Characterization of <Emphasis Type="Italic">n</Emphasis>-Type and <Emphasis Type="Italic">p</Emphasis>-Type Long-Wave InAs/InAsSb Superlattices

The influence of dopant concentration on both in-plane mobility and minority carrier lifetime in long-wave infrared InAs/InAsSb superlattices (SLs) was investigated. Unintentially doped (n-type) and various concentrations of Be-doped (p-type) SLs were characterized using variable-field Hall and photoconductive decay techniques. Minority carrier lifetimes in p-type InAs/InAsSb SLs are observed to decrease with increasing carrier concentration, with the longest lifetime at 77 K determined to be 437 ns, corresponding to a measured carrier concentration of p ₀ = 4.1 × 10¹⁵ cm^?3. Variable-field Hall technique enabled the extraction of in-plane hole, electron, and surface electron transport properties as a function of temperature. In-plane hole mobility is not observed to change with doping level and increases with reducing temperature, reaching a maximum at the lowest temperature measured of 30 K. An activation energy of the Be-dopant is determined to be 3.5 meV from Arrhenius analysis of hole concentration. Minority carrier electrons populations are suppressed at the highest Be-doping levels, but mobility and concentration values are resolved in lower-doped samples. An average surface electron conductivity of 3.54 × 10^?4 S at 30 K is determined from the analysis of p-type samples. Effects of passivation treatments on surface conductivity will be presented.     

Practical Surface Treatments and Surface Chemistry of <Emphasis Type="Italic">n</Emphasis>-Type and <Emphasis Type="Italic">p</Emphasis>-Type GaN

X-ray and ultraviolet photoelectron spectroscopies (XPS and UPS) were used to study the electronic structure of n-GaN and p-GaN(0001) surfaces after three ex situ surface treatments: aq-HCl, annealing in NH₃, and annealing in HCl vapor. The combination of in situ vacuum annealing and re-exposure of samples to air revealed that the adsorption of ambient contaminants can reduce the surface state density and subsequent band bending on both n-GaN and p-GaN surfaces. Insights derived from first-principles calculations of the adsorption of relevant species on the Ga-terminated GaN(0001) surface are used to explain these experimental observations qualitatively.     

High-efficiency LEDs based on <Emphasis Type="Italic">n</Emphasis>-GaSb/<Emphasis Type="Italic">p</Emphasis>-GaSb/<Emphasis Type="Italic">n</Emphasis>-GaInAsSb/<Emphasis Type="Italic">P</Emphasis>-AlGaAsSb type-II thyristor heterostructures

A new type of light-emitting diodes (LEDs), a high-efficiency device based on an n-GaSb/p-GaSb/n-GaInAsSb/P-AlGaAsSb thyristor heterostructure, with the maximum emission intensity at wavelength λ = 1.95 μm, has been suggested and its electrical and luminescent characteristics have been studied. It is shown that the effective radiative recombination in the thyristor structure in the n-type GaInAsSb active region is provided by double-sided injection of holes from the neighboring p-type regions. The maximum internal quantum efficiency of 77% was achieved in the structure under study in the pulsed mode. The average optical power was as high as 2.5 mW, and the peak power in the pulsed mode was 71 mW, which exceeded by a factor of 2.9 the power obtained with a standard n-GaSb/n-GaInAsSb/P-AlGaAsSb LED operating in the same spectral range. The approach suggested will make it possible to improve LED parameters in the entire mid-IR spectral range (2–5 μm).     

Power Factor Anisotropy of <Emphasis Type="Italic">p</Emphasis>-Type and <Emphasis Type="Italic">n</Emphasis>-Type Conductive Thermoelectric Bi-Sb-Te Thin Films

The best films for thermoelectric applications near room temperature are based on the compounds Bi₂Te₃, Sb₂Te₃, and Bi₂Se₃, which as single crystals have distinct anisotropy in their electrical conductivity σ regarding the trigonal c-axis, whereas the Seebeck coefficient S is nearly isotropic. For p- and n-type alloys, P _⊥c > P _||c, and the power factors P _⊥c of single crystals are always higher compared with polycrystalline films, where the power factor is defined as P = S ² σ, ⊥c and ||c are the direction perpendicular and parallel to the c-axis, respectively. For the first time in sputter-deposited p-type (Bi_0.15Sb_0.85)₂Te₃ and n-type Bi₂(Te_0.9Se_0.1)₃ thin films, the anisotropy of the electrical conductivity has been measured directly as it depends on the angle φ between the electrical current and the preferential orientation of the polycrystals (texture) using a standard four-probe method. The graphs of σ(φ) show the expected behavior, which can be described by a weighted mixture of σ _⊥c and σ _||c contributions. Because (σ _⊥c/σ _||c) _p  < (σ _⊥c/σ _||c) _n , the n-type films have stronger anisotropy than the p-type films. For this reason, the angular weighted contributions of P _||c lead to a larger drop in the power factor of polycrystalline n-type films compared with p-type films.     

Thermoelectric Properties of <Emphasis Type="Italic">n</Emphasis>-Type Multiple-Filled Skutterudites

Filled skutterudites are prospective intermediate temperature materials for␣thermoelectric power generation. CoSb₃-based n-type filled skutterudites have good electrical transport properties with power factor values over 40 μW/cm K² at elevated temperatures. Filling multiple fillers into the crystallographic voids of skutterudites would help scatter a broad range of lattice phonons, thus resulting in lower lattice thermal conductivity values. We report the thermoelectric properties of n-type multiple-filled skutterudites between 5 K and 800 K. The combination of different fillers inside the voids of the skutterudite structure shows enhanced phonon scattering, and consequently a strong suppression of the lattice thermal conductivity. Very good power factor values are achieved in multiple-filled skutterudite compared with single-element-filled materials. The dimensionless thermoelectric figure of merit for n-type filled skutterudites is improved through multiple-filling in a wide temperature range.     

Improved Thermal Stability Observed in Ni-Based Ohmic Contacts to <Emphasis Type="Italic">n</Emphasis>-Type SiC for High-Temperature Applications

The high-temperature stability of a Pt/TaSi₂/Ni/SiC ohmic contact metallization scheme was characterized using a combination of current–voltage measurements, Auger electron spectroscopy, and transmission electron microscopy imaging and associated analytical techniques. Increasing the thicknesses of the Pt and TaSi₂ layers promoted electrical stability of the contacts, which remained ohmic at 600°C in air for the extent of heat treatment; the specific contact resistance showed only a gradual increase from an initial value of 5.2 × 10⁻⁵ Ω cm². We observed a continuous silicon oxide layer in the thinner contact structures, which failed after 36 h of heating. Meanwhile, thicker contacts with enhanced stability contained a much lower oxygen concentration that was distributed across the contact layers, precluding the formation of an electrically insulating contact structure.     

Thin-film polycrystalline <Emphasis Type="Italic">n</Emphasis>-ZnO/<Emphasis Type="Italic">p</Emphasis>-CuO heterojunction

Results of X-ray diffraction and spectral-optical studies of n-ZnO and p-CuO films deposited by gas-discharge sputtering with subsequent annealing are presented. It is shown that, despite the difference in the crystal systems, the polycrystallinity of n-ZnO and p-CuO films enables fabrication of a heterojunction from this pair of materials.     

Au-Doped Indium Tin Oxide Ohmic Contacts to <Emphasis Type="Italic">p</Emphasis>-Type GaN

Indium tin oxide (ITO) thin films doped with Au, Ni, or Pt (3.5 at.% to 10.5 at.%) were deposited on p-GaN epilayers (Mg ~4 × 10¹⁹ cm⁻³) using direct-current (DC) sputter codeposition. It was found that undoped ITO con- tacts to p-GaN exhibited leaky Schottky behavior, whereas the incorporation of a small amount of Au (3.5 at.% to 10.5 at.%) significantly improved their ohmic characteristics. Compared with standard Ni/ITO contacts, the Au-doped ITO contacts had a similar specific contact resistance in the low 10⁻² Ω cm⁻² range, but were more stable above 600°C and more transparent at blue wavelengths. These results provide support for the use of Au-doped ITO ohmic contact to p-type GaN in high-brightness blue light-emitting diodes.     

Light-Harvesting in <Emphasis Type="Italic">n</Emphasis>-ZnO/<Emphasis Type="Italic">p</Emphasis>-Silicon Heterojunctions

Zinc oxide (ZnO) films were deposited onto Si to form n-ZnO/p-Si heterojunctions. Under the illumination of by both ultraviolet (UV) light and sunlight, obvious photovoltaic behavior was observed. It was found that the conversion efficiency of the heterojunctions increased significantly with increasing thickness of the ZnO film, and the mechanism for light-harvesting in the heterojunctions is discussed. The results suggest that ZnO films may be helpful to increasing the harvesting of UV photons, thus decreasing the thermalization loss of UV energy in Si-based solar cells.     

Electrical properties of <Emphasis Type="Italic">n</Emphasis>-ZnO/<Emphasis Type="Italic">p</Emphasis>-CuO heterostructures

The n-ZnO/p-CuO heterostructure is prepared, and its I-V characteristic is measured. It is shown that the heterostructure conductivity is primarily determined by the CuO layer and the n-ZnO/p-CuO heterojunction itself.     

Features of high-temperature electroluminescence in an LED <Emphasis Type="Italic">n</Emphasis>-GaSb/<Emphasis Type="Italic">n</Emphasis>-InGaAsSb/<Emphasis Type="Italic">p</Emphasis>-AlGaAsSb heterostructure with high potential barriers

The electroluminescent properties of a light-emitting diode n-GaSb/n-InGaAsSb/p-AlGaAsSb heterostructure with high potential barriers are studied in the temperature range of 290–470 K. An atypical temperature increase in the power of the long-wavelength luminescence band with an energy of 0.3 eV is experimentally observed. As the temperature increases to 470 K, the optical radiation power increases by a factor of 1.5–2. To explain the extraordinary temperature dependence of the radiation power, the recombination and carrier transport processes are theoretically analyzed in the heterostructure under study.     

Electrical Breakdown in Pure <Emphasis Type="Italic">n</Emphasis>- and <Emphasis Type="Italic">p</Emphasis>-Si

The results of calculations of the dependences of the kinetic coefficients of impact ionization and thermal recombination on an electric field in pure silicon are presented. By analogy with germanium, the dependences of the breakdown field Е_br on the material compensation ratio K are calculated. The validity of such calculation is justified in detail. The Е_br(K) curves are presented and compared with experimental data in the weak-compensation region. Matching with experimental results at which satisfactory agreement between theory and experiment is observed is performed.     

Recombination of charge carriers in the GaAs-based <Emphasis Type="Italic">p</Emphasis>-<Emphasis Type="Italic">i</Emphasis>-<Emphasis Type="Italic">n</Emphasis> diode

It is established that the radiative recombination of charge carriers plays a substantial role in the GaAs-based p-i-n diodes at high densities of the forward current. It is shown experimentally that the diodes operating in microwave integrated circuits intensely emit light in the IR range with wavelengths from 890 to 910 nm. The obtained results indicate the necessity of taking into account the features of recombination processes in the GaAs-based microwave p-i-n diodes.     

Study of the intermediate layer at the <Emphasis Type="Italic">n</Emphasis><Superscript>+</Superscript>-CdS/<Emphasis Type="Italic">p</Emphasis>-CdTe interface

The effect of production conditions and subsequent stimulation by ultrasonic irradiation on the formation of a solid solution at the n-CdS/p-CdTe interface in solar cells has been investigated. The phase composition of the solid-solution transient layer was investigated by a nondestructive photoelectric method (measurement of the spectral distribution of photosensitivity in the gate and photodiode modes). It is shown that the phase composition and thickness of the intermediate CdTe_1?x S _x layer depend strongly on the heterostructure formation conditions.     

Photovoltaic poperties of <Emphasis Type="Italic">n</Emphasis>-ZnO:Al/PbPc/<Emphasis Type="Italic">p</Emphasis>-Si structures

n-ZnO:Al/PbPc/p-Si photosensitive structures are fabricated for the first time. The steady-state current-voltage characteristics and spectral dependences of the relative quantum efficiency of the photoconversion of these structures are studied, and the mechanisms of charge transport and the photosensitivity processes are discussed. It is concluded that they are promising for application as multiband photoconverters of natural light.     

Current flow mechanism in ohmic contact to <Emphasis Type="Italic">n</Emphasis>-4<Emphasis Type="Italic">H</Emphasis>-SiC

Current flow in an In-n-4H-SiC ohmic contact (n ≈ 3 × 10¹⁷ cm⁻³) has been studied by analyzing the temperature dependence of the per-unit-area contact resistance. It was found that the thermionic emission across an ∼0.1-eV barrier is the main current flow mechanism and the effective Richardson constant is ∼2 × 10⁻² A cm⁻² K⁻¹.     

Extruded Bismuth-Telluride-Based <Emphasis Type="Italic">n</Emphasis>-Type Alloys for Waste Heat Thermoelectric Recovery Applications

Thermoelectric (TE) generator modules for a number of waste heat recovery applications are required to operate between room temperature and 500 K, a temperature range for which the composition of bismuth-telluride-based alloys needs to be adjusted to optimize performance. In particular n-type alloys do not perform as well as p-type and require a more systematic study. We have produced, by mechanical alloying followed by hot extrusion, alloys, within the range with fixed carrier concentration () to optimize their TE performance in the temperature range 300 K to 420 K. The optimum composition has been identified to be and which is very close to the composition that also maximizes the ratio of the electron mobility to the lattice component of the thermal conductivity. The optimized alloy performance can be further increased by adjusting the carrier concentration.     

Effects of SiC Nanodispersion on the Thermoelectric Properties of <Emphasis Type="Italic">p</Emphasis>-Type and <Emphasis Type="Italic">n</Emphasis>-Type Bi<Subscript>2</Subscript>Te<Subscript>3</Subscript>-Based Alloys

Polycrystalline p-type Bi_0.5Sb_1.5Te₃ and n-type Bi₂Te_2.7Se_0.3 thermoelectric (TE) alloys containing a small amount (vol.% ≤5) of SiC nanoparticles were fabricated by mechanical alloying and spark plasma sintering. It was revealed that the effects of SiC addition on TE properties can be different between p-type and n-type Bi₂Te₃-based alloys. SiC addition slightly increased the power factor of the p-type materials by decreasing both the electrical resistivity (ρ) and Seebeck coefficient (α), but decreased the power factor of n-type materials by increasing both ρ and α. Regardless of the conductivity type, the thermal conductivity was reduced by dispersing SiC nanoparticles in the Bi₂Te₃-based alloy matrix. As a result, a small amount (0.1 vol.%) of SiC addition increased the maximum dimensionless figure of merit (ZT _max) of the p-type Bi_0.5Sb_1.5Te₃ alloys from 0.88 for the SiC-free sample to 0.97 at 323 K, though no improvement in TE performance was obtained in the case of n-type Bi₂Te_2.7Se_0.3 alloys. Importantly, the SiC-dispersed alloys showed better mechanical properties, which can improve material machinability and device reliability.     

Electrical Properties of <Emphasis Type="Italic">p</Emphasis>-NiO/<Emphasis Type="Italic">n</Emphasis>-Si Heterostructures Based on Nanostructured Silicon

Silicon nanowires are formed on n-Si substrates by chemical etching. p-NiO/n-Si heterostructures are fabricated by reactive magnetron sputtering. The energy diagram of anisotype p-NiO/n-Si heterostructures is constructed according to the Anderson model. The current–voltage and capacitance–voltage characteristics are measured and analyzed. The main current-transport mechanisms through the p-NiO/n-Si heterojunction under forward and reverse biases are established.     

Electrodeposition of <Emphasis Type="Italic">p</Emphasis>-Type Sb<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Te<Subscript><Emphasis Type="Italic">y</Emphasis></Subscript> Thermoelectric Films

Thermoelectric Sb _x Te _y films were potentiostatically electrodeposited in aqueous nitric acid electrolyte solutions containing different concentrations of TeO₂. Stoichiometric Sb _x Te _y films were obtained by applying a voltage of −0.15 V versus saturated calomel electrode (SCE) using a solution consisting of 2.4 mM TeO₂, 0.8 mM Sb₂O₃, 33 mM tartaric acid, and 1 M HNO₃. The nearly stoichiometric Sb₂Te₃ films had a rhombohedral structure, R[`3]m R\bar{3}m , with a preferred orientation along the (015) direction. The films had hole concentration of 5.8 × 10¹⁸/cm³ and exhibited mobility of 54.8 cm²/Vs. A more negative potential resulted in higher Sb content in the deposited Sb _x Te _y films. Furthermore, it was observed that the hole concentration and mobility decreased with increasingly negative deposition potential, and eventually showed insulating properties, possibly due to increased defect formation. The absolute value of the Seebeck coefficient of the as-deposited Sb₂Te₃ thin film at room temperature was 118 μV/K.