用于单片集成光接收机前端的GaAs基InP/InGaAs HBT

实现了一种可用于单片集成光接收机前端的GaAs基InP/InGaAs HBT。借助超薄低温InP缓冲层在GaAs衬底上生长出了高质量的InP外延层。在此基础上,只利用超薄低温InP缓冲层技术就在半绝缘GaAs衬底上成功制备出了InP/InGaAsHBT,器件的电流截止频率达到4.4GHz,开启电压0.4V,反向击穿电压大于4V,直流放大倍数约为20。该HBT器件和GaAs基长波长、可调谐InP光探测器单片集成为实现适用于WDM光纤通信系统的高性能、集成化光接收机前端提供了一种新的解决方法。     

Self-organization phenomenon of strained InGaAs on InP (311) substrates grown by metalorganic vapor phase epitaxy

We have demonstrated that a self-organization phenomenon occurs in strained InGaAs system on InP (311) substrates grown by metalorganic vapor phase epitaxy. This suggests that a similar formation process of nanocrystals exists not only on the GaAs (311)B substrate but also on the InP (311)B substrate. However, the ordering and the size homogeneity of the self-organized nanocrystals are slightly worse than those of the InGaAs/AlGaAs system on the GaAs (311)B substrate. The tensilely strained condition of a InGaAs/InP system with growth interruption in a PH₃ atmosphere reveals a surface morphology with nanocrystals even on the InP (100) substrate. It was found that strain energy and high growth temperature are important factors for self-organization on III-V compound semiconductors. Preliminary results indicate that the self-organized nanostructures in strained InGaAs/InP systems on InP substrates exhibit room temperature photoluminescent emissions at a wavelength of around 1.3 p.m.     

Monte Carlo simulation of electron transport efficiency of an InGaAs/InP hot-electron transistor

Electron transport efficiency of an InGaAs/InP hot-electron transistor (HET) is determined by a Monte Carlo method including alloy scattering in an InGaAs base. Results are compared with those of a GaAs/AlGaAs HET. It is found that the InGaAs/InP HET offers a higher current gain than that of a GaAs/AlGaAs HET by an order of magnitude.     

量子阱平面光学各向异性的偏振差分反射谱研究

在室温下用偏振差分反射谱技术观察到了 Ga As/Al Ga As、In Ga As/Ga As和 In Ga As/In P三种量子阱材料的平面光学各向异性。我们发现 Ga As/Al Ga As量子阱 1 h→ 1 e跃迁的偏振度与阱宽成反比 ,与 In Ga As/In P量子阱的报道结果类似。 Ga原子偏析引起的界面不对称可以很好地解释这种行为。与之相反 ,In Ga As/Ga As量子阱的光学各向异性倾向于与阱宽成正比。目前还不能很好地解释这种现象。     

Infrared reflection spectra of multilayer epitaxial heterostructures with embedded InAs and GaAs layers

The effect of the thickness of embedded InAs and GaAs layers on the infrared reflection spectra of lattice vibrations for AlInAs/InAs/AlInAs, InGaAs/GaAs/InGaAs, and AlInAs/InGaAs/GaAs/InGaAs/AlInAs multilayer epitaxial heterostructures grown by MOC hydride epitaxy on InP (100) substrates is studied. Relative stresses emerging in the layers surrounding the embedded layers with variation in the number of monolayers from which the quantum dots are formed and with variation the thickness of the layers themselves surrounding the embedded layers are evaluated.     

InAs/InGaSb photodetectors grown on GaAs bonded substrates

The results of wafer fusion between GaAs and InP followed by transfer of an InGaAs film from the InP to GaAs substrate are presented in this paper. This technique of film transfer allowed the subsequent growth of epitaxial materials with approximately 7% lattice mismatch. Type-II InAs/GaInSb superlattices photodetectors of different designs have been grown by molecular beam epitaxy (MBE) on the alternative InGaAs/GaAs substrate and on standard GaSb substrates. Comparison between photodetectors grown on the two different substrates with nearly identical superlattice periods showed a shift in the cut-off wavelength. The superlattices grown on the alternative substrates were found to have uniform layers, with broader x-ray linewidths than superlattices grown on GaSb substrates.     

Charge storage in InAlAs/InGaAs/InP floating gate heterostructures

Charge retention in floating gate InAlAs/InGaAs/InP field effect transistors is limited by lateral electron motion along the storage channel, a different direction for motion than found for AlAs/GaAs devices. Storage times as a function of temperature for the InP based alloy devices are reported and compared with similar AlAs/GaAs devices by using Poisson equation models.<>     

Current-injection efficiency in semiconductor lasers with a waveguide based on quantum wells

A dynamic distributed diffusion-drift model of laser heterostructures, which takes into account carrier capture by quantum wells, is developed. The leakage currents in the lasing mode are calculated for different laser structures without wide-gap emitters: InGaAs/GaAs (lasing wavelength λ = 0.98 μm), InGaAsP/InP (λ = 1.3 μm), and InGaAs/InP (λ = 1.55 μm). It is shown that consideration of the finite carrier-capture time is of major importance for calculating structures with deep quantum wells. The ratio of the leakage currents to the total current in the structures with deep quantum wells (InGaAsP/InP and InGaAs/InP) increases with an increase in the injection current and may reach a few percent when the lasing threshold is multiply exceeded.     

Facet oxidation of InGaAsP/InP and InGaAs/InP lasers

The facet oxidation of InGaAsP/InP and InGaAs/InP lasers is investigated after aging under high constant optical output power or high current stress. Facet oxidation in InGaAsP/InP lasers is negligibly small under several thousand hours of practical operation. The thickness of oxide film increases in proportion to optical output power and logarithm of aging time. The growth rate of facet oxide film weakly depends on the junction temperature and the activation energy is estimated to be 0.07 eV within a experimental range between 25 and 150°C. The facet of InGaAs/InP lasers are oxidized more easily than that of InGaAsP/InP lasers but are about two orders of magnitude more stable against oxidation than that of AlGaAs/GaAs lasers.     

Current-gain cutoff frequency comparison of InGaAs HEMTs

The current-gain cutoff frequency performance of pseudomorphic InGaAs/AlGaAs (20% InAs composition) high-electron-mobility transistors (HEMTs) on GaAs is compared to that of lattice-matched InGaAs/InAlAs HEMTs on InP. The current-gain cutoff frequency (f_t) characteristics as a function of gate length (L_g) indicate that the f_t-L_g product of ~26 GHz-μm in InGaAs/InAlAs HEMTs is 23% higher than that of ~21 GHz-μm in InGaAs/AlGaAs HEMTs. The performance of InGaAs/AlGaAs HEMTs is also 46% higher than that of conventional GaAs/AlGaAs HEMTs (~18 GHz-μm). These data are very useful in improving the device performance of HEMTs for a given gate length     

22 nm In0.75Ga0.25As channel-based HEMTs on InP/GaAs substrates for future THz applications

In this work, the performance of L_g=22 nm In_0.75Ga_0.25As channel-based high electron mobility transistor (HEMT) on InP substrate is compared with metamorphic high electron mobility transistor (MHEMT) on GaAs substrate. The devices features heavily doped In_0.6Ga_0.4As source/drain (S/D) regions, Si double δ-doping planar sheets on either side of the In_0.75Ga_0.25As channel layer to enhance the transconductance, and buried Pt metal gate technology for reducing short channel effects. The TCAD simulation results show that the InP HEMT performance is superior to GaAs MHEMT in terms of f_T, f_max and transconductance (g_{m_max}). The 22 nm InP HEMT shows an f_T of 733 GHz and an f_max of 1340 GHz where as in GaAs MHEMT it is 644 GHz and 924 GHz, respectively. InGaAs channel-based HEMTs on InP/GaAs substrates are suitable for future sub-millimeter and millimeter wave applications.     

InP/InGaAs转移电子光阴极吸收层厚度设计与计算

采用基于密度泛函理论的第一性原理平面波赝势法计算了InP/InGaAs转移电子光阴极吸收层材料的电学结构和光学性质,交换关联能采用杂化泛函HSE06来描述。首先对闪锌矿结构GaAs材料能带图进行计算验证,接着建立标准InGaAs材料体结构模型,并对模型进行了动力学的自洽优化,在优化后的基础上进行了非自洽的计算,得到标准InGaAs材料的复介电函数,然后根据Kramers-Kronig关系推出标准InGaAs材料光吸收系数。最后,结合转移电子光阴极量子效率模型,在给定P型标准InGaAs材料非平衡少子扩散长度分别是0.8、1.0、1.2、1.4、1.6和2.0 mm的条件下,得到对能量在0.780 260~0.820 273 eV区间内、间距为0.002 eV的不同光子能量优化的InP/InGaAs转移电子光阴极吸收层厚度。     

直接键合四结GaAs太阳电池研究

晶圆直接键合技术由于能将表面洁净的两个晶圆集成到一起,从而可以用来制备晶格失配 III-V族多结太阳电池。为了制备GaInP/GaAs/InGaAsP/InGaAs四结太阳电池,需采用具有低电阻率的GaAs/InP键合界面,从而实现GaInP/GaAs和InGaAsP/InGaA上下两个子电池的电学导通。我们设计并研究了具有不同掺杂元素和掺杂浓度的三种键合界面,并采用IV曲线对其电学性质进行表征。此外,对影响键合界面质量的关键工艺过程进行了研究,主要包括表面清洗技术和键合参数优化,例如键合温度、键合压力和键合时间等。最终制备出的键合四结GaInP/GaAs/InGaAsP/InGaAs太阳电池在AM0条件下效率最高达33.2%。     

宽带半导体可饱和吸收镜研制方法及选择腐蚀研究

介绍了用于固体激光器被动锁模自启动实现飞秒级脉冲输出的两种波长的带半导体可饱和吸收镜(800nm和1550 nm SESAMs)的研制方法和应用.制作宽带反射层的关键技术之一是AlGaAs/GaAs和InP/InGaAs/InGaAs的选择腐蚀.分别就几种湿法腐蚀和干法腐蚀进行了详细的分析和比较.     

Hemt’s capability for millimeter wave applications

This paper presents a tutorial review on the High Electron Mobility Transistors (HEMTs)for low-noise and power applications at millimeter wave range frequencies. The major parameters to achieve high performance with such devices are discussed. Present status on power and noise performances is given for InAlAs/InGaAs HEMTs on InP and GaAs substrates.     

Low-intensity low-temperature (LILT) measurements and coefficients on new photovoltaic structures

Past NASA missions to Mars, Jupiter and the outer planets were powered by radioisotope thermal generators. Although these devices proved to be reliable, their high cost and highly toxic radioactive heat source has made them far less desirable for futur e planetary missions. This has resulted in a renewed search for alternate energy sources, some of them being photovoltaics (PV) and thermophotovoltaics. Both of these alternate energy sources convert light/thermal energy directly into electricity. In order to create a viable PV database for planetary mission planners and cell designers, we have compiled low-intensity low-temperature (LILT) I-V data on single-junction and multi-junction high-efficiency solar cells. The cells tested here represent the latest PV technology. Using these LILT data to calculate short-circuit current, open-circuit voltage and fill factor as a function of temperature and intensity, an accurate prediction of cell performance under the AMO spectrum can be determined. When combined with quantum efficiency at low temperature data, one can further enhance the data by adding spectral variations to the measurements. This paper presents an overview by LILT measurements and is only intended to be used as a guideline for material selection and performance predictions. As single-junction and multi-junction cell technologies emerge, new test data must be collected. Cell materials included are Si, GaAs/Ge, GaInP/GaAs/GaAs, InP, InGaAs/InP, InP/InGaAs/InP and GaInP. Temperatures range down to as low as — 180°C and intensities range from 1 sun down to 0.02 sun. The coefficients presented in this paper represent experimental results and are intended to provide the user with approximate numbers.     

InGaAs/InP double-heterostructure bipolar transistors with near-ideal β versus ICcharacteristic

InGaAs/InP double-heterostructure bipolar transistors (DHBT's) with current gain β ∼ 630 have been realized using gas-source molecular beam epitaxy (GSMBE). These devices exhibit near-ideal β versus ICcharacteristic (i.e., β independent of IC) with a small-signal gainh_{fe} sim 180atI_{C} sim 2nA. In comparison, we findbeta sim I_{C}^{0.5}for a high-quality AlGaAs/GaAs HBT grown by OMCVD. The higher emitter injection efficiency at low collector current levels found in the InGaAs/InP DHBT is due to at least a factor 100 smaller surface recombination current.     

InP/InAlAs/InGaAs quantum wires

Single InGaAs quantum wires and stacked InGaAs quantum wires with InAIAs barriers have been fabricated on V-grooved InP substrates by low pressure metal-organic chemical vapour deposition (MOCVD). We have found growth conditions where the InAIAs barrier exhibits a resharpening effect, similar to that of AlGaAs utilized for growth on GaAs substrates. The existence of structural and electronic quantum wires in the bottom of the grooves is proven.     

GaAs基InAlAs/InGaAsMHEMT直流特性研究

报道了用 MBE技术生长的 Ga As基 In Al As/In Ga As改变结构高电子迁移率晶体管 (MHEMT)的制作过程和器件的直流性能。对于栅长为 0 .8μm的器件 ,最大非本征跨导和饱和电流密度分别为 3 5 0 m S/mm和1 90 m A/mm。源漏击穿电压和栅反向击穿电压分别为 4V和 7.5 V。这些直流特性超过了相同的材料和工艺条件下 Ga As基 PHEMT的水平 ,与 In P基 In Al As/In Ga As HEMT的性能相当     

Fabrication of dry-etched mirrors in GaAs-based and InP-based lasers using chemically assisted ion-beam etching at low temperatures

We have fabricated dry-etched mirrors in high-speed InGaAs/GaAs/AlGaAs pseudomorphic multiple quantum well ridge-waveguide lasers at 60°C and in InGaAs/InP bulk lasers at 5°C using enhanced chemically assisted ion-beam etching (CAIBE) technique. The technique allows the etching of laser structures with good surface morphology and excellent anisotropy without cold traps in the etching system. Characteristics of the dry-etched facet lasers match those of cleaved devices. The low sample temperatures for etching allowed the use of standard photoresists as etch masks.