanomask patterns

We report the disordered silicon (Si) subwavelength structures (SWSs), which are fabricated with the use of inductively coupled plasma (ICP) etching in SiCl4 gas using nickel/silicon dioxide (Ni/SiO2) nanopattens as the etch mask, on Si substrates by varying the etching parameters for broadband antireflective and self-cleaning surfaces. For the fabricated Si SWSs, the antireflection characteristics are experimentally investigated and a theoretical analysis is made based on the rigorous coupled-wave analysis method. The desirable dot-like Ni nanoparticles on SiO2/Si substrates are formed by the thermal dewetting process of Ni films at 900 degrees C. The truncated cone shaped Si SWS with a high average height of 790 +/- 23 nm, which is fabricated by ICP etching with 5 sccm SiCl4 at 50 W RF power with additional 200 W ICP power under 10 mTorr process pressure, exhibits a low average reflectance of approximately 5% over a wide wavelength range of 450-1050 nm. The water contact angle of 110 degrees is obtained, indicating a hydrophobic surface. The calculated reflectance results are also reasonably consistent with the experimental data.     

Bottom-up photonic crystal lasers

The directed growth of III-V nanopillars is used to demonstrate bottom-up photonic crystal lasers. Simultaneous formation of both the photonic band gap and active gain region is achieved via catalyst-free selective-area metal-organic chemical vapor deposition on masked GaAs substrates. The nanopillars implement a GaAs/InGaAs/GaAs axial double heterostructure for accurate, arbitrary placement of gain within the cavity and lateral InGaP shells to reduce surface recombination. The lasers operate single-mode at room temperature with low threshold peak power density of ～625 W/cm2. Cavity resonance and lasing wavelength is lithographically defined by controlling pillar pitch and diameter to vary from 960 to 989 nm. We envision this bottom-up approach to pillar-based devices as a new platform for photonic systems integration.     

Fabrication of metallic magnetic nanostructures by argon ion milling using a reversed-polarity planar magnetron ion source

We demonstrate that a planar magnetron may be used as a source of ions for milling micro- and nanostructured devices. Reversing the polarity of the magnetron head, in combination with applying a voltage bias to the thin-film sample, allows acceleration of ions produced in the Ar glow-discharge to energies suitable for pattern transfer via etching. We have fabricated generic Hall-bar and nanowire L-bar structures from sputter deposited Ta/Ni/Ta trilayer films grown onto clean GaAs(001) surfaces. No degradation of the magnetic properties or contamination of the deposition chamber vacuum is observed, demonstrating that this method is effective for etching magnetic device structures patterned by both optical- and electron-beam lithography techniques.     

Laser generation in microdisc resonators with InAs/GaAs quantum dots transferred on a silicon substrate

Microdisc resonators based on InAs/GaAs quantum dots separated from a GaAs substrate by selective etching and fixed to a silicon substrate by epoxy glue are studied using luminescence spectroscopy. A disc resonator 6 μm in diameter exhibits quasi-single-mode laser generation at a temperature of 78 K with a threshold power of 320 μW and λ/Δλ ～ 27000.