Polymer composites with enhanced thermal conductivity via oriented boron nitride and alumina hybrid fillers assisted by 3-D printing

Herein, oriented boron nitride (BN)/alumina (Al₂O₃)/polydimethylsiloxane (PDMS) composites were obtained by filler orientation due to the shear-inducing effect via 3-D printing. The oriented BN platelets acted as a rapid highway for heat transfer in the matrix and resulted in a significant increase in the thermal conductivity along the orientation direction. Extra addition of spherical Al₂O₃ enhanced the fillers networks and resulted in the dramatic growth of slurry viscosity. This, together with filler orientation induced the synergism and provided large increases in the thermal conductivity. A high orientation degree of 90.65% and in-plane thermal conductivity of 3.64 W/(m∙K) were realized in the composites with oriented 35 wt% BN and 30 wt% Al₂O₃ hybrid fillers. We attributed the influence of filler orientation and hybrid fillers on the thermal conductivity to the decrease of thermal interface resistance of composites and proposed possible theoretical models for the thermal conductivity enhancement mechanisms.     

Synergistic thermal conductivity enhancement of PC/ABS composites containing alumina/magnesia/graphene nanoplatelets

Graphene nanoplatelets (GNPs) have attracted considerable attention in the field of thermal management materials due to their unique structure and exceptional thermal conductive properties. In this work, we demonstrate a significant synergistic effect of GNPs, alumina (Al₂O₃), and magnesia (MgO) in improving the thermal conductivity of polycarbonate/acrylonitrile‐butadiene‐styrene polymer alloy (PC/ABS) composites. The thermal conductivity of the composites prepared through partial replacement of Al₂O₃ and MgO with GNPs could increase dramatically compared with that without GNPs. The maximum thermal conductivity of the composite is 3.11 W mK⁻¹ at total mass fraction of 70% with 0.5 wt% GNPs loading. It increases 60% compared with that without GNPs (1.95 W mK⁻¹). The synergistic effect results from the compact packing structure formed by Al₂O₃/MgO and the bridging of GNPs with Al₂O₃/MgO, thus promoting the formation of effective thermal conduction pathways within PC/ABS matrix. More importantly, together with the intrinsically high thermal conductivity of GNPs, boosted and effective pathways for phonon transport can be created, thus decrease the thermal resistance at the interface between fillers and PC/ABS matrix and increase the thermal conductivity of composites. POLYM. COMPOS., 38:2221–2227, 2017. © 2015 Society of Plastics Engineers     

Thermal,electrical, and mechanical properties of addition-type liquid silicone rubber co-filled with Al2O3 particles and BN sheets

The addition-type liquid silicone rubber (ALSR) co-filled with spheroidal Al₂O₃ and flaky BN was prepared by the mechanical blending and hot press methods to enhance the thermal, electrical, and mechanical properties for industrial applications. Morphologies of ALSR composites were observed by scanning electron microscopy (SEM). It was found that the interaction and dispersion state of fillers in the ALSR matrix were improved by the introduction of BN sheets. Thermal, electrical, and mechanical performances of the ALSR composites were also investigated in this work. The result indicated that the thermal conductivity of ALSR can reach 0.64 W m⁻¹ K⁻¹ at the loading of 20 wt% Al₂O₃/20 wt% BN, which is 3.76 times higher than that of pure ALSR. The addition of Al₂O₃ particles and BN sheets also improve the thermal stability of ALSR composites. Moreover, pure ALSR and ALSR composites showed relatively lower dielectric permittivity (1.9–3.1) and dielectric loss factor (<0.001) at the frequency of 10³ Hz. The insulation properties including volume resistivity and breakdown strength were improved by the introduction of flaky BN in the ALSR matrix. The volume resistivity and characteristic breakdown strength E₀ are 6.68 × 10¹⁵ Ω m and 93 kV/mm, respectively, at the loading of 20 wt% Al₂O₃/20 wt% BN. In addition, the mechanical characteristics including elongation at break and tensile strength of ALSR composites were also enhanced by co-filled fillers. The combination of these improved performances makes the co-filled ALSR composites attractive in the field of electrical and electronic applications.     

Spherical hybrid filler BN@Al2O3 via chemical adhesive for enhancing thermal conductivity and processability of silicon rubber

Hexagonal boron nitride (h-BN) is an ideal candidate material for electrical and electronic systems due to its excellent performance. However, the addition of platelet-like h-BN leads to a dramatic increase of viscosity of composites and anisotropic thermal conductivity of composites. Herein, modified h-BN (m-BN) was coated onto spherical α-Al₂O₃ via chemical adhesive, and core-shell structured hybrid spherical filler (m-BN@Al₂O₃) was prepared. Furthermore, the microstructure, rheology, mechanical properties, and thermal conductivity of hybrid filler/polydimethylsiloxane (PDMS) were studied. At 60 vol% filler loading, the thermal conductivity of m-BN@Al₂O₃/PDMS is up to 2.23 W·m⁻¹·K⁻¹, which is 86% higher than that of Al₂O₃/PDMS and the ratio of in-plane diffusivity to through-plane diffusivity decreases from 2.0 to 1.0. At meanwhile, the viscosity of m-BN@Al₂O₃/PDMS is about one fourth of the viscosity of m-BN/Al₂O₃/PDMS. This simple and versatile strategy opens a pavement for enhancing the thermal conductivity of polymer and has great potential in high-frequency communication.     

Effect of nanoparticles on the performance of thermally conductive epoxy adhesives

Microsized or nanosized α‐alumina (Al₂O₃) and boron nitride (BN) were effectively treated by silanes or diisocyanate, and then filled into the epoxy to prepare thermally conductive adhesives. The effects of surface modification and particle size on the performance of thermally conductive epoxy adhesives were investigated. It was revealed that epoxy adhesives filled with nanosized particles performed higher thermal conductivity, electrical insulation, and mechanical strength than those filled with microsized ones. It was also indicated that surface modification of the particles was beneficial for improving thermal conductivity of the epoxy composites, which was due to the decrease of thermal contact resistance of the filler‐matrix through the improvement of the interface between filler and matrix by surface treatment. A synergic effect was found when epoxy adhesives were filled with combination of Al₂O₃ nanoparticles and microsized BN platelets, that is, the thermal conductivity was higher than that of any sole particles filled epoxy composites at a constant loading content. The heat conductive mechanism was proposed that conductive networks easily formed among nano‐Al₂O₃ particles and micro‐BN platelets and the thermal resistance decreased due to the contact between the nano‐Al₂O₃ and BN, which resulted in improving the thermal conductivity. POLYM. ENG. SCI., 50:1809–1819, 2010. © 2010 Society of Plastics Engineers     

Magnetic-induced dynamically enhanced in-plane or out-of-plane thermal conductivity of BN/Ag NWs@Ni/epoxy composites

The thermal conductivity of polymer composites could be improved through the orientation of fillers in specific directions. Here, a novel strategy to fabricate BN/Ag nanowires@Ni/epoxy composites (BN/Ag NWs@Ni/EP) to dynamically improve the in-plane or out-of-plane thermal conductivity of the composites in real-time by changing the direction of the magnetic field was investigated. The thermal conduction path was constructed by Ag NWs bridging between BN flakes. Ag NWs@Ni would be oriented in the in-plane or out-of-plane direction by changing the direction of the magnetic field. The out-of-plane or in-plane thermal conductivities of the composites were 0.824 and 0.723 W m⁻¹K⁻¹ at 40 wt% BN/Ag NWs@Ni content, and the corresponding TCEs were 429% and 359% respectively when Ag NWs@Ni was oriented in the out-of-plane or in-plane direction. Meanwhile, BN/Ag NWs@Ni/EP exhibited good mechanical and dielectric properties, which were beneficial for its industrial application in electronic packaging. This strategy provides the possibility for the applications that required the adjustment of the heat conduction direction in real-time.     

Process induced alignment of carbon nanotube decreases longitudinal thermal conductivity of Al2O3 based porous composites

Alumina (Al₂O₃) based porous composites, reinforced with zirconia (ZrO₂), 3 and 8 mol% Y₂O₃ stabilized ZrO₂ (YSZ) and 4 wt% carbon nanotube (CNT) are processed via spark plasma sintering. The normalized linear shrinkage during sintering process of Al₂O₃-based composite shows minimum value (19.2–20.4%) for CNT reinforced composites at the temperature between 1650 °C and 575 °C. Further, the combined effect of porosity, phase-content and its crystallite size in sintered Al₂O₃-based porous composite have elicited lowest thermal conductivity of 1.2 Wm⁻¹K⁻¹ (Al₂O₃-8YSZ composite) at 900 °C. Despite high thermal conductivity of CNT (∼3000 Wm⁻¹K⁻¹), only a marginal thermal conductivity increase (∼1.4 times) to 7.3–13.4 Wm⁻¹K⁻¹ was observed for CNT reinforced composite along the longitudinal direction at 25 °C. The conventional models overestimated the thermal conductivity of CNT reinforced composites by up to ∼6.7 times, which include the crystallite size, porosity, and interfacial thermal resistance of Al₂O₃, YSZ and, CNT. But, incorporation of a new process induced CNT-alignment factor, the estimated thermal conductivity (of <6.6 Wm⁻¹K⁻¹) closely matched with the experimental values. Moreover, the high thermal conductivity (<76.1 Wm⁻¹K⁻¹) of the CNT reinforced porous composites along transverse direction confirms the process induced alignment of CNT in the spark plasma sintered composites.     

Simultaneously enhanced mechanical properties and thermal properties of ultrahigh‐molecular‐weight polyethylene with polydopamine‐coated α‐alumina platelets

Polydopamine (PDA) was employed to modify micrometric Al₂O₃ platelets to improve the interfacial compatibility between α‐Al₂O₃ powder and ultrahigh‐molecular‐weight polyethylene (UHMWPE). The structure of PDA‐coated Al₂O₃ and UHMWPE composites was investigated via Fourier transform infrared spectroscopy, scanning electron microscopy and X‐ray photoelectron spectroscopy. The thermal stability and mechanical performance of the samples were also evaluated. It is clear that UHMWPE/PDA‐Al₂O₃ composites exhibit better mechanical properties, higher thermal stability and higher thermal conductivity than UHMWPE/Al₂O₃ composites, owing to the good dispersion of Al₂O₃ powder in the UHMWPE matrix and the strong interfacial force between the macromolecules and the inorganic filler caused by the presence of PDA. The tensile strength and the tensile elongation at break of UHMWPE/PDA‐Al₂O₃ composite with 1 wt% PDA‐Al₂O₃ are 62.508 MPa and 462%, which are 1.96 and 1.98 times higher than those of pure UHMWPE, respectively. The thermal conductivity of UHMWPE/PDA‐Al₂O₃ composite increases from 0.38 to 0.52 W m^?1 K^?1 with an increase in the dosage of PDA‐Al₂O₃ to 20 wt%. The results show that the prepared PDA‐coated Al₂O₃ powder can simultaneously enhance the mechanical properties and thermal conductivity of UHMWPE. © 2018 Society of Chemical Industry     

A comparative study of thermal conductivity and thermal emissivity of high temperature solar absorber of ZrO2 /Fe2O3 and Al2O3/CuO ceramics

Oxide ceramics are considered as promising high temperature solar absorber materials. The major aim of this work is the development of a new solar absorber material with promising characteristics, high efficiency and low-cost processing. Hence, this work provides a comparative and inclusive study of densification behavior, microstructure features, thermal emissivity and thermal conductivity values of the two new high temperature solar absorbers of ZrO₂/Fe₂O₃ and Al₂O₃/CuO ceramics. Ceramic composites of ZrO₂/(10–30 wt%) Fe₂O₃ and Al₂O₃/(10–30 wt%) CuO were prepared by pressureless sintering method at a temperature of 1700 °C/2hrs. Identification of the solar to thermal efficiency of the composites was evaluated in terms of their measured thermal emissivity. Thermal efficiency and heat transfer homogeneity were investigated in terms of thermal conductivity and diffusivity measurement. The results showed that both composites exhibited comparable densification behavior, homogenous and harmonious microstructure. However, Al₂O₃/10 wt% CuO composite showed higher thermal and solar to thermal efficiencies than ZrO₂/Fe₂O₃ composites. It gave the lowest and the best thermal emissivity of 0.561 and the highest thermal conductivity of 15.4 W/m. K. These values proved to be the best amongst all those of the most known solar absorber materials made from the expensive SiC and AlN ceramics. Thus, Al₂O₃/CuO composites have succeeded in obtaining outstanding properties at a much lower price than its other competitive materials. These results may strongly identify Al₂O₃/CuO composites as promising high-temperature solar absorber materials instead of ZrO₂ and the other carbide and nitride ceramics.     

Multi-contact hybrid thermal conductive filler Al2O3@AgNPs optimized three-dimensional thermal network for flexible thermal interface materials

In this work, a multi-contact Al₂O₃@AgNPs hybrid thermal conductive filler was synthesized by in-situ growth method to fill high thermal conductivity polydimethylsiloxane (PDMS)-based composites to prepare TIMs. And the thermal conductivity, electrical conductivity, and mechanical properties of the composite materials were studied. During the synthesis process of the multi-contact hybrid filler, different concentrations of silver ions were reduced to generate silver nanoparticles and attached to the surface of Al₂O₃. Al₂O₃@AgNPs/PDMS thermally conductive composites were prepared by changing the filler addition. Using SEM, XPS, and XRD is used to characterize the morphology and chemical composition of Al₂O₃@AgNPs hybrid filler. The thermal conductivity of PDMS-based composites with different AgNPs content under 70 wt% filler loading was studied. The results show that the thermal conductivity of PDMS-based composites filled with 7owt%Al₂O₃@3AgNPs/PDMS multi-contact hybrid filler is 0.67 W/m·K, which is 3.72 times that of pure PDMS, and is higher than that of unmodified Al₂O₃ with the same addition amount. /PDMS composite material has a high thermal conductivity of 24%. This work provides a new idea for the design and manufacture of high thermal conductivity hybrid fillers for TIMs.     

Effect of different size complex fillers on thermal conductivity of PA6 thermal composites

ABSTRACT

Nylon 6 (PA6) thermal conductive composites were prepared by melt blending with different sizes of spherical Al₂O₃ and AlN and the filling amount was 60 wt%. This paper explored the effects of different particle sizes and filler kinds on the thermal conductivity and mechanical properties of the composites. The results showed that the composites filled with AlN and spherical Al₂O₃ had higher thermal conductivity than the composites filled with single filler under the same filling amount. When the mass ratio of 48 μm spherical Al₂O₃ and 14 μm AlN was 1:2, the thermal conductivity and thermal diffusivity was 2.44 W/(m·K) and 0.72 mm²/s, respectively. In addition,the tensile strength was 57.50 MPa and the impact strength was 6.13 KJ/m². By comparing actual thermal conductivity value with the theoretical value calculated by Agari model, we found that actual value of alumina filling was close to the theoretical value.     

The effect of Al2O3 doped multi-walled carbon nanotubes on the thermal conductivity of Al2O3/epoxy terminated poly(dimethylsiloxane) composites

Al₂O₃ doped multi-walled carbon nanotubes (MWCNT) were synthesized as a conducting additive in alumina–epoxy terminated poly(dimethylsiloxane) (ETDS). The addition of Al₂O₃ doped MWCNT improved the thermal conductivity of the composites, which was a function of the Al₂O₃ loading. The mechanisms underlying this enhanced conductivity were examined in the context of the Hashin–Shtrikman (HS) boundaries and interconnectivity. The measured thermal conductivity revealed more enhanced thermal conductivity than expected by analytical predictions at a fixed micro Al₂O₃ concentration. Further analytical investigations showed that the addition of Al₂O₃ doped MWCNT affected the interconnectivity between the conducting particles because of their high aspect ratios. Overall, Al₂O₃ doped MWCNT may be useful for establishing three-dimensional heat conducting percolating networks in a matrix that affect the thermal conductivity of a composite.     

Preparation and characterization of alumina/calcium-hexaluminate ceramic composites from ferrotitanium slag

Low-cost alumina/calcium-hexaluminate (Al₂O₃-CaAl₁₂O₁₉) ceramic composites were prepared using ferrotitanium slag in this paper. By making use of the TiO₂ and MgO originally existing in ferrotitanium slag, the sintering densification of Al₂O₃-CaAl₁₂O₁₉ composites was promoted. The results show that the optimum sintering temperature of the composites is 1500 ℃. The dominant sintering mechanism is the solid solution mechanism, i.e., Ti⁴⁺ and Mg²⁺ are dissolved in the CA₆ and Al₂O₃ lattices and generate numerous defects, which ultimately enhance the lattice diffusion coefficient and matter transport. Sintering densification improves the specific heat capacity, thermal conductivity, and thermal shock resistance of Al₂O₃-CaAl₁₂O₁₉ composites. Thermophysical properties analysis indicates that the composites can be potentially used for thermal storage and the slag-utilized ratio is about 60 wt.%. However, the layered cleavage of CA₆ limits further improvement of thermal shock resistance.     

Alumina Doped Ni/YSZ Anode Materials for Solid Oxide Fuel Cells

The Al₂O₃–Ni–YSZ (Y₂O₃ stabilised ZrO₂) anode materials with 0–6 wt% Al₂O₃ were prepared by tape casting method after being ball‐milled for 48 h. The influence of Al₂O₃ content on flexural strength, electrical conductivity, open porosity, relative density and thermal expansion coefficient (TEC) of Al₂O₃–Ni–YSZ anode was investigated. The introduction of Al₂O₃ significantly enhances the flexural strength of Al₂O₃–Ni–YSZ anode. The flexural strengths of 430 and 299 MPa are achieved for the specimen containing 0.25 wt% Al₂O₃ before and after reduction, respectively, while the flexural strengths are 201 and 237 MPa for the Ni–YSZ samples. The density decreases with increasing Al₂O₃ content and the open porosity increases correspondingly, after being sintered at 1350 °C for 4 h. The electrical conductivity at ambient temperature does not fall off when Al₂O₃ content is less than 1 wt%, but decreases rapidly when the content is above 3 wt% due to the formation of NiAl₂O₄. A maximum electrical conductivity of 1418 S cm^–1 is obtained in the sample containing 0.5 wt% Al₂O₃. The TEC of the samples decreases with the introduction of Al₂O₃ in the temperature range of 20–850 °C.     

Eco-friendly tape casting of borosilicate glass/Al2O3 sheets for LTCC applications

This work reports the innovative development of a borosilicate glass/Al₂O₃ tape for LTCC applications using an eco-friendly aqueous tape casting slurry. Polyvinylpyrrolidone (PVP) and polyacrylic acid (PAA) were the respective dispersants, while carboxymethyl cellulose (CMC) and styrene acrylic emulsion (SA) were the respective binders. The results showed that PVP was more suitable than PAA as the dispersant for the aqueous casting slurry, and that 1.5 wt% PVP would achieve well dispersion of CABS glass/Al₂O₃ powder in the aqueous slurry. Moreover, a small amount of 2.0 wt% CMC binder could yield smooth CABS glass/Al₂O₃ tapes crack free. A high-quality CABS glass/Al₂O₃ tape with a smooth surface was made from an aqueous slurry containing 1.5 wt% PVP dispersant, 2.0 wt% CMC binder, and 2.0 wt% PEG-400 plasticizer. The density, tensile strength, and surface roughness of the green tape were 2.05 g/cm³, 0.87 MPa, and 148 nm, respectively. The resulting CABS glass/Al₂O₃ composites sintered at 875 °C exhibited a bulk density of 3.14 g/cm³, a dielectric constant of 8.09, a dielectric loss of 1.0 × 10^?3, a flexural strength of 213 MPa, a thermal expansion coefficient of 5.30 ppm/^°C, and a thermal conductivity of 3.2 W m^?1 K^?1, thus demonstrating its broad prospects in LTCC applications.     

Multilayered ultrahigh molecular weight polyethylene/natural graphite/boron nitride composites with enhanced thermal conductivity and electrical insulation by hot compression

A scalable strategy to fabricate thermally conductive but electrically insulating polymer composites was urgently required in various applications including heat exchangers and electronic packages. In this work, multilayered ultrahigh molecular weight polyethylene (UHMWPE)/natural graphite (NG)/boron nitride (BN) composites were prepared by hot compressing the UHMWPE/NG layers and UHMWPE/BN layers alternately. Taking advantage of the internal properties of NG and BN fillers, the UHMWPE/NG layers played a decisive role in enhancing thermal conductivity (TC), while the UHMWPE/BN layers effectively blocked the electrically conductive pathways without affecting the thermal conductive pathways. The in-plane TC, electrical insulation, and heat spreading ability of multilayered UHMWPE/NG/BN composites increased with the increasing layer numbers. At the total fillers loading of 40 wt%, the in-plane TC of multilayered UHMWPE/NG/BN composites with nine layers was markedly improved to 6.319 Wm⁻¹ K⁻¹, outperforming UHMWPE/BN (4.735 Wm⁻¹ K⁻¹) and pure UHMWPE (0.305 Wm⁻¹ K⁻¹) by 33.45% and 1971.80%, respectively. Meanwhile, the UHMWPE/NG/BN composites still maintained an excellent electrically insulating property (volume resistance~5.40×10¹⁴ Ω cm ; breakdown voltage~1.52 kV/mm). Moreover, the multilayered UHMWPE/NG/BN composites also exhibited surpassing heat dissipation capability and mechanical properties. Our results provided an effective method to fabricate highly thermal conductive and electrical insulating composites.     

Aluminum oxide particles/silicon carbide whiskers’ synergistic effect on thermal conductivity of high-density polyethylene composites

Aluminum oxide (Al₂O₃) particles and silicon carbide (SiC) whiskers improved the thermal conductivity of high-density polyethylene (HDPE). To improve the dispersion of inorganic fillers in the matrix, 5 wt% of maleic anhydride-modified polyethylene was added into HDPE as a compatibilizer, and the hybrid matrix was denoted as mHDPE. The thermal conductivity, heat resistance, and tensile properties of resulting HDPE composites were characterized. The results showed that the thermal conductivity reached its maximum value of 0.8876 W/(m K) at 1/4 weight ratio of Al₂O₃/SiC, which was 110.3, 54.8, and 8.8% higher than that of pure HDPE, mHDPE/Al₂O₃, and mHDPE/SiC composites, in the order given, indicating that hybrid fillers have synergistic effect on the thermal conductivity of HDPE composites. Moreover, they also have a synergistic effect on the heat resistance and Young’s modulus. As the SiC content increases, the heat resistance of the composites increases at first and then falls, and the maximum VST is reached at an Al₂O₃/SiC weight ratio of 3/2, which is 5.4 °C higher than that of HDPE. The maximum Young’s modulus of the composites (1160 MPa) is obtained at an Al₂O₃/SiC weight ratio of 1/4, and the yield strength increases gradually as the SiC whiskers’ content increases.     

Al2O3/h-BN/epoxy based electronic packaging material with high thermal conductivity and flame retardancy

The long-term and stable operation of integrated circuits and microelectronics requires packaging epoxy resin (EP) exhibit high thermal conductivity for efficient heat dissipation, and excellent flame retardancy in case of thermal runaway. We achieved such EP composite via filling poly-dopamine (PDA) modified nanoscale Al₂O₃ spheres and microscale h-BN sheets. The PDA modification increases the compatibility between fillers and EP and largely reduces the viscosity, improving the dispersion of fillers in EP thus the thermal conductivity of EP composites. In addition, NH₃, H₂O, and N₂ generated during the combustion of phenolic hydroxyls and aminos in PDA combined with the physical barrier effect of Al₂O₃ and h-BN can improve the flame retardancy of EP composites. As a consequence, the EP composite filled with PDA modified Al₂O₃ (26.67 wt%) and h-BN (13.33 wt%) (i.e., PDA-BNAO/EP) shows a thermal conductivity of 1.192 W/mK (654.9% of EP), a peak heat release rate of 194.9 W/g (33.8% of EP), and total heat release of 15.2 kJ/g (54.5% of EP), respectively. What's more, the viscosity of PDA-BNAO/EP is 20,443 mPa s, which is only 20% of BNAO/EP (whose viscosity is 102,281 mPa s). More importantly, the PDA-BNAO/EP has good dynamic mechanical properties with the storage modulus of 14.69 Gpa, glass transition temperature of 91.9°C and good electrical insulation, which is desired for packaging of microelectronics. PDA-BNAO/EP composite should be a promising candidate for widespread packaging materials of microelectronics.     

Mechanical and thermal properties of spark plasma sintered Al2O3-graphene-SiC hybrid composites

Monolithic Al₂O₃ and Al₂O₃-graphene-SiC hybrid composites were prepared by spark plasma sintering (SPS) under vacuum atmosphere. The results show that the hybrid composites were almost completely dense (>97%). SiC content has a significant effect on the microstructure of the composites. With the increase of SiC content, the average grain size of alumina decreased gradually. The addition of SiC to alumina changed fracture mode from inter-granular fracture to mixed fracture mode of inter-granular fracture and trans-granular fracture. The Al₂O₃-0.4 wt%graphene-5 wt% SiC hybrid composite has the highest bending strength and hardness, which were 57% and 19.22% higher than those of the monolithic alumina, respectively. The room temperature (RT) thermal conductivity of the monolithic Al₂O₃ (25.5 W/m·K) was the highest. The thermal conductivity and thermal diffusivity coefficient of the composites decreased with the increase in temperature, while the specific heat of monolithic alumina and composites increased with the increase in temperature and additives. These properties were related to the microstructure of materials and the possible transport mechanisms were discussed.     

Preparation of a novel bi-layer modified alumina-based hybrid material and its effect on the thermal conductivity enhancement of polymer composites

In this work, a new kind of double layers modified alumina-based hybrid (silver@copper@alumina (Ag@Cu@Al₂O₃) hybrid) was successfully synthesized through the two-step layer-by-layer process. First, copper (Cu) nanoparticles were assembled onto alumina (Al₂O₃) particles by reduction of Cu²⁺. Second, Ag@Cu@Al₂O₃ hybrids were assembled via Ag deposition on the surface of Cu@Al₂O₃ particles. The obtained Ag@Cu@Al₂O₃ hybrids served as thermally conductive fillers to greatly boost the thermal conductivity of poly (dimethylsiloxane) (PDMS). The thermal conductivity reached 1.465 W m^?1 K^?1 at 85 wt% filler loading. The thermal conductivity of PDMS matrix was increased more than 7 times by the addition of Ag@Cu@Al₂O₃ hybrid, which was much higher than single layer modified alumina-based hybrids (Ag@Al₂O₃ and Cu@Al₂O₃ hybrids) and virgin Al₂O₃ particle. The effect of double layers modified filler, single layer modified filler and virgin filler on the thermal conductivity of PDMS matrix was discussed in detail and the mechanism of these fillers for improving thermal conductivity was studied through Foygel's thermal conduction model. Otherwise, electric, mechanical and thermal properties of Ag@Cu@Al₂O₃/PDMS composites were also further tested and analyzed.