Synthesis of TaZnO thin films using combinatorial magnetron sputtering and its electrical, structural and optical properties

The structural, electrical, and optical properties of tantalium zinc oxide (TaZnO) thin films grown using combinatorial magnetron sputtering system were investigated. To explore the effects of film thickness and post annealing treatment on the properties of the films, we have fabricated TaZnO sample libraries having different thicknesses and carried out post annealing treatment. Sample libraries fabricated at room temperature showed the resistivity ranged 2.1 to approximately 7.1 x 10(-3) Omega cm, while the films post annealed at 200 degrees C under 1 mTorr exhibited the resistivity as low as 1.2 x 10(-3) Omega cm. XRD measurements revealed that the film structure was strongly depended on the film thickness, showing that the structure was changed from amorphous to polycrystalline with increasing the film thickness. Furthermore, it was found that figure of merit (0TC), which was determined by T% and Rs of the TaZnO films, showed maximum value as the films with a thickness of 230 nm was post-annealed at 200 degrees C under vacuum of 1 mTorr.     

Oxidation behaviour of Ti2AIN films composed mainly of nanolaminated MAX phase

In this paper, we reported the oxidation behaviour of Ti2AIN films on polycrystalline Al2O3 substrates. The Ti2AIN films composed mainly of nanolaminated MAX phase was obtained by first depositing Ti-Al-N films using reactive sputtering of two elemental Ti and Al targets in Ar/N2 atmosphere and subsequent vacuum annealing at 800 degrees C for 1 h. The Ti2AIN films exhibited excellent oxidation resistance and thermal stability at 600-900 degrees C in air. Very low mass gain was observed. At low temperature (600 degrees C), no oxide crystals were observed on film surface. Blade-like Theta-Al2O3 fine crystals formed on film surfaces at 700-800 degrees C. At high temperature (900 degrees C), firstly Theta-Al2O3 formed on film surface and then transformed into alpha-Al2O3. At 700-900 degrees C, a continuous Al2O3 layer formed on Ti2AIN films surface, acting as diffusion barrier preventing further oxidation attack. The mechanism of the excellent oxidation resistance of Ti2AIN films was discussed based on the experimental results.     

Effect of thermal annealing on the optical properties and residual stress of TiO2 films produced by ion-assisted deposition

The effects of thermal annealing of titanium oxide films deposited by ion-beam assistance at annealing temperatures from 100 degrees C to 300 degrees C on the residual stress and optical properties of the films was investigated. The refractive indices and extinction coefficients increased gradually as the temperature was increased from 100 degrees C to 200 degrees C and then declined gradually as the temperature was increased further from 200 degrees C to 300 degrees C. The film lost oxygen and slowly generated lower suboxides as the annealing temperature was reduced below 200 degrees C, as determined by x-ray photoelectron spectroscopy (XPS). As the annealing temperature increased above 200 degrees C, the lower suboxides began to capture oxygen and form stable oxides. XPS measurements were made to verify both the binding energy associated with the Ti 2p line and the variation of the O 1s line. A Twyman-Green interferometer was employed for phase-shift interferometry to study the residual stress. The residual stress declined as the temperature was reduced from 100 degrees C to 200 degrees C because the lower suboxides reduced the stress in the film. Above 200 degrees C, the film began to capture oxygen, so the residual stress rose. At 300 degrees C, the film was no longer amorphous as the anatase was observed by x-ray diffraction.     

Material and sensing properties of Pd-deposited WO3 thin films

The physicochemical and electrical properties of Pd-deposited WO3 thin films were investigated as a function of Pd thickness, annealing temperature, and operating temperature for application as a hydrogen gas sensor. WO3 thin films were deposited on an insulating material using a thermal evaporator. X-ray diffractometry (XRD), field emission scanning electron microscopy (FE-SEM), atomic force microscopy (AFM), and X-ray photoelectron spectroscopy (XPS) were used to evaluate the crystal structure, microstructure, surface roughness, and chemical property of the films, respectively. The deposited films grew into polycrystalline WO3 with a rhombohedral structure after annealing at 500 degrees C. Adding Pd had no effect on the crystallinity, but suppressed the growth of WO3 grains. The Pd was scattered as isolated small spherical particles of PdO2 on the WO3 thin film after annealing at 500 degrees C, while it agglomerated as irregular large particles or diffused into the WO3 after annealing at 600 degrees C. PdO2 reduction under H2 and reoxidation under air were dependent on both the Pd deposition thickness and annealing conditions. The WO3 thin film with a 2-nm-thick Pd deposit showed a good response and recovery to H2 gas at a 250 degrees C operating temperature.     

Annealing effects on structural and electrical properties of fluorinated amorphous carbon films deposited by plasma enhanced chemical vapor deposition

The annealing effects on the structural and electrical properties of fluorinated amorphous carbon (a-C:F) thin films prepared from C₆F₆ and Ar plasma are investigated in a N₂ environment at 200 mTorr. The a-C:F films deposited at room temperature are thermally stable up to 250 °C, but as the annealing temperature is increased beyond 300 °C, the fluorine incorporation in the film is reduced, and the degree of crosslinking and graphitization in the film appears to be enhanced. At the annealing temperature of 250 °C, the chemical bond structures of the film are unchanged noticeably, but the interface trapped charges between the film and the silicon substrate are reduced significantly. The increased annealing temperature contributes the decrease of both the interface charges and the effective charge density in the a-C:F film. Higher self-bias voltage is shown to reduce the charge density in the film.     

Thermoelectric properties of Sb2Te3 thin films by electron beam evaporation

This study applies the thermoelectric grains of Sb2Te3 on conductive glass to evaporate Sb2Te3 thin films by the electron beam evaporation method. Through experimental tests with different evaporation process parameters and film annealing conditions, thin films with better Seebeck coefficient, resistivity (p) and power fact (PF) can be obtained. Experimental results show that when thin films are annealed, their defects can be decreased accordingly, and carrier mobility can be enhanced to further elevate the conductivity of thin films. When the substrate temperature is set at 200 degrees C to fabricate Sb2Te3 thin films by the evaporation process and by annealing at 220 degrees C for 60 minutes, the Seebeck coefficient of Sb2Te3 thin films increase from 87.6 microV/K to 177.7 microV/K; resistivity falls from 6.21 m ohms-cm to 2.53 m ohms-cm and PF can achieve the maximum value of 1.24 10(-3) W/K2 m. Finally, this study attempts to add indium (In) to Sb2Te3 thin films. Indium has been successfully fabricated In3SbTe, thin films. This study also analyzes the effects of In on the thermoelectric properties of In3SbTe2 thin films.     

Effects of temperature on columnar microstructure and recrystallization of TiO2 film produced by ion-assisted deposition

Titanium oxide thin films were deposited by electron-beam evaporation with ion-beam-assisted deposition. The effect of the substrate temperature and annealing temperature on the columnar microstructure and recrystallization of titanium oxide was studied. The values of the refractive index varied from 2.26 to 2.4, indicating that the different substrate temperatures affected the film density. X-ray diffraction revealed that all films were amorphous as deposited. At annealing temperatures from 100 degrees C to 300 degrees C, only the anatase phase was formed. As the substrate temperature increased from 150 degrees C to 200 degrees C to 250 degrees C, the recrystallization temperature fell from 300 degrees C through 250 degrees C to 200 degrees C. Changing the substrate temperature resulted in the formation of various types of columnar microstructure, as determined by scanning-electron microscopy. Different columnar structures resulted in different surface morphologies, as measured by atomic-force microscopy.     

Electrical Properties of Sputter-deposited ZrO2-based Pt/ZrO2/Si Capacitors

Pt/ZrO2/Si sandwich structures where ZrO2 is deposited by radio frequency （r.f.） magnetron sputtering using a Zr target in an atmosphere of O2/Ar gas mixture, were fabricated and the effects of the O2/Ar flow ratio in the reactive sputtering process, the annealing temperature, the ZrO2 film thickness on the structure, the surface roughness of ZrO2 films and the electric properties of Pt/ZrO2/Si metal-oxide-semiconductor （MOS） capacitors were investigated. The optimum process parameters of the Pt/ZrO2/Si capacitor based on reactively sputtered-ZrO2 determined in such a way as the capacitance is maximized and the leakage current, the oxide charge, and the interface trap density are minimized that is the O2/Ar flow ratio of 1.5, the annealing temperature of 800℃, and the film thickness of 10 nm. Also the conduction mechanism in the Pt/ZrO2/Si capacitor has been discussed.     

The effect of annealing ambient on the characteristics of an indium-gallium-zinc oxide thin film transistor

In this study, the effects of different annealing conditions (air, O2, N2, vacuum) on the chemical and electrical characteristics of amorphous indium-gallium-zinc oxide (a-IGZO) thin film transistors (TFT) were investigated. The contact resistance and interface properties between the IGZO film and the gate dielectric improved after an annealing treatment. However, the chemical bonds in the IGZO bulk changed under various annealing atmospheres, which, in turn, altered the characteristics of the TFTs. The TFTs annealed in vacuum and N2 ambients exhibited undesired switching properties due to the high carrier concentration (>10(17) cm(-3)) of the IGZO active layer. In contrast, the IGZO TFTs annealed in air and oxygen ambients displayed clear transfer characteristics due to an adequately adjusted carrier concentration in the operating range of the TFT. Such an optimal carrier concentration arose through the stabilization of unstable chemical bonds in the IGZO film. With regard to device performance, the TFTs annealed in O2 and air exhibited saturation mobility values of 8.29 and 7.54 cm2/Vs, on-off ratios of 7.34 x 10(8) and 3.95 x 10(8), and subthreshold swing (SS) values of 0.23 and 0.19 V/decade, respectively. Therefore, proper annealing ambients contributed to internal modifications in the IGZO structure and led to an enhancement in the oxidation state of the metal. As a result, defects such as oxygen vacancies were eliminated. Oxygen annealing is thus effective for controlling the carrier concentration of the active layer, decreasing electron traps, and enhancing TFT performance.     

The tunable amorphous-crystalline transition temperature by indium-doping on GeTe thin films

Amorphous germanium telluride (GeTe) thin films were fabricated on SiO2/Si subtracts by RF sputtering at room temperature. The thickness of the as-deposited films is about 200 nm. Indium-doping on GeTe thin films were prepared by solution doping method. The GeTe thin films were dipped into InCl3 solution with 1 mol/L, 0.8 mol/L, 0.5 mol/L and 0.1 mol/L for an hour at 100 degrees C, respectively. Then the thin films were annealed at 200 degrees C for 10 min. The I-T measurements show that the amorphous-crystalline transition temperature of In-GeTe films is lower than that of the undoped thin films. XRD reveals the formation of rock salt structure after annealing at 280 degrees C. XPS indicates that In-Te bond which may correspond to In2Te3 exists in the doped thin film. The results of calculating density of states (DOS) show that the changes of electronic states are mainly located around Fermi energy level with the increasing Indium content. These results indicate that the transition temperature of GeTe films can be effectively tuned by solution process doping indium, which may be useful to decrease set current.     

Nickel nanorods produced by annealing composite oxide films

Nickel nanorods have been produced by annealing a dense composite film. The nanorods of 45-140 nm in lateral dimensions and 230-1400 nm in longitudinal dimensions were obtained by annealing NiO-YSZ composite films in H2 at 800 degrees C for one hour. The axis of the nanorods at the (220) direction was observed. The dense NiO-YSZ composite film was originally created by co-sputtering Ni and Zr-Y-Ce targets in Ar and O2 environment at 350 degrees C. Reduction of NiOx to Ni nuclei takes place on the surface of the film. The low crystallinity of the original composite film is believed to facilitate the NiO to grow into Ni nanorods on the discrete Ni seeds by diffusion.     

Deposition and Magnetic Properties of Fe3O4/Fe/Fe3O4Tri-layer Films

1. IntroductionIron oxides include several crystalline forms:hematite (or-FeZO3), magnetite (Fe3O4), maghemite(7-Felon) and wustite (FeO). They have interesting structural and magnetic properties, and are practically important in magnetic and electronic applications. The strongly ferrimagnetic 7--FeZO3 phaseearned much attention due to their applications asrecording media. The attainment of 7-FeZO3 involves complicated processing[1]. In our previousstudies, high coercivity 7-FeZO3, Fe3…     

Effect of annealing atmosphere (Ar vs. air) and temperature on the electrical and optical properties of spin-coated colloidal indium tin oxide films

Colloidal indium tin oxide (ITO) ~6 nm nanoparticles synthesized in-house were deposited by spin coating on fused silica substrates, resulting in high resistivity films due to the presence of passivating organics. These films were annealed at various temperatures ranging from 150 to 750 °C in air and argon atmospheres. The films are very transparent in the as-coated form, and they retain high transparency upon annealing, except the films annealed at 300 °C in argon, which became brown due to incomplete pyrolysis of the organics. Thermogravimetric analysis and Raman characterization showed that the removal of organics increases with an increase in the annealing temperature, and that this removal is more efficient in the oxidizing atmosphere of air, especially in the 300–450 °C temperature range than in Ar. Although ITO defect chemistry suggests that argon annealing should result in higher carrier concentration than air annealing, the faster removal of insulating organics upon annealing in air resulted in significantly lower film resistivity at intermediate annealing temperatures for films annealed in air than in Ar. At higher annealing temperatures, both Ar and air annealing, resulted in comparable film resistivities (the lowest achieved was ~10⁰ Ω cm).     

Nanostructure of pure iron anodically oxidized in borate buffer solution and annealed by infrared radiation

The behavior of oxide film on pure iron passivated in a borate buffer solution and subsequently radiated by infrared light (IR) was investigated in comparing to that by just IR annealing without passivation, and was evaluated by film structure, etc. The effect of thermal annealing over 250 degrees C was observed with gamma-Fe2O3 grain growth and sharp increase in surface roughness, film thickness and oxygen content. An ellipsometric parameter of tan psi was sensitively reflected by annealing effect, and tan psi curve had a shoulder at 150 degrees C for 5 min and a peak of tan psi was shifted from 350 nm to 450 nm in wavelength. This shift was also caused by the formation of gamma-Fe2O3, because the peak was also observed in tan psi of the bulk Fe2O3 family. Passivation effects at 800 mV prior to IR annealing on thickness and oxygen content changed at 150 degrees C, and decreased tan psi at 350 nm and excessive film growth over 250 degrees C, and increased oxygen content under 100 degrees C and surface roughness at 50-250 degrees C. The terrace width with atomic scale flatness was slightly increase by passivation prior to IR annealing at 50-250 degrees C, and the maximum terrace width reached larger than 10 nm by passivation and IR annealing at 100 degrees C for 30 min.     

N掺杂Cu2O薄膜的低温沉积及快速热退火研究

采用氧化亚铜(Cu_2O)陶瓷靶,利用射频磁控溅射沉积法在氮气和氩气的混合气氛下制备了N掺杂Cu_2O(Cu_2O∶N)薄膜,并在N_2气氛下对薄膜进行了快速热退火处理,研究了N_2流量和退火温度对Cu_2O∶N薄膜的生长行为、物相结构、表面形貌及光电性能的影响。结果显示,在衬底温度300℃、N_2流量12sccm条件下生长的薄膜为纯相Cu_2O薄膜;在N_2气氛下对预沉积薄膜进行快速热退火处理不影响薄膜的物相结构,薄膜的结晶质量随退火温度(450℃)的升高而显著改善;快速热退火处理能改善薄膜的结晶质量和缺陷,降低光生载流子的散射,增强载流子的传输,预沉积Cu_2O∶N薄膜经400℃退火处理后展示出较好的电性能,薄膜的霍尔迁移率(μ)为27.8cm~2·V~(-1)·s~(-1)、电阻率(ρ)为2.47×10~3Ω·cm。研究表明低温溅射沉积和快速热退火处理能有效改善Cu_2O∶N薄膜的光电性能。     

Effects of neutral particle beam on nano-crystalline silicon thin films, with application to thin film transistor backplane for flexible active matrix organic light emitting diodes

A novel deposition process for nano-crystalline silicon (nc-Si) thin films was developed using neutral beam assisted chemical vapor deposition (NBaCVD) technology for the application of the thin film transistor (TFT) backplane of flexible active matrix organic light emitting diode (AMOLED). During the formation of a nc-Si thin film, the energetic particles enhance nano-sized crystalline rather microcrystalline Si in thin films. Neutral Particle Beam (NPB) affects the crystallinity in two ways: (1) NPB energy enhances nano-crystallinity through kinetic energy transfer & chemical annealing, and (2) heavier NPB (such as Ar) induces damage & amorphization through energetic particle impinging. Nc-Si thin film properties effectively can be changed by the reflector bias. As increase of NPB energy limits growing the crystalline, the performance of TFT supports this NPB behavior. The results of nc-Si TFT by NBaCVD demonstrate the technical potentials of neutral beam based processes for achieving high stability and reduced leakage in TFT backplanes for AMOLEDs.     

Investigation of thermal annealing of optical properties and residual stress of ion-beam-assisted TiO2 thin films with different substrate temperatures

Titanium oxide films were prepared by ion-beam-assisted deposition on glass substrates at various substrate temperatures. The effect of the temperature of thermal annealing from 100 degrees C to 300 degrees C on the optical properties and residual stress was investigated. The influence on the stoichiometry and residual stress of titanium oxides deposited at different substrate temperature was discussed. The residual-stress was minimum and the extinction coefficient was maximum at an annealing temperature of 200 degrees C with a substrate temperature of 150 degrees C. However, when the substrate temperature was increased to 200 degrees C and 250 degrees C, the residual stress was minimum and the extinction coefficient was maximum at an annealing temperature of 250 degrees C. The spectra of x-ray photoelectron spectroscopy reveal that the films lost oxygen and slowly generated lower suboxides at the annealing temperature at which the residual stress was minimum and the extinction coefficient was maximum. As the annealing temperature increased above the temperature at minimum stress, the lower suboxides began to capture oxygen and form stable oxides. TiO2 films deposited at substrate temperatures of 200 degrees C and 250 degrees C were more stable than films deposited at 150 degrees C.     

Sputtering ZnO films on langasite and its SAW properties

C-axis-oriented ZnO films were sputtered on Langasite substrate (LGS, La(3)Ga(5)SiO(14)). The crystalline structure of the films was determined by grazing incident angle X-ray diffraction, the surface microstructure of films was investigated by scanning electron microscopy and atomic force microscopy, the atom composition ratio O/Zn of films was determined by energy dispersive X-ray spectroscopy, and the resistivity of films was determined by the four-point probe instrument. The measurement results showed those films prepared were all polycrystalline hexagonal ZnO films. By analyzing the microstructure of the ZnO films, those prepared at the oxygen flow rate (O(2)/O(2)+Ar) of 20%, the RF power of 200 W, and the substrate temperature of 200 degrees C had the best performance: highly c-axis-oriented microstructures, dense surface morphology, and the atom composition ratio 1.02. The measured scattering parameters of the SAW device fabricated on the composite substrate (ZnO/LGS) with film thickness 1.76 microm showed an average shifted velocity around 2741 m/s at 57.1 MHz and a electromagnetic coupling coefficient greater than 1%.     

Dependence of electrical properties on thermal temperature in nanocrystalline SnO2 thin films

Nanocrystalline SnO2 thin films were prepared by pulsed laser deposition techniques on clean glass substrates, and the films were then annealed for 30 min from 50 to 550 degrees C with a step of 50 degrees C, respectively. The investigation of X-ray diffraction confirmed that the various SnO2 thin films were consisted of nanoparticles with average grain size in the range of 23.7-28.9 nm. Root-mean-square surface roughness of the as-prepared SnO2 thin film was measured to be 25.6 nm which decreases to 16.2 nm with thermal annealing. Electrical resistivity and refractive index were measured as a function of annealing temperature, and found to lie between 1.24 to 1.45 momega-cm, and 1.502 to 1.349, respectively. The results indicate that nearly opposite actions to root-mean-square surface roughness and electrical resistivity make a unique performance with thermal annealing temperature. The post annealing shows greater tendency to affect the structural and electrical properties of SnO2 thin films which composed of nanoparticles.     

Investigation of copper layers deposited by CVD using Cu(I)hfac(TMVS) precursor

Chemical vapour deposition (CVD) of copper on titanium-coated substrates was performed in a stainless steel reactor using copper(I) hexafluoroacetylacetonate trimethylvinylsilane (Cu(I)hfac(TMVS)) as a precursor and nitrogen (N₂) as carrier gas. Film resistivity, film composition and surface morphology were studied in relation to deposition temperature, process pressure and process gas flow ratio. The lowest resistivity value obtained was around 2 μΩcm. In addition, cross-sectional examination of the copper films, using a LEO SEM imaging system, indicated increased film porosity at higher deposition temperatures. An optimum carrier gas flow rate was determined: higher carrier gas flow rates caused excessive dilution of the copper precursor, whilst lower carrier gas flow rates weakened the transport of the copper precursor to the substrate. XRD data revealed formation of copper oxide (Cu₂O) if annealing temperatures exceeded 450∘C for a period of 30 min.FIB/TEM imaging revealed that CVD copper offers better conformality and viafilling than PVD copper in trenches 0.25 μm wide and 0.5 μm deep. CVD copper layers, passivated by a spin-on-glass dielectric, were shown to have reduced surface migration of copper atoms, compared to unpassivated layers. Copper films with a predominantly (111) orientation were found to exhibit a longer electromigration lifetime than copper films with mixed (111) and (200) orientations.