Transient Thermal Stress Analysis of Orthotropic Functionally Graded Materials with a Crack

The transient thermal fracture problem of a crack (perpendicular to the gradient direction) in a graded orthotropic strip is investigated. Most of the materials properties are assumed to vary as an exponential function of thickness direction. The transient two-dimensional temperature problem is analyzed by the methods of Laplace and Fourier transformations. A system of singular integral equations are obtained and solved numerically. Numerical results are figured out to show the variation of the temperature on the crack faces and extended line and stress intensity factors for different material parameters with dimensionless time.     

Thermal Stress Analysis of an Embedded Crack in a Graded Orthotropic Coating-Substrate Structure

An analysis of a coupled plane thermoelastic problem for a graded orthotropic coating-substrate structure is performed under thermomechanical loading conditions. The crack direction is parallel to the free surface. Applying the superposition principle and Fourier integral transform, the heat conduction and plane elasticity equations lends themselves to the derivation of two sets of Cauchy-type singular integral equations. The thermal stress intensity factors are defined and evaluated. In the numerical results, the effects of the orthotropy parameters, thermoelastic non-homogeneity parameters, and dimensionless thermal resistance on the temperature distribution and the thermal stress intensity factors (TSIFs) are studied. The obtained results can be used to design graded orthotropic coating-substrate structures under thermomechanical loading.     

An Annular Crack in a Functionally Graded Piezoelectric Strip Under Thermoelectric Loadings

A thermoelectroelastic problem of a functionally graded piezoelectric material (FGPM) strip containing an annular crack is solved. It is assumed that the thermoelectroelastic properties of the strip vary continuously along the thickness of the strip, and that the strip is under the thermoelectric loadings. The crack faces are supposed to be insulated thermally and electrically. Using integral transform techniques, the problem is reduced to that of solving a singular integral equation and a system of singular integral equations. Numerical calculations are carried out, and the variations of the stress and electric displacement intensity factors are plotted against the geometric parameters for some values of the material non-homogeneity parameters.     

The effect of a stiffener on a cracked plate under bending

In this study the problem of a stiffened plate containing a through-crack under uniform bending load is analyzed. The problem is formulated for a specially orthotropic material by using Reissner's plate theory. By using the Fourier integral transform technique the problem is reduced to a singular integral equation. This singular integral equation is then solved numerically by using Gȧuss-Chebyshev and Gauss-Jacobi quadrature formulas. The special case of the problem in which the crack tip terminates at the stiffener is also analyzed in order to assess the crack arrest effectiveness of the stiffener. The asymptotic stress state near the crack tip terminating at the stiffener is examined, and normalized Mode I stress intensity factors are tabulated. The results also include the effect of Poisson's ratio, stiffness constants and material orthotropy for specially orthotropic materials on the stress intensity factors.     

Thermal Intensity Factors for a Parallel Crack in a Functionally Graded Piezoelectric Strip

In this paper, the mixed-mode thermoelectromechanical fracture problem for a functionally graded piezoelectric material (FGPM) strip is considered. It is assumed that the thermoelectroelastic properties of the strip vary continuously along the thickness of the strip, and that the strip is under the thermoelectric loadings. The crack faces are supposed to be insulated thermally and electrically. The problem is formulated in terms of a system of singular integral equations. The stress and electric displacement intensity factors are presented for various values of dimensionless parameters representing the crack size, the crack location, and the material nonhomogeneity.     

THERMAL STRESS ANALYSIS IN THERMOPIEZOELASTIC STRIP WITH AN EDGE CRACK

The analysis of thermal stresses becomes important when the piezoelectric material has to be operated in either extremely cold or hot temperature environments. Hence, it is essential to know the interaction of mechanical defects with temperature changes. This investigation is concerned with a strip problem of transversely isotropic thermopiezoelastic material containing an edge crack under partial thermal and electric loading conditions. Thermopiezoelastic stresses are analyzed by introducing potential functions and Fourier transforms. The problem reduces to solving a singular integral equation, and the singular integral equation is solved. Numerical calculations of the thermal stress intensity factors are carried out for a cadmium selenide material.     

EDGE-CRACKED PLATE WITH ONE FREE AND ONE CONSTRAINED BOUNDARY SUBJECTED TO SUDDEN CONVECTIVE COOLING

The transient thermal stress edge crack problem for an elastic strip with free and fully constrained boundaries is considered. The plate is suddenly subjected to convective cooling on the face containing the edge crack while the other face is insulated. The solution of the problem is obtained by using the superposition technique results in a singular integral equation that is solved numerically. The results of the transient temperature and thermal stress distributions in the uncracked strip are presented. Also, numerical results are obtained for the stress-intensity factor in terms of the Fourier number, crack length, and different values of the Biot number.     

Transient thermoelectroelastic response of a piezoelectric material strip with two parallel cracks in arbitrary positions

This work is concerned with the thermoelectromechanical fracture behavior of two parallel cracks in arbitrary positions of a piezoelectric material strip under thermal shock loading. The crack faces are supposed to be insulated thermally and electrically. By using both the Laplace transform and the Fourier transform, the thermal and electromechanical problems are reduced to two systems of singular integral equations. The singular integral equations are solved numerically, and a numerical method is then employed to obtain the time-dependent solutions by way of a Laplace inversion technique. The intensity factors versus time for various geometric parameters are calculated and presented in graphical forms. The temperature, stress and electric displacement distributions in a transient state are also included.     

Transient Response of a Cracked Piezoelectric Strip Under Thermoelectric Loading

In this study, the theoretical analysis of a transient piezothermoelastic problem is developed for a piezoelectric strip with a parallel crack under static electric loading and thermal shock loading conditions. The crack faces are supposed to be insulated thermally and electrically. By using both the Laplace transform and the Fourier transform, the thermal and electromechanical problems are reduced to a system of singular integral equations, respectively, which are solved numerically. Some numerical results for the temperature change, the stress and electric displacement distributions, and the energy density factor as well as the stress and electric displacement intensity factors in a transient state are shown in figures.     

Transient Thermoelectroelastic Response of a Functionally Graded Piezoelectric Strip with Two Parallel Axisymmetric Cracks

In this article, the problem of two parallel axisymmetric cracks in a plate of a functionally graded piezoelectric material (FGPM) strip is analyzed under transient thermal loading conditions. It is assumed that the thermoelectroelastic properties of the strip vary continuously along the thickness of the strip, and that the crack faces are supposed to be insulated thermally and electrically. By using both the Laplace and Hankel transforms, the thermal and electromechanical problems are reduced to two systems of singular integral equations. The singular integral equations are solved numerically, and a numerical method is then employed to obtain the time dependent solutions by way of a Laplace inversion technique. Systematic numerical calculations are carried out, and the field intensity factors versus time are presented for various values of dimensionless parameters representing the crack geometry and the material non-homogeneity.     

THERMAL SHOCK FRACTURE IN AN EDGE-CRACKED PLATE

In this paper the transient thermal stress problem for an elastic strip with an edge crack is investigated. The elastic medium is assumed to be insulated on one face and cooled by surface convection on the face contaning the edge crack. Using the principle of superposition, the formulation results in a mixed boundary value problem, with the thermal stresses calculated from the thermoelasticity solution for an uncracked strip utilized as the necessary crack surface tractions. The resulting singular integral equation is of a well-known type and is solved numerically. In this paper, inertia effects are assumed negligible and possible temperature dependence of thermoelastic constants is not considered. The numerical results presented, include the stress intensity factor as a function of nondimensional time (Fourier number) and crack length, for various values of the dimensionless Biot number. The temperature distribution and the thermal stresses in the uncracked strip are also included. The time lag, which occurs between the time at which the stress on the surface of the strip is a maximum and the time when a maximum occurs in the stress intensity factor, is clearly shown to be a function of the Biot number for any given ratio of crack length to strip thickness. A result of particular interest is the degree with which the maximum stress intensity factor decreases, as a function of crack length, for decreasing values of the Biot number.     

Thermoelectromechanical Response of a Center Crack in a Symmetrical Functionally Graded Piezoelectric Strip

The thermoelectromechanical fracture problem for a symmetrical functionally graded piezoelectric strip containing a center crack parallel to the free boundaries is considered in this study. It is assumed that the thermoelectroelastic properties of the medium vary continuously in the thickness direction, and that the strip is under thermomechanical loadings. The crack faces are supposed to be insulated thermally and electrically. By using the Fourier transform, the thermal and electromechanical problems are reduced to singular integral equations, respectively, which are solved numerically. Numerical calculations are carried out, and detailed results are presented to illustrate the influence of the crack length and the material nonhomogeneity on the temperature-stress distributions and the stress intensity factor.     

Two Parallel Cracks in Arbitrary Positions of a Piezoelectric Material Strip Under Thermo-Electric Loadings

In this article, thermo-electro-elastic fracture behavior of two parallel cracks in arbitrary positions of a piezoelectric material strip under thermo-electric loadings is considered. The crack faces are assumed to be insulated thermally and electrically. Fourier transform techniques are used to reduce the mixed boundary value problems to two systems of singular integral equations. Numerical calculations are carried out, and detailed results are presented to illustrate the influence of the geometric parameters on the stress and electric displacement intensity factors. The results for the temperature and electro-elastic fields are also included.     

Infinite Row of Parallel Cracks in a Functionally Graded Piezoelectric Material Strip Under Mechanical and Transient Thermal Loading Conditions

In this paper, the problem of an infinite row of parallel cracks in a functionally graded piezoelectric material strip (FGPM strip) is analyzed under static mechanical and transient thermal loading conditions. The crack faces are supposed to be completely insulated. Material properties are assumed to be exponentially dependent on the distance from the bottom surface. By using the Laplace and Fourier transforms, the thermoelectromechanical problem is reduced to a singular integral equation, which is solved numerically. The stress intensity factors for both the embedded and edge cracks are computed. The results for the crack contact problem are also included.     

A Surface Crack in a Graded Coating Bonded to a Homogeneous Substrate under Transient Thermal Loading

The elastodynamic problem of a surface crack in a graded coating bonded to a homogeneous substrate under transient heat flux is considered. The coating is graded along the thickness direction and modelled as a nonhomogeneous medium with an isotropic stress-strain law. The problem is solved under the assumption of plane strain or generalized plane stress conditions. The resulting crack problem is of mode I because the orientations of the crack axis, the material gradient and the heat-flux are all parallel. The equivalent crack surface tractions are first obtained and substituted in the plane elasticity equations which are then converted analytically using appropriate integral transforms into a singular integral equation. The resulting equation is solved numerically using orthogonal Jacobi polynomials to yield the Mode I stress intensity factor. The main objective of the research is to study the effect of the layer thickness and nonhomogeneity parameters on the dynamic crack tip stress intensity factor for the purpose of gaining better understanding on the behavior of graded coatings under transient thermal loading.     

An axisymmetric crack in a functionally graded thermal barrier coating bonded to a homogeneous elastic substrate under transient thermal loading

Abstract

In this paper, the fracture problem of an axisymmetric crack in a functionally graded thermal barrier coating (FGTBC) bonded to a homogeneous substrate is considered. The problem is solved for the laminate that is suddenly heated from the upper surface of the FGTBC. The bottom surface of the homogeneous substrate is maintained at the initial temperature. The crack faces are supposed to be completely insulated. Material properties are assumed to be exponentially dependent on the distance from the interface. By using both the Laplace and Hankel transforms, the thermo-mechanical fracture problem is reduced to a singular integral equation and a system of singular integral equations which are solved numerically. The stress intensity factors of the crack are computed and presented as functions of the normalized time for various values of the nonhomogeneous and geometric parameters.     

THERMOELASTIC PROBLEM OF STEADY-STATE HEAT FLOW DISTURBED BY A CRACK PERPENDICULAR TO THE GRADED INTERFACIAL ZONE IN BONDED MATERIALS

The plane thermoelasticity equations are used to investigate the steady-state nonisothermal crack problem for bonded materials with a graded interfacial zone. The interfacial zone is modeled as a nonhomogeneous interlayer having continuously varying thermoelastic moduli in the exponential form between the dissimilar, homogeneous half-planes. A crack is assumed to exist in one of the half-planes oriented perpendicular to the nominal interface, disturbing a uniform heat flow. Based on the method of Fourier integral transform, formulation of the crack problem is reduced to solving two sets of Cauchy-type singular integral equations for temperature and thermal stress fields. The heat-flux intensity factors and the thermally induced mode II stress intensity factors are defined in order to characterize the singular behavior of temperature gradients and thermal stresses, respectively, in the vicinity of the crack tips. In the numerical results, the values of heat-flux and thermal-stress intensity factors are presented for various combinations of material and geometric parameters of the dissimilar media bonded through a thermoelastically graded interfacial zone. The influence of crack-surface partial conductance on the near-tip temperature and thermal stress fields is also addressed.     

Thermal Stress Intensity Factors for a Normal Crack in a Piezoelectric Material Strip

This paper investigates the electromechanical fracture behavior of a normal crack in a piezoelectric material strip subjected to a uniform heat flow far away from the crack region. The crack faces are supposed to be insulated thermally and electrically. By using the Fourier transform, the thermal and electromechanical problems are reduced to singular integral equations, respectively, which are solved numerically. Both the cases of an internal crack and an edge crack are studied. Numerical calculations are carried out, and detailed results are presented to illustrate the influence of the crack location and length on the temperature distribution and the stress intensity factors.     

THERMAL SINGULAR STRESSES NEAR A CIRCUMFERENTIAL EDGE CRACK IN A SPHERICAL CAVITY UNDER UNIFORM AXIAL HEAT FLOW

The linear thermoelastic problem of a spherical cavity with a circumferential edge crack is solved. The thermal stresses are caused by a uniform heat flow disturbed by the presence of the crack and the cavity. The surfaces of the crack and the cavity are assumed to be insulated. Integral transform techniques are used to reduce the problem concerning the temperature and thermoelastic fields to that of solving two singular integral equations of the first kind. The integral equations are solved numerically and the variation of the thermal stress intensity factor with the crack depth and the crack opening displacement are shown graphically.     

The Influence of Graded Coatings on the Thermal Stress Intensity Factors of an Oblique Crack in a Semi-Infinite Substrate Subjected to Local Heating on the Boundary

Thermally induced singular behavior of an arbitrarily oriented crack in a homogeneous substrate overlaid with a functionally graded coating is considered, within the framework of linear plane thermoelasticity. It is assumed that the graded coating/substrate system is subjected to steady-state thermal loading applied over a finite region at the coating surface and the crack in the substrate is thermally insulated, disturbing the prescribed heat flow. Based on the method of Fourier integral transform and the coordinate transformations of basic field variables in thermoelasticity equations, formulation of the crack problem is reduced to two sets of Cauchy-type singular integral equations for temperature and thermal stresses in the coated medium. In the numerical results, the main emphasis is placed on the investigation of influences of loading, geometric, and material parameters of the coated system on the variations of mixed-mode thermal stress intensity factors. Further addressed are the probable cleavage angles for the incipient growth of the original crack and the corresponding values of effective tensile-mode stress intensity factors.