Optoelectronic properties of CdTe/Si heterojunction prepared by pulsed Nd:YAG-laser deposition technique

The present study is on the optoelectronic properties of isotype CdTe/c-Si heterojunction photodetector made by deposition of CdTe by pulsed laser deposition (PLD) technique on clean monocrystalline Si. Optical, electrical and structural properties of grown CdTe film were investigated. The optical data show that the optical band gap of CdTe was around 1.45 eV at 300 K. The CdTe/Si junction exhibits fair diode rectification and the soft breakdown occurred at V_B>9 V. Dark and illuminated I–V characteristics of the CdTe/Si photodetector are examined at room temperature. The photodetector showed good photosensitivity in the visible and near-infrared regions with a value as high as 0.5A/W at 950 nm.     

Characterization of AZO/p-Si heterojunction prepared by DC magnetron sputtering

Al-doped ZnO (AZO) film was deposited by direct-current (DC) magnetron sputtering on p-Si (1 0 0) wafer to fabricate Al-doped n-ZnO/p-Si heterojunctions. The microstructural, optical and electrical properties of the AZO film were characterized by XRD, SEM; UV–vis spectrophotometer; four-point probe and Hall effect measurement, respectively. Results show that the AZO film is of good quality. The electrical junction properties were investigated by I–V measurement, which reveals that the heterojunction shows rectifying behavior under a dark condition. The ideality factor and the saturation current of this diode are 20.1 and 1.19×10⁻⁴ A, respectively. The value of I_F/I_R (I_F and I_R stand for forward and reverse current, respectively) at 5 V is found to be as high as 19.7. It shows fairly good rectifying behavior, indicating formation of a diode between AZO and p-Si. High photocurrent is obtained under a reverse bias when the crystalline quality of AZO film is good enough to transmit light into p-Si.     

High photosensitivity with enhanced photoelectrical contribution in hybrid nanocomposite flexible UV photodetector

To devise a reliable strategy to develop an ultraviolet (UV) sensitive hybrid photodetector, plasma process is utilized as a single step method for production of large area nanocomposite films based on plasma polymerized aniline–titanium dioxide (PPani–TiO₂). The synthesis of PPani–TiO₂ nanocomposite films are made using reactive magnetron sputtering in combination with plasma polymerization. The deposited PPani–TiO₂ nanocomposite films are characterized and discussed in terms of structural, optical and electrochemical properties. A hybrid flexible nanostructured UV photodetector is constructed from PPani–TiO₂ nanocomposite and its optoelectronic properties are evaluated which exhibits a greatly enhanced photosensitivity resulting in high photoconductive gain (G = 4.56 × 10⁴) and high responsivity (R = 9.36 × 10³ AW⁻¹) under UV illumination of 254 nm. The flexible devices are successfully operated under bending up to 170° (bending radius, R = 8 mm) and showed a good folding strength and stability. The proposed plasma based method provides a green technology where the self-assembly of molecules, that is, the spontaneous association of atomic or molecular building blocks under plasma environment, emerge as a successful strategy to form well-defined structural and morphological units of nanometer dimensions.     

Varying load resistances of zinc oxide ultraviolet photodetectors: A simple method to change responsivity

The metal–semiconductor–metal structured ultraviolet photodetector has been fabricated based on Zinc oxide thin films grown by a radio frequency magnetron sputtering technique, and Au is used as the contact metal. The dark current of the photodetector is as low as 1.17 nA at 3 V bias in the current–voltage measurements. The photoresponse properties are characterized by varying the load resistors (1 kΩ, 10 kΩ, 100 kΩ, 1 MΩ and 22 MΩ), and the corresponding responsivities are 2.69, 1.27, 0.25, 0.02 and 7.20×10⁻⁴ A/W. It can be found that the responsivity of the photodetector is enhanced with the load resistors decreasing; however, the signal-to-noise ratio decreases. It is demonstrated that the best method to make the ZnO-based photodetector suitable for different application environments is with the appropriate load resistance.     

Source-drain resistance characteristics of back-channel etched amorphous InGaZnO thin film transistors with TiO2:Nb protective layer

This work investigates the source-drain (S-D) parasitic resistance (R_SD) characteristics of the back-channel-etched (BCE) a-IGZO TFTs with ultra-thin Nb doped TiO₂ (TNO) protective layer. It is shown that R_SD is strongly related to the thickness of the TNO protective layer although the electrical performances of the BCE a-IGZO TFTs with different TNO thickness are similar to each other. The BCE TFT with 3 nm TNO shows an unusually large R_SD value (300 Ω cm). It is suggested that a ~3 nm TNO depletion layer should be formed at the TNO/a-IGZO interface in the S-D region in this case. In addition, R_SD of the BCE TFTs with 1 and 5 nm TNO is 11 and 26 Ω cm, respectively. The low R_SD of these two devices is caused by much thinner TNO depletion layers in the S-D region. Besides, a moderate R_SD of 53 Ω cm for the S-D lift-off device can be ascribed to a lower a-IGZO band bending at the Mo/a-IGZO interface than that of the BCE devices at the TNO/a-IGZO interface.     

High-performing transparent photodetectors based on Schottky contacts

Transparent UV-photodetectors exhibiting very high responsivity and fast operation are discussed. Schottky contact photoelectric devices utilizing wide band gap TiO₂ absorber layer were evaluated for their performances as UV-photodetectors. Three different work function metals Cu, Mo and Ni were used to realize Schottky barrier with TiO₂. Ni Schottky contacts were found to be most suitable to fabricate high responsivity (2.034 A/W) photodetector with faster rise time (0.14 ms) and wide linear dynamic range (128 dB) operating at small applied reverse bias of −1 V. However, higher barrier height in the case of Mo/TiO₂ interface resulted in lowest dark current density of the value 2.21×10⁻⁸ A/cm² with quick fall time of 0.52 ms. The modulation of the barrier height would provide a route for designing fast and high responsive Schottky photodetector with broad linear dynamic range performance.     

A low voltage SANOS nonvolatile semiconductor memory (NVSM) device

In this paper, we present a new Polysilicon–Aluminum Oxide–Nitride–Oxide–Silicon (SANOS) device structure suitable for future nonvolatile semiconductor memories. Replacing SiO₂ with a high-K material, Al₂O₃ (K_f = 9) as the top blocking layer of the conventional SONOS device increases the electric field across the tunnel oxide, while reducing the electric field across the blocking layer with its dielectric constant during write and erase operations. Therefore, this new device can achieve lower programming voltages and faster programming speed than the conventional SONOS device. We have fabricated SANOS capacitors with 2 nm tunnel oxide, 5 nm silicon nitride and 8 nm aluminum oxide and studied the programming speed and charge retention characteristics of the new devices. These new SANOS devices achieve a 2 V reduction in the programming voltages with 2.1 V initial memory window.     

Charge injection in metal/organic/metal structures with ZnO:Al/organic interface modified by Zn1−xMgxO:Al layer

Aluminum-doped zinc oxide (ZnO:Al, AZO) electrodes were covered with very thin (∼6 nm) Zn_1−xMg_xO:Al (AMZO) layers grown by atomic layer deposition. They were tested as hole blocking/electron injecting contacts to organic semiconductors. Depending on the ALD growth conditions, the magnesium content at the film surface varied from x = 0 to x = 0.6. Magnesium was present only at the ZnO:Al surface and subsurface regions and did not diffuse into deeper parts of the layer. The work function of the AZO/AMZO (x = 0.3) film was 3.4 eV (based on the ultraviolet photoelectron spectroscopy). To investigate carrier injection properties of such contacts, single layer organic structures with either pentacene or 2,4-bis[4-(N,N-diisobutylamino)-2,6-dihydroxyphenyl] squaraine layers were prepared. Deposition of the AMZO layers with x = 0.3 resulted in a decrease of the reverse currents by 1–2 orders of magnitude and an improvement of the diode rectification. The AMZO layer improved hole blocking/electron injecting properties of the AZO electrodes. The analysis of the current-voltage characteristics by a differential approach revealed a richer injection and recombination mechanisms in the structures containing the additional AMZO layer. Among those mechanisms, monomolecular, bimolecular and superhigh injection were identified.     

Silicon/organic hybrid heterojunction infrared photodetector operating in the telecom regime

The authors report on the fabrication of a silicon/organic heterojunction based IR photodetector. It is demonstrated that an Al/p-Si/perylene-derivative/Al heterostructure exhibits a photovoltaic effect up to 2.7 μm (0.46 eV), a value significantly lower than the bandgap of either material. Although the devices are not optimized, at room temperature a rise time of 300 ns, a responsivity of ≈0.2 mA/W with a specific detectivity of D¹ ≈ 7 × 10⁷ Jones at 1.55 μm is found. The achieved responsivity is two orders of magnitude higher compared to our previous efforts [1], [2]. It will be outlined that the photocurrent originates from an absorption mechanism involving excitation of an electron from the Si valence band into the extended LUMO state in the perylene-derivative, with possible participation of intermediate localized surface state in the organic material.The non-invasive deposition of the organic interlayer onto the Si results in compatibility with the CMOS process, making the presented approach a potential alternative to all inorganic device concepts.     

The effect of oxide layer thickness on the quantification of 1.5 MeV γ–radiation induced interface traps in the Ag/SiO2/Si MOS devices

This work presents the effect of varied thickness of oxide layer and radiation dose on electrical characteristics of Ag/SiO₂/Si MOS devices irradiated by 1.5 MeV γ–radiations of varied doses. SiO₂ layers of 50, 100, 150 and 200 nm thickness were grown on Si substrates using dry oxidation and exposed to radiation doses of 1, 10 and 100 kGy. The exposure to radiation resulted in generation of fixed charge centers and interface traps in the SiO₂ and at the Si/SiO₂ interface. Capacitance-conductance-voltage (C-G-V) and capacitance-conductance-frequency (C-G-f) measurements were performed at room temperature for all MOS devices to quantify the active traps and their lifetimes. It is shown that accumulation and minimum capacitances decreased as the thickness of SiO₂ layer increased. For the unexposed MOS devices, the flat band voltage V_FB decreased at a rate of −0.12 V/nm, density of active traps increased by 4.5 times and depletion capacitance C_DP, increased by 2.5 times with the increase of oxide layer thickness from 50 to 200 nm. The density of active traps showed strong dependence on the frequency of the applied signal and the thickness of the oxide layer. The MOS device with 200 nm thick oxide layer irradiated with 100 kGy showed density of active interface traps was high at 50 kHz and was 3.6×10¹⁰ eV⁻¹ cm⁻². The relaxation time of the interface traps also increased with the exposure of γ–radiation and reached to 9.8 µs at 32 kHz in 200 nm thick oxide MOS device exposed with a dose of 100 kGy. It was inferred that this was due to formation of continuum energy states within the band gap and activation of these defects depended on the thickness of oxide layer, applied reverse bias and the working frequency. The present study highlighted the role of thickness of oxide layer in radiation hard environments and that only at high frequency, radiation induced traps remain passivated due to long relaxation times.     

Fabrication of high-speed InP/InGaAs/InP DHBT with a new self-aligned metallization technique for reduced base resistance

A new self-aligned emitter–base metallization (SAEBM) technique with wet etch is developed for high-speed heterojunction bipolar transistors (HBTs) by reducing extrinsic base resistance. After mesa etch of the base layer using a photo-resist mask, the base and emitter metals are evaporated simultaneously to reduce the emitter–base gap (S_EB) and base gap resistance (R_GAP). The InP/InGaAs/InP double heterojunction bipolar transistor (DHBT) fabricated using the technique has a reduced R_GAP, from 16.48 Ω to 4.62 Ω comparing with the DHBT fabricated by conventional self-aligned base metallization (SABM) process. Furthermore, we adopt a novel collector undercut technique using selective etching nature of InP and InGaAs to reduce collector–base capacitance (C_CB). Due to the reduced R_GAP, the maximum oscillation frequency (f_max) for a 0.5 μm-emitter HBT is improved from 205 GHz to 295 GHz, while the cutoff frequency (f_T) is maintained at around 300 GHz.     

Analysis of nanometer-scale InGaAs/InAs/InGaAs composite channel MOSFETs using high-K dielectrics for high speed applications

The outstanding electron transport properties of InGaAs and InAs semiconductor materials, makes them attractive candidates for future nano-scale CMOS. In this paper, the ON state and OFF state performance of 30 nm gate length InGaAs/InAs/InGaAs buried composite channel MOSFETs using various high-K dielectric materials is analyzed using Synopsys TCAD tool. The device features a composite channel to enhance the mobility, an InP spacer layer to minimize the defect density and a heavily doped multilayer cap. The simulation results show that MOSFETs with Al₂O₃/ZrO₂ bilayer gate oxide exhibits higher gm/I_D ratio and lower sub threshold swing than with the other dielectric materials. The measured values of threshold voltage (V_T), on resistance (R_ON) and DIBL for Lg = 30 nm In_0.53Ga_0.47As/InAs/In_0.53Ga_0.47As composite channel MOSFET having Al₂O₃/ZrO₂ (EOT = 1.2 nm) bilayer dielectric as gate oxide are 0.17 V, 290 Ω-µm, and 65 mV/V respectively. The device displays a transconductance of 2 mS/µm.     

Fabrication,temperature dependent current-voltage characteristics and photoresponse properties of Au/α-PbO2/p-Si/Al heterojunction photodiode

Thin film of lead dioxide, α-PbO₂, has been grown by thermal evaporation technique on the single crystal of p-Si substrate and heterojunction photodiode, Au/α-PbO₂/p-Si/Al, was fabricated. The current-voltage characteristics of the diode have been studied in the temperature ranged from 303 to 373 K and the voltage applied during measurements varied from −1 to 1.5 V. It was found from the (I-V) characteristics of the diode that the conduction mechanisms in the forward bias direction are controlled by the thermionic emission at bias potential ≤0.7 V followed by single trap space charge limited current (SCLC) conduction in the voltage range >0.7 V. The capacitance-voltage characteristics of the device were studied at room temperature in dark condition and it has been shown that the diode is abrupt junction. The carrier concentration on both sides of the depletion layer has been determined. Energy band diagram for α-PbO₂/p-Si device was constructed. The device under illumination with light of intensity 20 W/m² gives acceptable values of photoresponse parameters such as photosensitivity and photoconductivity. The presented photodiode parameters exhibit the typical photosensor applications with reproducibility phenomenon.     

HCS degradation of 5 nm oxide high-voltage PLDMOS

Hot carrier (HC) injection, inducing drain and gate leakage current increase in 5 nm oxide p-channel LDMOS transistors, is investigated. Devices with two different drain implants are studied. At low gate voltage (V_GS) and high drain voltage (V_DS), reduction of the ON-resistance (R_ON) is observed. At stress times at which R_ON almost reaches its constant level, an increase of the drain leakage in OFF state (V_DS = −60 V, V_GS = 0 V) is observed. Longer stress time leads to increased gate leakage and in some cases oxide breakdown. In contrast to what was reported for devices with 25 nm gate oxide thickness, the threshold voltage of 5 nm gate oxide PLDMOS transistors does not drift. The experimental data can be fully explained by hot carrier injection and the oxide damage can be explained by two different and competing degradation mechanisms. By combining experimental data and TCAD simulations we are further capable to locate the hot spot of maximum oxide damage in the accumulation (Acc) region of the PLDMOS.     

Effect of fullerene doping on the electrical properties of P3HT/PCBM layers

Poly (3-hexylthiophene-2, 5-diyl) (P3HT) and its blend with Phenyl-C₆₁-Butyric acid-Methyl-Ester (PCBM) and fullerene (C₆₀) thin films were prepared and their electrical properties for memory applications were studied. Due to doping, a sharp decrease in the resistance for a P3HT:PCBM:C₆₀ device was observed at around 70 °C which makes it useful for thermal switching applications. Addition of C₆₀ to P3HT:PCBM blend gave a high value for R_RESET/R_SET in thermal switching. For bias switching, threshold voltage reduces to 1.4 V from 25 V with the addition of C₆₀ to P3HT layer.     

Electrical properties of Π-conjugated Fe-TPP molecular solar cell device

A heterojunction device of Au/Fe-TPP/n-Si/Al was assembled by thermally evaporated deposition. The dark current density–voltage characteristics of device were investigated. Results showed a rectification behavior. Measurements of thermo electric power confirm that Fe-TPP thin film behaves as p-type semiconductors. Electronic parameters such as barrier height, diode ideality factor, series resistance, shunt resistance were found to be 0.83 eV, 1.5, 7 × 10⁵ Ω and 2 × 10¹⁰ Ω, respectively. The Au/Fe-TPP/n-Si/Al device indicates a photovoltaic behavior with an open circuit voltage V_oc of 0.52 V, short circuit current I_sc of 2.22 × 10^?6 A, fill factor FF of 0.49 and conversion efficiency 1.13% under white light illumination power 50 W/m².     

Characterization of an Au/n-Si photovoltaic structure with an organic thin film

We demonstrate that a copper(II) organic complex can control the electrical characteristics of conventional Au/n-Si metal–semiconductor (MS) contacts. We investigated the electronic and photovoltaic properties of a Cu(II) complex/n-Si heterojunction diode. The ideality factor n and barrier height Φ_b of the diode were 2.22 and 0.736 eV, respectively. An ideality factor greater than unity indicates that the diode exhibits non-ideal current–voltage behavior. This behavior results from the effect of series resistance and the presence of an interfacial layer. The series resistance and barrier height determined using Norde’s method were 6.7 kΩ and 0.77 eV, respectively. The device showed photovoltaic behavior, with a maximum open-circuit voltage of 0.24 V and a short circuit current of 1.7 μA under light of 8 mW/cm².     

Achieving high sensitivity in single organic submicrometer ribbon based photodetector through surface engineering

The performance of the single organic submicrometer ribbon based photodetector has been improved by one order of magnitude by combining a better crystalline structure with proper surface engineering, such as coating a dielectric layer PMMA or PS between the substrate and the organic semiconductor. The photoconductivity gain is as much as 1.3 × 10⁴, the responsivity is about 4372 A W^?1 at the field of about 2 × 10⁶ V m^?1, and the highest on/off ratio reaches 10⁴. The extremely high gain is attributed to the high mobility and the long photo carrier’s lifetime induced by the dielectric layer.     

Transparent conductor-embedding high-sensitive germanium NIR photodetector

An extreme NIR photodetector was achieved by using transparent conducting layers on a small energy bandgap germanium (Ge) semiconductor. The optically-transparent and electrically-conducting layers (AZO and ITO) were sequentially coated on a Ge substrate by a large-scale available sputtering method, which spontaneously forms a Schottky junction (ITO/AZO/Ge) without an intentional doping process. The interface effect between AZO and Ge materials was studied at different depth levels from the surface using XPS and UPS measurements. The energy bands of AZO were bent at the interface to make a rectifying junction with Ge. The band bending at the interface is one of the important characteristics of Schottky photodiodes. The dark I-V profile of the AZO/Ge device showed rectification ratio of 22.36 along with the lowest reverse saturation current of 53.6  μA. The leakage current was perfectly suppressed due to the passivation effect of GeO_x interfacial layer. At low frequency region, the Mott-Schottky analysis measured the barrier height as 0.38 eV which was correlated well with the value derived from the simulated band offset using SCAPS. This functionally designed transparent-embedding photodetector showed the excellent photoresponses for NIR regions. We propose a promising approach for highly-sensitive NIR photodetector by using a small energy bandgap Ge semiconductor with the transparent conducting layer.     

Highly efficient green phosphorescent organic light emitting diodes with simple structure

A series of simple structures is investigated for realization of the highly efficient green phosphorescent organic light emitting diodes with relatively low voltage operation. All the devices were fabricated with mixed host system by using 1,1-bis[(di-4-tolylamino)phenyl]cyclohexane (TAPC) and 1,3,5-tri(p-pyrid-3-yl-phenyl)benzene (TpPyPB) which were known to be hole and electron type host materials due to their great hole and electron mobilities [μ_h(TAPC): 1 × 10^?2 cm²/V s and μ_e(TpPyPB): 7.9 × 10^?3 cm²/V s] [1]. The optimized device with thin TAPC (5–10 nm) as an anode buffer layer showed relatively high current and power efficiency with low roll-off characteristic up to 10,000 cd/m². The performances of the devices; with buffer layer were compared to those of simple devices with single layer and three layers. Very interestingly, the double layer device with TAPC buffer layer showed better current and power efficiency behavior compared to that of three layer device with both hole and electron buffer layers (TAPC, TpPyPB, respectively).