全视场外差移相双波长干涉面形检测技术

双波长干涉检测技术可以实现高动态范围与高测试精度的兼顾,是一种极具潜力的检测技术,用于干涉检测的压电位移机械移相技术存在着一些问题,使用全视场外差移相技术,低频差的外差光源与面阵探测器采集帧率相配合,相较于传统的压电位移机械移相技术,可以同时保证不同波长的移相精度,简化移相的复杂度,且可以方便实现多步移相。提出了全视场外差移相双波长干涉测量技术,并搭建了全视场外差移相双波长干涉测量系统,测试了在边缘最高偏离顶点球13 μm的非球面以及高度为(1.3±0.1) μm的台阶,经过实验验证其非球面面形PV测试精度为λ/3.53 (λ=633 nm),面形PV测试重复精度为λ/77.38,面形RMS测试精度为λ/14.16,面形RMS测试重复精度为λ/919.10,台阶高度测试精度为λ/16.19,测试重复精度为λ/311.85。     

Shear strength of LED solder joints using SAC-nano Cu solder pastes

The addition of Cu nanoparticles into the solder pastes by mechanical mixing method creates a positive effect on the microstructure refinement of the LED solder joints. The grain size of β-Sn and Cu₆Sn₅ decrease obviously due to the increasing concentration of the nanoparticles in the solder pastes. However, the addition of nanoparticles facilitates the formation of voids in the solder joints, especially when the concentration of nanoparticles is higher than 0.5 wt% in the solder pastes. Both the microstructure refinement and void percentage affect the shear strength of the solder joints. Since the increase of the void percentage is limited when the concentration of nanoparticles increases from 0 to 0.5 wt%, the microstructure refinement shows a dominant effect on the shear performance and thus improves the shear strength of the solder joints from 49.8 to 55 MPa. Further addition of nanoparticles in the solder pastes leads to a sharp increase of the void percentage. Consequently, the shear strength of the solder joints decreases from 55 to 48.8 MPa when the concentration of doped particles increases from 0.5 to 1 wt% in the solder pastes.     

3-D measurement of moving particles by circular image shifting

A new approach to the three-dimensional (3-D) measurement of position and velocity of moving particles is introduced. A single TV camera with an apparatus to add circular shift to the image enables us to record the 3-D movement of particles as spiral streaks on a single image. Every shape of the spiral streak on the image plane is related to the position and the velocity of the individual particle. The information about 3-D movement of particles is extracted from the image using an image processing technique. We applied the technique to the measurement of the 3-D water-flow field seeded with tracer particles in a test tank and obtained satisfactory results     

位相法三维形貌测量数值模拟系统

设计了位相法三维形貌测量数值模拟系统.实验结果表明,该系统可以模拟相位测量的主要过程,根据模拟物体和系统参数对投影光栅进行有效调制,并利用行列法对调制光栅得到的包裹相位图正确解包裹.本系统为研究各种高效健壮的相位解包裹算法提供了模拟平台.     

Viscoelastic properties of solder pastes

Two solder pastes, used in an electronic card assembly process, were investigated under both oscillating and continuous shear fields, in order to characterize their viscoelastic and plastic properties. A further study on the vehicle used for the formulation of a paste was carried out in order to isolate the contribution of the disperse phase to the rheological properties of the corresponding system. The stress conditions for the departure from linear viscoelasticity and the transition from the solid- to liquid-like behavior, respectively, were defined on the basis of creep and oscillatory data. Appreciable elastic components were exhibited by the pastes examined, particularly at low stress conditions and, hence, can affect their screening performance. The contribution of the disperse phase is almost negligible at low shear or frequency, despite the high content of the disperse phase, and increases with increasing strain rate or frequency, essentially concerning only the viscous properties of the paste. This means that the rheological properties of the paste can be properly modulated by adjusting the formulation of the vehicle.     

Rheological characterization of solder pastes

Solder paste is the strategic material for the electronic card assembly process, based on the surface mounting technology. The paste is a concentrated suspension (50% of volume) of metallic powder in an organic continuous phase and its screening on the printed circuit board is the first operation of the assembly. The result of the screening depends strongly on the rheological characteristics of the solder paste but, nevertheless the research activity on this material is so far very poor. In this paper, an analytical procedure for the rheological characterization is given and the most important rheological parameters, affecting the screening performance, are shown.     

一种基于相移技术的三维轮廓检测方法

光学三维轮廓检测技术在工业生产控制与检测、医学诊断和机器人视觉等领域正占有越来越重要的地位.提出了一种将莫尔投影法与单片机控制的相移技术相结合的物体表面三维轮廓测量方法,有效地实现了物体表面三维轮廓的高速、自动高精度测量.     

Solder balling of lead-free solder pastes

Solder balling in Sn/Ag/Cu solder pastes was studied in this work. Three different solder pastes, several different reflow profiles and conditions, and two stencil thicknesses were used in the investigation. During the first phase, called the verification phase, the solder pastes were checked to ensure they met the minimum requirements. In the process-screening phase, the reflow profile was varied. Results show that besides flux chemistry, reflow atmosphere plays the major role in solder balling. The average number of solder balls with the best paste was one fifth of that with the worst paste. Furthermore, with all the pastes, the number of solder balls dropped close to zero when nitrogen atmosphere was used. Another finding during the reflow process screening was the influence of the stencil thickness on the solder-balling result. With a thinner stencil, two of the pastes exhibited significant solder balling. This is assumed to be caused by the different ability of fluxes to withstand oxidation during the preheating in the reflow process. In the last phase, the effect of the solder-paste particle size on solder balling was studied more closely. The flux chemistry was kept unchanged, and the solder particle size was varied between type 3 and type 4. The results show that, with type 4 paste, significantly more solder balls are formed compared to type 3 paste. It was also confirmed that, regarding the reflow profile, the ramp-up rate from 150°C to 217°C and the reflow atmosphere were the most significant factors that determine the solder-ball formation for both types of paste.     

3-D radar imaging using range migration techniques

An imaging system with three-dimensional (3-D) capability can be implemented by using a stepped frequency radar which synthesizes a two-dimensional (2-D) planar aperture. A 3-D image can be formed by coherently integrating the backscatter data over the measured frequency band and the two spatial coordinates of the 2-D synthetic aperture. This paper presents a near-field 3-D synthetic aperture radar (SAR) imaging algorithm. This algorithm is an extension of the 2-D range migration algorithm (RMA). The presented formulation is justified by using the method of the stationary phase (MSP). Implementation aspects including the sampling criteria, resolutions, and computational complexity are assessed. The high computational efficiency and accurate image reconstruction of the algorithm are demonstrated both with numerical simulations and measurements using an outdoor linear SAR system     

Flip chip on board solder joint reliability analysis using 2-D and3-D FEA models

This study investigates the effects of employing different two-dimensional (2-D) and three-dimensional (3-D) finite element analysis (FEA) models for analyzing the solder joint reliability performance of a flip chip on board assembly. The FEA models investigated were the 2-D-plane strain, 2-D-plane stress, 3-D-1/8th symmetry and 3-D-strip models. The different stress and strain responses generated by the four different FEA models were applied to various solder joint low cycle fatigue life prediction relationships. The investigation shows that the 2-D-plane strain and 2-D-plane stress models gave the highest and lowest solder joint strains, respectively. The 3-D-strip and 3-D-1/8th symmetry model results fall in between the 2-D-plane strain and 2-D-plane stress model results. The 3-D-1/8th symmetry model agrees better with the 2-D-plane strain model, while the 3-D-strip model agrees better with the 2-D-plane stress model results. The results for the fatigue life prediction analyses also show similar trends     

条纹投影动态3维测量中相位高精度估计

为了提高条纹投影动态3-D形貌测量精度, 采用加窗傅里叶分析辅助相移的方法来减小运动导致的相移误差。首先采用加窗傅里叶分析法估计变形条纹间的实际相移量, 然后采用最小二乘法估计出变形条纹的高精度相位分布, 最后由估计的相位计算得到场景3维形貌。理论分析了物体运动对相移量的影响, 通过仿真研究了所提方法的相移量估计精度, 并搭建了实验系统进行验证。结果表明, 实验中采用所提方法的相位恢复精度达到0.1673rad, 比现有方法有明显提高。该方法用来提高条纹投影动态3-D形貌测量中相位精度是有效的。     

High-temperature variable melting point Sn-Sb lead-free solder pastes using transient liquid-phase powder processing

During this investigation, a high-temperature, variable melting point (VMP) Sn-Sb solder paste was developed. The solder was created by mixing pure Sn and Sb powders together with a flux to form a paste. The proper choice of flux composition and Sn powder size resulted in a Sn-10wt.%Sb solder paste that had an initial melting point of 232°C and solder ball formation at peak temperatures as low as 241°C. This represents a significant reduction in the process temperature that would normally be required for a prealloyed solder with a melting point of 250°C. When this solder paste is reheated, significant remelting does not take place until a temperature above 241°C is reached. In this way, the solder exhibits a VMP. Experiments indicate that this VMP behavior is due to isothermal solidification (or freezing) at the solder temperature owing to the partial transient liquid-phase (TLP) behavior of the solder powder paste.     

Comparison of in-situ measurement techniques of solder joint reliability under thermo-mechanical stresses

Thermo Mechanical Cycle Lifetime (TMCL) test is a widely used test methodology for evaluating the reliability of solder joints in the microelectronics industry. The commonly used measurement techniques to monitor solder joint failures during the TMCL test are either event detector or data logger. In this study, TMCL test has been carried out on the same devices in parallel with both measurement techniques. The pros and cons of both techniques are compared. It is observed that the solder joint reliability results on the investigated samples by both techniques are comparable. The event detector can catch short intermittent events, while the data logger is able to capture the details of the solder joint degradation process. In applications for which performance is dependent on the transmission of signals with a frequency of several hundred megahertz or more, the event detector technique shall be used. In such cases the data logger technique may overestimate product lifetime. On the other hand, for some applications where the performance is less susceptible to intermittent solder joint interconnect interruption but more to the increase of the solder joint resistance, the data logger shall be used. In such cases the event detector technique may underestimate product lifetime. In conclusion depending on the end application of the device, the most suitable technique can be selected.     

Microwave phase shifting with gain using IMPATT diodes

The use of an IMPATT reflection amplifier to produce phase modulation at microwave frequencies has been demonstrated. By operating the IMPATT diode near to avalanche resonance frequency, phase-switching through 180° can be obtained, and the drive current can be set to give equal gain in the two phase states so that no amplitude modulation is produced. Possible application to high-frequency data-transmission systems is envisaged.     

A full-duplex dual-frequency self-steering array using phase detection and phase shifting

A full-duplex dual-frequency self-steering array using phase detection and phase shifting is presented. By RF decoupling the transmitter and receiver arrays, the proposed system promises greater system efficiency by ensuring a constant transmit power. This also allows for a separate low-frequency interrogating signal capable of various modulation schemes. A two-element prototype is demonstrated with interrogating and retrodirective frequencies of 1.425 and 2.85 GHz, respectively. Retrodirectivity is reported for angles of 0/spl deg/, -15/spl deg/, and +25/spl deg/. The power of the received signal is improved by up to 12 dB for -60/spl deg//spl les//spl theta//spl les/60/spl deg/ when compared to a conventional two-element array.     

全息相移技术用于物体的三维面形测量

提出将全息干涉条纹和相移技术用于三维面形测量,首先利用相移进行位相解调,得到各点的包裹相位分布,再利用投影条纹最小二乘法得到的高度信息对位相进行去包裹处理,从而得到具有较高精度的位相测量和相应的三维面形测量结果.     

多个线结构光传感器三维测量系统的校准

提出了一种3个激光线结构光传感器测量系统的校准方法。该方法避免了对测量系统结构参数的繁琐标定,只需对特殊设计的模块进行一次测量就能得到系统的校准参数,从而快速有效地实现CCD像面坐标向世界空间坐标的转换。实验证明,在100mm测量范围内能获得0.05mm的空间定位精度,并能有效地抑止光源散斑噪声对激光三角法测量精度的影响。这一方法已经在多传感三维测量系统得到很好的应用。     

数字图像相关用于印刷电路板全场微应变的测量

提出了利用数字图像相关技术测量印刷电路板全场微应变的方法,用于评估电路板由应力所导致的失效风险,克服传统实验测试方法不能有效测量全场应变以及难以给出应变集中区域的不足。设计了基于三维数字图像相关技术和应力加载策略的实验方法,通过所获得的全场主应变分布及局部区域内应变历史曲线来评估电路板的失效风险。实验结果表明,所提出的电路板微应变测量方法的重复性优于100 ,能够有效地获得电路板全场的微应变分布,尤其是能够直观地显示电路板应变超过额定值的区域分布,为改进电路板设计、降低电路板失效风险和保护电子元器件的安全提供了重要的实测数据。     

基于相位光栅的立体视觉测量系统及其相位解析表示

针对自由曲面,采用双目立体视觉与相移光 栅结合的方式实现一种三维面型视觉测量系统。首先, 对测量系统的数学模型和标定方法进行了介绍;然后,对涉及的相位解析理论进行了详细的 分析;最后,针对当前相位解析 过程中存在的问题提出了相应的解决方法,并与当前主流的相位解析算法进行比较,证明本 文提出的算法在测量速度和精度 方面具有一定的优势。实验结果表明,本文系统的测精度约为0.04m m。     

基于单频四步相移条纹投影的不连续物体三维形貌测量

提出了基于单频四步相移条纹投影的不连续物体三维形貌测量方法。由计算机产生相移步长为π/2的4幅正弦条纹图像,利用液晶投影仪投影到被测物体表面,由CCD相机同步采集获得含有形貌信息的畸变条纹图并保存在计算机中,通过四步相移算法获得条纹相位信息。对于表面形貌不连续的物体,通过4幅畸变条纹图灰度算术和运算并进行二值化处理定位阴影或暗背景,利用二值图像修正解调的相位从而得到正确相位。实验结果验证了本方法的有效性。